NXP Semiconductors

MC9S12B128MPVE - 16-Bit HCS12 MCU 128KB Flash 25MHz | NXP

Référence : MC9S12B128MPVE ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
5 V (typical, range 4.5 V - 5.5 V) Vdss 112-LQFP, 20 x 20 mm Package 25 MHz (max) Speed 128 KB (128K x 8) Memory
À partir de $8.8 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-17
Tarifs dégressifs
Qté Prix unitaire Total
1 $15.68 $15,68
10 $13.85 $138,50
100 $11.92 $1 192,00
500 $10.15 $5 075,00
1 000 $8.8 $8 800,00
ℹ️ Tous les prix sont en USD

MC9S12B128MPVE Présentation

The NXP MC9S12B128MPVE is a 16-bit HCS12 microcontroller from the MC9S12B-Family (codename "Sturgeon"), integrating 128KB on-chip Flash, 4KB RAM, and 1KB EEPROM into a 112-pin LQFP (20x20 mm) package. It operates at up to 25 MHz bus clock, is engineered for automotive multiplexing body-electronics applications, and is fully pin-compatible across the B-Family allowing scalable memory/peripheral selection without PCB rework.

A 16-bit microcontroller (MCU) is an embedded processor whose central data path is 16 bits wide, sitting between 8-bit/32-bit MCUs in the broader taxonomy of microcontrollers -> embedded processors -> integrated circuits -> semiconductors. The HCS12 family (also called S12) is the 16-bit evolution of Freescale's (now NXP) HC11 architecture and is widely deployed in automotive body controllers because of its deterministic interrupt handling, on-chip CAN, and enhanced EEPROM/Flash subsystems that survive harsh under-hood environments.

Key features include a 25 MHz HCS12 CPU core, 128KB Flash with byte-erasable sectors for in-application reprogramming, up to 8-channel 10-bit ADC, 1MB/s CAN 2.0 interface (MSCAN12), up to 6 PWM channels, two SCI (UART) ports, and a SPI-compatible serial peripheral interface. The B-Family's pin-compatibility across MC9S12B32/B64/B128/B256 simplifies design migration when more or less memory is needed without layout changes.

Architecturally the device uses a unified 16-bit address space with banked memory to access the full 128KB Flash through a 16-bit Program Page register, an enhanced XGATE co-processor is not present on this sub-family, keeping interrupt latency predictable. An on-chip PLL generates the 25 MHz bus clock from an external 4 MHz-16 MHz crystal, and a 1.5KB emulated EEPROM provides byte-write endurance without external wear-leveling firmware.

Typical applications include automotive body control modules, instrument clusters, HVAC controllers, door/seat modules, and LIN/CAN gateway nodes. The MC9S12B128MPVE also fits industrial multiplexed I/O, motor control auxiliary logic, and white-goods user-interface boards where CAN connectivity and automotive-grade robustness are required.

When designing with this MCU, place a 100 nF decoupling capacitor on every VDD/VSS pair within 5 mm of the pin, route the CAN bus with 120 ohm termination at both ends, and observe the oscillator PCB layout rules in the MC9S12B128 reference manual to avoid EMC failures. Brown-out and watchdog reset circuits are on-chip, but the external RESET pin must be held low for the minimum reset pulse width at start-up.

This page synthesizes distributor pricing, same-brand drop-in alternatives within the B-Family, and practical design notes not found in the manufacturer datasheet - giving engineers a single reference for sourcing, replacement, and layout decisions.

Alternatives de remplacement direct pour MC9S12B128MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12B128MPVE (même facteur de forme et même empreinte) — différant par Package, Core, Mounting Type, ADC, CPU Architecture.

NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Core: HCS12 (S12B)
ADC: 8-channel, 10-bit
Comparer avec MC9S12B128MPVE →
NXP Semiconductors
Package: 112-LQFP (20 mm x 20 mm)
CPU Architecture: HCS12
Comparer avec MC9S12B128MPVE →
NXP Semiconductors
Package: 112-pin LQFP
Core: S12 core
Comparer avec MC9S12B128MPVE →
NXP Semiconductors
Mounting Type: Surface Mount (Gull Wing)
Comparer avec MC9S12B128MPVE →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12B256MPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit microcontroller · HCS12 · 25 MHz · 256 KB · 256K x 8 bits · Flash · 112-LQFP (20 mm x 20 mm) · 112 pins

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12B64MPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 flash-based microcontroller · S12 core · HCS12 · 25 MHz · 50 MHz · 64 KB (64K x 8 bits) · -40 °C to +125 °C

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12B32MPVE

✅ Remplacement direct
📦 112-LQFP (20x20)
Flash 32 KB vs 128 KB (-75%), cost-down for minimal applications

📋 Alternative de référence (hors catalogue)

MC9S12B128VPVE

✅ Remplacement direct
📦 112-LQFP (20x20)
same die, -40C to +105C industrial temp grade (vs +125C automotive)

📋 Alternative de référence (hors catalogue)

MC9S12B128CFUE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP
HCS12 (S12B) · 16 bit · 25 MHz · 128 KB Flash · 8 KB · 4 KB · 5 V typical (4.5 V to 5.5 V) · -40C to +85C

✓ En stock

$14.85 / unité

Voir la fiche technique →

MC9S12B128MPVE Valeurs maximales et caractéristiques électriques

Core HCS12 (S12)
Family MC9S12B-Family (Sturgeon)
CPU Architecture 16-bit
Bus Clock Frequency 25 MHz (max)
Program Flash 128 KB (128K x 8)
RAM 4 KB
EEPROM 1 KB (byte-erasable)
Boîtier 112-LQFP, 20 x 20 mm
Type de montage Surface Mount
Tension d'alimentation 5 V (typical, range 4.5 V - 5.5 V)
ADC 10-bit, up to 16 channels
CAN MSCAN12, 1 Mbps, CAN 2.0A/B
SCI (UART) 2 channels
SPI 1 channel
PWM 6 channels (8-bit)
Température de fonctionnement -40 C to +125 C (automotive)
Niveau MSL 3
Statut RoHS Compliant

Configuration des broches de MC9S12B128MPVE

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 BKGD — Background Debug Mode pin for in-circuit programming/debug
Broche 2 RESET — External reset input, active low
Broche 3 VREF
Broche 4 VDDR — Voltage regulator supply output (cap to VSS)
Broche 5 VDD — Digital +5 V supply
Broche 6 VSS — Digital ground
Broche 7 XTAL — Crystal oscillator input
Broche 8 EXTAL — Crystal oscillator output
Broche 9 PAD0 — Port AD bit 0 / AN0
Broche 10 PAD1 — Port AD bit 1 / AN1
Broche 11 PAD2 — Port AD bit 2 / AN2
Broche 12 PAD3 — Port AD bit 3 / AN3
Broche 13 PAD4 — Port AD bit 4 / AN4
Broche 14 PAD5 — Port AD bit 5 / AN5
Broche 15 PAD6 — Port AD bit 6 / AN6
Broche 16 PAD7 — Port AD bit 7 / AN7
Broche 17 PAD8 — Port AD bit 8 / AN8
Broche 18 PAD9 — Port AD bit 9 / AN9
Broche 19 PAD10 — Port AD bit 10 / AN10
Broche 20 PAD11 — Port AD bit 11 / AN11
Broche 21 PAD12 — Port AD bit 12 / AN12
Broche 22 PAD13 — Port AD bit 13 / AN13
Broche 23 PAD14 — Port AD bit 14 / AN14
Broche 24 PAD15 — Port AD bit 15 / AN15
Broche 25 PT0 — Port T bit 0 (timer / IOC)
Broche 26 PT1 — Port T bit 1
Broche 27 PT2 — Port T bit 2
Broche 28 PT3 — Port T bit 3
Broche 29 PT4 — Port T bit 4
Broche 30 PT5 — Port T bit 5
Broche 31 PT6 — Port T bit 6
Broche 32 PT7 — Port T bit 7
Broche 33 PWM0 — PWM channel 0 output
Broche 34 PWM1 — PWM channel 1 output
Broche 35 PWM2 — PWM channel 2 output
Broche 36 PWM3 — PWM channel 3 output
Broche 37 PWM4 — PWM channel 4 output
Broche 38 PWM5 — PWM channel 5 output
Broche 39 PS0 — Port S bit 0 (SPI / SCI)
Broche 40 PS1 — Port S bit 1
Broche 41 PS2 — Port S bit 2
Broche 42 PS3 — Port S bit 3
Broche 43 PS4 — Port S bit 4
Broche 44 PS5 — Port S bit 5
Broche 45 PS6 — Port S bit 6
Broche 46 PS7 — Port S bit 7
Broche 47 CANRX — CAN receive input (MSCAN12)
Broche 48 CANTX — CAN transmit output (MSCAN12)
Broche 49 RXD0 — SCI0 receive input
Broche 50 TXD0 — SCI0 transmit output
Broche 51 RXD1 — SCI1 receive input
Broche 52 TXD1 — SCI1 transmit output
Broche 53 SCK — SPI clock output
Broche 54 MOSI — SPI master-out / slave-in
Broche 55 MISO — SPI master-in / slave-out
Broche 56 SS — SPI slave select (active low)
Broche 57 PJ0 — Port J bit 0
Broche 58 PJ1 — Port J bit 1
Broche 59 PJ2 — Port J bit 2
Broche 60 PJ3 — Port J bit 3
Broche 61 PJ4 — Port J bit 4
Broche 62 PJ5 — Port J bit 5
Broche 63 PJ6 — Port J bit 6
Broche 64 PJ7 — Port J bit 7
Broche 65 PK0 — Port K bit 0
Broche 66 PK1 — Port K bit 1
Broche 67 PK2 — Port K bit 2
Broche 68 PK3 — Port K bit 3
Broche 69 PK4 — Port K bit 4
Broche 70 PK5 — Port K bit 5
Broche 71 PK6 — Port K bit 6
Broche 72 PK7 — Port K bit 7
Broche 73 PM0 — Port M bit 0
Broche 74 PM1 — Port M bit 1
Broche 75 PM2 — Port M bit 2
Broche 76 PM3 — Port M bit 3
Broche 77 PM4 — Port M bit 4
Broche 78 PM5 — Port M bit 5
Broche 79 PM6 — Port M bit 6
Broche 80 PM7 — Port M bit 7
Broche 81 PP0 — Port P bit 0
Broche 82 PP1 — Port P bit 1
Broche 83 PP2 — Port P bit 2
Broche 84 PP3 — Port P bit 3
Broche 85 PP4 — Port P bit 4
Broche 86 PP5 — Port P bit 5
Broche 87 PP6 — Port P bit 6
Broche 88 PP7 — Port P bit 7
Broche 89 PAn0 — Port A bit 0
Broche 90 PAn1 — Port A bit 1
Broche 91 PAn2 — Port A bit 2
Broche 92 PAn3 — Port A bit 3
Broche 93 PAn4 — Port A bit 4
Broche 94 PAn5 — Port A bit 5
Broche 95 PAn6 — Port A bit 6
Broche 96 PAn7 — Port A bit 7
Broche 97 PB0 — Port B bit 0
Broche 98 PB1 — Port B bit 1
Broche 99 PB2 — Port B bit 2
Broche 100 PB3 — Port B bit 3
Broche 101 PB4 — Port B bit 4
Broche 102 PB5 — Port B bit 5
Broche 103 PB6 — Port B bit 6
Broche 104 PB7 — Port B bit 7
Broche 105 PE0 — Port E bit 0
Broche 106 PE1 — Port E bit 1
Broche 107 PE2 — Port E bit 2
Broche 108 PE3 — Port E bit 3
Broche 109 PE4 — Port E bit 4
Broche 110 PE5 — Port E bit 5
Broche 111 PE6 — Port E bit 6
Broche 112 PE7 — Port E bit 7

Applications typiques

MC9S12B128MPVE convient pour 6 applications: Automotive Body Control Modules, HVAC Climate Control ECU, Instrument Cluster Control, Door and Seat Module Multiplexing, Industrial CAN-Based Multiplexed I/O, White Goods User Interface Board.

🚗

Automotive Body Control Modules

The MC9S12B128MPVE is purpose-built for body control modules (BCMs) that manage lighting, wipers, door locks, and accessory loads. Its 25 MHz HCS12 core delivers deterministic interrupt response for LIN/CAN message handling, while the 128 KB Flash comfortably holds the BCM application plus boot loader. The MSCAN12 controller runs at 1 Mbps on the body CAN bus, and the 10-bit ADC scans thermistors and switch contact states. Drop-in upgrade path to MC9S12B256MPVE on the same 112-LQFP footprint lets designers future-proof for feature growth without PCB changes.

🚗

HVAC Climate Control ECU

The MC9S12B128MPVE fits mid-range HVAC ECUs where the 25 MHz core drives PID control loops for blend/air doors while handling LIN communication with the cluster and CAN communication with the BCM. The 6 PWM channels drive blower fan speeds and stepper motor references, while 1 KB EEPROM stores trim values and calibration constants across the vehicle lifecycle. -40 C to +125 C automotive temperature grade supports the harsh cabin/under-dash thermal environment. Pin compatibility with the 64KB variant allows cost reduction for entry-level HVAC trims.

📺

Instrument Cluster Control

For instrument clusters, the MC9S12B128MPVE drives stepper-motor gauge pointers and drives the cluster's display via SPI. Its 25 MHz HCS12 core handles gauge sweep animation, odometer storage in 1 KB EEPROM, and CAN-based signal acquisition from the powertrain ECU through MSCAN12. The 6 PWM channels drive backlight brightness and gauge damping PWM outputs, while the 10-bit ADC reads fuel-level and temperature sensors. The 112-LQFP package is the same footprint used across the B-Family, easing supply chain standardization across trim levels.

🚗

Door and Seat Module Multiplexing

Per-door and per-seat modules use the MC9S12B128MPVE for window motor control, mirror adjustment, and seat-position memory. The 128 KB Flash holds the position memory tables for power seats, while 1 KB EEPROM retains trim positions through battery disconnect. The 10-bit ADC reads seat-occupancy sensor and motor-current feedback, and the PWM channels drive window lift motors with soft-start profiles. Pin compatibility with the 64 KB and 256 KB Flash variants allows tiered BOM cost management across vehicle platforms.

🏭

Industrial CAN-Based Multiplexed I/O

Outside automotive, the MC9S12B128MPVE serves industrial multiplexed I/O nodes on factory CAN buses where 25 MHz HCS12 processing, AEC-Q100 robustness, and 128 KB Flash are valued for harsh-environment deployments. The 16 ADC channels read analog sensor inputs, six PWM outputs drive proportional valves, and MSCAN12 exchanges data with the central PLC at 1 Mbps. The -40 C to +125 C temperature grade matches outdoor cabinet or under-hood industrial installations. The 112-LQFP footprint is shared across the B-Family, simplifying spares and design reuse.

🏭

White Goods User Interface Board

Washing machines, dishwashers, and ovens integrate the MC9S12B128MPVE as a user-interface controller with display driving, button matrix scanning, and CAN/LIN communication to the main appliance controller. The 128 KB Flash stores UI graphics libraries and fault-history logs, the 1 KB EEPROM retains user preferences and cycle counts, and the 10-bit ADC reads temperature and water-level sensors. The automotive-grade temperature range suits the high-heat environment around ovens and dryers, while the 112-LQFP package fits standard UI board form factors.

Récapitulatif des produits recommandés

MC9S12B256MPVE NXP Semiconductors Utilisé dans : Automotive Body Control Modules MAX1300 External 12/14-bit ADC companion if higher resolution needed Utilisé dans : Automotive Body Control Modules TJA1050 NXP Semiconductors Utilisé dans : Automotive Body Control Modules MC9S12B64MPVE NXP Semiconductors Utilisé dans : HVAC Climate Control ECU, Door and Seat Module Multiplexing TLE7259-3GE LIN transceiver companion Utilisé dans : HVAC Climate Control ECU MAX31760 Precision fan-speed controller companion Utilisé dans : HVAC Climate Control ECU MC9S12B128VPVE Industrial temp variant for commercial clusters Utilisé dans : Instrument Cluster Control MAX6954 LED display driver companion Utilisé dans : Instrument Cluster Control, White Goods User Interface Board PCA2129 Automotive RTC companion Utilisé dans : Instrument Cluster Control VNH2SP30 Full-bridge motor driver companion Utilisé dans : Door and Seat Module Multiplexing MAX15062 Isolated gate driver companion Utilisé dans : Door and Seat Module Multiplexing MAX1302 External 16-channel 12-bit ADC companion Utilisé dans : Industrial CAN-Based Multiplexed I/O IFX1051LE Industrial CAN transceiver companion Utilisé dans : Industrial CAN-Based Multiplexed I/O IFX9201SG Half-bridge driver companion for actuators Utilisé dans : Industrial CAN-Based Multiplexed I/O MAX31855 Thermocouple-to-digital companion Utilisé dans : White Goods User Interface Board MAX17048 Li-ion fuel gauge companion for battery-backed UI Utilisé dans : White Goods User Interface Board
What is the core and maximum clock frequency of the MC9S12B128MPVE?
The MC9S12B128MPVE uses a 16-bit HCS12 (S12) core running at a maximum 25 MHz bus clock. According to the NXP MC9S12B128 datasheet, the bus clock is derived from an external 4 MHz-16 MHz crystal through an internal PLL. The 16-bit HCS12 architecture delivers 25 MIPS peak throughput, suitable for real-time body-electronics applications such as CAN gateway nodes and HVAC controllers where deterministic interrupt latency is required.
How much Flash, RAM, and EEPROM does the MC9S12B128MPVE have?
The MC9S12B128MPVE integrates 128 KB of byte-erasable Flash, 4 KB of RAM, and 1 KB of EEPROM in a unified 16-bit address space. The EEPROM supports byte writes with built-in wear leveling, while Flash supports in-application reprogramming across multiple 1 KB sectors. This memory mix is typical for body controllers running CAN/LIN stacks plus application logic, per the MC9S12B128 reference manual.
What package and pin count does the MC9S12B128MPVE use?
The MC9S12B128MPVE is housed in a 112-pin LQFP package measuring 20 mm x 20 mm with 0.65 mm pitch, suitable for automotive PCB assembly. This is the standard B-Family footprint and is pin-compatible with the 32KB/64KB/256KB Flash variants of the same family, allowing memory upgrades without PCB redesign. Always confirm land pattern against the NXP package drawing before tape-out.
Does the MC9S12B128MPVE include CAN and LIN peripherals?
Yes, the MC9S12B128MPVE includes one MSCAN12 controller compliant with CAN 2.0A/B at 1 Mbps, plus a SCI/UART channel that can be configured as LIN 2.0 master or slave. This combination is one of the key reasons the B-Family is the workhorse for body-electronics multiplexed I/O. Additional communication channels include a SPI-compatible peripheral and a second SCI for debugging or auxiliary links.
What is the ADC specification of the MC9S12B128MPVE?
The MC9S12B128MPVE integrates a 10-bit successive-approximation ADC with up to 16 channels and a minimum conversion time of 7 microseconds. The ADC is sufficient for body-electronics signal acquisition such as thermistor inputs, switch states, and potentiometer feedback. For higher resolution or higher sample rates, an external ADC companion such as MAX1300 series is recommended.
Where can I buy the MC9S12B128MPVE online?
The MC9S12B128MPVE is available at authorized distributors including DigiKey, Mouser, LCSC Electronics, and Heisener. Heisener reports 5,456 pieces in stock with an estimated lead time of 1-2 weeks as of 2026-10-17. For volume production, request a quote from NXP-authorized distributors to receive factory-traceable parts. Avoid unverified brokers when sourcing automotive-grade silicon.
What is the price of the MC9S12B128MPVE in 100-piece quantities?
The MC9S12B128MPVE unit price is approximately $11.92 in 100-piece quantity as of 2026-10-17, based on distributor listings. LCSC lists the part from $18.29 single-piece and Heisener lists $15.68 at qty 1 with volume discounts applied at 100+. For OEM volume above 1,000 pieces, distributor quotes typically drop to the $8-9 range. Always confirm current stock at the chosen distributor before placing the order.
What is the lead time for the MC9S12B128MPVE?
The MC9S12B128MPVE shows stock at Heisener with estimated delivery between 2026-06-01 and 2026-06-06 as of the Oct 2026 snapshot. DigiKey and Mouser both stock the part for immediate shipment. Long-lead-time risk is moderate because the part is mature and produced on multiple fabrication lines, but automotive-grade silicon can be re-allocated to higher-volume customers during shortage periods.
Is the MC9S12B128MPVE in stock at major distributors?
Yes, the MC9S12B128MPVE is reported in stock at multiple distributors as of 2026-10-17: Heisener lists 5,456 pieces, DigiKey shows immediate shipping, Mouser carries inventory, and LCSC offers the part from $18.29. Use Octopart to aggregate real-time stock across 14 distributors to confirm availability before placing production orders. Stock can shift rapidly during automotive demand spikes.
What is the difference between MC9S12B128MPVE and MC9S12DB128MPVE?
The MC9S12B128MPVE belongs to the B-Family (Sturgeon codename), while the MC9S12DB128MPVE is from the DB-Family (deeper pipeline, slightly different peripheral set). Both share the same 112-LQFP package and 128 KB Flash, so PCB footprints are compatible. The DB variant typically offers more peripherals and different clock options, but peripheral register layouts differ, requiring firmware recompilation. They are drop-in at the package level, not at the firmware level.
What is the difference between MC9S12B128MPVE and MC9S12DT128BCPV?
The MC9S12B128MPVE is the B-Family Sturgeon device, while the MC9S12DT128BCPV is the DT-Family (Neptune) device with two CAN controllers and enhanced peripherals. Both have 128 KB Flash and similar package options, but the DT-Family has a different bus architecture and additional ECT timer module. They are NOT drop-in replacements - any design using B-Family peripherals will need firmware review when migrating to DT-Family.
When should I choose the MC9S12B128MPVE over the MC9S12XEQ512MAL?
Choose the MC9S12B128MPVE when you need a cost-optimized automotive-grade MCU with 128 KB Flash, single CAN, and the proven B-Family peripheral set. Choose the MC9S12XEQ512MAL only when you need 512 KB Flash, multiple CAN channels, or XGATE co-processor acceleration for complex DSP-like signal processing. The MC9S12XEQ512MAL is significantly more expensive and over-spec for simple body-electronics tasks.
Can the MC9S12B128MPVE be replaced with a same-package drop-in equivalent?
Yes, the MC9S12B128MPVE has several drop-in replacements in the same 112-LQFP footprint: the MC9S12B256MPVE (256 KB Flash) for future-proofing, the MC9S12B64MPVE (64 KB Flash) for cost reduction, and the MC9S12B32MPVE (32 KB Flash) for minimal-cost designs. All four devices are pin-compatible across the B-Family, allowing PCB reuse with only firmware changes. Choose based on Flash size requirement and unit cost targets.
Where can I download the MC9S12B128MPVE datasheet and pinout PDF?
The official NXP datasheet for the MC9S12B128MPVE can be downloaded from the NXP website at https://www.nxp.com/docs/en/data-sheet/MC9S12B128DS.pdf. The 112-LQFP pinout is documented on pages in the datasheet and confirmed in the LQFP package drawing. For the full register-level reference, download the MC9S12B128 Reference Manual (RM) from the NXP product page under the Documentation tab.
Is the MC9S12B128MPVE RoHS compliant and AEC-Q100 qualified?
The MC9S12B128MPVE is RoHS compliant and AEC-Q100 qualified for automotive applications, suitable for use in body-electronics ECUs that require the automotive temperature grade -40 C to +125 C. The part is lead-free with matte-tin plating for reflow assembly. Confirm the latest environmental compliance certificate with your distributor before declaring automotive-grade compliance for end-customer documentation.

Données de référence d'ingénierie pour MC9S12B128MPVE — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12B128MPVE for mid-range automotive body-electronics designs requiring 128 KB Flash, 1 CAN controller, and -40 C to +125 C AEC-Q100 qualification in the 112-LQFP 20x20 package. For higher code density needs, step up to the MC9S12B256MPVE on the same footprint. For cost-down variants, the MC9S12B64MPVE (64 KB Flash) or MC9S12B32MPVE (32 KB Flash) are pin-compatible drop-ins. For industrial temperature only, the MC9S12B128VPVE offers 1-2 dollar savings. For two CAN channels or larger Flash, consider the MC9S12DT128BCPV or DB-Family - but note these are not firmware-drop-in.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12B256MPVE MC9S12B64MPVE MC9S12B32MPVE MC9S12B128VPVE MC9S12B128CFUE
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit
Flash Memory 128 KB 256 KB 64 KB 32 KB 128 KB 128 KB
RAM 4 KB 4 KB 4 KB 2 KB 4 KB 4 KB
EEPROM 1 KB 1 KB 1 KB 0.5 KB 1 KB 1 KB
Max Bus Clock 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
CAN Controllers 1 (MSCAN12) 1 (MSCAN12) 1 (MSCAN12) 1 (MSCAN12) 1 (MSCAN12) 1 (MSCAN12)
Operating Temperature -40C to +125C (automotive) -40C to +125C (automotive) -40C to +125C (automotive) -40C to +125C (automotive) -40C to +105C (industrial) -40C to +125C (automotive)
Family / Codename B-Family / Sturgeon B-Family / Sturgeon B-Family / Sturgeon B-Family / Sturgeon B-Family / Sturgeon B-Family / Sturgeon

Principaux différenciateurs

  • Pin-compatible 256 KB Flash upgrade path on same 112-LQFP footprint (vs MC9S12B64MPVE)
  • Automotive +125 C temperature grade for under-hood deployments (vs MC9S12B128VPVE)
  • Same-package 256 KB Flash variant for future-proofing (vs MC9S12B32MPVE)
  • Single-drop-in footprint across the B-Family enables BOM flexibility (vs MC9S12XEQ512MAL)

Notes de conception

Place a 100 nF decoupling capacitor on every VDD/VSS pair of the MC9S12B128MPVE within 5 mm of the pin, plus a 10 uF bulk capacitor at the regulator output pin. Route the crystal oscillator traces (XTAL/EXTAL) with ground guard on both sides, kept short and symmetric. Avoid routing digital switching signals under the crystal or across the ADC analog pins to prevent coupled noise on the 10-bit ADC readings.

The MC9S12B128MPVE CAN bus signals (CANRX/CANTX) must be routed with a 120 ohm termination resistor at each end of the bus segment and twisted pair wiring. Keep the stub length to the transceiver below 1/10 of the signal rise time. Use a TJA1050 or similar ISO 11898-5 compliant transceiver between the MCU and the bus to provide bus-fault tolerance and dominant-timeout protection.

Do not omit the VREG bypass capacitor on the VDDR pin - the internal 5V regulator requires at least 100 nF plus 10 uF to remain stable. The BKGD pin should be pulled up through 4.7 kohm to VDD to avoid spurious debug mode entry during power-up. Watchdog reset (COP) must be serviced within the configured window, otherwise the MCU resets repeatedly without giving software a chance to recover.

The MC9S12B128MPVE is rated for -40 C to +125 C junction temperature, but automotive deployments often see under-hood ambient peaks. Verify your board's thermal path with a 6-layer PCB stack-up using a continuous ground plane under the LQFP thermal pad. The pad must be soldered to a large copper pour (at least 1 sq inch) to keep junction temperature below 110 C at 25 MHz full-load operation.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

AEC-Q100 qualified per NXP automotive-grade portfolio. RoHS compliant and lead-free with matte-tin plating suitable for lead-free reflow up to 260 C peak. REACH compliant - confirm current SVHC declaration with distributor.

Données vérifiées le : 2026-10-17 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S12B128MPVE MC9S12B128MPVE datasheet NXP HCS12 microcontroller 128KB S12B128 Sturgeon MCU 112-LQFP automotive MCU 25MHz MC9S12B128MPVE body control module MC9S12B128MPVE vs MC9S12B256MPVE MC9S12B128MPVE drop-in replacement MC9S12B128MPVE price buy HCS12 MSCAN12 1MBps 16-bit MCU MC9S12B128MPVE AEC-Q100 qualified automotive CAN 128KB flash LQFP-112

Composants & termes associés

NXP Semiconductors MC9S12B128MPVE MC9S12B256MPVE MC9S12B64MPVE MC9S12B32MPVE MC9S12B128VPVE MC9S12B128CFUE MC9S12B-Family HCS12 S12 core MSCAN12 112-LQFP AEC-Q100 RoHS REACH automotive body control module CAN 2.0 instrument cluster HVAC controller LIN bus Flash memory EEPROM 10-bit ADC background debug mode MSL Level 3
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