MC9S12P128MQK - 16-Bit 128KB Flash S12 MCU | NXP | QFP-80
Référence : MC9S12P128MQK ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.95 | $89,50 |
| 100 | $7.6 | $760,00 |
| 500 | $6.85 | $3 425,00 |
| 1 000 | $6.1 | $6 100,00 |
MC9S12P128MQK Présentation
The HCS12 platform is an enhanced 16-bit CISC architecture that evolved from the original Motorola HC11 and HC12 cores. A microcontroller (MCU) is a self-contained processor with integrated Flash, RAM, peripherals, and interrupt controller on a single die; the S12 sub-family sits between 8-bit MCUs (used for simple I/O control) and 32-bit ARM Cortex-M devices (used for high-performance applications), making it well-suited for LIN nodes, body controllers, and small gateway ECUs.
Key features of the MC9S12P128MQK include 6 KB of RAM, a 12-bit ADC, a 32 MHz bus clock, 64 I/O lines, and an integrated CAN and SCI/SPI peripheral set. The 80-pin LQFP package provides sufficient pin count for parallel motor driving, switch scanning, and sensor interfaces while keeping the board footprint compact for body-electronics modules. An internal phase-locked loop (IPLL) multiplies the external reference to 32 MHz, eliminating the need for an external high-frequency crystal in most designs.
Architecturally, the device is built on a 0.18 µm Flash process with embedded EEPROM emulation and a background-debug mode (BDM) interface for non-intrusive in-circuit programming. The CPU12 instruction set is largely source-compatible with HC11 assembly, easing code migration. A multi-channel 16-bit timer (TIM), 8-channel 10-bit PWM, and a CAN 2.0A/B controller give the MCU enough peripheral bandwidth to drive a small body controller without an external companion chip.
Typical applications include automotive body controllers, HVAC flap and blower drivers, instrument cluster sub-MCUs, lighting/ECM modules, LIN/J2602 slaves, and CAN nodes that require moderate compute and a wide temperature range. The wide supply range also allows the part to be powered directly from 12 V-derived 5 V rails in automotive systems.
When designing with the MC9S12P128MQK, ensure the BDM header is brought out for production programming and that the PLL filter network follows the reference manual layout. Use at least four layers or a solid ground pour to keep digital switching noise out of the analog ADC inputs.
This page synthesizes distributor stock, AEC-Q100 grade details, drop-in S12P-family alternatives, and practical PCB design notes that the standalone datasheet does not provide in a single place.
Alternatives de remplacement direct pour MC9S12P128MQK — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12P128MQK (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Supply Voltage, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S9S12P128J0MQK
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S9S12P128J0VFT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.78 / unité
Voir la fiche technique →MC9S12C96CFAE557
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →MC9S12H256VFVE
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →MC9S12XEG128MAA
✅ Remplacement direct✓ En stock
$8.9 / unité
Voir la fiche technique →MC9S12DT256CPVE
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →MC9S12P128MQK Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12 / CPU12 (16-bit) |
| Program Memory | 128 KB Flash |
| Data RAM | 6 KB |
| Maximum CPU Frequency | 32 MHz |
| Largeur du bus de données | 16-bit |
| Number of I/Os | 64 I/O |
| ADC Resolution | 12-bit |
| Tension d'alimentation | 3.15 V to 5.5 V |
| Température de fonctionnement | -40 °C to +125 °C (Automotive) |
| Style de montage | SMD/SMT |
| Boîtier | QFP-80 (LQFP-80, 14x14 mm) |
| Terminal Form | GULL WING |
| Communications | CAN, SCI, SPI |
| Programming Interface | Background Debug Mode (BDM) |
| Temperature Grade | Automotive |
Configuration des broches de MC9S12P128MQK
| Broche 1 | PP0 — Port P, bit 0 / PWM0 |
| Broche 2 | PP1 — Port P, bit 1 / PWM1 |
| Broche 3 | PP2 — Port P, bit 2 / PWM2 |
| Broche 4 | PP3 — Port P, bit 3 / PWM3 |
| Broche 5 | PP4 — Port P, bit 4 / PWM4 |
| Broche 6 | PP5 — Port P, bit 5 / PWM5 |
| Broche 7 | PP6 — Port P, bit 6 / PWM6 |
| Broche 8 | PP7 — Port P, bit 7 / PWM7 |
| Broche 9 | VDDR — Voltage regulator supply |
| Broche 10 | VDD — Digital supply (3.15-5.5 V) |
| Broche 11 | VSS — Digital ground |
| Broche 12 | VSSR — Voltage regulator ground |
| Broche 13 | TEST — Test mode pin (tie to VSS in normal operation) |
| Broche 14 | RESET — Active-low external reset input |
| Broche 15 | BKGD — Background Debug Mode (BDM) interface |
| Broche 16 | XTAL — Crystal oscillator input |
| Broche 17 | EXTAL — Crystal oscillator input / external clock |
| Broche 18 | VSSPLL — PLL ground |
| Broche 19 | VDDPLL — PLL supply |
| Broche 20 | XFC — PLL loop filter capacitor |
| Broche 21 | PAD0 — Port AD, bit 0 (analog/digital) |
| Broche 22 | PAD1 — Port AD, bit 1 (analog/digital) |
| Broche 23 | PAD2 — Port AD, bit 2 (analog/digital) |
| Broche 24 | PAD3 — Port AD, bit 3 (analog/digital) |
| Broche 25 | PAD4 — Port AD, bit 4 (analog/digital) |
| Broche 26 | PAD5 — Port AD, bit 5 (analog/digital) |
| Broche 27 | PAD6 — Port AD, bit 6 (analog/digital) |
| Broche 28 | PAD7 — Port AD, bit 7 (analog/digital) |
| Broche 29 | PAD8 — Port AD, bit 8 (analog/digital) |
| Broche 30 | PAD9 — Port AD, bit 9 (analog/digital) |
| Broche 31 | PAD10 — Port AD, bit 10 (analog/digital) |
| Broche 32 | PAD11 — Port AD, bit 11 (analog/digital) |
| Broche 33 | PAD12 — Port AD, bit 12 (analog/digital) |
| Broche 34 | PAD13 — Port AD, bit 13 (analog/digital) |
| Broche 35 | PAD14 — Port AD, bit 14 (analog/digital) |
| Broche 36 | PAD15 — Port AD, bit 15 (analog/digital) |
| Broche 37 | VRH — ADC high reference voltage |
| Broche 38 | VRL — ADC low reference voltage |
| Broche 39 | VDDA — Analog supply |
| Broche 40 | VSSA — Analog ground |
| Broche 41 | PM0 — Port M, bit 0 |
| Broche 42 | PM1 — Port M, bit 1 |
| Broche 43 | PM2 — Port M, bit 2 |
| Broche 44 | PM3 — Port M, bit 3 |
| Broche 45 | PM4 — Port M, bit 4 |
| Broche 46 | PM5 — Port M, bit 5 |
| Broche 47 | PM6 — Port M, bit 6 |
| Broche 48 | PM7 — Port M, bit 7 |
| Broche 49 | PJ0 — Port J, bit 0 |
| Broche 50 | PJ1 — Port J, bit 1 |
| Broche 51 | PJ2 — Port J, bit 2 |
| Broche 52 | PJ3 — Port J, bit 3 |
| Broche 53 | PJ4 — Port J, bit 4 |
| Broche 54 | PJ5 — Port J, bit 5 |
| Broche 55 | PJ6 — Port J, bit 6 |
| Broche 56 | PJ7 — Port J, bit 7 |
| Broche 57 | PK0 — Port K, bit 0 |
| Broche 58 | PK1 — Port K, bit 1 |
| Broche 59 | PK2 — Port K, bit 2 |
| Broche 60 | PK3 — Port K, bit 3 |
| Broche 61 | PK4 — Port K, bit 4 |
| Broche 62 | PK5 — Port K, bit 5 |
| Broche 63 | PK6 — Port K, bit 6 |
| Broche 64 | PK7 — Port K, bit 7 |
| Broche 65 | PS0 — Port S, bit 0 / SCI0 RXD |
| Broche 66 | PS1 — Port S, bit 1 / SCI0 TXD |
| Broche 67 | PS2 — Port S, bit 2 / SPI0 SCK |
| Broche 68 | PS3 — Port S, bit 3 / SPI0 MOSI |
| Broche 69 | PS4 — Port S, bit 4 / SPI0 MISO |
| Broche 70 | PS5 — Port S, bit 5 / SPI0 SS |
| Broche 71 | PS6 — Port S, bit 6 |
| Broche 72 | PS7 — Port S, bit 7 |
| Broche 73 | PTC0 — Port T, bit 0 / IOC0 |
| Broche 74 | PTC1 — Port T, bit 1 / IOC1 |
| Broche 75 | PTC2 — Port T, bit 2 / IOC2 |
| Broche 76 | PTC3 — Port T, bit 3 / IOC3 |
| Broche 77 | PTC4 — Port T, bit 4 / IOC4 |
| Broche 78 | PTC5 — Port T, bit 5 / IOC5 |
| Broche 79 | VDDX — I/O supply (3.15-5.5 V) |
| Broche 80 | VSSX — I/O ground |
Applications typiques
MC9S12P128MQK convient pour 7 applications: Automotive Body Controller, HVAC Flap and Blower Driver, Instrument Cluster Sub-MCU, LIN/J2602 Slave Node, Automotive Lighting and ECM Module, CAN Sensor Node, Industrial 16-Bit Controller Retrofit.
Automotive Body Controller
The MC9S12P128MQK's 64 I/O pins, 32 MHz CPU12 core, and 128 KB Flash make it a strong fit for automotive body controllers that aggregate door, mirror, seat, and lighting functions. Its CAN 2.0A/B interface lets it sit on the body CAN bus talking to the BCM, while the 12-bit ADC reads switch and sensor inputs at 32 MHz sample rates. Unlike ARM Cortex-M0 parts at the same price, the S12 core runs LIN/J2602 stacks in firmware alone, removing the need for a separate LIN transceiver MCU.
Recommandé
HVAC Flap and Blower Driver
For HVAC modules, the MC9S12P128MQK provides enough Flash (128 KB) for LIN/J2602 stacks plus a closed-loop PI controller that drives the blower MOSFET bridge via PWM. Its 8-channel PWM and 12-bit ADC allow direct sensing of the blower current and temperature with no extra analog front end. The -40 °C to +125 °C automotive grade handles under-dash thermal stress, and the integrated CAN option lets the module participate in the climate-control network when wired to a CAN bus.
Recommandé
Instrument Cluster Sub-MCU
The MC9S12P128MQK works well as a sub-MCU in instrument clusters, where it drives gauge stepper motors, reads the fuel/temperature sensors, and forwards warnings to the main cluster MCU over CAN or SPI. Its 32 MHz bus gives enough headroom for 100 Hz gauge update rates, and 6 KB of RAM is sufficient for the small RTOS-like scheduler that runs gauge state machines. The 80-QFP package keeps the cluster PCB at a competitive cost vs 32-bit ARM Cortex-M0 alternatives.
Recommandé
LIN/J2602 Slave Node
As a LIN/J2602 slave, the MC9S12P128MQK provides the SCI hardware, 128 KB Flash for LIN stacks and node capability files (NCFs), and 64 I/Os for switch-matrix reading and LED driving. Its automotive temperature grade qualifies it for under-dash and door-module mounting, and its small 80-QFP footprint fits inside a typical door-module housing. A common design pattern pairs the MCU with an external LIN transceiver such as the TJA1027.
Recommandé
Automotive Lighting and ECM Module
The MC9S12P128MQK's 64 I/Os and 8 PWM channels suit exterior lighting modules (headlamp leveling, DRL, indicators) where each lamp needs an independent FET driver and current feedback. The 12-bit ADC reads lamp current and diagnostics, while CAN exposes the module to the body network for fault reporting. The wide 3.15-5.5 V supply lets the MCU run directly from a 5 V regulator fed by the 12 V battery rail.
Recommandé
CAN Sensor Node
For seat-occupancy, battery-current, or wheel-speed sensor nodes that report onto a CAN bus, the MC9S12P128MQK offers integrated CAN 2.0A/B plus 128 KB Flash for sensor-fusion firmware. Its 32 MHz core can sample at 1 kHz and still have headroom for CAN message filtering and retransmit logic. The 80-QFP package fits a 30 mm x 30 mm sensor PCB alongside a CAN transceiver and a small SMPS.
Recommandé
Industrial 16-Bit Controller Retrofit
Outside automotive, the MC9S12P128MQK can retrofit HC11/HC12 sockets in industrial controllers that need 128 KB Flash and 64 I/Os at a competitive price. The CPU12 instruction set is largely source-compatible with HC11, easing code migration. Its 32 MHz bus and 12-bit ADC meet the resolution and timing requirements of small PLCs, motor-control boards, and machine-tool sub-controllers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12P128MQK — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S9S12P128J0MQK | S9S12P128J0VFT | MC9S12C96CFAE557 | MC9S12H256VFVE | MC9S12XEG128MAA | MC9S12DT256CPVE |
|---|---|---|---|---|---|---|---|
| Package | QFP-80 (LQFP, 14x14 mm) | QFP-80 (same) | QFP-80 (same) | QFP-80 (same) | QFP-80 (same) | QFP-80 (same) | QFP-80 (same) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS12 (CPU12) | HCS12 | HCS12 | HCS12 | HCS12 | HCS12X (with XGATE) | HCS12 |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 25 MHz | 32 MHz | 40 MHz | 25 MHz |
| Flash Memory | 128 KB | 128 KB | 128 KB | 96 KB | 256 KB | 128 KB | 256 KB |
| RAM | 6 KB | 6 KB | 6 KB | 4 KB | 12 KB | 12 KB | 12 KB |
| ADC | 12-bit | 12-bit | 12-bit | 10-bit | 10-bit | 12-bit | 10-bit |
| CAN | Yes (CAN 2.0A/B) | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +85 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C |
| Lifecycle | Active | Active (long-life-program) | Active | Active | Active | Active | Active (legacy) |
Principaux différenciateurs
- Identical 128 KB Flash and 6 KB RAM in a 80-QFP package for legacy drop-in reuse (vs MC9S12C96CFAE557)
- Long-life-program variant available as a true drop-in (vs S9S12P128J0MQK)
- S12 core with 32 MHz headroom at a competitive automotive-grade price (vs MC9S12XEG128MAA)
Notes de conception
The MC9S12P128MQK integrates an internal 2.5 V voltage regulator fed from VDDR. Place a 100 nF + 4.7 µF decoupling pair on VDDR close to the pin, and a separate 100 nF on each VDD/VSS pair. The internal regulator is not designed to source external loads; do not tap VDDR to power other ICs.
Use a 4-layer PCB with a solid ground pour under the QFP-80 footprint and keep the PLL filter trace to XFC as short as possible (<10 mm). Place the 0.1 µF + 10 µF decoupling pair on VDDX within 5 mm of the pin. Route BKGD and RESET away from PWM edges to avoid false-triggered resets.
Route CANH/CANL as a differential pair with 120 Ω characteristic impedance and place a split-termination network (60 Ω + 60 Ω with 4.7 nF to ground) close to the MCU. Keep CAN traces away from PWM and switch-node edges. The MC9S12P128MQK's internal CAN controller still needs an external transceiver such as the TJA1057 or TJA1027.
Estimated: at 32 MHz core and full 64 mA I/O sourcing load, the package dissipates up to ~0.4 W; draw-line EEPROM (estimated: 5 mA standby, 50 mA active inrush) may brown out if VDDR bulk capacitance is insufficient. Provide at least 10 µF of bulk + 100 nF of HF decoupling on VDDR to ride through inrush, and leave the TEST pin tied directly to VSS (not floating) so the part does not enter test mode.
Informations de conformité
Automotive temperature grade (-40 °C to +125 °C) per NXP product page indicates AEC-Q100 qualification; specific stress-test results require the NXP PPAP package. RoHS, REACH, and halogen-free status were not in the verified web data and are marked as unknown.
