MC9S12GC32VFAE - 16-Bit HCS12 MCU, 32KB Flash, 25MHz | NXP
Référence : MC9S12GC32VFAE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.4 | $9,40 |
| 10 | $8.46 | $84,60 |
| 100 | $7.52 | $752,00 |
| 500 | $6.58 | $3 290,00 |
| 1 000 | $5.64 | $5 640,00 |
MC9S12GC32VFAE Présentation
What is a 16-bit microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash/ROM), working memory (RAM), and a rich set of peripheral blocks (ADC, timers, communication ports, GPIO). 16-bit MCUs such as the HCS12 family occupy the middle ground between low-cost 8-bit devices (PIC, AVR) and high-performance 32-bit Cortex-M parts, offering more arithmetic headroom and larger addressable memory while keeping deterministic interrupt latency and low power consumption for real-time control.
Key features include 32KB Flash organized as 32K x 8, 2KB SRAM, 1KB byte-erasable EEPROM for data storage, an SCI (UART) and SPI port for master/slave peripherals, an 8-channel CAN 2.0A/B module compliant with ISO 11898 for in-vehicle networking, a 10-bit 10-channel successive-approximation ADC, and a 16-bit timer/PWM module. The CPU12 core supports a BDM (Background Debug Mode) interface for in-circuit emulation and Flash programming. The 48-LQFP package (7x7 mm) offers an industry-standard surface-mount footprint.
The MC9S12GC32VFAE uses NXP's HCS12 architecture with an enhanced instruction set, 16-bit registers, indexed addressing modes, and a memory-mapped peripheral model. Internal phase-locked loop (IPLL) multiplies an external 4 MHz crystal up to the 25 MHz bus clock, simplifying EMC-compliant board design by avoiding high-frequency external oscillators.
Typical applications include automotive body controllers and CAN nodes, HVAC and appliance control panels, motor control boards for small BLDC and stepper drivers, smart sensor hubs, and low-cost industrial PLC I/O cards. Its combination of CAN 2.0, SCI/SPI, and ADC makes it an efficient single-chip solution for distributed nodes that previously required a separate CAN transceiver and ADC.
Design consideration: the 48-LQFP (7x7) package has moderate thermal performance and the part should be operated within the automotive temperature range (-40C to +105C for the VFAE suffix). Decoupling capacitors must be placed within 3 mm of each VDD/VSS pair, and the RESET pin should be pulled up to VDDR through a 4.7 kohm resistor with a 1 nF to 100 nF decoupling cap.
This page synthesizes distributor stock and pricing, drop-in compatible HCS12 alternatives, and practical design considerations not consolidated in the NXP product folder.
Alternatives de remplacement direct pour MC9S12GC32VFAE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12GC32VFAE (même facteur de forme et même empreinte) — différant par Core Processor, Package, Peripherals, Program Memory Size, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12C32VFAE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12C32VFAE25
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12C32MFAE25
✅ Remplacement direct✓ En stock
$6.4 / unité
Voir la fiche technique →MC9S12GC32VFAE16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12GC32CFAE16
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC9S12GC32VFAE Valeurs maximales et caractéristiques électriques
| Core | CPU12 (HCS12) |
| Core Architecture | 16-bit |
| Series | HCS12 (Goldfish / MC9S12C) |
| Program Memory (Flash) | 32 KB (32K x 8) |
| RAM | 2 KB |
| EEPROM | 1 KB (byte-erasable) |
| Maximum CPU Frequency | 25 MHz |
| Boîtier | 48-LQFP (7x7 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +105C (automotive) |
| ADC | 10-bit, 10 channels |
| CAN Module | MSCAN (CAN 2.0A/B), 8 channels |
| SCI / UART | 1 channel |
| SPI | 1 channel |
| Timers | 16-bit TIM/PWM module + 8-bit MOD timer |
| GPIO | Up to 35 (package dependent) |
| Debug Interface | BDM (Background Debug Mode) |
| Supply Voltage (VDD) | 2.35 V to 2.75 V |
| I/O Supply (VDDR) | 2.35 V to 5.5 V |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12GC32VFAE
| Broche 1 | PWM3 / IOC3 — Timer/PWM channel 3 or general I/O |
| Broche 2 | PWM5 / IOC5 — Timer/PWM channel 5 or general I/O |
| Broche 3 | BKGD — Background Debug Mode (BDM) data |
| Broche 4 | GND — Ground |
| Broche 5 | RESET — Active-low reset, open-drain with internal pull-up |
| Broche 6 | VDDR — I/O supply voltage (2.35-5.5 V) |
| Broche 7 | VSSX — Crystal oscillator ground |
| Broche 8 | EXTAL — External clock input / crystal pin 1 |
| Broche 9 | XTAL — Crystal pin 2 |
| Broche 10 | VDDX — Crystal oscillator supply |
| Broche 11 | PAD0 / AN0 — GPIO or ADC input channel 0 |
| Broche 12 | PAD1 / AN1 — GPIO or ADC input channel 1 |
| Broche 13 | PAD2 / AN2 — GPIO or ADC input channel 2 |
| Broche 14 | PAD3 / AN3 — GPIO or ADC input channel 3 |
| Broche 15 | PAD4 / AN4 — GPIO or ADC input channel 4 |
| Broche 16 | PAD5 / AN5 — GPIO or ADC input channel 5 |
| Broche 17 | PAD6 / AN6 — GPIO or ADC input channel 6 |
| Broche 18 | PAD7 / AN7 — GPIO or ADC input channel 7 |
| Broche 19 | VRH — ADC high reference voltage |
| Broche 20 | VRL — ADC low reference voltage |
| Broche 21 | VDDAD — ADC supply voltage |
| Broche 22 | VSSAD — ADC ground |
| Broche 23 | PM0 / IOC0 — Port M bit 0 / TIM channel 0 |
| Broche 24 | PM1 / IOC1 — Port M bit 1 / TIM channel 1 |
| Broche 25 | PM2 / IOC2 — Port M bit 2 / TIM channel 2 |
| Broche 26 | PM3 / IOC3 — Port M bit 3 / TIM channel 3 |
| Broche 27 | PM4 — Port M bit 4 |
| Broche 28 | PM5 — Port M bit 5 |
| Broche 29 | PM6 / RXD — Port M bit 6 / SCI receive |
| Broche 30 | PM7 / TXD — Port M bit 7 / SCI transmit |
| Broche 31 | PS0 / SS — Port S bit 0 / SPI slave select |
| Broche 32 | PS1 / SCK — Port S bit 1 / SPI clock |
| Broche 33 | PS2 / MOSI — Port S bit 2 / SPI master-out |
| Broche 34 | PS3 / MISO — Port S bit 3 / SPI master-in |
| Broche 35 | CANRX — MSCAN receive input |
| Broche 36 | CANTX — MSCAN transmit output |
| Broche 37 | PJ0 / CAN0TX — Port J bit 0 |
| Broche 38 | PJ1 / CAN0RX — Port J bit 1 |
| Broche 39 | PP0 / PWM0 — Port P bit 0 / PWM channel 0 |
| Broche 40 | PP1 / PWM1 — Port P bit 1 / PWM channel 1 |
| Broche 41 | PP2 / PWM2 — Port P bit 2 / PWM channel 2 |
| Broche 42 | PP3 / PWM3 — Port P bit 3 / PWM channel 3 |
| Broche 43 | PP4 / PWM4 — Port P bit 4 / PWM channel 4 |
| Broche 44 | PP5 / PWM5 — Port P bit 5 / PWM channel 5 |
| Broche 45 | VDDPLL — PLL supply voltage |
| Broche 46 | VSSPLL — PLL ground |
| Broche 47 | VDD — Core supply voltage (2.35-2.75 V) |
| Broche 48 | VSS — Core ground |
Applications typiques
MC9S12GC32VFAE convient pour 6 applications: Automotive CAN Node / Body Control Module, Industrial Sensor Hub / Remote I/O Node, Small BLDC / Stepper Motor Controller, Smart Appliance Control Board, Lighting Control Module (DALI / 0-10V), Battery-Management Monitoring Slave.
Automotive CAN Node / Body Control Module
The MC9S12GC32VFAE's integrated MSCAN (CAN 2.0A/B) controller and 32KB Flash make it a natural fit for distributed automotive body-control and CAN-node applications. Placed at the leaf-node end of a CAN bus, the MCU handles local I/O - switches, LEDs, and sensor conditioning - while the MSCAN hardware autonomously transmits/receives 11-bit and 29-bit identifiers without CPU load. The 48-LQFP (7x7 mm) footprint allows placement in space-constrained behind-panel modules, and the -40C to +105C temperature grade meets cabin and underhood requirements. Pairing the MCU with an external ISO 11898 transceiver (such as NXP TJA1050 or TJA1043) yields a complete CAN-node for body electronics, lighting, or HVAC actuators.
Recommandé
Industrial Sensor Hub / Remote I/O Node
The MC9S12GC32VFAE serves industrial 4-20 mA loop controllers, RS-485 sensor hubs, and remote I/O nodes thanks to its 10-bit 10-channel ADC, SCI (UART) and SPI ports. The ADC's 7 us conversion time at 25 MHz bus clock easily handles industrial 0-10 V or 4-20 mA signal conditioning, while the SPI master can drive external DACs, FRAM, or EEPROM. With 32KB Flash and 2KB RAM, it runs typical 4-20 mA loop transmitter stacks, calibration routines, and Modbus RTU framing on the SCI. The 48-LQFP industrial operating range supports factory-floor deployments.
Recommandé
Small BLDC / Stepper Motor Controller
The MC9S12GC32VFAE's 16-bit TIM/PWM module with PWM/center-aligned capability and 10-bit ADC closes the loop for small brushless DC and stepper motor controllers used in fans, pumps, and small appliances. Six PWM channels drive a 3-phase FET bridge through gate drivers (such as NXP MC33937 or TI DRV8301), while the ADC samples phase currents for sensorless trapezoidal or FOC commutation. The CPU12 core's indexed addressing and BDM debug simplify tuning of the speed-control loop. The automotive temperature grade allows deployment in-vehicle HVAC blower and coolant-pump applications.
Recommandé
Smart Appliance Control Board
White-goods control boards in washing machines, dishwashers, and induction cooktops use the MC9S12GC32VFAE for keypad scanning, display driving, and main motor / heater control. Its 35 GPIO handle segmented LCD bias (via external charge pump), key-matrix scanning, and triac firing. The 32KB Flash fits state-machine code for cycle profiles, while the EEPROM stores user preferences and fault logs. The 48-LQFP surface-mount footprint supports automated assembly in high-volume appliance lines.
Recommandé
Lighting Control Module (DALI / 0-10V)
DALI (Digital Addressable Lighting Interface) controllers and 0-10 V dimmer modules rely on the MC9S12GC32VFAE for protocol handling, dim curve smoothing, and PWM fade generation. The SCI (UART) implements DALI bidirectional half-duplex signaling through an external DALI transceiver, while the TIM/PWM outputs drive constant-current LED drivers with smooth fade transitions. The 2KB RAM stores per-channel fade state and 64 DALI ballast entries, and 32KB Flash fits the IEC 62386 stack with comfortable headroom for custom lighting logic.
Recommandé
Battery-Management Monitoring Slave
As a cell-monitoring slave in a distributed BMS, the MC9S12GC32VFAE reads individual cell voltages through its 10-bit ADC, communicates up the stack via SPI, and broadcasts critical events via CAN (MSCAN). The byte-erasable EEPROM stores calibration data and lifetime cycle counts, while the 32KB Flash implements the cell-balancing algorithm and SPI-to-CAN bridge firmware. The automotive temperature grade and -40C to +105C operation cover underhood and trunk-mounted battery-pack environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12GC32VFAE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12C32VFAE | MC9S12C32VFAE25 | MC9S12C32MFAE25 | MC9S12GC32VFAE16 | MC9S12GC32CFAE16 |
|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| CPU Clock (Max) | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 16 MHz | 16 MHz |
| CAN Module | MSCAN (1x, 8-channel) | MSCAN | MSCAN | MSCAN | MSCAN | MSCAN |
| ADC Channels | 10 (10-bit) | 10 (10-bit) | 10 (10-bit) | 10 (10-bit) | 10 (10-bit) | 10 (10-bit) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +125C | -40C to +105C | -40C to +85C |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Core | HCS12 CPU12 | HCS12 CPU12 | HCS12 CPU12 | HCS12 CPU12 | HCS12 CPU12 | HCS12 CPU12 |
Principaux différenciateurs
- Integrated MSCAN controller for in-vehicle networking (vs MC9S08PA4VTG)
- 32KB Flash vs larger-code-size variants in same package (vs MC9S12XDP512CAG)
- Automotive temperature grade (-40C to +105C) (vs MC9S12GC32CFAE16)
Notes de conception
Decouple VDD/VSS pairs with 100 nF X7R ceramic capacitors placed within 3 mm of each pin pair, plus a single 4.7 uF bulk tantalum or ceramic capacitor on each supply rail. The VDDR (I/O supply) pin powers the GPIO drivers; tying it to a regulated 5 V supply enables 5 V-tolerant logic on the GPIO pins. The VDDX (oscillator supply) should be decoupled separately with a 100 nF cap to avoid PLL noise coupling. Estimated: at 25 MHz full operation the core consumes approximately 30-40 mA; the I/O supply adds 10-20 mA depending on loading.
The 48-LQFP package has a thermal resistance (theta_JA) of approximately 65 C/W on a 2-layer JEDEC test board. Estimated: at full 25 MHz operation with all peripherals active, dissipation is ~150 mW, leading to a junction temperature rise of ~10C above ambient - well within the 105C automotive grade. For sealed enclosures with no airflow, derate by adding copper pour under the exposed thermal pad area (the 48-LQFP has no exposed pad, so copper pours on both sides are recommended).
Place the 4 MHz crystal (or ceramic resonator) within 5 mm of EXTAL/XTAL with short, symmetric traces to maintain stable oscillation. The RESET pin requires a 4.7 kohm pull-up to VDDR plus a 1 nF-100 nF decoupling cap. Route the BKGD pin adjacent to RESET; BDM pods require both signals. Keep CANRX/CANTX traces short and impedance-controlled (typically 50 ohm single-ended) when connecting to the external CAN transceiver.
Do not leave the RESET pin floating during normal operation - the internal pull-up is weak and noise can cause spurious resets. When using BDM, ensure the BKGD line is not driven by external circuitry during debug. Flash endurance is rated for 10k program/erase cycles - implement wear-leveling if updating EEPROM-backed parameters frequently. The PLL requires lock time (~1 ms) before switching to the PLL clock; do not access peripherals requiring accurate timing before the PLL locks.
Informations de conformité
RoHS compliant per NXP product folder. AEC-Q100 qualification status: VFAE suffix is automotive temperature grade (-40C to +105C) but full Q100 qualification status is not explicitly stated in available data - consult NXP for PPAP. Lead-free (Pb-free) 48-LQFP terminations. Halogen-free status unknown from verified data; check NXP product environmental compliance page for confirmation.