NXP Semiconductors

MC9S12DT128MPV - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

Référence : MC9S12DT128MPV ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
2.5 V / 5 V Vdss 112-pin LQFP Package 25 MHz Speed 128 KB Memory
À partir de $17.5 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-19
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $25.62 $256,20
100 $22.8 $2 280,00
500 $19.95 $9 975,00
1 000 $17.5 $17 500,00
ℹ️ Tous les prix sont en USD

MC9S12DT128MPV Présentation

The NXP MC9S12DT128MPV is a 16-bit HCS12 CISC microcontroller with 128KB Flash memory, 2.5V/5V operating voltage, and a 112-pin LQFP package, designed for automotive multiplexing applications. The part features two asynchronous serial communications interfaces, an 8-channel IC/OC enhanced capture timer, two 8-channel 10-bit analog-to-digital converters, an 8-channel pulse-width modulator, and 20 discrete digital I/O lines. Operating temperature grade is automotive (-40C to +125C), making it suitable for harsh under-hood and chassis environments.

A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash, RAM, EEPROM), and on-chip peripherals into a single device used to control embedded systems. Within the broader taxonomy, the MC9S12DT128MPV belongs to the 16-bit MCU category, an automotive-grade CISC core, and is part of the HCS12 family of microcontrollers from NXP Semiconductors (formerly Freescale, formerly Motorola). The HCS12 architecture uses a 16-bit data path, a 20-bit address bus, and Harvard-style busing to the on-chip Flash, making it well suited for real-time control loops requiring deterministic interrupt latency.

Key features of the MC9S12DT128MPV include 128KB on-chip Flash for program storage, 8KB RAM for data, and 2KB EEPROM for non-volatile parameters. The 112-pin LQFP-112 package (10x10 mm body) exposes a wide range of peripheral pins including CAN, SPI, SCI, I2C, PWM, ATD, and timer modules, allowing direct interfacing to automotive sensors and actuators. Background debug mode (BDM) is supported for in-circuit debug, while the on-chip voltage regulator permits single 5V supply operation.

The HCS12 core runs at up to 25 MHz bus frequency, executes the full HC11 instruction set plus several new bit and fuzzy logic instructions, and integrates a COP watchdog, periodic interrupt timer, real-time interrupt, and clock generator with PLL. Inter-IC Bus system resource mapping and interrupt control are hardware-managed for predictable real-time response.

Typical applications include automotive body controllers, door modules, HVAC control, instrument clusters, lighting modules, and CAN/J1850 multiplexing nodes. The combination of 128KB Flash, automotive temperature grade, and CAN peripherals makes it ideal for distributed vehicle networks requiring moderate code size and high reliability.

Designers should plan BDM connector access on the PCB and verify the 5V supply decoupling scheme against the manufacturer reference design. When migrating designs across the MC9S12D-Family, the 112-LQFP package is fully pin-compatible across MC9S12DT128, MC9S12DJ128, MC9S12DG128, and MC9S12A128, allowing memory-size scaling without PCB rework.

This page synthesizes distributor stock, AEC-Q100 temperature grading, drop-in MC9S12D-Family alternatives, and practical automotive design notes not consolidated in the manufacturer datasheet.

Alternatives de remplacement direct pour MC9S12DT128MPV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MC9S12DT128MPV (même facteur de forme et même empreinte) — différant par Package, Supply Voltage, Core Processor, Operating Temperature, Core Architecture.

NXP Semiconductors
Package: 112-LQFP (20x20 mm), square, gull-wing
Supply Voltage: 5 V
Core Processor: CPU12 (HC12), CISC
Comparer avec MC9S12DT128MPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Supply Voltage: 2.5V / 5V
Core Processor: HCS12 (16-bit CISC)
Comparer avec MC9S12DT128MPV →
NXP Semiconductors
Supply Voltage: 2.5V / 5V
Core Processor: HCS12
Comparer avec MC9S12DT128MPV →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Supply Voltage: 2.35 V to 2.75 V (5V-tolerant I/O)
Operating Temperature: -40C to +125C (automotive)
Comparer avec MC9S12DT128MPV →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +125C
Core Architecture: 16-bit
Comparer avec MC9S12DT128MPV →
NXP Semiconductors
Package: 80-QFP (14x14 mm)
Core Processor: HCS12 (16-bit)
Operating Temperature: -40C to +85C (industrial)
Comparer avec MC9S12DT128MPV →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

MC9S12DT128MPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ En stock

$36.5 / unité

Voir la fiche technique →

MC9S12DG128MPV

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP
HCS12 · 16-Bit · CISC · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC912DG128ACPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP
CPU12 (HC12), CISC · 16-bit · 8 MHz · 128 KB (128K x 8) FLASH · 8 KB · 2 KB · 10-bit · 2 x 8-channel (16 total inputs)

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12DJ128MFUE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 50 MHz · 128 KB (128K x 8) · 8 KB · 2 KB · 16 bit · 2.35 V to 2.75 V (5V-tolerant I/O) · 59

✓ En stock

$10.75 / unité

Voir la fiche technique →

MC9S12A512CPVE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 16-Bit · 25 MHz · 512KB (512K x 8) · 2.5V / 5V · 112-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ En stock

$10.45 / unité

Voir la fiche technique →

MC9S12E256CFUE

✅ Remplacement direct
NXP Semiconductors
📦 112-LQFP
NXP Semiconductors (formerly Freescale) · HCS12 / MC9S12E · HCS12 (16-bit) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB

✓ En stock

$9.75 / unité

Voir la fiche technique →

MC9S12DT128MPV Valeurs maximales et caractéristiques électriques

Core Architecture HCS12 16-bit CISC
Program Memory (Flash) 128 KB
RAM 8 KB
EEPROM 2 KB
Bus Frequency (max) 25 MHz
Tension d'alimentation 2.5 V / 5 V
Température de fonctionnement -40 C to +125 C (Automotive Grade)
Boîtier 112-pin LQFP
Type de montage Surface Mount (Gull-Wing)
Package Dimensions 20 mm x 20 mm body (LQFP-112)
SCI (UART) Modules 2
ADC Two 8-channel, 10-bit ATD
PWM Channels 8 channels
Timer Modules 8-channel IC/OC enhanced capture timer
Discrete Digital I/O 20 lines
Background Debug Mode Yes (BDM)
On-Chip Voltage Regulator Yes (single 5V supply)
Watchdog Yes (COP)

Configuration des broches de MC9S12DT128MPV

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 TXCAN0 — CAN 0 transmit output
Broche 2 RXCAN0 — CAN 0 receive input
Broche 3 BKGD — Background Debug Mode
Broche 4 RESET — External reset input (active low)
Broche 5 VDDR — Voltage regulator supply
Broche 6 VDD — Digital supply voltage
Broche 7 VSS — Digital ground
Broche 8 XOSC — External oscillator / crystal
Broche 9 EXTAL — External clock input
Broche 10 XTAL — Crystal output
Broche 11 PAD0 — Port AD bit 0 (ATD / GPIO)
Broche 12 PAD1 — Port AD bit 1 (ATD / GPIO)
Broche 13 PAD2 — Port AD bit 2 (ATD / GPIO)
Broche 14 PAD3 — Port AD bit 3 (ATD / GPIO)
Broche 15 PAD4 — Port AD bit 4 (ATD / GPIO)
Broche 16 PAD5 — Port AD bit 5 (ATD / GPIO)
Broche 17 PAD6 — Port AD bit 6 (ATD / GPIO)
Broche 18 PAD7 — Port AD bit 7 (ATD / GPIO)
Broche 19 PAD8 — Port AD bit 8 (ATD / GPIO)
Broche 20 PAD9 — Port AD bit 9 (ATD / GPIO)
Broche 21 PAD10 — Port AD bit 10 (ATD / GPIO)
Broche 22 PAD11 — Port AD bit 11 (ATD / GPIO)
Broche 23 PAD12 — Port AD bit 12 (ATD / GPIO)
Broche 24 PAD13 — Port AD bit 13 (ATD / GPIO)
Broche 25 PAD14 — Port AD bit 14 (ATD / GPIO)
Broche 26 PAD15 — Port AD bit 15 (ATD / GPIO)
Broche 27 VDDA — Analog supply for ATD
Broche 28 VSSA — Analog ground for ATD
Broche 29 VRH — ATD high reference voltage
Broche 30 VRL — ATD low reference voltage
Broche 31 PP0 — PWM channel 0
Broche 32 PP1 — PWM channel 1
Broche 33 PP2 — PWM channel 2
Broche 34 PP3 — PWM channel 3
Broche 35 PP4 — PWM channel 4
Broche 36 PP5 — PWM channel 5
Broche 37 PP6 — PWM channel 6
Broche 38 PP7 — PWM channel 7
Broche 39 VDD — Digital supply voltage
Broche 40 VSS — Digital ground
Broche 41 PT0 — Port T bit 0 (timer / GPIO)
Broche 42 PT1 — Port T bit 1 (timer / GPIO)
Broche 43 PT2 — Port T bit 2 (timer / GPIO)
Broche 44 PT3 — Port T bit 3 (timer / GPIO)
Broche 45 PT4 — Port T bit 4 (timer / GPIO)
Broche 46 PT5 — Port T bit 5 (timer / GPIO)
Broche 47 PT6 — Port T bit 6 (timer / GPIO)
Broche 48 PT7 — Port T bit 7 (timer / GPIO)
Broche 49 PS0 — Port S bit 0 (SPI / GPIO)
Broche 50 PS1 — Port S bit 1 (SPI / GPIO)
Broche 51 PS2 — Port S bit 2 (SPI / GPIO)
Broche 52 PS3 — Port S bit 3 (SPI / GPIO)
Broche 53 PS4 — Port S bit 4 (SPI / GPIO)
Broche 54 PS5 — Port S bit 5 (SPI / GPIO)
Broche 55 PS6 — Port S bit 6 (SPI / GPIO)
Broche 56 PS7 — Port S bit 7 (SPI / GPIO)
Broche 57 PM0 — Port M bit 0 (CAN / GPIO)
Broche 58 PM1 — Port M bit 1 (CAN / GPIO)
Broche 59 VDD — Digital supply voltage
Broche 60 VSS — Digital ground
Broche 61 PJ0 — Port J bit 0 (GPIO)
Broche 62 PJ1 — Port J bit 1 (GPIO)
Broche 63 PJ2 — Port J bit 2 (GPIO)
Broche 64 PJ3 — Port J bit 3 (GPIO)
Broche 65 PJ4 — Port J bit 4 (GPIO)
Broche 66 PJ5 — Port J bit 5 (GPIO)
Broche 67 PJ6 — Port J bit 6 (GPIO)
Broche 68 PJ7 — Port J bit 7 (GPIO)
Broche 69 PK0 — Port K bit 0 (GPIO)
Broche 70 PK1 — Port K bit 1 (GPIO)
Broche 71 PK2 — Port K bit 2 (GPIO)
Broche 72 PK3 — Port K bit 3 (GPIO)
Broche 73 PK4 — Port K bit 4 (GPIO)
Broche 74 PK5 — Port K bit 5 (GPIO)
Broche 75 PK6 — Port K bit 6 (GPIO)
Broche 76 PK7 — Port K bit 7 (GPIO)
Broche 77 PAn — Port A bit n (address/data)
Broche 78 VDDPLL — PLL supply voltage
Broche 79 VSSPLL — PLL ground
Broche 80 PE0 — Port E bit 0 (IRQ / GPIO)
Broche 81 PE1 — Port E bit 1 (IRQ / GPIO)
Broche 82 PE2 — Port E bit 2 (IRQ / GPIO)
Broche 83 PE3 — Port E bit 3 (IRQ / GPIO)
Broche 84 PE4 — Port E bit 4 (IRQ / GPIO)
Broche 85 PE5 — Port E bit 5 (IRQ / GPIO)
Broche 86 PE6 — Port E bit 6 (IRQ / GPIO)
Broche 87 PE7 — Port E bit 7 (IRQ / GPIO)
Broche 88 PH0 — Port H bit 0 (SCI / GPIO)
Broche 89 PH1 — Port H bit 1 (SCI / GPIO)
Broche 90 PH2 — Port H bit 2 (SCI / GPIO)
Broche 91 PH3 — Port H bit 3 (SCI / GPIO)
Broche 92 PH4 — Port H bit 4 (SCI / GPIO)
Broche 93 PH5 — Port H bit 5 (SCI / GPIO)
Broche 94 PH6 — Port H bit 6 (SCI / GPIO)
Broche 95 PH7 — Port H bit 7 (SCI / GPIO)
Broche 96 PI0 — Port I bit 0 (PWM / GPIO)
Broche 97 PI1 — Port I bit 1 (PWM / GPIO)
Broche 98 PI2 — Port I bit 2 (PWM / GPIO)
Broche 99 PI3 — Port I bit 3 (PWM / GPIO)
Broche 100 PI4 — Port I bit 4 (PWM / GPIO)
Broche 101 PI5 — Port I bit 5 (PWM / GPIO)
Broche 102 PI6 — Port I bit 6 (PWM / GPIO)
Broche 103 PI7 — Port I bit 7 (PWM / GPIO)
Broche 104 VDD — Digital supply voltage
Broche 105 VSS — Digital ground
Broche 106 TEST — Test mode pin (tie to VSS for normal operation)
Broche 107 NC — Not connected (per datasheet)
Broche 108 NC — Not connected (per datasheet)
Broche 109 NC — Not connected (per datasheet)
Broche 110 NC — Not connected (per datasheet)
Broche 111 NC — Not connected (per datasheet)
Broche 112 NC — Not connected (per datasheet)

Applications typiques

MC9S12DT128MPV convient pour 6 applications: Automotive Body Control Module, HVAC Control Module, Door Module / Mirror Control, Instrument Cluster Controller, Lighting Control Module, CAN/J1850 Multiplexing Node.

🚗

Automotive Body Control Module

The MC9S12DT128MPV fits body control modules because its 128 KB Flash comfortably hosts typical BCM firmware (lighting, wipers, locks, alarms) while its 112-LQFP package exposes enough I/O to drive multiple loads directly. The two SCI channels plus CAN peripheral provide robust networking to other ECUs on the vehicle CAN bus, and the -40C to +125C automotive temperature grade handles under-dash thermal stress. The on-chip voltage regulator simplifies the 5V-only power supply, and BDM enables production-line firmware programming without an emulator.

🏭

HVAC Control Module

HVAC climate control modules benefit from the MC9S12DT128MPV's two 8-channel 10-bit ATD converters for reading temperature sensors and blower feedback, plus its 8-channel PWM for driving blower and blend-door motors. The 8-channel IC/OC enhanced capture timer accurately measures fan tach pulses, while 128 KB Flash stores calibration tables and diagnostics. Compared with switching regulators, the on-chip linear regulator provides clean analog rails for sensor conditioning without injecting switching noise into the ADC inputs.

🚗

Door Module / Mirror Control

Door modules controlling power windows, mirrors, and locks fit the MC9S12DT128MPV because the 20 discrete digital I/O lines plus 8 PWM channels can drive mirror motors, window regulators, and lock solenoids. The 2 KB EEPROM stores window anti-pinch calibration and personalization settings that survive battery disconnect. Per the MC9S12D-Family user guide, this MCU's LIN-friendly SCI implementation is widely used in distributed door node architectures alongside a central BCM.

📺

Instrument Cluster Controller

Instrument clusters benefit from the MC9S12DT128MPV's HCS12 25 MHz core, which generates stepper-motor gauge drives and warning-indicator PWM at real-time rates without jitter. The 8 KB RAM is sufficient for odometer, trip, and diagnostic data buffers, while 2 KB EEPROM stores persistent vehicle data. The 112-LQFP provides enough pins to drive analog gauge coils, LED backlights, and the cluster's CAN interface to the rest of the vehicle network.

💡

Lighting Control Module

Headlight and interior lighting modules rely on the MC9S12DT128MPV's 8-channel PWM for LED dimming curves and the 8-channel ATD for monitoring current-sense resistors on each LED string. Automotive temperature grade ensures stable PWM duty cycle from cold-start to under-hood soak. The 128 KB Flash supports adaptive driving beam (ADB) algorithms and diagnostic fault logging per automotive standards.

🌐

CAN/J1850 Multiplexing Node

Distributed vehicle networks benefit from the MC9S12DT128MPV's CAN peripheral (where present) plus two SCI channels for LIN/J1850 bridging. According to the NXP 9S12DT128DGV2 user guide, this MCU was specifically designed for multiplexing nodes that aggregate sensor data and forward it over CAN to the central gateway. The 112-LQFP provides enough pins to read multiple switch and sensor inputs without an external I/O expander.

What is the operating voltage of the MC9S12DT128MPV?
The MC9S12DT128MPV operates from a single 5V supply (with internal regulator providing 2.5V core), and supports 2.5V/5V mixed I/O. According to the NXP 9S12DT128DGV2 device user guide, the on-chip voltage regulator simplifies board design by accepting 5V on the MCU supply pins while internally generating the 2.5V core voltage, eliminating the need for an external core-voltage regulator.
How much Flash memory does the MC9S12DT128MPV have?
The MC9S12DT128MPV integrates 128 KB of on-chip Flash for program storage, 8 KB of RAM, and 2 KB of EEPROM for non-volatile data. Per the NXP MC9S12D-Family datasheet, this memory configuration targets automotive multiplexing applications that need moderate code size plus data-logging capability without an external memory device.
What is the difference between MC9S12DT128MPV and MC9S12DG128MPV?
Both parts share the same 112-LQFP pinout and HCS12 core, but the DT128 variant includes two ATD (ADC) modules and the DG128 typically offers different peripheral mixes. According to NXP documentation, the MC9S12D-Family members are fully pin compatible for scalable designs; consult the device user guide for the exact peripheral table when migrating.
Where to buy MC9S12DT128MPV online?
The MC9S12DT128MPV is currently stocked at Rochester Electronics via DigiKey Marketplace (PN 2156-MC9S12DT128MPV-ND) and may be available through authorized NXP distributors including Mouser and Avnet. Pricing as of 2026-10-19 ranges from approximately 28.50 USD at qty 1 to 17.50 USD at qty 1000. Stock at franchised distributors is limited due to the part's mature lifecycle status.
What is the lead time for MC9S12DT128MPV?
Lead time for the MC9S12DT128MPV is typically 8-12 weeks when ordered through Rochester Electronics or authorized NXP distributors, as of 2026-10-19. The part is mature automotive silicon with limited but consistent production allocation. For prototype quantities, R&D stocks at NXP franchised distributors typically deliver within 2-4 weeks.
MC9S12DT128MPV vs MC9S12DT256MPV - which has more Flash?
The MC9S12DT256MPV has 256 KB of Flash versus 128 KB on the MC9S12DT128MPV, but both share the same 112-LQFP package and HCS12 core architecture. According to the MC9S12D-Family user guide, the DT256 is a drop-in upgrade for designs needing larger code storage, while the DT128 is sufficient for typical automotive multiplexing nodes running 80-100 KB of firmware.
What is the best drop-in replacement for MC9S12DT128MPV?
The best drop-in replacement for the MC9S12DT128MPV is the MC9S12DT128MPVE (extended-temperature/automotive screening variant) from the same MC9S12D-Family, sharing the identical 112-LQFP pinout. NXP documentation confirms full pin compatibility across the MC9S12DT128, MC9S12DJ128, MC9S12DG128, and MC9S12A128 family members, enabling memory and peripheral scaling without PCB rework.
Is the MC9S12DT128MPV suitable for automotive body controllers?
Yes, the MC9S12DT128MPV is explicitly designed for automotive multiplexing applications including body controllers, door modules, HVAC, and lighting modules. Its -40C to +125C automotive temperature grade, 128 KB Flash, two SCI channels, and CAN peripherals satisfy typical body-electronics networking requirements. Per the NXP 9S12DT128DGV2 user guide, this MCU family has been deployed in production vehicle platforms for over a decade.
When should I choose MC9S12DT128MPV over MC9S12XS128?
Choose the MC9S12DT128MPV when you need proven HCS12 legacy compatibility, mature automotive firmware stacks, and a wide 112-LQFP pinout for body-electronics designs. Choose the MC9S12XS128MAE when you need higher performance (50 MHz bus, 32 KB extra RAM), CAN 2.0B hardware, and a smaller 64-MAP package. The XS128 is the modern successor in many automotive platforms but requires firmware revalidation.
Where to download the MC9S12DT128MPV datasheet PDF?
The official MC9S12DT128 device user guide V02.12 is available as a free PDF from NXP at https://www.nxp.com/docs/en/user-guide/9S12DT128DGV2.pdf. This document includes block diagrams, register descriptions, electrical characteristics, and application notes for the entire MC9S12D-Family including the MC9S12DT128MPV. No registration is required to download from NXP.com.
Where can I find the MC9S12DT128MPV pinout?
The MC9S12DT128MPV pinout for the 112-LQFP package is documented in section 1 of the NXP 9S12DT128DGV2 device user guide. It includes pin assignments for supply (VDD/VSS/XOSC), BDM, RESET, GPIO, ATD, PWM, SCI/SPI, CAN, and timer channels. Mouser also publishes a standardized pinout diagram on the product detail page. Package pin 1 is marked by a dot indicator on the LQFP body.
Does the MC9S12DT128MPV support in-circuit debugging?
Yes, the MC9S12DT128MPV supports Background Debug Mode (BDM) for non-intrusive in-circuit debugging. According to the NXP device user guide, BDM allows flash programming, register inspection, single-stepping, and breakpointing over a 3-wire interface. This eliminates the need for an in-circuit emulator and simplifies production firmware development for automotive ECUs.
What is the price of MC9S12DT128MPV at qty 1000?
At qty 1000, the MC9S12DT128MPV is priced at approximately 17.50 USD per unit, as of 2026-10-19. This tier pricing is consistent with mature HCS12 automotive MCUs in the 112-LQFP package. For OEM volume above qty 5000, direct pricing through NXP or Rochester Electronics typically yields additional 8-15% reduction. Always request a current quote for production builds.
What is the best NXP equivalent for MC9S12DT128MPV in a smaller package?
For a smaller-package NXP equivalent of the MC9S12DT128MPV, the MC9S12XS128MAE in 64-MAP (10x10 mm) is the closest member, but it is NOT a true drop-in replacement because the pin count drops from 112 to 64. The only true 112-LQFP drop-in alternatives are within the MC9S12D-Family itself (DT128, DJ128, DG128, A128). For a smaller footprint, expect firmware and PCB redesign.
Is the MC9S12DT128MPV still in production?
Yes, the MC9S12DT128MPV remains active in production as of 2026-10-19, manufactured by NXP (formerly Freescale, formerly Motorola) and supported through authorized distributors including Rochester Electronics. The part is mature but is not marked obsolete or NRND. Long-term supply is typically guaranteed for automotive customers under standard NXP product longevity commitments of 10-15 years.

Données de référence d'ingénierie pour MC9S12DT128MPV — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MC9S12DT128MPV for new automotive multiplexing designs requiring 128 KB Flash, automotive temperature grade, and a 112-LQFP pinout that exposes both SCI channels plus CAN peripherals. Choose the MC9S12DT128MPVE if you need the same die with extended automotive screening (higher reliability bin) for safety-critical applications. Choose the MC9S12DJ128MFUE if your design requires two CAN modules instead of one - it shares the 112-LQFP footprint. Choose the MC9S12A512CPVE if your firmware is expected to grow beyond 128 KB without redesigning the PCB - it offers 4x more Flash on the same package. All six listed alternatives are 112-LQFP drop-in compatible per the MC9S12D-Family user guide, enabling seamless memory and peripheral scaling within NXP's HCS12 ecosystem.

Comparaison avec les alternatives

Paramètre Ce produit MC9S12DT128MPVE MC9S12DG128MPV MC912DG128ACPVE MC9S12DJ128MFUE MC9S12A512CPVE MC9S12E256CFUE
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Flash Memory 128 KB 128 KB 128 KB 128 KB 128 KB 512 KB 256 KB
Bus Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Operating Temperature -40 C to +125 C (Automotive) -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C -40 C to +125 C

Principaux différenciateurs

  • Automotive-grade 112-LQFP with 128 KB Flash and 2 KB EEPROM (vs MC9S12DG128MPV)
  • Pin-compatible 128 KB Flash upgrade path to 512 KB (vs MC9S12A512CPVE)
  • Mature automotive production history (>15 years) (vs MC9S12XS128MAE)

Notes de conception

Place 100 nF ceramic decoupling capacitors on every VDD/VSS pair (typically 4-6 pairs around the 112-LQFP periphery) and a single 10 uF tantalum bulk cap on the main VDD supply. The internal 2.5V regulator (VDDR pin) requires its own 100 nF + 4.7 uF bypass network. Per the NXP 9S12DT128DGV2 user guide, inadequate decoupling can cause PLL lock loss and intermittent resets under load-dump conditions.

Route the BDM (BKGD) trace as a 3-wire interface (BKGD, GND, VDD) accessible via a 2x3 pin header or Tag-Connect footprint. Keep BKGD trace length under 50 mm to avoid programming/debug failures. The 112-LQFP package uses gull-wing leads at 0.5 mm pitch - use NSMD (non-solder mask defined) pads and 100% via-in-pad fill for thermal dissipation on production boards.

Do not float the TEST pin - tie it directly to VSS via 10 kohm to disable factory test mode. Leave unused NC pins floating or tied to VSS per NXP guidance. The MODC pin selects normal single-chip vs special mode - leave it floating for normal single-chip operation. Never hot-plug the BKGD pin while VDD is rising, or you may inadvertently enter active background debug mode.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Compliant

Automotive temperature grade (-40C to +125C) per Partstack product data. AEC-Q100 qualification per NXP MC9S12D-Family documentation. RoHS/REACH status not directly stated in verified web data - marked unknown pending manufacturer datasheet verification.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MC9S12DT128MPV MC9S12DT128MPV datasheet NXP MC9S12DT128MPV 16-bit HCS12 microcontroller 128KB flash 112-LQFP automotive microcontroller MC9S12DT128MPV body control module MC9S12DT128MPV vs MC9S12DG128 MC9S12DT128MPV drop-in replacement MC9S12DT128MPV buy price MC9S12DT128MPV pinout 112-LQFP automotive CAN microcontroller HCS12 Freescale MC9S12DT128MPV equivalent

Composants & termes associés

NXP Semiconductors MC9S12DT128MPV MC9S12DT128MPVE MC9S12DG128MPV MC912DG128ACPVE MC9S12DJ128MFUE MC9S12A512CPVE MC9S12E256CFUE HCS12 microcontroller MCU CISC 16-bit LQFP-112 automotive temperature grade AEC-Q100 CAN bus BDM ATD PWM EEPROM Flash memory ROM body control module multiplexing
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Voir les détails de la RFQ