S912XDG256F1MAL - 16-Bit 80MHz 256KB MCU | NXP
Référence : S912XDG256F1MAL ✗ Fin de vie| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
S912XDG256F1MAL Présentation
A microcontroller is a programmable semiconductor that integrates a CPU core, nonvolatile program memory, data memory, peripherals, and interface logic on one device. The S12X family extends the HCS12 architecture with an enhanced instruction set, enhanced indexed addressing, and an interrupt model compatible with the HCS12 programmer's model. These features place the device in the broader 16-bit embedded MCU hierarchy rather than application processors or FPGAs.
Verified source data identifies a 256K by 8 flash configuration, 80 MHz maximum operating frequency, HCS12X core, SPI capability, automotive qualification, and a temperature range from -40 °C to +125 °C. A secondary component listing reports 14 KB RAM, 4 KB EEPROM, one CAN interface, three SPI interfaces, and an 80-pin HQFP configuration for a related MC9S12XD256CAA device. Those secondary values are not assigned to this exact 112-pin target because package-specific verification remains necessary.
The S12X platform is appropriate for powertrain accessories, body electronics, gateways, sensors, and industrial controllers when a deterministic 16-bit architecture is preferred. SPI can connect serial sensors, transceivers, memories, and display or communication modules, while flash storage supports embedded firmware. The key selection constraint is lifecycle status: NXP's product page identifies this exact MPN as end of life, so new production designs should require an explicit supplier confirmation, last-time-buy assessment, or approved lifecycle migration.
For a new PCB, verify the 112-pin pad pattern, all multiplexed peripheral functions, supply rails, clock configuration, and software compatibility against the official datasheet before schematic release. Do not substitute a lower-pin-count HQFP MCU or a different core without board redesign and firmware validation. Inventory shown by brokers or distributors does not by itself establish manufacturer availability.
This page consolidates verified product identity, lifecycle information, source discovery links, and design cautions. It deliberately avoids treating generic search-tool results as proof of pin-compatible replacement parts. Because no same-package, pin-to-pin substitute was established from the supplied cross-reference results, procurement should verify any claimed alternative with NXP documentation and application engineering review.
Alternatives de remplacement direct pour S912XDG256F1MAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XDG256F1MAL (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Core Architecture, RoHS Status, CPU Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912XDT256F1VAA
✅ Remplacement direct✓ En stock
$13.6 / unité
Voir la fiche technique →S912XD256F1MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XEG384J2CAL
✅ Remplacement direct✓ En stock
$9.1 / unité
Voir la fiche technique →S912XDT384J1MAG
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →S912XES384J2CAL
✅ Remplacement direct✓ En stock
$5.15 / unité
Voir la fiche technique →S912XES384J3VAL
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →S912XDG256F1MAL Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit HCS12X automotive microcontroller |
| CPU Core | HCS12X |
| Maximum CPU Frequency | 80 MHz |
| Flash Memory | 256 KB (256K x 8 bits) |
| Plage de température de fonctionnement | -40 °C to +125 °C |
| Boîtier | 112-pin LQFP |
| Package Dimensions | 20 mm x 20 mm |
| Type de montage | Surface mount |
| SPI Support | Yes |
| Automotive Qualification | Automotive qualified |
| Instruction Set Compatibility | Upward compatible with HCS12 instruction set |
| Indexed Addressing | Enhanced indexed addressing |
| Niveau MSL | 3 (168 hours), per Rochester Electronics listing |
| Statut RoHS | unknown |
| REACH Status | unknown |
Guide de configuration des broches du S912XDG256F1MAL 20 mm x 20 mm
Configuration des broches du S912XDG256F1MAL (boîtier 20 mm x 20 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour S912XDG256F1MAL.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
S912XDG256F1MAL convient pour 6 applications: Automotive Body Control Modules, Powertrain Accessory Controllers, Industrial Sensor and Actuator Hubs, Vehicle Network Gateways, Robotics and Motion Control, Diagnostic and Service Tool Interfaces.
Automotive Body Control Modules
The S912XDG256F1MAL fits legacy body-control designs that need a qualified 16-bit MCU, 256 KB flash, and operation across -40 °C to +125 °C. Its HCS12X-compatible architecture and SPI support can coordinate sensors, actuators, diagnostic links, and distributed body functions. Because the exact device is end of life, retain it mainly for sustaining an approved existing platform unless NXP confirms continued supply. Any migration must preserve the 112-pin PCB, timing behavior, interrupt model, and validated automotive firmware rather than relying on the 80 MHz headline frequency alone.
Recommandé
Powertrain Accessory Controllers
An S912XDG256F1MAL-based controller can manage pumps, valves, relays, or other deterministic accessory loads when an existing S12X software platform is already validated. The 80 MHz CPU supplies computational headroom, while 256 KB flash stores control routines, diagnostics, and calibration tables. The -40 °C to +125 °C grade supports harsh environments, but production use must account for the exact end-of-life designation and the part's unprovided electrical limits. Validate timing, watchdog behavior, transient immunity, and thermal performance on production-intent hardware before any last-time-buy deployment.
Recommandé
Industrial Sensor and Actuator Hubs
The S912XDG256F1MAL can act as a centralized controller for SPI sensors, remote actuators, and diagnostic reporting in industrial equipment. Its S12X core provides deterministic instruction execution, and 256 KB flash accommodates application firmware and parameter storage. SPI connectivity is explicitly present in the verified source data, making serial sensor aggregation a practical fit. However, the exact MCU is not a new-design choice by default: confirm supply-voltage limits, peripheral pin multiplexing, clock configuration, and package details from the official datasheet before redesign, and reserve software work for any selected migration path.
Recommandé
Vehicle Network Gateways
The S912XDG256F1MAL is suitable for a legacy gateway that aggregates sensor data and coordinates communications inside an automotive electrical system. Its 80 MHz HCS12X core can process protocol tasks, while SPI can support local transceivers or sensors. The verified target listing does not provide a definitive CAN-controller count, so network suitability must be confirmed from the exact pinout and peripheral manual rather than assumed from a related MCU summary. In an end-of-life gateway, package reuse offers procurement value only after signal mapping, electrical limits, timing, and diagnostic behavior pass a formal equivalence review.
Recommandé
Robotics and Motion Control
The S912XDG256F1MAL can support a controller for robots or motion equipment where deterministic 16-bit control and established S12X software are more important than purchasing a currently produced MCU. The 80 MHz operating frequency and 256 KB flash provide capacity for sequencing, motor commands, sensor fusion, and diagnostics. SPI allows connection to motion sensors or external controllers. Design work must still verify timer channels, PWM outputs, interrupt latency, pin multiplexing, and supply rails because those parameters were not supplied. Treat board reuse as conditional, not guaranteed, until every package pin matches.
Recommandé
Diagnostic and Service Tool Interfaces
The S912XDG256F1MAL can support a legacy vehicle diagnostic interface or service-node controller when an existing software stack targets S12X. Its 256 KB flash provides room for protocols and diagnostic routines, while SPI can bridge to external interface hardware. The device's automotive qualification and broad stated temperature range suit demanding service environments. End-of-life procurement requires controlled inventory handling and configuration traceability. For a new diagnostic product, compare newer MCUs first and validate any replacement for boot behavior, bus timing, watchdog rules, cryptographic assumptions, and service-tool compatibility.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XDG256F1MAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XDT256F1VAA | S912XD256F1MAL | S912XEG384J2CAL | S912XDT384J1MAG | S912XES384J2CAL |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-pin LQFP, 20 mm x 20 mm | 112-pin QFP candidate; exact package data not verified | QFP 112; exact package data not verified | 112-pin QFP candidate; exact package data not verified | 112-pin QFP candidate; exact package data not verified | 112-pin QFP candidate; exact package data not verified |
| CPU Core | 16-bit HCS12X | Related S12X device; exact compatibility unverified | S12X core | Related S12X device; exact compatibility unverified | Related S12X device; exact compatibility unverified | Related S12X device; exact compatibility unverified |
| Flash Memory | 256 KB | 256 KB from MPN family naming; official verification required | 256 KB | 384 KB from related MPN naming; official verification required | 384 KB from related MPN naming; official verification required | 384 KB from related MPN naming; official verification required |
Principaux différenciateurs
- Exact qualified identity with broad temperature range (vs S912XDT256F1VAA)
- Documented 256 KB target configuration (vs S912XD256F1MAL)
- Matches the required 256 KB flash class without relying on larger-memory parts (vs S912XEG384J2CAL)
Notes de conception
Do not treat a related S12X MPN as a drop-in replacement merely because its name contains 256 or 384 KB. Verify the official ordering information, 112-pin land pattern, every multiplexed pin, power and ground assignments, clock connections, debug interface, and exposed thermal behavior. Then compare memory maps, startup code, interrupt vectors, peripheral registers, and compiler assumptions. The supplied cross-reference results did not establish manufacturer-approved equivalence, so production substitution requires written engineering approval and hardware regression testing.
The supplied data does not state the MCU supply-voltage range or absolute maximum ratings, so do not infer them from an HCS12X family member. Before schematic release, obtain every power pin and decoupling requirement from the official S912XDG256F1MAL data sheet. Validate regulator tolerance, startup sequencing, reset behavior, and analog or digital load currents in hardware. Estimated thermal and power calculations are intentionally omitted because verified voltage, current, thermal-resistance, and clock-profile data were not provided.
Preserve the original 112-pin LQFP land pattern and assembly constraints when sustaining existing hardware. Confirm pin 1 orientation, package dimensions, lead pitch, maximum board temperature, and whether a thermal pad is present using the official package drawing rather than search snippets. For any migration, compare drill and courtyard compatibility as well as nominal pin count; mechanically similar packages can differ in exposed-pad requirements or assembly process. Run ERC, DRC, and a pin-to-pin signal audit before releasing revised artwork.
Clock, reset, serial, and high-speed control signals must be reviewed at 80 MHz rather than copied from a lower-frequency design. Verify external clock tolerance, clock-tree configuration, debug connectivity, and peripheral multiplexing in the official manual. For PCB sustain work, preserve the original topology, impedance assumptions, grounding, and return paths until measurements validate them. Any replacement MCU should undergo signal-integrity, timing, EMI, and functional testing across voltage and temperature corners.
Informations de conformité
NXP describes the exact MPN as automotive qualified, but the supplied snippets do not provide the underlying AEC-Q100 certificate. Rochester Electronics reports MSL 3 with a 168-hour classification and a vendor-undefined REACH status. RoHS, lead-free, halogen-free, and conflict-minerals claims remain unverified.