MC9S08SL8CTL - 8KB Flash 40MHz S08 MCU w/ LIN | NXP
Référence : MC9S08SL8CTL ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.16 | $1,16 |
| 10 | $1.05 | $10,50 |
| 100 | $0.92 | $92,00 |
| 500 | $0.78 | $390,00 |
| 1 000 | $0.65 | $650,00 |
| 3 000 | $0.52 | $1 560,00 |
MC9S08SL8CTL Présentation
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and peripherals such as timers, ADC, and communication interfaces. The MC9S08SL8CTL belongs to the S08 family of 8-bit microcontrollers, which traces to the original HC08 instruction set with extensions like BGND for background debug. Within NXP's portfolio, it sits in the S08SL sub-line that adds a slave LIN interface controller (SLIC) and on-chip LIN transceiver, simplifying LIN slave node designs.
Key features include 8KB on-chip Flash, 512 bytes EEPROM, 256-byte TFL (Three-Flash-Lock) security area, 16-bit timer/PWM module (TPM), a 16-channel 10-bit ADC with 2.5 µs conversion, and an inter-integrated circuit (IIC) serial interface. The supply voltage range is 2.7V to 5.5V and the device supports up to 32 interrupt sources. The integrated LIN 2.1 / SAE J2602 physical layer plus SLIC removes the need for an external LIN transceiver in most LIN slave nodes.
The HCS08 core executes most instructions in 1-2 bus cycles at 40MHz internal bus rate, achieving roughly 1 MIPS/MHz effective throughput. Internal architecture is Freescale (now NXP) proprietary 0.25 µm CMOS, paired with an on-chip voltage regulator that allows single-supply 2.7V-5.5V operation. Background debug mode (BDM) and on-chip in-circuit emulation simplify firmware development and field upgrades.
Typical applications include automotive body control modules (door modules, seat controllers, mirror switch packs), LIN slave nodes for HVAC blower controls and ambient lighting, and industrial sensor peripherals with LIN connectivity. It is also used in low-cost consumer appliances that benefit from LIN or IIC host communication.
When designing, note that 28-pin TSSOP thermal limits and 5V-tolerant I/O are appropriate for body electronics rather than under-hood conditions. Decouple VDD/VSS with a 100 nF ceramic placed within 5 mm of the IC, and follow NXP's AN3494 LIN physical-layer layout guidelines for EMC robustness.
This page synthesizes distributor pricing, verified drop-in alternatives, and application-specific design guidance that complement the manufacturer datasheet.
Alternatives de remplacement direct pour MC9S08SL8CTL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S08SL8CTL (même facteur de forme et même empreinte) — différant par Package, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S08SL16CTJ
✅ Remplacement direct✓ En stock
$1.83 / unité
Voir la fiche technique →MC9S08SL8CTL Valeurs maximales et caractéristiques électriques
| Core | S08 (HCS08) 8-bit |
| Program Memory | 8 KB Flash |
| EEPROM | 512 Bytes |
| Maximum CPU Frequency | 40 MHz |
| Tension d'alimentation | 2.7 V to 5.5 V |
| I/O Pins | 16 |
| ADC | 16-channel, 10-bit, 2.5 µs conversion |
| Timers | 16-bit TPM (Timer/PWM Module) |
| Serial Interfaces | IIC, SCI (UART), LIN via SLIC + on-chip LIN PHY |
| LIN Physical Layer | Integrated, LIN 2.1 / SAE J2602 compliant |
| Interrupts | Up to 32 sources |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Boîtier | 28-pin TSSOP |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Process Technology | 0.25 µm CMOS |
| Debug Interface | Background Debug Mode (BDM) |
Configuration des broches de MC9S08SL8CTL
| Broche 1 | PTE4/TCLK2 — Port E bit 4 / TPM clock input |
| Broche 2 | PTE5 — Port E bit 5 |
| Broche 3 | PTE6 — Port E bit 6 |
| Broche 4 | VSS — Ground |
| Broche 5 | PTE7 — Port E bit 7 |
| Broche 6 | VDD — Supply voltage 2.7V-5.5V |
| Broche 7 | PTA0 — Port A bit 0 |
| Broche 8 | PTA1 — Port A bit 1 |
| Broche 9 | PTA2 — Port A bit 2 |
| Broche 10 | PTA3 — Port A bit 3 |
| Broche 11 | PTA4 — Port A bit 4 |
| Broche 12 | PTA5 — Port A bit 5 / reset config |
| Broche 13 | PTA6 — Port A bit 6 |
| Broche 14 | PTA7 — Port A bit 7 |
| Broche 15 | PTB0 — Port B bit 0 / ADC ch0 |
| Broche 16 | PTB1 — Port B bit 1 / ADC ch1 |
| Broche 17 | PTB2 — Port B bit 2 / ADC ch2 / SDA |
| Broche 18 | PTB3 — Port B bit 3 / ADC ch3 / SCL |
| Broche 19 | PTB4 — Port B bit 4 / ADC ch4 |
| Broche 20 | PTB5 — Port B bit 5 / ADC ch5 |
| Broche 21 | PTB6 — Port B bit 6 / ADC ch6 |
| Broche 22 | PTB7 — Port B bit 7 / ADC ch7 |
| Broche 23 | LIN — LIN bus line (LIN 2.1 PHY) |
| Broche 24 | VSUP — LIN supply (battery) |
| Broche 25 | VBAT — Battery voltage monitor |
| Broche 26 | RESET — External reset, active low |
| Broche 27 | BKGD/MS — Background Debug Mode / Mode Select |
| Broche 28 | PTC0 — Port C bit 0 / TPM ch0 |
Applications typiques
MC9S08SL8CTL convient pour 6 applications: Automotive Body Control Modules, LIN Slave HVAC Blower Controller, Ambient Lighting and Seat Heater Slave, Industrial Sensor Peripherals with LIN, Cost-Sensitive White Goods Appliances, Automotive Switch Packs and Mirror Modules.
Automotive Body Control Modules
The MC9S08SL8CTL is well suited for automotive body control modules such as door modules, seat controllers, and mirror switch packs. Its integrated LIN 2.1 physical layer eliminates the external transceiver, reducing BOM cost in the typical 5V body-electronic environment. The 40 MHz S08 core runs LIN stack and PWM comfortably while the 16-channel 10-bit ADC samples switch inputs and analog sensors. Operating from 2.7V-5.5V across -40 °C to +85 °C, it matches passenger-compartment temperature ranges. Compared to an MCU + discrete LIN solution, this integration cuts roughly $0.40-0.60 BOM in node volume.
Recommandé
LIN Slave HVAC Blower Controller
For HVAC blower slave nodes, the MC9S08SL8CTL's on-chip LIN 2.1 PHY and SLIC allow direct connection to the body controller's LIN bus without external transceiver. The 16-bit TPM generates the PWM command to the blower FET driver while the 10-bit ADC reads tach feedback. The 8KB Flash holds a LIN 2.1 slave stack plus diagnostic routines, while 512-byte EEPROM stores trim and fault history. At 40 MHz the core closes the LIN 2.1 scheduling without timing pressure, freeing cycles for housekeeping and fault management.
Recommandé
Ambient Lighting and Seat Heater Slave
In ambient lighting strips and seat heater pads, the MC9S08SL8CTL drives multi-channel LED PWM via its 16-bit TPM and communicates status over LIN to the master BCM. The wide 2.7V-5.5V supply range tolerates the wide battery-rail swings of cranking events. The 16-channel ADC monitors temperature and current sense for over-temperature protection. Compared to a discrete LED controller plus LIN transceiver, this single-chip approach saves roughly 30-40 percent PCB area in compact lighting fixtures.
Recommandé
Industrial Sensor Peripherals with LIN
Industrial sensor modules often use LIN for cost reasons. The MC9S08SL8CTL's integrated LIN physical layer and S08 core simplify sensor nodes that report temperature, pressure, or proximity over a LIN network. The 10-bit ADC digitizes sensor output while the 512-byte EEPROM stores calibration constants in the field. At 40 MHz the device runs LIN protocol stacks plus signal conditioning algorithms. Its industrial -40 °C to +85 °C temperature rating suits factory-floor sensor hubs and HVAC control equipment.
Recommandé
Cost-Sensitive White Goods Appliances
White-goods appliances - washing machines, dishwashers, refrigerators - use LIN or simple UART to interconnect user-interface, motor, and sensor boards. The MC9S08SL8CTL's integrated LIN PHY and IIC bus cover the typical appliance network. Its 40 MHz CPU handles user-interface polling and motor-control supervisory logic, while the 16-channel ADC monitors sensors (temperature, water level, door state). The 28-pin TSSOP package fits on compact UI and sensor boards, and the 2.7V-5.5V supply aligns with 5 V appliance rails.
Recommandé
Automotive Switch Packs and Mirror Modules
Door-mounted switch packs and mirror modules consolidate many discrete switches, LEDs, and small actuators behind a LIN slave interface. The MC9S08SL8CTL scans the switch matrix via ADC channels and drives indicator LEDs through the 16-bit TPM. The on-chip LIN 2.1 PHY eliminates external transceiver cost. BDM debug simplifies firmware iteration during validation. The wide supply range tolerates cranking and load-dump events common in 12 V automotive systems when paired with appropriate external protection.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S08SL8CTL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S08SL16CTJ |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Package | 28-pin TSSOP | 28-pin TSSOP |
| Core | S08 (HCS08) 8-bit | S08 (HCS08) 8-bit |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Program Flash | 8 KB | 16 KB |
| EEPROM | 512 Bytes | 512 Bytes |
| Integrated LIN PHY | Yes (LIN 2.1) | Yes (LIN 2.1) |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Lifecycle Status | NRND | Active (recommended for new designs) |
| Unit Price (qty 1, as of 2026-10-19) | $1.16 | $1.40 (approx.) |
Principaux différenciateurs
- Integrated LIN 2.1 physical layer and SLIC on-chip (vs MC9S08QE4CTG)
- Compact 28-pin TSSOP package vs larger LQFP variants (vs MC9S08QE4CTG (32-LQFP))
- NRND migration path to same-package 16KB Flash part (vs MC9S08SL16CTJ (active part))
Notes de conception
Place a 100 nF X7R ceramic decoupling capacitor within 5 mm of the VDD pin and a bulk 1-10 µF tantalum or aluminum on VSUP for the LIN regulator. The internal voltage regulator draws burst current up to 50 mA during Flash programming - bulk capacitance prevents rail collapse. Add a TVS diode on VSUP to absorb load-dump transients per ISO 7637-2.
Do not assume the VDD ADC ramp can deliver sufficient decoupling; the analog supply is shared with digital logic. Place a 100 nF near each VDD pin and route the ADC reference pins (VREFH/VREFL) with a star ground. Background debug mode (BKGD/MS) requires a 4.7 kΩ pull-up to VDD - omitting it prevents the BDM tool from acquiring the device.
The LIN physical-layer bus pin is sensitive to PCB capacitance - keep LIN traces short and free of via stubs to meet LIN 2.1 rise-time specs (max 22 V/µs into 1 nF load). Use a guard ring around the LIN trace tied to VSS. Reference NXP application note AN3494 for EMC-compliant LIN board layout.
Informations de conformité
RoHS compliant per NXP product environmental data. Not AEC-Q100 qualified for under-hood automotive use - passenger compartment only. Reach and conflict-minerals compliance per NXP supplier declarations. Halogen-free status not specifically stated in retrieved data.
