MC9S12C128MPBE - 16-Bit 25MHz HCS12 MCU, 128KB Flash | NXP
Référence : MC9S12C128MPBE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.65 | $11,65 |
| 10 | $10.48 | $104,80 |
| 100 | $9.32 | $932,00 |
| 500 | $8.4 | $4 200,00 |
| 1 000 | $7.55 | $7 550,00 |
MC9S12C128MPBE Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a set of peripherals such as timers, ADCs, communication controllers, and GPIO. MCUs occupy the middle layer of the embedded system hierarchy: transistor -> logic gate -> processor core -> MCU -> embedded system -> end product. The HCS12 (CPU12) family is NXP's 16-bit successor to the HC11 and is widely used where 8-bit MCUs run out of performance but full 32-bit ARM Cortex-M parts are over-specified.
Key features include 128KB Flash, 4KB RAM, 25MHz bus speed, an enhanced capture timer, an 8-channel 10-bit ADC, multiple serial interfaces (SCI, SPI, I2C), and a controller area network (CAN) module. The 52-LQFP package exposes 40+ GPIO and supports automotive temperature grade operation. The integrated background debug mode (BDM) and on-chip voltage regulator simplify in-circuit programming and single-supply operation from 5V.
Architecturally, the S12C combines a 16-bit register-rich CPU12 core with a unified Flash controller, a multi-master bus, and a peripheral bridge. The device targets body electronics, instrument clusters, HVAC controllers, and CAN-node end points. Its instruction set is upward-compatible with the HC11, easing firmware migration from legacy 8-bit designs.
Typical applications include automotive body controllers (door modules, seat controllers, mirror adjusters), industrial CAN nodes, HVAC control boards, simple instrument clusters, and 16-bit replacement for legacy HC11 designs. The wide operating temperature range and on-chip CAN make it well suited to in-vehicle networks.
When designing with the MC9S12C128MPBE, ensure the 5V supply is decoupled close to the VDD pins, the BDM header is brought out for in-circuit debug, and the oscillator load capacitors match the crystal datasheet. Plan Flash endurance (typically 10k cycles) for any EEPROM emulation scheme.
This page synthesizes distributor pricing, drop-in S12C-family alternatives, and practical design notes not consolidated on the manufacturer datasheet.
Alternatives de remplacement direct pour MC9S12C128MPBE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12C128MPBE (même facteur de forme et même empreinte) — différant par Program Memory Size, RAM Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12C128CPBE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12GC128MPBE
✅ Remplacement direct✓ En stock
$7.9 / unité
Voir la fiche technique →MC9S12C128VPBE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C96VPBE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C64MPB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C128MPBE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (CPU12) |
| Largeur du bus de données | 16-bit |
| Fréquence d'horloge maximale | 25 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| RAM Size | 4 KB |
| Boîtier | 52-LQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Tension d'alimentation | 5 V (single-supply with on-chip regulator) |
| Température de fonctionnement | -40C to +125C (automotive) |
| ADC | 10-bit, multi-channel |
| Communication Interfaces | SCI (UART), SPI, I2C, CAN |
| CAN Module | Yes (msCAN) |
| Timers | Enhanced Capture Timer (ECT) |
| Debug Interface | Background Debug Mode (BDM) |
| Temperature Grade | Automotive |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12C128MPBE
| Broche 1 | BKGD/MODC — Background Debug Mode / Mode select |
| Broche 2 | VDDR — Voltage regulator supply |
| Broche 3 | VSS — Ground |
| Broche 4 | VDDX — External I/O supply |
| Broche 5 | VSSX — External I/O ground |
| Broche 6 | RESET — External reset input (active low) |
| Broche 7 | TEST — Test mode (tie to VSS) |
| Broche 8 | XCLKS — Clock mode select |
| Broche 9 | EXTAL — External oscillator input |
| Broche 10 | XTAL — External oscillator output |
| Broche 11 | PAD0/AN0 — GPIO / ADC channel 0 |
| Broche 12 | PAD1/AN1 — GPIO / ADC channel 1 |
| Broche 13 | PAD2/AN2 — GPIO / ADC channel 2 |
| Broche 14 | PAD3/AN3 — GPIO / ADC channel 3 |
| Broche 15 | PAD4/AN4 — GPIO / ADC channel 4 |
| Broche 16 | PAD5/AN5 — GPIO / ADC channel 5 |
| Broche 17 | PAD6/AN6 — GPIO / ADC channel 6 |
| Broche 18 | PAD7/AN7 — GPIO / ADC channel 7 |
| Broche 19 | PA0 — GPIO port A bit 0 |
| Broche 20 | PA1 — GPIO port A bit 1 |
| Broche 21 | PA2 — GPIO port A bit 2 |
| Broche 22 | PA3 — GPIO port A bit 3 |
| Broche 23 | PA4 — GPIO port A bit 4 |
| Broche 24 | PA5 — GPIO port A bit 5 |
| Broche 25 | PA6 — GPIO port A bit 6 |
| Broche 26 | PA7 — GPIO port A bit 7 |
| Broche 27 | PB0 — GPIO port B bit 0 |
| Broche 28 | PB1 — GPIO port B bit 1 |
| Broche 29 | PB2 — GPIO port B bit 2 |
| Broche 30 | PB3 — GPIO port B bit 3 |
| Broche 31 | PB4 — GPIO port B bit 4 |
| Broche 32 | PB5 — GPIO port B bit 5 |
| Broche 33 | PB6 — GPIO port B bit 6 |
| Broche 34 | PB7 — GPIO port B bit 7 |
| Broche 35 | PC0/CANRX — GPIO port C bit 0 / CAN receive |
| Broche 36 | PC1/CANTX — GPIO port C bit 1 / CAN transmit |
| Broche 37 | PC2 — GPIO port C bit 2 |
| Broche 38 | PC3 — GPIO port C bit 3 |
| Broche 39 | PC4 — GPIO port C bit 4 |
| Broche 40 | PC5 — GPIO port C bit 5 |
| Broche 41 | PC6 — GPIO port C bit 6 |
| Broche 42 | PC7 — GPIO port C bit 7 |
| Broche 43 | PD0/SCI0RX — GPIO port D bit 0 / SCI0 receive |
| Broche 44 | PD1/SCI0TX — GPIO port D bit 1 / SCI0 transmit |
| Broche 45 | PD2/SPI0SCK — GPIO port D bit 2 / SPI0 clock |
| Broche 46 | PD3/SPI0MOSI — GPIO port D bit 3 / SPI0 MOSI |
| Broche 47 | PD4/SPI0MISO — GPIO port D bit 4 / SPI0 MISO |
| Broche 48 | PD5/SPI0SS — GPIO port D bit 5 / SPI0 slave select |
| Broche 49 | PE0/TIM0 — GPIO port E bit 0 / Timer channel 0 |
| Broche 50 | PE1/TIM1 — GPIO port E bit 1 / Timer channel 1 |
| Broche 51 | PE2/TIM2 — GPIO port E bit 2 / Timer channel 2 |
| Broche 52 | PE3/TIM3 — GPIO port E bit 3 / Timer channel 3 |
Applications typiques
MC9S12C128MPBE convient pour 6 applications: Automotive Body Controller, HVAC Control Module, Industrial CAN Node, Instrument Cluster Sub-Controller, Legacy HC11 Migration Target, Battery Management Slave Module.
Automotive Body Controller
The MC9S12C128MPBE is purpose-built for automotive body controllers such as door modules, seat controllers, mirror adjusters, and lighting nodes. Its 25 MHz CPU12 core and 128 KB Flash handle the layered state-machine logic typical of body control firmware, while the integrated msCAN module talks directly to the vehicle CAN bus at up to 1 Mbit/s without an external transceiver controller. The -40C to +125C automotive temperature grade and 52-LQFP footprint meet the thermal and PCB-area requirements of underhood and cabin ECUs. Compared with an 8-bit HC11, the HCS12 core offers roughly 3-5x more throughput per MHz, freeing headroom for LIN sub-bus management, PWM-driven mirror/glass actuators, and OBD-II diagnostics in a single chip. Recommend pairing the MCU with NXP TJA1042 CAN transceivers and TLE4271 supply rails.
Recommandé
HVAC Control Module
HVAC control modules for automotive cabins benefit from the MC9S12C128MPBE's combination of a 10-bit multi-channel ADC, enhanced capture timer (ECT), and CAN connectivity in a 52-LQFP package sized for compact dashboard-mounted PCBAs. The ADC digitizes thermistor inputs from cabin, evaporator, and outside-air sensors with adequate resolution for closed-loop temperature control, while the ECT generates the PWM outputs that drive blower fans and mode doors. The 128 KB Flash accommodates lookup-table-driven control algorithms and self-test routines, and 4 KB of RAM is sufficient for sensor filtering and CAN message buffering. The automotive temperature grade and on-chip voltage regulator simplify the bill of materials. Recommend pairing with NXP MM912J637 sensor interface ICs for rotary HVAC knob decoding.
Recommandé
Industrial CAN Node
For industrial CANopen or DeviceNet slave nodes, the MC9S12C128MPBE offers a compelling combination of 16-bit performance, 128 KB Flash for CANopen stack libraries, and a hardware CAN 2.0A/B controller. The 52-LQFP (10x10 mm) footprint fits inside IP65 node housings and the -40C to +125C temperature range tolerates cabinet and outdoor environments. The BDM debug interface accelerates firmware bring-up, while the SCI (UART) and SPI peripherals support local sensor and actuator expansion. Estimated firmware footprint for a typical CANopen CiA 401 generic I/O profile plus stack is 40-60 KB, well within the 128 KB Flash budget. Recommend pairing with isolated CAN transceivers such as ADM3053 for industrial bus isolation.
Recommandé
Instrument Cluster Sub-Controller
Distributed instrument cluster architectures use the MC9S12C128MPBE as a sub-controller that drives gauges, indicator LEDs, and warning buzzers while communicating with the main cluster MCU over CAN. The 25 MHz CPU12 core is fast enough to multiplex multiple gauge stepper motors and refresh indicator states at 100+ Hz without visible flicker, and the 128 KB Flash stores gauge calibration tables. The 52-LQFP package footprint and on-chip PWM/timer channels minimize external driver count. The automotive temperature grade supports behind-dash thermal environments. Recommend pairing with NXP MC33932 stepper motor driver H-bridges for analog gauge actuation.
Recommandé
Legacy HC11 Migration Target
Designers maintaining legacy HC11-based products can migrate to the MC9S12C128MPBE for a 3-5x performance boost while keeping the CPU instruction set and development environment similar enough to reuse most firmware. The S12C family shares the HC11 programming model and adds 128 KB Flash (vs typical 32-60 KB on HC11), 4 KB RAM, and modern peripherals including msCAN. The 52-LQFP package is pin-compatible with the HC11 in many of the same footprints, enabling PCB reuse. Recommend a BDM-based firmware port using NXP CodeWarrior and validating the new peripheral interrupt vector table against the HC11 source.
Recommandé
Battery Management Slave Module
Battery management systems (BMS) for 12V/48V automotive batteries use the MC9S12C128MPBE as a cell-monitoring slave that reads ADC channels, performs local calculations, and reports results over CAN. The 10-bit ADC and 25 MHz core provide sufficient performance for cell-voltage sampling at 1 kHz, and the 128 KB Flash stores cell-balancing tables and safety state machines. The -40C to +125C temperature range tolerates underhood battery placement, and the 52-LQFP package supports compact BMS PCBAs. Recommend pairing with NXP MC33771B battery cell controller ICs for the analog front-end and isolated CAN transceivers for the high-voltage isolation boundary.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12C128MPBE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12C128CPBE | MC9S12GC128MPBE | MC9S12C128VPBE | MC9S12C96VPBE | MC9S12C64MPB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 52-LQFP (10x10 mm) | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same |
| Core | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) | HCS12 (CPU12) |
| Maximum Clock Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 96 KB | 64 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40C to +125C (automotive) | 0C to +70C (commercial) | -40C to +125C (automotive) | -40C to +125C (extended) | -40C to +125C | -40C to +125C (automotive) |
| CAN Module | msCAN (CAN 2.0A/B) | msCAN | msCAN | msCAN | msCAN | msCAN |
Principaux différenciateurs
- Automotive-grade temperature range in 52-LQFP (vs MC9S12C128CPBE)
- Enhanced peripheral set of S12GC sub-family (vs MC9S12C128VPBE)
- Larger Flash budget vs lower-cost variants (vs MC9S12C64MPB)
Notes de conception
The MC9S12C128MPBE includes an on-chip voltage regulator that derives the internal logic supply from a single external 5V rail. Place a 100nF decoupling capacitor on every VDD/VSS pin pair, plus a bulk 4.7uF-10uF tantalum or ceramic on the VDDR (pin 2) regulator input. The regulator can source the internal core plus moderate GPIO loads but cannot drive external high-current peripherals - use a discrete 5V LDO such as the TLE4271-2 for external loads.
Do not float the BKGD/MODC pin (pin 1) - it is used for background debug mode entry at reset and must be tied through a resistor network or left for the BDM tool. Floating this pin can cause unexpected reset vector behavior. Per the NXP S12C reference manual, the recommended BDM circuit includes a pull-up to VDDR and a series resistor to the debugger. Also ensure the TEST pin (pin 7) is tied directly to VSS - leaving it floating or pulled high places the device into factory test mode.
Route the CAN bus differential pair (PC0/CANRX and PC1/CANTX) as a 100-ohm differential pair with controlled impedance, keeping total stub length under 10mm. Place the CAN transceiver (e.g., TJA1042T) within 50mm of the MCU pins to minimize EMI susceptibility. The EXTAL/XTAL oscillator traces should be short, surrounded by a ground guard ring, and isolated from noisy switching signals to avoid jitter on the 25 MHz bus clock. Decoupling capacitors must be placed within 3mm of their respective VDD pins.
Informations de conformité
Automotive temperature grade per 'M' suffix in NXP ordering scheme. AEC-Q100 qualification expected for automotive-grade S12C family members per NXP product page. Halogen-free status not explicitly confirmed in provided data.
