MC9S12GC128CPBER - 16-bit 25MHz 128KB Flash MCU | NXP
Référence : MC9S12GC128CPBER ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.1 | $81,00 |
| 100 | $7.25 | $725,00 |
| 500 | $6.6 | $3 300,00 |
| 1 000 | $5.95 | $5 950,00 |
MC9S12GC128CPBER Présentation
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die. The HCS12 (S12) family belongs to the broader 16-bit microcontroller category within NXP's embedded processing portfolio, and is a successor of the widely used 68HC12 architecture. MCUs of this class typically run closed-loop control, communication, and monitoring tasks in embedded systems where a 32-bit application processor would be unnecessary.
Key features of the MC9S12GC128 include its 25MHz operating speed, 128KB on-chip Flash with in-circuit programmability, 4KB RAM, an internal oscillator that removes the need for an external clock source in cost-sensitive designs, and the rich S12 peripheral set including SCI serial ports, SPI, an 8-channel timer, and an ADC. The 52-TQFP 10x10 mm footprint provides 35 I/O while remaining hand-solderable for prototyping.
Architecturally, the device is based on the CPU12 core, which retains full object-code compatibility with the 68HC12. The single-chip operating mode is intended for typical embedded control, while the expanded modes allow external bus operation. Flash programming is performed via the on-chip charge pump, so no high external programming voltage is required.
Typical applications include automotive body modules, industrial control panels, motor control boards, building automation nodes, and legacy HCS12 design maintenance. Its 5V-compatible operation and robust I/O make it a common choice in electrically noisy environments.
A key design consideration: the 'R' suffix and 'P' package code define tape-and-reel packaging and temperature/package options - verify the exact ordering-code breakdown in the NXP datasheet before production purchasing, and confirm availability since this family is aging.
This page adds value beyond the datasheet by synthesizing distributor availability from six sources, drop-in S12 family alternatives, comparison tables, and practical design notes in one place.
Alternatives de remplacement direct pour MC9S12GC128CPBER — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12GC128CPBER (même facteur de forme et même empreinte) — différant par Package, ADC, Communication Interfaces, Core, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesMC9S12GC128CPBER Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 (CPU12), 16-bit |
| Core Size | 16-bit |
| Speed | 25MHz |
| Program Memory Size | 128KB (128K x 8) Flash |
| RAM Size | 4K x 8 |
| Number of I/O | 35 |
| Oscillator Type | Internal |
| Connectivity | SCI, SPI |
| Peripherals | PWM, WDT, ADC, LVD |
| Boîtier / Format | 52-TQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Program Memory Type | FLASH |
Guide de configuration des broches du MC9S12GC128CPBER 52-tqfp (10x10 mm)
Configuration des broches du MC9S12GC128CPBER (boîtier 52-tqfp (10x10 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MC9S12GC128CPBER.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MC9S12GC128CPBER convient pour 6 applications: Automotive Body Control Modules, Industrial Control Panels, Motor Control Boards, Building Automation Nodes, Legacy S12 Design Maintenance, Test Fixtures and Instrumentation.
Automotive Body Control Modules
The MC9S12GC128CPBER fits body electronics such as lighting control, door modules, and seat controllers, where the S12 family has a long installed base. Its 25MHz CPU12 core handles closed-loop relay and lamp timing tasks, while 128KB Flash accommodates diagnostic and protocol code and 4KB RAM holds runtime state. The 35 I/O lines directly drive loads and read switches with 5V-tolerant robustness valued in electrically noisy 12V vehicle environments. Firmware is typically developed on the internal oscillator for cost-sensitive variants, or with a crystal where CAN/SCI baud accuracy matters. Because the family is mature, this part is most often used to sustain existing module designs rather than start new ones.
Recommandé
Industrial Control Panels
In factory panels and machine controllers, the MC9S12GC128CPBER provides a 16-bit control core with 128KB Flash for ladder-style or state-machine firmware and 4KB RAM for process variables. The 25MHz execution rate is adequate for millisecond-level scan cycles, and the S12 timer and PWM peripherals sequence actuators, while the ADC reads potentiometers and sensors. The internal oscillator option lowers BOM cost across panel variants. The 5V-class I/O of the 52-TQFP tolerates noisy cabinet environments better than many 3.3V MCUs. Its 10x10 mm TQFP is also reworkable with standard hot-air tools, simplifying field repair and small-batch production of control boards.
Recommandé
Motor Control Boards
The S12 PWM channels of the MC9S12GC128CPBER make it suitable for DC and small BLDC motor control, generating 8-channel PWM with the 25MHz bus providing fine duty resolution. The on-chip ADC samples current shunts and position feedback, while 128KB Flash holds FOC-lite or trapezoidal commutation firmware. The 35 I/O lines interface hall sensors, direction inputs, and fault feedback directly at 5V logic levels. Its internal oscillator allows low-cost fan and pump boards, whereas closed-loop servo variants benefit from a crystal for timing determinism. Designers should verify PWM dead-time insertion capability against requirements, since the GC family PWM block is simpler than newer S12G motor-control peripherals.
Recommandé
Building Automation Nodes
HVAC dampers, lighting scenes, and access control nodes use the MC9S12GC128CPBER as a self-contained control MCU: the internal oscillator removes one timing component, the 52-TQFP 10x10 mm footprint fits compact node boards, and 128KB Flash stores protocol stacks and scheduling logic. SCI and SPI ports link to RS-485 transceivers or EEPROM for configuration storage, while the ADC digitizes temperature sensors such as NTC networks. The 4KB RAM supports modest buffering for polled networks. Its 5V I/O drives relays through transistors without level shifting, reducing node cost. For battery-powered nodes, verify the low-power wait/stop currents in the family datasheet, as this mature family predates modern sub-uA sleep levels.
Recommandé
Legacy S12 Design Maintenance
A major use of the MC9S12GC128CPBER today is sustaining production of existing HCS12 designs whose original firmware and toolchains remain valid. Because the CPU12 core is object-code compatible across the S12 range, replacing a discontinued GC sibling with the CPBER typically requires only a Flash re-flash, not a rewrite. The 52-TQFP footprint matches other 52-pin GC variants, so PCBs need no layout change. Stock exists through authorized distribution and secondary sources including Rochester Electronics, giving manufacturers a bridge while they plan migration to NXP's S12G or MagniV families. Always confirm the temperature grade suffix and re-verify oscillator trim in-circuit when substituting within the family.
Recommandé
Test Fixtures and Instrumentation
Bench fixtures and simple instruments use the MC9S12GC128CPBER for sequencing, limit comparison, and result reporting. The 25MHz core executes test step state machines, the ADC captures analog pass/fail measurements, and SCI communicates results to a PC or PLC over RS-232/RS-485. 128KB Flash retains multiple fixture profiles, and 4KB RAM buffers measurement logs between uploads. The internal oscillator suits fixtures where timing tolerance is loose, while the 5V I/O directly interfaces optocouplers, relays, and industrial sensors without extra translation. The through-reworkable TQFP package supports engineering change iterations on fixture boards, and its long S12 ecosystem documentation base shortens firmware bring-up for maintenance engineers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12GC128CPBER — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12GC128CPBE | MC9S12GC96CPBER | MC9S12C128VPBE | MC9S12C128MPBE |
|---|---|---|---|---|---|
| Package | 52-TQFP (10x10 mm) | 52-TQFP (10x10 mm) - same | 52-TQFP (10x10 mm) - same | 52-TQFP (10x10 mm) - same | 52-pin QFP (M option) - verify footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Speed | HCS12 16-bit, 25MHz | HCS12 16-bit, 25MHz | HCS12 16-bit, 25MHz | S12 16-bit, similar clock | S12 16-bit, similar clock |
| Flash Memory | 128KB (128K x 8) | 128KB | 96KB (-25%) | 128KB | 128KB |
| Software Compatibility | S12 / CPU12 object code | 100% (same die) | 100% (same family) | Core compatible, peripherals differ | Core compatible, peripherals differ |
Principaux différenciateurs
- Full 128KB Flash in the 52-pin GC package (vs MC9S12GC96CPBER)
- Tape-and-reel delivery for automated assembly (vs MC9S12GC128CPBE)
- GC-family peripheral set with S12 code compatibility (vs MC9S12C128VPBE)
Notes de conception
Confirm the exact ordering-code breakdown before purchasing: in MC9S12GC128CPBER the 'P' denotes the 52-TQFP (10x10 mm) package, 'R' the tape-and-reel delivery, and the final temperature/grade letters matter for qualification. Mixing up GC vs C sub-families is a common error - the S12C parts share core and Flash size but differ in peripheral set and some pin multiplexing, so firmware written for the GC PWM/ADC block may not run unchanged on an S12C device. Always validate against the GC family datasheet, not generic S12 documentation.
The S12 family operates from a single 5V-class supply per the datasheet electrical characteristics - confirm the exact VDD range for this grade in the NXP documentation before powering. Decouple the VDD/VDDA pins with 0.1uF ceramics placed within a few millimeters of each pin, plus bulk 10uF near the regulator. If you use the internal oscillator, expect higher clock tolerance than a crystal; systems communicating over SCI/CAN should budget baud-rate error accordingly or fit a crystal per the clock section of the family reference manual.
Lay out the 52-TQFP with short, direct traces to the crystal (if fitted) and keep the analog VDDA/VRH/VRL references on a quiet region of the board separated from PWM and relay switching currents. Use a solid ground plane under the MCU and star-connect analog ground returns. Unprogrammed Flash ships erased; add a BDM header for in-circuit programming via the background debug interface - this avoids socketed programming and allows field firmware updates. Leave test points on RESET and the SCI lines for bring-up diagnostics.
Informations de conformité
Compliance status was not stated in the retrieved distributor data; verify RoHS/REACH certificates on the NXP product page for the exact ordering code.
