S9S08DZ16F2MLF - 8-bit S08 MCU 16KB Flash CAN 40MHz | NXP
Référence : S9S08DZ16F2MLF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.37 | $1,37 |
| 10 | $1.3 | $13,00 |
| 100 | $1.23 | $123,00 |
| 500 | $1.17 | $585,00 |
| 1 000 | $1.1 | $1 100,00 |
S9S08DZ16F2MLF Présentation
An 8-bit microcontroller (MCU) is a single-chip computer that integrates a processor core, program memory, data memory, and peripherals such as timers, serial interfaces, and analog blocks. In the power-management hierarchy of embedded systems, MCUs of this class sit at the lowest cost tiers, typically controlling actuators, sensors, and communication links in automotive body electronics, motor control, and industrial nodes where a 32-bit processor would be unnecessary.
Key features of the S9S08DZ16 family include an embedded CAN 2.0 A/B controller - one of the first such integrations in an 8-bit MCU family - along with I2C, LINbus, SCI, and SPI connectivity. Peripheral support includes low-voltage detection (LVD), power-on reset (POR), PWM timers, a watchdog timer (WDT), and on-chip emulation/debug, eliminating the need for external debug headers in cost-sensitive designs.
The device operates from a 2.7V to 5.5V supply and retains data in Flash across power cycles while the 512-byte EEPROM provides parameter storage without external memory. The 40 MHz core clock combined with the CAN interface makes the part well suited to in-vehicle network nodes that must respond quickly to bus traffic.
Typical applications include automotive body control modules, seat and mirror controllers, HVAC actuators, LIN/CAN gateway satellites, and industrial sensor nodes. The -40C to +125C operating range and automotive qualification make it appropriate for under-hood and in-cabin environments alike.
Designers should budget the 39 available general-purpose I/O pins carefully when using the CAN, SPI, and I2C peripherals simultaneously, since pin multiplexing reduces available GPIO.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour S9S08DZ16F2MLF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S08DZ16F2MLF (même facteur de forme et même empreinte) — différant par Core Processor, Instruction Set, RAM, Operating Temperature, Connectivity.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S08DZ32F1MLF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.21 / unité
Voir la fiche technique →MC9S08DZ32AMLH
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S9S08DZ48F1CLH
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.8 / unité
Voir la fiche technique →S9S08DZ60F1CLH
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.95 / unité
Voir la fiche technique →MC9S08DZ96CLH
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.21 / unité
Voir la fiche technique →MC9S08DZ60AMLH
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S08DV48AMLH
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.31 / unité
Voir la fiche technique →S9S08DZ16F2MLF Valeurs maximales et caractéristiques électriques
| Core Processor | S08 (CISC) |
| Core Size | 8-Bit |
| Maximum Clock Speed | 40 MHz |
| Program Memory Size | 16KB (16K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 512 x 8 |
| RAM Size | 2KB |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Number of I/O | 39 |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount |
| Qualification | Automotive Qualified (AEC qualified family) |
| Series | S08 / S9S08DZ16 |
| Part Status | Active |
| DAC Channels | No |
| Data Converters | 12-bit ADC |
Configuration des broches de S9S08DZ16F2MLF
| Broche 1 | PTA0/KBIP0 — General-purpose I/O, keyboard interrupt |
| Broche 2 | PTA1/KBIP1 — General-purpose I/O, keyboard interrupt |
| Broche 3 | PTA2/KBIP2 — General-purpose I/O, keyboard interrupt |
| Broche 4 | PTA3/KBIP3 — General-purpose I/O, keyboard interrupt |
| Broche 5 | PTA4 — General-purpose I/O |
| Broche 6 | PTA5 — General-purpose I/O |
| Broche 7 | PTA6 — General-purpose I/O |
| Broche 8 | PTA7 — General-purpose I/O |
| Broche 9 | PTB0/AD0 — General-purpose I/O, ADC channel 0 |
| Broche 10 | PTB1/AD1 — General-purpose I/O, ADC channel 1 |
| Broche 11 | PTB2/AD2 — General-purpose I/O, ADC channel 2 |
| Broche 12 | PTB3/AD3 — General-purpose I/O, ADC channel 3 |
| Broche 13 | PTB4/AD4 — General-purpose I/O, ADC channel 4 |
| Broche 14 | PTB5/AD5 — General-purpose I/O, ADC channel 5 |
| Broche 15 | PTB6/AD6 — General-purpose I/O, ADC channel 6 |
| Broche 16 | PTB7/AD7 — General-purpose I/O, ADC channel 7 |
| Broche 17 | VDDAD — ADC analog power supply |
| Broche 18 | VSSAD — ADC analog ground |
| Broche 19 | PTC0 — General-purpose I/O |
| Broche 20 | PTC1 — General-purpose I/O |
| Broche 21 | PTC2 — General-purpose I/O |
| Broche 22 | PTC3 — General-purpose I/O |
| Broche 23 | PTC4 — General-purpose I/O |
| Broche 24 | PTC5 — General-purpose I/O |
| Broche 25 | PTC6 — General-purpose I/O |
| Broche 26 | PTC7 — General-purpose I/O |
| Broche 27 | PTD0 — General-purpose I/O |
| Broche 28 | PTD1 — General-purpose I/O |
| Broche 29 | PTD2 — General-purpose I/O |
| Broche 30 | PTD3 — General-purpose I/O |
| Broche 31 | PTD4 — General-purpose I/O |
| Broche 32 | PTD5 — General-purpose I/O |
| Broche 33 | PTD6 — General-purpose I/O |
| Broche 34 | PTD7 — General-purpose I/O |
| Broche 35 | PTE0/TXD — General-purpose I/O, SCI transmit |
| Broche 36 | PTE1/RXD — General-purpose I/O, SCI receive |
| Broche 37 | PTE2 — General-purpose I/O |
| Broche 38 | PTE3 — General-purpose I/O |
| Broche 39 | PTE4 — General-purpose I/O |
| Broche 40 | PTE5 — General-purpose I/O |
| Broche 41 | PTE6 — General-purpose I/O |
| Broche 42 | PTE7 — General-purpose I/O |
| Broche 43 | BKGD/MS — Background debug / mode select |
| Broche 44 | XTAL — Oscillator output / crystal |
| Broche 45 | EXTAL — Oscillator input / crystal |
| Broche 46 | VSS — Digital ground |
| Broche 47 | VDD — Digital power supply (2.7 V to 5.5 V) |
| Broche 48 | RESET — External reset input, active low, bidirectional |
Applications typiques
S9S08DZ16F2MLF convient pour 6 applications: Automotive Body Control Modules, Seat and Mirror Control Nodes, HVAC Blower and Actuator Control, Industrial CAN Sensor Nodes, LIN Gateway Satellites, Lighting and LED Control Modules.
Automotive Body Control Modules
The S9S08DZ16F2MLF was engineered specifically for automotive body electronics, integrating an embedded CAN 2.0 A/B controller, LINbus interface, and 39 GPIO in a single 8-bit S08 device rated -40C to +125C. In a body control module it drives relays, lamp outputs, and switch matrices while responding to CAN bus commands, with the 40 MHz core providing headroom for fast message handling. The 512-byte EEPROM stores calibration and learn values (e.g., window positions) without external memory, and the watchdog plus low-voltage detection protect against brown-out corruption in crank conditions where supply can dip to 2.7V or lower transiently.
Recommandé
Seat and Mirror Control Nodes
Seat adjustment, memory-position, and power-fold mirror modules are classic S08DZ16 applications: they need moderate GPIO count (the 39 I/O pins cover motor H-bridge enables and Hall/position switch inputs), PWM outputs for motor speed control, and CAN or LIN connectivity to the vehicle network. The S9S08DZ16F2MLF's 16KB Flash is typically sufficient for position-learning algorithms, and the on-chip EEPROM retains seat memory across key-off. Because the family offers pin-compatible 32KB/60KB variants in the same 48-LQFP footprint, a single PCB can be scaled up if diagnostic or calibration code grows beyond 16KB.
Recommandé
HVAC Blower and Actuator Control
In HVAC systems the S9S08DZ16F2MLF generates PWM for blower motor drives and stepper/actuator control for blend-air doors, reading position feedback through its I2C or SPI peripherals. The 40 MHz bus speed allows closed-loop position correction at kilohertz rates, while the -40C to +125C automotive grade covers under-dash thermal extremes near heater cores. LINbus support makes it a natural fit for zonal HVAC satellites that communicate with a master climate controller over a single wire, reducing harness cost. The watchdog and POR peripherals ensure recovery from the voltage sags common during blower motor start.
Recommandé
Industrial CAN Sensor Nodes
Beyond automotive, the S9S08DZ16F2MLF serves industrial networks where CAN or LIN links connect distributed sensors to a PLC or controller. Its 12-bit ADC digitizes analog sensor signals (pressure, temperature, position) on-chip, the SPI interface streams data to the CAN controller, and the 16KB Flash holds both protocol handling and compensation math. With a 2.7V-5.5V supply range it runs directly from industrial 5V rails without a regulator cascade, and the 40 MHz core executes filtering fast enough for kHz-band signals. The industrial temperature coverage and low device cost make it economical to deploy across many nodes.
Recommandé
LIN Gateway Satellites
The S9S08DZ16F2MLF integrates SCI-based LINbus support, positioning it as a slave node in LIN 2.x clusters - window lifters, wiper controls, rain sensors, and door modules. A typical topology places this MCU as the LIN slave executing local actuation logic while forwarding diagnostics to a CAN master; the DZ16 can even bridge both protocols since CAN and LIN are on the same die. The 512-byte EEPROM stores node configuration and NVM flags required by LIN diagnostic services, and the on-chip debug interface allows field tooling to reflash firmware through the single-wire background pin without disassembly.
Recommandé
Lighting and LED Control Modules
Automotive interior and exterior lighting modules use the S9S08DZ16F2MLF's PWM timers to drive LED string dimming with microsecond-resolution duty cycles, while CAN commands set brightness and animation. The 39 GPIO address multiple lamp channels, and the 40 MHz core executes soft-start ramps and fault supervision (open/short detection via the ADC) at rates that avoid visible flicker. The -40C to +125C rating is essential near headlamp housings. The part's watchdog ensures lamps fail to a safe state on firmware lockup, a common regulatory requirement for exterior lighting ECU qualification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S08DZ16F2MLF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S08DZ32F1MLF | MC9S08DZ32AMLH | S9S08DZ48F1CLH | S9S08DZ60F1CLH | MC9S08DZ96CLH |
|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same | 48-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Speed | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz |
| Flash Memory | 16KB (16K x 8) | 32KB | 32KB | 48KB | 60KB | 96KB |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI | CANbus, I2C, LINbus, SCI, SPI | CANbus, I2C, LINbus, SCI, SPI | CANbus, I2C, LINbus, SCI, SPI | CANbus, I2C, LINbus, SCI, SPI | CANbus, I2C, LINbus, SCI, SPI |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
Principaux différenciateurs
- Lowest-cost CAN integration in the S08DZ family (vs S9S08DZ32F1MLF)
- Identical footprint enables memory upgrade without respin (vs MC9S08DZ96CLH)
- On-chip EEPROM for parameter retention (vs MC9S08DV48AMLH)
Notes de conception
Decouple VDD and VDDAD separately: place a 100 nF ceramic capacitor within 5 mm of each supply pin plus a bulk 4.7-10 uF capacitor near the MCU. In automotive crank conditions the 2.7V minimum supply can be violated transiently - the on-chip LVD will reset the core, but the watchdog and EEPROM write routines must tolerate mid-write resets. Consider an RC delay on RESET for slow-rising battery rails, and route the analog ground return of VSSAD as a star point back to the main VSS.
The 48-LQFP (7x7 mm, 0.5 mm pitch) lands cleanly on standard QFP-48 footprints; keep oscillator traces (EXTAL/XTAL) short, guarded by ground, and place the crystal load capacitors within 3 mm of the pins. Route the BKGD pin to a test pad - it is the single-wire background debug access and difficult to reach after assembly if unbroken out. For CAN applications, place the transceiver within 20 mm of the CAN TX/RX pins and keep the split termination close to the connector.
Pin multiplexing is the biggest integration risk: CAN, SPI, I2C, and SCI functions share port pins, and enabling all peripherals simultaneously can silently steal needed GPIO from the 39-pin budget - map the pin function table in the datasheet before committing the schematic. Also confirm the exact S9S08DZ16 variant suffix: F2 vs F1 mask/temperature options differ, and the MLF package is tray-packed (verify reel variants for automated assembly lines).
Informations de conformité
Automotive Qualified per NXP product page and distributor listings (M74K mask, AUTO grade). REACH, halogen-free, and conflict-minerals declarations should be confirmed via the Environmental Quality tab on the NXP product page.