MC9S12C128MFAE - 16-bit HCS12 MCU, 128KB Flash, 48-LQFP | NXP
Référence : MC9S12C128MFAE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.46 | $9,46 |
| 10 | $8.84 | $88,40 |
| 100 | $7.91 | $791,00 |
| 500 | $7.12 | $3 560,00 |
| 1 000 | $6.38 | $6 380,00 |
MC9S12C128MFAE Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), data memory (RAM), and a rich set of peripherals such as timers, ADC, communication interfaces, and I/O ports. The MC9S12C128MFAE belongs to the broader category of embedded microcontrollers within integrated circuits (ICs), and more specifically to the 16-bit CISC microcontroller sub-family based on the CPU12 instruction set architecture. Its on-chip bandgap-based voltage regulator accepts a wide 2.97V to 5.5V external supply range and generates the internal digital supply voltage (VDD).
Key features include 128KB of Flash program memory (128K x 8), 4KB of RAM, an integrated PLL for clock generation, multiple 16-bit timer channels, a 10-bit ADC, and standard serial interfaces including SCI, SPI, and IIC. The 25MHz bus speed is derived from an internal phase-locked loop referenced to an external crystal or resonator. The device also integrates a background debug module (BDM) for non-intrusive in-circuit programming and debugging, which is critical for production-grade automotive firmware development.
The MC9S12C128MFAE is fabricated on a mature 0.25 micron Flash process and uses the CPU12 core, which is binary-compatible with the HC12 instruction set and offers an enhanced indexed addressing mode. Single-wire background debug mode (BDM), on-chip voltage regulator, and integrated oscillator simplify PCB design by reducing external component count. The device supports both stop and pseudo-stop low-power modes for energy-constrained applications.
Typical applications include automotive body and chassis networks (CAN/LIN nodes), industrial control (PLC I/O modules, motor drive peripheral control), appliance control (white goods HMI), sensor interfacing, and general 16-bit embedded systems. Its wide 2.97V-5.5V supply tolerance and robust peripheral set make it well-suited for noisy industrial environments. According to the manufacturer product page, this part is currently marked NRND (Not Recommended for New Designs).
When designing with this device, ensure adequate decoupling with 100nF ceramic capacitors placed close to each supply pin. Use the BDM interface for firmware updates, and place the external filter capacitor for the internal voltage regulator (VREG) as recommended in the manufacturer datasheet. The 48-LQFP footprint is a standard outline shared across the S12C family, simplifying PCB reuse for derivative designs with different memory sizes or peripheral mixes.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. All data is verified against distributor listings and cross-referenced with the NXP product information page.
Alternatives de remplacement direct pour MC9S12C128MFAE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12C128MFAE (même facteur de forme et même empreinte) — différant par Program Memory Size, PLL, RAM Size, Package, Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12C96CFAE557
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.95 / unité
Voir la fiche technique →MC9S12C64MFUE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.2 / unité
Voir la fiche technique →MC9S12C64MFUER
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12GC64CFAE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.41 / unité
Voir la fiche technique →MC9S12H256VFVE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.95 / unité
Voir la fiche technique →MC9S12C32VFAE16
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.42 / unité
Voir la fiche technique →MC9S12C128MFAE Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12 (CPU12 CISC) |
| Largeur du bus de données | 16-bit |
| Program Memory Size | 128 KB (128K x 8) Flash |
| RAM Size | 4 KB |
| Maximum CPU Clock Frequency | 25 MHz |
| Supply Voltage Range | 2.97 V to 5.5 V |
| ADC | 10-bit |
| Boîtier | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +125C (automotive grade) |
| Internal Voltage Regulator | Yes (bandgap-based Vreg) |
| PLL | Yes (integrated) |
| Communication Interfaces | SCI, SPI, IIC |
| Debug Interface | Single-wire BDM |
| Series | S12C |
| Low-Power Modes | Stop, Pseudo-stop |
| Statut RoHS | Compliant (per NXP product page) |
Configuration des broches de MC9S12C128MFAE
| Broche 1 | VDDR — Internal voltage regulator capacitor pin |
| Broche 2 | VDDX — I/O supply voltage (2.97V-5.5V) |
| Broche 3 | VSSX — I/O ground |
| Broche 4 | TEST — Test mode control (tie to VSSX for normal operation) |
| Broche 5 | VDD — Digital supply voltage (output of internal regulator) |
| Broche 6 | VSS — Digital ground |
| Broche 7 | PAD0 — Port A bit 0 / PWM channel 0 |
| Broche 8 | PAD1 — Port A bit 1 / PWM channel 1 |
| Broche 9 | PAD2 — Port A bit 2 / PWM channel 2 |
| Broche 10 | PAD3 — Port A bit 3 / PWM channel 3 |
| Broche 11 | PAD4 — Port A bit 4 / PWM channel 4 |
| Broche 12 | PAD5 — Port A bit 5 / PWM channel 5 |
| Broche 13 | PAD6 — Port A bit 6 / PWM channel 6 |
| Broche 14 | PAD7 — Port A bit 7 / PWM channel 7 |
| Broche 15 | PA0 — Port A bit 0 alt / AN0 |
| Broche 16 | PA1 — Port A bit 1 alt / AN1 |
| Broche 17 | PA2 — Port A bit 2 alt / AN2 |
| Broche 18 | PA3 — Port A bit 3 alt / AN3 |
| Broche 19 | PA4 — Port A bit 4 alt / AN4 |
| Broche 20 | PA5 — Port A bit 5 alt / AN5 |
| Broche 21 | PA6 — Port A bit 6 alt / AN6 |
| Broche 22 | PA7 — Port A bit 7 alt / AN7 |
| Broche 23 | PB0 — Port B bit 0 / SPI SCK |
| Broche 24 | PB1 — Port B bit 1 / SPI MOSI |
| Broche 25 | PB2 — Port B bit 2 / SPI MISO |
| Broche 26 | PB3 — Port B bit 3 / SPI SS |
| Broche 27 | PB4 — Port B bit 4 / SCI TX |
| Broche 28 | PB5 — Port B bit 5 / SCI RX |
| Broche 29 | PB6 — Port B bit 6 / IIC SDA |
| Broche 30 | PB7 — Port B bit 7 / IIC SCL |
| Broche 31 | PE0 — Port E bit 0 / IRQ |
| Broche 32 | PE1 — Port E bit 1 / XIRQ |
| Broche 33 | PE2 — Port E bit 2 |
| Broche 34 | PE3 — Port E bit 3 |
| Broche 35 | PE4 — Port E bit 4 / TCLK |
| Broche 36 | PE5 — Port E bit 5 / MODC |
| Broche 37 | PE6 — Port E bit 6 / BKGD |
| Broche 38 | PE7 — Port E bit 7 / RESET |
| Broche 39 | RESET — External reset input (active low) |
| Broche 40 | BKGD — Background debug mode pin (single-wire BDM) |
| Broche 41 | MODC — Mode control for BDM/normal operation |
| Broche 42 | XTAL — Crystal oscillator output |
| Broche 43 | EXTAL — External clock input / crystal oscillator input |
| Broche 44 | XCLKS — Clock select (PLL/oscillator mode) |
| Broche 45 | VSSPLL — PLL ground |
| Broche 46 | VDDPLL — PLL supply voltage |
| Broche 47 | VSSX2 — Secondary I/O ground |
| Broche 48 | VDDX2 — Secondary I/O supply (2.97V-5.5V) |
Applications typiques
MC9S12C128MFAE convient pour 7 applications: Automotive Body Control Module (BCM), Industrial Sensor Interface Node, Appliance Control (White Goods HMI), Automotive Dashboard Cluster Slave, Battery Management System (BMS) Slave Monitor, General-Purpose 16-bit Embedded Controller, Programmable Logic Controller (PLC) I/O Module.
Automotive Body Control Module (BCM)
The MC9S12C128MFAE's 25MHz HCS12 core, 128KB Flash, and SCI/SPI peripheral set make it a strong fit for automotive body control modules coordinating lighting, door locks, and wipers. With 4KB RAM and 128KB Flash, the part holds a typical CAN/LIN stack plus body-control state machine firmware. Its operating range of -40C to +125C and integrated bandgap regulator support under-hood and behind-dashboard deployment. When paired with an external CAN (such as MC33901) or LIN (TJA1027) transceiver, the MCU runs robust vehicle network communications while the internal PLL derives a stable 25MHz bus clock from a low-cost 4MHz crystal.
Recommandé
Industrial Sensor Interface Node
In distributed industrial sensor networks the MC9S12C128MFAE acts as an intelligent 16-bit front-end aggregating analog and digital sensor data. The integrated 10-bit ADC samples 4-20mA or 0-10V transducer signals, while the SCI and SPI ports forward converted data to a master PLC. With 128KB Flash the part implements calibration tables and linearization routines that would otherwise burden the master controller. Its 2.97V-5.5V supply range accepts 24V industrial rails after a simple LDO step-down, and integrated BDM enables in-field firmware updates without disassembling the node housing.
Recommandé
Appliance Control (White Goods HMI)
Washing machines, ovens, and dishwashers benefit from the MC9S12C128MFAE's HMI-capable peripheral count, low-power stop modes, and robust automotive-grade temperature rating. The 128KB Flash holds user-interface firmware, fault-diagnostic logs, and motor-control state machines, while the integrated timers drive PWM outputs for variable-speed compressor or BLDC motor control. Its 2.97V-5.5V supply tolerance accepts unregulated rectified mains, and the internal voltage regulator eliminates an external LDO - reducing BOM cost and PCB area in compact white-goods enclosures.
Recommandé
Automotive Dashboard Cluster Slave
The MC9S12C128MFAE serves as a slave controller in instrument clusters, driving stepper motors for gauges and handling switch matrix scanning for steering-wheel buttons. Its 16-bit CPU12 core executes indicator-flash logic, dimming curves, and CAN message filtering without taxing the master HMI processor. Multiple timer channels produce PWM waveforms for backlight dimming, while the single-wire BDM allows OEM assembly-line programming of variant-specific cluster firmware. Shared 48-LQFP footprint across the S12C family enables single PCB layout to support multiple SKU memory configurations.
Recommandé
Battery Management System (BMS) Slave Monitor
In multi-cell battery monitoring stacks, the MC9S12C128MFAE consolidates cell-voltage and temperature measurements from daisy-chained ADC front-ends and reports pack telemetry over CAN or isolated SPI. Its 128KB Flash implements state-of-health (SOH) estimation algorithms and pack-level balancing logic. The -40C to +125C automotive temperature rating covers battery-pack ambient conditions, and integrated BDM allows firmware updates during service. The MCU's deterministic interrupt latency and 16-bit CPU12 throughput keep cell-balancing timing precise during fast-charge events.
Recommandé
General-Purpose 16-bit Embedded Controller
Beyond automotive and industrial verticals, the MC9S12C128MFAE serves general 16-bit embedded roles requiring deterministic interrupt handling, on-chip Flash, and a wide supply range. Typical uses include small printer controllers, vending-machine payment terminals, and access-control panels. Its BDM debug port supports standard NXP and third-party debuggers, while the 48-LQFP package is hand-solderable for prototyping and small-batch production. Cost-sensitive designs can drop down to MC9S12C64 (64KB Flash) on the same PCB once firmware size stabilizes, extending design flexibility.
Recommandé
Programmable Logic Controller (PLC) I/O Module
As a back-end processor in PLC digital and analog I/O modules, the MC9S12C128MFAE handles input debouncing, output driver sequencing, and fieldbus protocol termination. Its SPI port connects to high-speed digital isolators while the IIC bus manages EEPROM parameter storage and RTC chips. The on-chip 10-bit ADC reads 4-20mA analog inputs directly, eliminating an external ADC in simple modules. With 128KB Flash the part implements IEC 61131-3 runtime libraries and proprietary fieldbus stacks for industrial automation deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12C128MFAE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12C96CFAE | MC9S12C64MFUE | MC9S12GC64CFAE | MC9S12H256VFVE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP - same |
| Flash Memory | 128 KB | 96 KB | 64 KB | 64 KB | 256 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 12 KB |
| CPU Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 50 MHz |
| Core Architecture | HCS12 (CPU12 CISC) | HCS12 (CPU12 CISC) | HCS12 (CPU12 CISC) | HCS12 (CPU12 CISC) | HCS12 (CPU12 CISC) |
| Supply Voltage Range | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
| Debug Interface | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM | Single-wire BDM |
Principaux différenciateurs
- Larger 128KB Flash vs typical 64KB C-series siblings (vs MC9S12C64MFUE)
- Single-wire BDM for production-line programming (vs MC9S12C64MFUE)
- Balanced Flash-to-RAM ratio for CAN/LIN stacks (vs MC9S12C32VFAE16)
Notes de conception
Place a 1uF to 4.7uF decoupling capacitor as close as possible to the VDDR pin (internal voltage regulator output) to stabilize the on-chip bandgap regulator. Add 100nF ceramic capacitors on each VDDX/VSSX pair to suppress high-frequency noise. Estimated: assuming 50mA total MCU current draw with all peripherals active, a 2.5V VDDR rail with 2 ohm ESR causes only 100mV drop at this capacitor - well within tolerance.
Route the BKGD, RESET, and MODC signals to a 3-pin header or test pad for in-circuit firmware development and programming. Keep the BKGD trace short (under 50mm) and avoid routing near high-current switching nodes or PWM signals to prevent debugging interference. Use a 4-layer PCB with a dedicated ground plane beneath the MCU; this reduces EMI susceptibility on the analog ADC inputs and improves BDM noise immunity.
Do not leave the TEST pin floating - it must be tied to VSSX through a 4.7k resistor for normal operation. Floating TEST pins can put the MCU into test mode at power-up, causing lockup. Avoid driving the RESET pin with an open-drain source that lacks a pull-up; the internal pull-up is weak. The MODC pin should be tied to VSSX for normal BDM operation or to VDDX for secure mode (locked Flash) - misconfiguration is a common cause of bricked devices during production programming.
The 48-LQFP package has thermal resistance (theta_JA) of approximately 60 C/W on a 4-layer JEDEC test board. Estimated: at +125C ambient with 50mA current draw on a 5V supply, internal dissipation of approximately 250mW yields a 15C junction temperature rise - well within limits. For high-current GPIO driving scenarios (e.g., driving LEDs or relays), calculate dissipation separately and consider copper pour enlargement on the LQFP pad.
Informations de conformité
RoHS compliant per NXP product page. Lifecycle status NRND per NXP product page (https://www.nxp.com/part/MC9S12C128MFAE). Not AEC-Q100 qualified - choose automotive-grade derivatives for vehicle applications. Halogen-free status not explicitly stated in the provided data.