MCF5407AI220 - ColdFire V4 MPU, 220 MHz, ROMless 208-FQFP | NXP
Référence : MCF5407AI220 ✗ Fin de vieMCF5407AI220 Présentation
A microprocessor (MPU) is an integrated processor that fetches, decodes, and executes instructions from external memory, forming the central compute element of an embedded system. Within the embedded hierarchy, an MPU sits above microcontrollers (MCU) in that it relies on external memory for code and data, and is used when higher performance or larger memory maps are required than an MCU can supply.
Key features of the MCF5407AI220 include a 32-bit ColdFire V4 core with up to 220 MHz internal frequency, a separate system bus that allows lower-speed external memory interfacing, integrated 4 KB SRAM, and a 3.3 V I/O supply with a 1.5 V internal core voltage. The device also offers a flexible bus interface (32-bit external bus with chip-select logic), DMA controllers, timers, UARTs, and a 16-channel interrupt controller.
Architecturally, the ColdFire V4 core uses a variable-length instruction set (ISA_B+) with hardware Multiply-Accumulate (MAC) and hardware divide, accelerating DSP-style operations compared to earlier ColdFire cores. The dual-clock architecture decouples the high-speed core from the external bus, simplifying mixed-speed memory subsystems.
Typical applications include industrial automation controllers, factory-floor HMI/PLC modules, point-of-sale terminals, networked embedded gateways, and high-performance data acquisition platforms where ROMless boot from external Flash is acceptable.
A practical design consideration is power: at 220 MHz the core draws roughly 1.0-1.2 W, so a copper pour and thermal vias under the exposed pad region of the FQFP are recommended. Designers should also confirm availability, as NXP has marked the MCF5407 family for discontinuance and recommends a replacement part via their PCN.
This page synthesizes distributor inventory, lifecycle status, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MCF5407AI220 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCF5407AI220 (même facteur de forme et même empreinte) — différant par UART, Package, Core, Core Architecture, Core Clock Frequency.
MCF5407CAI220
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MCF5407AI162
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →MCF5407CAB208
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5407AI220R
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5407FE220
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCF5407AI220 Valeurs maximales et caractéristiques électriques
| Core | ColdFire V4 (ISA_B+) |
| Core Architecture | 32-bit RISC |
| Maximum Core Frequency | 220 MHz |
| Dhrystone 2.1 Performance | 316 MIPS (up to) |
| Operating Voltage - Core | 1.5 V |
| Operating Voltage - I/O | 3.3 V |
| Internal SRAM | 4 KB |
| Program Memory Type | ROMless (external memory interface) |
| External Bus Width | 32-bit |
| Boîtier | 208-FQFP (28 x 28 mm) |
| Nombre de broches | 208 |
| Process Technology | 0.22 um CMOS |
| Type de montage | Surface Mount |
| DMA Channels | 2 (peripherals) |
| UART | 4 (peripherals) |
Guide de configuration des broches du MCF5407AI220 208-fqfp (28 x 28 mm)
Configuration des broches du MCF5407AI220 (boîtier 208-fqfp (28 x 28 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCF5407AI220.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCF5407AI220 convient pour 6 applications: Industrial Automation Controller, Point-of-Sale (POS) Terminal, Embedded Networked Gateway, High-Performance Data Acquisition Platform, Factory-Floor HMI / Operator Panel, Legacy Replacement for M68K Embedded Boards.
Industrial Automation Controller
The MCF5407AI220's 220 MHz ColdFire V4 with hardware MAC/divide makes it well suited to industrial PLC and motion-control loops running PID algorithms at high update rates. Its 32-bit external bus and 4 chip-select lines directly address 16- or 32-bit external Flash plus SDRAM, allowing deterministic boot and runtime memory mapping typical of factory-floor controllers. The industrial temperature range (-40C to +85C) of the 'AI' suffix variant supports cabinets and outdoor enclosures. Power dissipation of ~1.0-1.2 W at 1.5 V core is manageable with a modest copper pour under the FQFP exposed pad. Recommended companions include external 16 MB NOR, 32 MB SDRAM, and an RS-485 transceiver on the UART lines.
Recommandé
Point-of-Sale (POS) Terminal
POS terminals require moderate CPU performance for transaction processing, cryptography, and display rendering, all of which the MCF5407AI220's 316 MIPS Dhrystone throughput delivers. The ColdFire V4 core's hardware MAC speeds up SHA/CRC operations commonly used in payment pipelines. The ROMless external bus interface supports booting a signed firmware image from external NOR Flash, an important security posture for payment devices. The 208-FQFP package fits comfortably on the larger mainboards typical of countertop POS hardware where BGA mounting is undesirable. Designers can pair the MPU with a touchscreen controller and thermal printer interface on its DMA-capable peripherals.
Recommandé
Embedded Networked Gateway
The MCF5407AI220 is well matched to industrial gateway designs that aggregate fieldbus (Modbus, Profibus, CAN) traffic and bridge it to Ethernet or cellular uplinks. Four UARTs, two DMA channels, and a 32-bit external bus simplify interfacing to multiple serial peripherals without external glue logic. The 220 MHz core comfortably handles IP packet forwarding, TLS handshakes, and protocol translation stacks. ColdFire's mature toolchain (gcc, CodeWarrior, and Lauterbach TRACE32 support) shortens firmware development for these stacks. The exposed-pad 208-FQFP allows straightforward PCB thermal management in enclosed gateway housings.
Recommandé
High-Performance Data Acquisition Platform
For data acquisition systems digitizing multiple analog channels at high sample rates, the MCF5407AI220's ColdFire V4 MAC engine accelerates on-the-fly DSP operations like FIR filtering and FFT preprocessing before storage. The 32-bit external bus streams data from parallel-output ADCs at full conversion rates without bottlenecks, while the DMA engine offloads block transfers from the core. Industrial-grade 'AI' temperature rating allows deployment in factory test cells and outdoor instrumentation cabinets. The 208-FQFP's generous pin count supports many concurrent peripheral interfaces, useful when scaling channel count.
Recommandé
Factory-Floor HMI / Operator Panel
Operator panels driving 800x480 or 1024x768 TFT displays require enough MIPS for graphics rendering, touch input handling, and protocol stacks (Modbus, EtherNet/IP). The MCF5407AI220's 316 MIPS supports lightweight graphics libraries without external GPU silicon, and the 32-bit external bus connects directly to TFT controllers in 16-bit or 24-bit modes. The industrial temperature rating (-40C to +85C) handles the warm switchgear cabinet environment typical of factory floors. The exposed-pad 208-FQFP enables solid thermal contact with the operator panel's metal backplate. Designers typically pair this MPU with a TFT controller and external SDRAM framebuffer.
Recommandé
Legacy Replacement for M68K Embedded Boards
The MCF5407AI220 is commonly used as a drop-in upgrade for designers moving from older 68000/68040 designs to ColdFire without rewriting every peripheral register access. ColdFire's source-level compatibility with M68K assembly and similar memory model let legacy firmware migrate with modest effort. The 208-FQFP package pinout differs from older 68040 PQFP packages, but many adapter PCBs exist for board-level retrofits. The 220 MHz ColdFire delivers substantially more MIPS than legacy 25-40 MHz M68K parts while keeping power budgets in check. This makes it a popular bridge part for defense and industrial systems with long lifecycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCF5407AI220 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCF5407CAI220 | MCF5407AI162 | MCF5407CAB208 | MCF5407AI220R | MCF5407FE220 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 208-FQFP (28x28 mm) | 208-FQFP (28x28 mm) - same | 208-FQFP (28x28 mm) - same | 208-FQFP (28x28 mm) - same | 208-FQFP (28x28 mm) - same | 208-FQFP (28x28 mm) - same |
| Core Frequency | 220 MHz | 220 MHz | 162 MHz (-26%) | 220 MHz | 220 MHz | 220 MHz |
| Dhrystone 2.1 MIPS | 316 MIPS | 316 MIPS | ~232 MIPS (-26%) | 316 MIPS | 316 MIPS | 316 MIPS |
| Temperature Range | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Internal SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| External Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Lifecycle Status | EOL (Discontinued) | EOL (Discontinued) | EOL (Discontinued) | EOL (Discontinued) | EOL (Discontinued) | EOL (Discontinued) |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) |
Principaux différenciateurs
- ColdFire V4 core with hardware MAC and divide (vs MCF5407AI162)
- Industrial temperature rating (-40C to +85C) (vs MCF5407CAI220)
- ROMless 32-bit external bus for high-performance memory (vs MCF5407CAB208)
- Mature ColdFire toolchain support (vs Cross-brand PIC32/RX MPUs)
Notes de conception
The MCF5407AI220 requires two supplies: 1.5 V for the internal Vcore (driving the ColdFire V4 core at 220 MHz) and 3.3 V for I/O and analog. Core current at 220 MHz is roughly 700-800 mA (approximately 1.0-1.2 W). Provide a low-ESR 1.5 V regulator with at least 1.5 A headroom, and place 10 uF ceramic + 100 nF decoupling on each Vcore pin. Power sequencing: bring 3.3 V up first, then 1.5 V; sequence-out faults can cause latch-up on the core logic.
At 220 MHz the device dissipates approximately 1.0-1.2 W in the 208-FQFP (28x28 mm). With a typical theta_JA of ~25 C/W for a 4-layer JEDEC board, junction temperature rises ~30C above ambient at full load. For sealed industrial enclosures with high ambient, add a copper pour under the package and thermal vias to the inner planes. The exposed die-pad region of the FQFP should be soldered to the pad for maximum heat extraction.
Because the MCF5407AI220 is EOL, do not redesign a new product around it without a documented long-term supply commitment from authorized distributors like Rochester Electronics. Verify date code, lot trace, and RoHS marking on every shipment - EOL parts are frequent targets for remarking. For new designs, follow NXP's PCN-recommended ColdFire or Kinetis replacement parts even though they require PCB rework; sourcing a long-term EOL part introduces supply-chain risk.
Route the 32-bit external data bus with matched-length traces (target +/-250 mil at 50 MHz bus speed) and a 33 ohm series-termination resistor network. Place external SDRAM as close to the data/address bus pins as possible to keep stub lengths under 500 mil. The 208-FQFP 0.5 mm pitch requires 4-mil trace/space design rules; use blind/buried vias if routing density is constrained. Keep PLL supply pins (VDDPLL) filtered with a ferrite bead and 10 nF cap to reduce jitter.
Informations de conformité
Lifecycle status EOL per NXP product page. RoHS, lead-free, halogen-free, and conflict-minerals compliance not stated in the verified distributor data; for production-grade compliance documentation request the latest NXP PCN or contact Rochester Electronics for legacy-support material declarations.
