MC9S12B64MPVE - 16-Bit 25MHz 64KB MCU | NXP
Référence : MC9S12B64MPVE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
MC9S12B64MPVE Présentation
A microcontroller is a semiconductor device that executes firmware, reads inputs, controls outputs, and coordinates peripherals within an embedded system. The HCS12 MC9S12B64 belongs to the broader hierarchy of 16-bit MCU, embedded processor, embedded-control IC, and semiconductor. Its flash-based architecture supports standalone control applications without an external program-memory device, while the large 112-pin package exposes substantially more I/O and peripheral connections than a small 32-pin or 48-pin MCU.
Verified features include a 16-bit S12 core, 64 KB organized as 64K by 8 bits of flash, and a -40 °C to +125 °C operating-temperature range. The package is identified as 112-pin LQFP in a 20 mm by 20 mm body. One aggregation source identifies the device as CMOS, with a 260 °C peak reflow temperature, 40-second maximum peak-reflow exposure, MSL 3, and tin terminal finish. These process attributes matter when selecting assembly process and handling components after opening moisture-sensitive packaging.
Typical uses include automotive body, multiplexing, sensor, actuator, and communication-control modules. The broad temperature range supports harsh industrial environments, while the 64 KB flash capacity accommodates embedded control firmware and application data. Exact RAM capacity, peripheral inventory, supply voltage, ADC performance, timer resources, communication modules, and individual pin functions were not supplied in the verified dataset and therefore must be confirmed from the manufacturer datasheet before schematic capture.
Designers should use the 112-pin package only when the required I/O and peripheral mix justifies its footprint. Confirm every pin, alternate function, power pin, ground pin, decoupling requirement, and programming interface against the official documentation. For a new PCB, also evaluate smaller active HCS12 devices that may meet the actual memory and I/O needs; for an existing MC9S12B64 design, lifecycle and sourcing constraints should be addressed explicitly.
This page consolidates the supplied manufacturer and distributor records, separates conflicting frequency claims, identifies sourcing and lifecycle concerns, and provides engineering-focused selection guidance. Detailed pricing, complete pinout, and verified drop-in replacement MPNs were not available, so this synthesis avoids presenting unsupported values as production-ready design data.
Alternatives de remplacement direct pour MC9S12B64MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12B64MPVE (même facteur de forme et même empreinte) — différant par Core, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesMC9S12B64MPVE Valeurs maximales et caractéristiques électriques
| Microcontroller Type | 16-bit HCS12 flash-based microcontroller |
| Core | S12 core |
| Architecture | HCS12 |
| Verified Maximum Frequency | 25 MHz |
| Distributor-Reported Alternative Frequency | 50 MHz |
| Flash Memory | 64 KB (64K x 8 bits) |
| Plage de température de fonctionnement | -40 °C to +125 °C |
| Boîtier | 112-pin LQFP |
| Package Dimensions | 20 mm x 20 mm |
| Type de montage | Surface mount |
| Technology | CMOS |
| Moisture Sensitivity Level | MSL 3 |
| Peak Reflow Temperature | 260 °C |
| Maximum Time at Peak Reflow Temperature | 40 s |
| Terminal Finish | Tin |
| Automotive Qualification | AEC-Q100 |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
Guide de configuration des broches du MC9S12B64MPVE 20 mm x 20 mm
Configuration des broches du MC9S12B64MPVE (boîtier 20 mm x 20 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12B64MPVE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12B64MPVE convient pour 6 applications: Automotive Body Control, Automotive Multiplexing Gateway, Industrial Sensor Hub, Actuator and Motor Control, Automotive Communication Gateway, High-Temperature Embedded Controller.
Automotive Body Control
The MC9S12B64MPVE fits body-control modules that combine multiple digital inputs with actuator and communication outputs. Its verified 16-bit S12 core operates at 25 MHz, while 64 KB of flash provides room for control logic, state handling, and device drivers. The 112-pin LQFP offers more external connections than compact controllers, and the -40 °C to +125 °C range supports harsh vehicle environments. Before release, verify the exact CAN, LIN, timer, ADC, interrupt, and diagnostic resources in the official data sheet, and validate software timing and electrical margins across temperature and supply tolerance.
Recommandé
Automotive Multiplexing Gateway
The MC9S12B64MPVE is a candidate for automotive multiplexing gateways because its 25 MHz 16-bit S12 core provides deterministic embedded processing and its 64 KB flash supports network-facing application firmware. The large 112-pin package can accommodate the required power, communications, sensing, and diagnostic connections in a consolidated controller. Design work must confirm which communication peripherals are present and how their alternate-function pins are muxed. Because the MCU is End of Life, production sourcing requires lifecycle review, traceability controls, and a software abstraction that can support migration if the device is replaced.
Recommandé
Industrial Sensor Hub
The MC9S12B64MPVE can serve as the controller in a multi-sensor industrial hub when a legacy design depends on its HCS12 architecture and needs many external connections. The 16-bit core at 25 MHz handles protocol servicing and control tasks, while 64 KB of flash stores embedded firmware. Its verified -40 °C to +125 °C range supports industrial environments beyond ordinary commercial temperature limits. The exact ADC channels, conversion performance, serial interfaces, and supply limits were not supplied, so they must be checked before sensor selection. Keep analog and digital return paths separated to prevent switching and transient noise from corrupting measurements.
Recommandé
Actuator and Motor Control
The MC9S12B64MPVE can coordinate actuator sequencing, digital control, and system diagnostics in legacy automotive or industrial equipment. Its 25 MHz 16-bit S12 core provides more processing headroom than typical low-end 8-bit controllers, and the 112-pin package exposes ample pins for input capture, outputs, communications, and safety-related monitoring. Suitable PWM channels, timers, analog interfaces, and electrical limits must be confirmed from the full manufacturer data sheet. In motor applications, keep switching devices and high-current returns away from sensitive controller ground paths, and validate timing, thermal performance, fault handling, and actuator diagnostics across operating conditions.
Recommandé
Automotive Communication Gateway
The MC9S12B64MPVE is relevant to legacy communication gateways where protocol handling and event-driven control must coexist with a generous pin count. Its 16-bit S12 core, 64 KB flash, and 25 MHz clock provide a defined platform for CAN, LIN, or other supported networking tasks once the exact peripheral inventory is confirmed. The -40 °C to +125 °C specification suits vehicle environments, while the LQFP package facilitates inspection and rework for legacy maintenance. Design protection, bus transients, grounding, and termination according to the selected network standards. End-of-life sourcing means hardware freeze periods and long-term availability should be treated as explicit system requirements.
Recommandé
High-Temperature Embedded Controller
The MC9S12B64MPVE can support legacy industrial controllers deployed across a verified -40 °C to +125 °C range. Its 16-bit S12 core at 25 MHz supports deterministic control logic, while 64 KB of flash provides nonvolatile program storage. The 112-pin package offers enough connectivity for multiple sensors, discrete outputs, communications, and monitoring functions. Because clock tolerance, memory behavior, and electrical limits at temperature were not included, engineers must verify worst-case timing and analog or digital performance. Use a controlled thermal enclosure, adequate copper and ground distribution, and qualification testing appropriate to the product’s environmental severity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12B64MPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit |
|---|---|
| Brand | NXP Semiconductors |
| Package | 112-pin LQFP, 20 mm x 20 mm |
| Core | 16-bit S12 |
| Maximum Frequency | 25 MHz |
| Flash Memory | 64 KB (64K x 8 bits) |
| Operating Temperature | -40 °C to +125 °C |
| Technology | CMOS |
| Automotive Qualification | AEC-Q100 |
| Moisture Sensitivity Level | MSL 3 |
| Lifecycle Status | End of Life |
Principaux différenciateurs
- Official product-page frequency avoids relying on a conflicting 50 MHz distributor snippet (vs DigiKey Rochester MC9S12B64MPVE listing)
- Verified 64 KB flash supports the intended HCS12 embedded-control segment (vs MC9S12DJ128CPVE)
- Wide verified temperature range supports harsh operating environments (vs MC9S12DP512CPVE)
Notes de conception
Generate the PCB footprint only from the official MC9S12B64MPVE package drawing and pin table. The 112-pin LQFP has many closely spaced perimeter connections, so verify pin-1 orientation, pin numbering, land width, span, solder mask, and paste apertures before release. Do not infer the layout from a generic QFP library because pitch, pin length, exposed functions, and package-specific recommendations must match. Electrical review should include every power and ground connection and the manufacturer’s bypass-capacitor placement.
Separate controller power routing from noisy actuator and switching-power stages, while grounding them according to the complete system architecture. Place required bypass capacitors directly at the relevant pins and minimize loop area before adding bulk capacitance. Exact voltage limits and capacitor values were not included in the verified data, so use the official electrical characteristics rather than values from generic HCS12 designs. Validate startup, brownout behavior, supply transients, and I/O current at every connected load before production.
Do not assume that another 112-pin CPVE or HCS12 device is drop-in compatible. Memory capacity, alternate-function multiplexing, peripheral resources, clock details, and package revisions can differ even when the package outline matches. A software migration also needs startup code, clock initialization, interrupt-vector review, peripheral-driver changes, linker-script work, and validation of memory assumptions. Obtain a manufacturer migration document and compare every pin and software-visible peripheral before approving a replacement.
Estimated assembly exposure must remain within the verified 260 °C peak-reflow condition and the reported 40-second maximum time at peak temperature. MSL 3 handling requires attention to moisture protection, bake requirements, floor life, and the assembly line’s bake procedure; these details should be checked against the current JEDEC handling document specified by NXP. The component is a microcontroller rather than a power semiconductor, so SOA is not applicable, but package thermal performance still depends on PCB copper, airflow, and the assembled thermal environment.
Informations de conformité
A supplied technical aggregation record identifies AEC-Q100 for this automotive MCU. The verified dataset does not provide conclusive RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements, so those fields remain unknown.