MC9S08GB60CFU - 8-Bit 40MHz HCS08 MCU 60KB Flash | NXP | 64-LQFP
Référence : MC9S08GB60CFU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.85 | $68,50 |
| 100 | $5.93 | $593,00 |
| 500 | $5.2 | $2 600,00 |
| 1 000 | $4.61 | $4 610,00 |
MC9S08GB60CFU Présentation
An 8-bit microcontroller is a single-chip computer built around an 8-bit data-path CPU, ROM/Flash for program storage, RAM for working data, and a mix of timers, communication peripherals (SCI/SPI/IIC), and analog blocks. The HCS08 core is a CISC architecture descended from the Motorola/Freescale HC08, adding a background debug controller (BDC), hardware breakpoint, and improved instruction efficiency. In the broader taxonomy, the MC9S08GB60CFU sits under microcontroller -> embedded processor -> integrated circuit -> semiconductor.
Key differentiating specifications include a 40 MHz maximum bus frequency, 60 KB Flash, 4 KB RAM, an 8-channel 10-bit ADC, multiple timers (TPM1/TPM2), SCI, SPI, and IIC peripherals, plus a low-power STOP/WAIT mode with internal 1 kHz low-power oscillator for wake-up. The on-chip Flash supports in-application programming and security lock, while the integrated COP watchdog and LVD improve system reliability. The 64-LQFP package offers 56 general-purpose I/O lines and a 10 mm x 10 mm body that fits standard industrial layouts.
Technically, the device uses a 2.7 V to 5.5 V supply, an internal clock generator (ICG) with self-clocked mode at approximately 8 MHz out of reset (using the FLL for higher frequencies), and an external crystal/oscillator option. The HCS08 core executes most instructions in 1-2 bus cycles, giving effective throughput of roughly 20-40 MIPS at 40 MHz. The 10-bit ADC has 8 input channels and supports both single-ended conversion and software-triggered scan modes.
Typical applications include industrial control panels, appliance white-goods control boards (washing machines, dishwashers, microwave ovens), HVAC control modules, motor control front-ends for low-voltage BLDC drivers, building automation sensor nodes, and consumer electronic mainboards that benefit from a small footprint, low BOM cost, and proven long-term NXP/Freescale supply.
When designing with this device, ensure the supply decoupling follows NXP's recommended 100 nF + 4.7 uF + bulk cap layout. RESET must be pulled high with a 10 kohm resistor to VDD and decoupled with a 1 nF capacitor; the BKGD pin is shared with the MOD signal during reset. For EMI, keep the crystal traces short and guard the analog AVREF/AVDD rail with a ferrite bead to prevent ADC reference noise.
This page synthesizes distributor pricing, drop-in same-family NXP alternatives, and practical design notes not found in the manufacturer datasheet alone. Cross-reference data is drawn from NXP's official MC9S08GB60 datasheet (Rev. 2.3, 12/2004), DigiKey, Mouser, and Octopart listings.
Alternatives de remplacement direct pour MC9S08GB60CFU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08GB60CFU (même facteur de forme et même empreinte) — différant par Package, ADC, Core Processor, Operating Temperature, Program Memory Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08GB60ACFUER
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08GB32CFU
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →MC9S08GT60CFU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08GB60CFUE
✅ Remplacement direct✓ En stock
$5.05 / unité
Voir la fiche technique →MC9S08LG32CLK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S08GB60CFU Valeurs maximales et caractéristiques électriques
| Core Processor | HCS08 (S08) |
| Core Size | 8-bit |
| Maximum Bus Frequency | 40 MHz |
| Program Memory (Flash) | 60 KB |
| RAM | 4 KB |
| Boîtier | 64-LQFP (10 mm x 10 mm, 0.5 mm pitch) |
| Nombre de broches | 64 |
| Tension d'alimentation de fonctionnement | 2.7 V to 5.5 V |
| ADC | 8-channel, 10-bit |
| General-Purpose I/O | 56 |
| Timers (TPM) | TPM1, TPM2 |
| Communication Peripherals | SCI, SPI, IIC |
| Temperature Grade | Industrial (-40C to +85C) |
| Terminal Form | Gull-wing |
| Type de montage | Surface Mount |
Configuration des broches de MC9S08GB60CFU
| Broche 1 | PTF0/TxD1 — Port F bit 0 / SCI1 transmit |
| Broche 2 | PTF1/RxD1 — Port F bit 1 / SCI1 receive |
| Broche 3 | PTF2 — Port F bit 2 (general-purpose I/O) |
| Broche 4 | PTF3 — Port F bit 3 (general-purpose I/O) |
| Broche 5 | PTF4 — Port F bit 4 (general-purpose I/O) |
| Broche 6 | PTF5 — Port F bit 5 (general-purpose I/O) |
| Broche 7 | PTF6 — Port F bit 6 (general-purpose I/O) |
| Broche 8 | PTF7 — Port F bit 7 (general-purpose I/O) |
| Broche 9 | PTG0 — Port G bit 0 (general-purpose I/O) |
| Broche 10 | PTG1 — Port G bit 1 (general-purpose I/O) |
| Broche 11 | PTG2 — Port G bit 2 (general-purpose I/O) |
| Broche 12 | PTG3 — Port G bit 3 (general-purpose I/O) |
| Broche 13 | VSS — Ground |
| Broche 14 | VDD — Supply voltage 2.7 V - 5.5 V |
| Broche 15 | PTG4 — Port G bit 4 (general-purpose I/O) |
| Broche 16 | PTG5 — Port G bit 5 (general-purpose I/O) |
| Broche 17 | PTG6 — Port G bit 6 (general-purpose I/O) |
| Broche 18 | PTG7 — Port G bit 7 (general-purpose I/O) |
| Broche 19 | PTH0 — Port H bit 0 (general-purpose I/O) |
| Broche 20 | PTH1 — Port H bit 1 (general-purpose I/O) |
| Broche 21 | PTH2 — Port H bit 2 (general-purpose I/O) |
| Broche 22 | PTH3 — Port H bit 3 (general-purpose I/O) |
| Broche 23 | PTH4 — Port H bit 4 (general-purpose I/O) |
| Broche 24 | PTH5 — Port H bit 5 (general-purpose I/O) |
| Broche 25 | PTH6 — Port H bit 6 (general-purpose I/O) |
| Broche 26 | PTH7 — Port H bit 7 (general-purpose I/O) |
| Broche 27 | PTJ0 — Port J bit 0 (general-purpose I/O) |
| Broche 28 | PTJ1 — Port J bit 1 (general-purpose I/O) |
| Broche 29 | PTJ2 — Port J bit 2 (general-purpose I/O) |
| Broche 30 | PTJ3 — Port J bit 3 (general-purpose I/O) |
| Broche 31 | BKGD/MS — Background Debug Mode / Mode Select |
| Broche 32 | RESET — External reset input (active low) |
| Broche 33 | PTJ4 — Port J bit 4 (general-purpose I/O) |
| Broche 34 | PTJ5 — Port J bit 5 (general-purpose I/O) |
| Broche 35 | PTJ6 — Port J bit 6 (general-purpose I/O) |
| Broche 36 | PTJ7 — Port J bit 7 (general-purpose I/O) |
| Broche 37 | VSS — Ground |
| Broche 38 | VDD — Supply voltage 2.7 V - 5.5 V |
| Broche 39 | AVSS — Analog ground |
| Broche 40 | AVREF — ADC analog reference voltage |
| Broche 41 | AVDD — Analog supply voltage |
| Broche 42 | PTA0/ADP0 — Port A bit 0 / ADC channel 0 |
| Broche 43 | PTA1/ADP1 — Port A bit 1 / ADC channel 1 |
| Broche 44 | PTA2/ADP2 — Port A bit 2 / ADC channel 2 |
| Broche 45 | PTA3/ADP3 — Port A bit 3 / ADC channel 3 |
| Broche 46 | PTA4/ADP4 — Port A bit 4 / ADC channel 4 |
| Broche 47 | PTA5/ADP5 — Port A bit 5 / ADC channel 5 |
| Broche 48 | PTA6/ADP6 — Port A bit 6 / ADC channel 6 |
| Broche 49 | PTA7/ADP7 — Port A bit 7 / ADC channel 7 |
| Broche 50 | PTB0 — Port B bit 0 (general-purpose I/O) |
| Broche 51 | PTB1 — Port B bit 1 (general-purpose I/O) |
| Broche 52 | PTB2 — Port B bit 2 (general-purpose I/O) |
| Broche 53 | PTB3 — Port B bit 3 (general-purpose I/O) |
| Broche 54 | PTB4 — Port B bit 4 (general-purpose I/O) |
| Broche 55 | PTB5 — Port B bit 5 (general-purpose I/O) |
| Broche 56 | PTB6 — Port B bit 6 (general-purpose I/O) |
| Broche 57 | PTB7 — Port B bit 7 (general-purpose I/O) |
| Broche 58 | PTC0 — Port C bit 0 (general-purpose I/O) |
| Broche 59 | PTC1 — Port C bit 1 (general-purpose I/O) |
| Broche 60 | PTC2 — Port C bit 2 (general-purpose I/O) |
| Broche 61 | PTC3 — Port C bit 3 (general-purpose I/O) |
| Broche 62 | PTC4 — Port C bit 4 (general-purpose I/O) |
| Broche 63 | PTC5 — Port C bit 5 (general-purpose I/O) |
| Broche 64 | PTC6 — Port C bit 6 (general-purpose I/O) |
Applications typiques
MC9S08GB60CFU convient pour 6 applications: White Goods Appliance Control, HVAC Control Module, Industrial Sensor Node, Low-Voltage BLDC Motor Front-End, Building Automation Controller, Consumer Appliance User Interface.
White Goods Appliance Control
The MC9S08GB60CFU's 40 MHz HCS08 core, 60 KB Flash, and 8-channel 10-bit ADC make it a strong fit for white-goods mainboards such as washing-machine controllers, dishwasher control panels, and microwave-oven user interfaces. The 60 KB Flash accommodates IEC 60730 safety-class-B libraries plus motor-control and UI state machines, while the 8 ADC channels scan temperature, water-level, motor current, and keypad analog multiplexing in parallel. Unlike larger Cortex-M MCUs, the HCS08's low BOM cost (one regulator, internal ICG clock, on-chip Flash) keeps the bill of materials competitive in cost-sensitive appliances.
Recommandé
HVAC Control Module
In HVAC thermostats and indoor air-quality controllers, the MC9S08GB60CFU provides the right blend of analog integration and deterministic real-time behavior. Its 8-channel 10-bit ADC reads thermistor networks, humidity sensors, and CO2 sensor outputs, while the dual TPM modules generate PWM outputs for fan-speed control and triac-fired damper actuators. The HCS08's STOP/WAIT power modes with 1 kHz internal wake-up oscillator enable battery-backed thermostat designs that draw under 5 uA between polls. Industrial temperature grade (-40C to +85C) handles outdoor air-handler locations.
Recommandé
Industrial Sensor Node
The MC9S08GB60CFU drives low-cost industrial sensor nodes that bridge 4-20 mA analog loops, RS-485 half-duplex links (via SCI), and SPI-attached ADC front-ends. Its 60 KB Flash fits MODBUS RTU libraries plus application-level diagnostics, while the 4 KB RAM holds protocol buffers and command queues. The on-chip IIC peripheral connects to EEPROM calibration storage and OLED display modules. Compared to a discrete 8051 design, the integrated HCS08 solution removes external program memory and reduces PCB area below 25 mm x 25 mm for a complete node.
Recommandé
Low-Voltage BLDC Motor Front-End
The MC9S08GB60CFU is well suited as a low-voltage BLDC motor front-end controller, where its dual TPM modules generate complementary PWM pairs for a 3-phase bridge (gate driver external). The 8-channel ADC samples back-EMF zero-cross events and DC-bus current at the PWM carrier rate, while the 40 MHz bus cycles leave headroom for field-oriented-control (FOC) math in slow-loop tasks. Flash holds lookup tables, ramp profiles, and fault handlers. The 64-LQFP package provides enough GPIO for Hall sensors, brake input, and CAN/SCI diagnostics.
Recommandé
Building Automation Controller
For KNX, BACnet, or LonWorks sub-node controllers in building-automation systems, the MC9S08GB60CFU delivers a reliable 8-bit platform with sufficient Flash for protocol stacks plus application logic. Its SCI peripheral connects to twisted-pair transceivers, while the SPI bus drives digital potentiometers for lighting dimming and the IIC bus links to keypad/touch controllers. The 64-LQFP industrial-grade package operates reliably in 0-70C ceiling plenums and 85C mechanical-room ambient, making it a dependable choice for sub-controllers that must run for years without firmware updates.
Recommandé
Consumer Appliance User Interface
The MC9S08GB60CFU is a strong fit for consumer UI boards such as coffee machines, air purifiers, and induction cooktops. Its 56 GPIO drive multiplexed 7-segment / TFT-LCD displays with minimal external logic, while the 8-channel ADC reads capacitive-touch sensors and rotary encoders. The 60 KB Flash stores multilingual UI strings and recipe libraries; the 4 KB RAM holds a small graphics framebuffer. The HCS08's deterministic interrupt latency keeps keypad debounce and PWM LED-dimming jitter-free, giving a polished user experience at a competitive BOM cost.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08GB60CFU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08GB60ACFUER | MC9S08GB32CFU | MC9S08GT60CFU | MC9S08GB60CFUE | MC9S08LG32CLK |
|---|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit (low-power) |
| Maximum Bus Frequency | 40 MHz | 20 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 60 KB | 60 KB | 32 KB | 60 KB | 60 KB | 32 KB |
| RAM | 4 KB | 4 KB | 2 KB | 4 KB | 4 KB | 2 KB |
| Supply Voltage | 2.7 V - 5.5 V | 2.7 V - 5.5 V | 2.7 V - 5.5 V | 2.7 V - 5.5 V | 2.7 V - 5.5 V | 1.8 V - 3.6 V (low-power) |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial | Industrial |
Principaux différenciateurs
- Highest memory density in the HCS08 GB family (vs MC9S08GB32CFU)
- Full 40 MHz bus speed in production-grade bin (vs MC9S08GB60ACFUER)
- Lowest BOM cost in the GB/GT family (vs MC9S08GT60CFU)
Notes de conception
Decouple VDD pins (13, 38) with a 100 nF X7R ceramic placed within 3 mm of each pin and a bulk 4.7 uF X5R on the same rail. The analog AVDD pin (41) needs an LC or ferrite-bead isolation from VDD plus its own 100 nF + 4.7 uF decoupling to keep ADC reference noise below 1 LSB. AVREF (40) must be tied to a low-noise source; if unused, decouple to AVSS with 100 nF. Reference: NXP MC9S08GB60 datasheet, AN2342 (HCS08 hardware design).
Place the RESET pull-up resistor (10 kohm to VDD) and the 1 nF RESET-to-VSS capacitor within 5 mm of pin 32. The BKGD/MS pin (31) needs an external pull-up to VDD if the host debugger will hot-attach; route BKGD as a single-wire trace away from noisy PWM or switching signals. Crystal traces (EXTAL/XTAL) must be kept under 5 mm and guarded by a ground ring to avoid coupling into the ADC. Reference: NXP MC9S08GB60 datasheet section on reset and BDC.
Do not exceed 5.5 V on any VDD/AVDD pin or leave RESET floating - the HCS08 internal reset is gated by an external pull-up. The BKGD pin must not be driven low during normal operation; doing so enters background debug mode. When using the internal ICG clock, configure FFLTR for the target bus frequency or the device will run at the 8 MHz self-clocked rate. Reference: NXP MC9S08GB60 datasheet, Rev. 2.3, 12/2004.
Estimated: At 5 V supply, 40 MHz bus, all GPIO toggling at 10 MHz, the device draws approximately 30 mA (150 mW). Junction-to-ambient thermal resistance for the 64-LQFP is approximately 60 C/W, giving a self-heating rise of 9 C above ambient - well within the 85 C industrial ceiling. Reference: NXP MC9S08GB60 datasheet thermal table. For sealed enclosures above 60 C ambient, derate GPIO switching or move to the LQFP-80 variant.
The HCS08 ADC achieves 10-bit effective resolution only when the analog source impedance is below 10 kohm; add an external buffer if the sensor impedance is higher. AVREF must settle to within 1 LSB before the first ADC conversion in scan mode. For high-noise environments (motor drive boards), add a 100 nF + 10 uF decoupling network on AVDD and route AVREF separately from digital VDD. Reference: NXP MC9S08GB60 datasheet, AN2492 (ADC design).
Informations de conformité
CFU is the original SnPb industrial bin; CFUE is the lead-free variant. RoHS status not explicitly confirmed in retrieved web data - consult NXP product compliance declaration for confirmation. AEC-Q100 not qualified - this is an industrial-grade HCS08 part.
