MC9S12B128MPVE - 16-Bit HCS12 MCU 128KB Flash 25MHz | NXP
부품 번호: MC9S12B128MPVE ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $15.68 | $15.68 |
| 10 | $13.85 | $138.50 |
| 100 | $11.92 | $1,192.00 |
| 500 | $10.15 | $5,075.00 |
| 1,000 | $8.8 | $8,800.00 |
MC9S12B128MPVE 개요
A 16-bit microcontroller (MCU) is an embedded processor whose central data path is 16 bits wide, sitting between 8-bit/32-bit MCUs in the broader taxonomy of microcontrollers -> embedded processors -> integrated circuits -> semiconductors. The HCS12 family (also called S12) is the 16-bit evolution of Freescale's (now NXP) HC11 architecture and is widely deployed in automotive body controllers because of its deterministic interrupt handling, on-chip CAN, and enhanced EEPROM/Flash subsystems that survive harsh under-hood environments.
Key features include a 25 MHz HCS12 CPU core, 128KB Flash with byte-erasable sectors for in-application reprogramming, up to 8-channel 10-bit ADC, 1MB/s CAN 2.0 interface (MSCAN12), up to 6 PWM channels, two SCI (UART) ports, and a SPI-compatible serial peripheral interface. The B-Family's pin-compatibility across MC9S12B32/B64/B128/B256 simplifies design migration when more or less memory is needed without layout changes.
Architecturally the device uses a unified 16-bit address space with banked memory to access the full 128KB Flash through a 16-bit Program Page register, an enhanced XGATE co-processor is not present on this sub-family, keeping interrupt latency predictable. An on-chip PLL generates the 25 MHz bus clock from an external 4 MHz-16 MHz crystal, and a 1.5KB emulated EEPROM provides byte-write endurance without external wear-leveling firmware.
Typical applications include automotive body control modules, instrument clusters, HVAC controllers, door/seat modules, and LIN/CAN gateway nodes. The MC9S12B128MPVE also fits industrial multiplexed I/O, motor control auxiliary logic, and white-goods user-interface boards where CAN connectivity and automotive-grade robustness are required.
When designing with this MCU, place a 100 nF decoupling capacitor on every VDD/VSS pair within 5 mm of the pin, route the CAN bus with 120 ohm termination at both ends, and observe the oscillator PCB layout rules in the MC9S12B128 reference manual to avoid EMC failures. Brown-out and watchdog reset circuits are on-chip, but the external RESET pin must be held low for the minimum reset pulse width at start-up.
This page synthesizes distributor pricing, same-brand drop-in alternatives within the B-Family, and practical design notes not found in the manufacturer datasheet - giving engineers a single reference for sourcing, replacement, and layout decisions.
드롭인 대체품: MC9S12B128MPVE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12B128MPVE (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core, Mounting Type, ADC, CPU Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S12B256MPVE
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S12B64MPVE
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S12B32MPVE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12B128VPVE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12B128CFUE
✅ 드롭인✓ 재고 있음
$14.85 / 개
데이터시트 보기 →MC9S12B128MPVE 최대 정격 & 전기적 특성
| Core | HCS12 (S12) |
| Family | MC9S12B-Family (Sturgeon) |
| CPU Architecture | 16-bit |
| Bus Clock Frequency | 25 MHz (max) |
| Program Flash | 128 KB (128K x 8) |
| RAM | 4 KB |
| EEPROM | 1 KB (byte-erasable) |
| 패키지 | 112-LQFP, 20 x 20 mm |
| 실장 유형 | Surface Mount |
| 공급 전압 | 5 V (typical, range 4.5 V - 5.5 V) |
| ADC | 10-bit, up to 16 channels |
| CAN | MSCAN12, 1 Mbps, CAN 2.0A/B |
| SCI (UART) | 2 channels |
| SPI | 1 channel |
| PWM | 6 channels (8-bit) |
| 동작 온도 | -40 C to +125 C (automotive) |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
MC9S12B128MPVE 핀 구성
| 핀 1 | BKGD — Background Debug Mode pin for in-circuit programming/debug |
| 핀 2 | RESET — External reset input, active low |
| 핀 3 | VREF |
| 핀 4 | VDDR — Voltage regulator supply output (cap to VSS) |
| 핀 5 | VDD — Digital +5 V supply |
| 핀 6 | VSS — Digital ground |
| 핀 7 | XTAL — Crystal oscillator input |
| 핀 8 | EXTAL — Crystal oscillator output |
| 핀 9 | PAD0 — Port AD bit 0 / AN0 |
| 핀 10 | PAD1 — Port AD bit 1 / AN1 |
| 핀 11 | PAD2 — Port AD bit 2 / AN2 |
| 핀 12 | PAD3 — Port AD bit 3 / AN3 |
| 핀 13 | PAD4 — Port AD bit 4 / AN4 |
| 핀 14 | PAD5 — Port AD bit 5 / AN5 |
| 핀 15 | PAD6 — Port AD bit 6 / AN6 |
| 핀 16 | PAD7 — Port AD bit 7 / AN7 |
| 핀 17 | PAD8 — Port AD bit 8 / AN8 |
| 핀 18 | PAD9 — Port AD bit 9 / AN9 |
| 핀 19 | PAD10 — Port AD bit 10 / AN10 |
| 핀 20 | PAD11 — Port AD bit 11 / AN11 |
| 핀 21 | PAD12 — Port AD bit 12 / AN12 |
| 핀 22 | PAD13 — Port AD bit 13 / AN13 |
| 핀 23 | PAD14 — Port AD bit 14 / AN14 |
| 핀 24 | PAD15 — Port AD bit 15 / AN15 |
| 핀 25 | PT0 — Port T bit 0 (timer / IOC) |
| 핀 26 | PT1 — Port T bit 1 |
| 핀 27 | PT2 — Port T bit 2 |
| 핀 28 | PT3 — Port T bit 3 |
| 핀 29 | PT4 — Port T bit 4 |
| 핀 30 | PT5 — Port T bit 5 |
| 핀 31 | PT6 — Port T bit 6 |
| 핀 32 | PT7 — Port T bit 7 |
| 핀 33 | PWM0 — PWM channel 0 output |
| 핀 34 | PWM1 — PWM channel 1 output |
| 핀 35 | PWM2 — PWM channel 2 output |
| 핀 36 | PWM3 — PWM channel 3 output |
| 핀 37 | PWM4 — PWM channel 4 output |
| 핀 38 | PWM5 — PWM channel 5 output |
| 핀 39 | PS0 — Port S bit 0 (SPI / SCI) |
| 핀 40 | PS1 — Port S bit 1 |
| 핀 41 | PS2 — Port S bit 2 |
| 핀 42 | PS3 — Port S bit 3 |
| 핀 43 | PS4 — Port S bit 4 |
| 핀 44 | PS5 — Port S bit 5 |
| 핀 45 | PS6 — Port S bit 6 |
| 핀 46 | PS7 — Port S bit 7 |
| 핀 47 | CANRX — CAN receive input (MSCAN12) |
| 핀 48 | CANTX — CAN transmit output (MSCAN12) |
| 핀 49 | RXD0 — SCI0 receive input |
| 핀 50 | TXD0 — SCI0 transmit output |
| 핀 51 | RXD1 — SCI1 receive input |
| 핀 52 | TXD1 — SCI1 transmit output |
| 핀 53 | SCK — SPI clock output |
| 핀 54 | MOSI — SPI master-out / slave-in |
| 핀 55 | MISO — SPI master-in / slave-out |
| 핀 56 | SS — SPI slave select (active low) |
| 핀 57 | PJ0 — Port J bit 0 |
| 핀 58 | PJ1 — Port J bit 1 |
| 핀 59 | PJ2 — Port J bit 2 |
| 핀 60 | PJ3 — Port J bit 3 |
| 핀 61 | PJ4 — Port J bit 4 |
| 핀 62 | PJ5 — Port J bit 5 |
| 핀 63 | PJ6 — Port J bit 6 |
| 핀 64 | PJ7 — Port J bit 7 |
| 핀 65 | PK0 — Port K bit 0 |
| 핀 66 | PK1 — Port K bit 1 |
| 핀 67 | PK2 — Port K bit 2 |
| 핀 68 | PK3 — Port K bit 3 |
| 핀 69 | PK4 — Port K bit 4 |
| 핀 70 | PK5 — Port K bit 5 |
| 핀 71 | PK6 — Port K bit 6 |
| 핀 72 | PK7 — Port K bit 7 |
| 핀 73 | PM0 — Port M bit 0 |
| 핀 74 | PM1 — Port M bit 1 |
| 핀 75 | PM2 — Port M bit 2 |
| 핀 76 | PM3 — Port M bit 3 |
| 핀 77 | PM4 — Port M bit 4 |
| 핀 78 | PM5 — Port M bit 5 |
| 핀 79 | PM6 — Port M bit 6 |
| 핀 80 | PM7 — Port M bit 7 |
| 핀 81 | PP0 — Port P bit 0 |
| 핀 82 | PP1 — Port P bit 1 |
| 핀 83 | PP2 — Port P bit 2 |
| 핀 84 | PP3 — Port P bit 3 |
| 핀 85 | PP4 — Port P bit 4 |
| 핀 86 | PP5 — Port P bit 5 |
| 핀 87 | PP6 — Port P bit 6 |
| 핀 88 | PP7 — Port P bit 7 |
| 핀 89 | PAn0 — Port A bit 0 |
| 핀 90 | PAn1 — Port A bit 1 |
| 핀 91 | PAn2 — Port A bit 2 |
| 핀 92 | PAn3 — Port A bit 3 |
| 핀 93 | PAn4 — Port A bit 4 |
| 핀 94 | PAn5 — Port A bit 5 |
| 핀 95 | PAn6 — Port A bit 6 |
| 핀 96 | PAn7 — Port A bit 7 |
| 핀 97 | PB0 — Port B bit 0 |
| 핀 98 | PB1 — Port B bit 1 |
| 핀 99 | PB2 — Port B bit 2 |
| 핀 100 | PB3 — Port B bit 3 |
| 핀 101 | PB4 — Port B bit 4 |
| 핀 102 | PB5 — Port B bit 5 |
| 핀 103 | PB6 — Port B bit 6 |
| 핀 104 | PB7 — Port B bit 7 |
| 핀 105 | PE0 — Port E bit 0 |
| 핀 106 | PE1 — Port E bit 1 |
| 핀 107 | PE2 — Port E bit 2 |
| 핀 108 | PE3 — Port E bit 3 |
| 핀 109 | PE4 — Port E bit 4 |
| 핀 110 | PE5 — Port E bit 5 |
| 핀 111 | PE6 — Port E bit 6 |
| 핀 112 | PE7 — Port E bit 7 |
일반적인 애플리케이션
MC9S12B128MPVE 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, HVAC Climate Control ECU, Instrument Cluster Control, Door and Seat Module Multiplexing, Industrial CAN-Based Multiplexed I/O, White Goods User Interface Board.
Automotive Body Control Modules
The MC9S12B128MPVE is purpose-built for body control modules (BCMs) that manage lighting, wipers, door locks, and accessory loads. Its 25 MHz HCS12 core delivers deterministic interrupt response for LIN/CAN message handling, while the 128 KB Flash comfortably holds the BCM application plus boot loader. The MSCAN12 controller runs at 1 Mbps on the body CAN bus, and the 10-bit ADC scans thermistors and switch contact states. Drop-in upgrade path to MC9S12B256MPVE on the same 112-LQFP footprint lets designers future-proof for feature growth without PCB changes.
추천
HVAC Climate Control ECU
The MC9S12B128MPVE fits mid-range HVAC ECUs where the 25 MHz core drives PID control loops for blend/air doors while handling LIN communication with the cluster and CAN communication with the BCM. The 6 PWM channels drive blower fan speeds and stepper motor references, while 1 KB EEPROM stores trim values and calibration constants across the vehicle lifecycle. -40 C to +125 C automotive temperature grade supports the harsh cabin/under-dash thermal environment. Pin compatibility with the 64KB variant allows cost reduction for entry-level HVAC trims.
추천
Instrument Cluster Control
For instrument clusters, the MC9S12B128MPVE drives stepper-motor gauge pointers and drives the cluster's display via SPI. Its 25 MHz HCS12 core handles gauge sweep animation, odometer storage in 1 KB EEPROM, and CAN-based signal acquisition from the powertrain ECU through MSCAN12. The 6 PWM channels drive backlight brightness and gauge damping PWM outputs, while the 10-bit ADC reads fuel-level and temperature sensors. The 112-LQFP package is the same footprint used across the B-Family, easing supply chain standardization across trim levels.
추천
Door and Seat Module Multiplexing
Per-door and per-seat modules use the MC9S12B128MPVE for window motor control, mirror adjustment, and seat-position memory. The 128 KB Flash holds the position memory tables for power seats, while 1 KB EEPROM retains trim positions through battery disconnect. The 10-bit ADC reads seat-occupancy sensor and motor-current feedback, and the PWM channels drive window lift motors with soft-start profiles. Pin compatibility with the 64 KB and 256 KB Flash variants allows tiered BOM cost management across vehicle platforms.
추천
Industrial CAN-Based Multiplexed I/O
Outside automotive, the MC9S12B128MPVE serves industrial multiplexed I/O nodes on factory CAN buses where 25 MHz HCS12 processing, AEC-Q100 robustness, and 128 KB Flash are valued for harsh-environment deployments. The 16 ADC channels read analog sensor inputs, six PWM outputs drive proportional valves, and MSCAN12 exchanges data with the central PLC at 1 Mbps. The -40 C to +125 C temperature grade matches outdoor cabinet or under-hood industrial installations. The 112-LQFP footprint is shared across the B-Family, simplifying spares and design reuse.
추천
White Goods User Interface Board
Washing machines, dishwashers, and ovens integrate the MC9S12B128MPVE as a user-interface controller with display driving, button matrix scanning, and CAN/LIN communication to the main appliance controller. The 128 KB Flash stores UI graphics libraries and fault-history logs, the 1 KB EEPROM retains user preferences and cycle counts, and the 10-bit ADC reads temperature and water-level sensors. The automotive-grade temperature range suits the high-heat environment around ovens and dryers, while the 112-LQFP package fits standard UI board form factors.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S12B128MPVE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S12B256MPVE | MC9S12B64MPVE | MC9S12B32MPVE | MC9S12B128VPVE | MC9S12B128CFUE |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit | HCS12 16-bit |
| Flash Memory | 128 KB | 256 KB | 64 KB | 32 KB | 128 KB | 128 KB |
| RAM | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB | 4 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 0.5 KB | 1 KB | 1 KB |
| Max Bus Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| CAN Controllers | 1 (MSCAN12) | 1 (MSCAN12) | 1 (MSCAN12) | 1 (MSCAN12) | 1 (MSCAN12) | 1 (MSCAN12) |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +125C (automotive) | -40C to +105C (industrial) | -40C to +125C (automotive) |
| Family / Codename | B-Family / Sturgeon | B-Family / Sturgeon | B-Family / Sturgeon | B-Family / Sturgeon | B-Family / Sturgeon | B-Family / Sturgeon |
주요 차별점
- Pin-compatible 256 KB Flash upgrade path on same 112-LQFP footprint (vs MC9S12B64MPVE)
- Automotive +125 C temperature grade for under-hood deployments (vs MC9S12B128VPVE)
- Same-package 256 KB Flash variant for future-proofing (vs MC9S12B32MPVE)
- Single-drop-in footprint across the B-Family enables BOM flexibility (vs MC9S12XEQ512MAL)
설계 노트
Place a 100 nF decoupling capacitor on every VDD/VSS pair of the MC9S12B128MPVE within 5 mm of the pin, plus a 10 uF bulk capacitor at the regulator output pin. Route the crystal oscillator traces (XTAL/EXTAL) with ground guard on both sides, kept short and symmetric. Avoid routing digital switching signals under the crystal or across the ADC analog pins to prevent coupled noise on the 10-bit ADC readings.
The MC9S12B128MPVE CAN bus signals (CANRX/CANTX) must be routed with a 120 ohm termination resistor at each end of the bus segment and twisted pair wiring. Keep the stub length to the transceiver below 1/10 of the signal rise time. Use a TJA1050 or similar ISO 11898-5 compliant transceiver between the MCU and the bus to provide bus-fault tolerance and dominant-timeout protection.
Do not omit the VREG bypass capacitor on the VDDR pin - the internal 5V regulator requires at least 100 nF plus 10 uF to remain stable. The BKGD pin should be pulled up through 4.7 kohm to VDD to avoid spurious debug mode entry during power-up. Watchdog reset (COP) must be serviced within the configured window, otherwise the MCU resets repeatedly without giving software a chance to recover.
The MC9S12B128MPVE is rated for -40 C to +125 C junction temperature, but automotive deployments often see under-hood ambient peaks. Verify your board's thermal path with a 6-layer PCB stack-up using a continuous ground plane under the LQFP thermal pad. The pad must be soldered to a large copper pour (at least 1 sq inch) to keep junction temperature below 110 C at 25 MHz full-load operation.
규정 준수 정보
AEC-Q100 qualified per NXP automotive-grade portfolio. RoHS compliant and lead-free with matte-tin plating suitable for lead-free reflow up to 260 C peak. REACH compliant - confirm current SVHC declaration with distributor.
