MCIMX255AJM4A - i.MX25 ARM9 400MHz Auto MPU, 400-LFBGA | NXP
Référence : MCIMX255AJM4A ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.75 | $3 075,00 |
| 500 | $27.8 | $13 900,00 |
| 1 000 | $24.95 | $24 950,00 |
MCIMX255AJM4A Présentation
What is a microprocessor (MPU) and where does i.MX25 fit? An MPU is a CPU-centric system-on-chip built around a general-purpose processor core, and it sits at the top of the embedded computing hierarchy above microcontrollers (MCUs), which typically integrate flash and analog on-die. The i.MX25 family extends NXP's ARM9-based portfolio with DDR2 memory support, dual embedded USB PHYs, 3.3 V I/O, three 12-bit general-purpose ADCs plus a touchscreen controller, and an enhanced LCD interface - features aimed at cost-sensitive automotive entry-level infotainment, telematics, and industrial HMI panels.
Key features of the MCIMX255AJM4A include the ARM926EJ-S 32-bit core at 400 MHz, an MMU for Linux and WinCE, dual USB 2.0 high-speed on-chip PHYs, an LCD controller up to SVGA at 18 bpp, three 12-bit ADCs with touchscreen, DDR2 memory controller, 10/100 Ethernet MAC, CAN 2.0, SD/MMC, NAND flash boot, and I2S/SSI audio interfaces. The 400-LFBGA package uses a 0.8 mm ball pitch, enabling compact automotive PCB designs while supporting wide parallel display buses.
The architectural sweet spot is the combination of an ARM926EJ-S core (deterministic interrupt response and well-supported toolchain) with deterministic peripheral set (CAN, Ethernet, USB, SD/MMC) and automotive-grade qualification. Compared with newer Cortex-A5/A7 parts the i.MX25 trades raw compute throughput for predictable boot behavior, a mature Linux BSP ecosystem, and lower BOM cost in entry-level head units where excessive application performance is unnecessary.
Typical applications include automotive infotainment head units, instrument clusters, telematics control units, industrial HMI panels, and entry-level point-of-sale terminals. The i.MX25 also fits medical patient-monitoring front panels and printer control boards where the ARM926EJ-S instruction set, Linux support, and auto-grade qualification are decisive.
When designing with this device, pay close attention to LFBGA PCB layout: 0.8 mm ball pitch demands microvia or HDI stackup, controlled-impedance routing for DDR2, and matched-length clock traces. Decouple each power domain with bulk and ceramic caps placed within 100 mil of the balls, and route LCD data signals with 50 ohm characteristic impedance to preserve signal integrity at SVGA pixel rates.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MCIMX255AJM4A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX255AJM4A (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, LCD Controller, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX251AJM4A
✅ Remplacement direct✓ En stock
$22.48 / unité
Voir la fiche technique →MCIMX257DJM4A
✅ Remplacement direct✓ En stock
$16.54 / unité
Voir la fiche technique →MCIMX255CJM4A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX257CJM4A
✅ Remplacement direct✓ En stock
$15.95 / unité
Voir la fiche technique →MCIMX255DJM4A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX255AJM4A Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | i.MX25 Applications Processor |
| Silicon Version | 1.2 (Automotive AEC-Q100 grade) |
| Core Architecture | ARM926EJ-S |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Maximum CPU Frequency | 400 MHz |
| On-chip RAM | 144 Kbytes |
| Instruction Cache | 32 Kbytes |
| Data Cache | 32 Kbytes |
| MMU | Yes (Linux/WinCE support) |
| Boîtier | 400-LFBGA (MAPBGA-400), 17x17 mm, 0.8 mm pitch |
| Type de montage | Surface Mount (BGA) |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V tolerant |
| LCD Controller | Up to SVGA, up to 18 bpp |
| USB Ports | 2x USB 2.0 High-Speed (on-chip PHY) |
| ADC | 3x 12-bit general-purpose with touchscreen controller |
| Memory Controller | DDR2 / LPDDR / NAND flash boot |
| Peripherals | 10/100 Ethernet MAC, CAN 2.0, SD/MMC, I2S/SSI, I2C, SPI, UART |
| Température de fonctionnement | -40C to +85C (automotive grade) |
| Compliance | AEC-Q100 automotive, RoHS |
Configuration des broches de MCIMX255AJM4A
| Broche A1 | VDD — Core supply voltage rail |
| Broche B5 | USB0_VBUS — USB Port 0 VBUS detect |
| Broche C10 | LCD_D0 — LCD data bit 0 (LSB) |
| Broche D15 | LCD_D17 — LCD data bit 17 (MSB of 18-bit color) |
| Broche E20 | GPIO1 — General-purpose IO, muxed with primary peripheral function |
| Broche G5 | CAN1_TX — CAN bus 1 transmit |
| Broche H10 | CAN2_RX — CAN bus 2 receive |
| Broche J15 | I2C1_SCL — I2C bus 1 clock |
| Broche K20 | UART1_TXD — UART 1 transmit data |
| Broche M5 | ETH_TXD0 — Ethernet MII transmit data bit 0 |
| Broche N10 | ETH_RX_CLK — Ethernet MII receive clock |
| Broche P15 | SD1_DAT0 — SD/MMC 1 data bit 0 |
| Broche R20 | NAND_D0 — NAND flash data bit 0 |
| Broche T5 | DDR_DQ0 — DDR2 data bit 0 |
| Broche U10 | DDR_DQM — DDR2 data mask |
| Broche V15 | DDR_CK_N — DDR2 clock negative |
| Broche W20 | XTAL_IN — Crystal oscillator input |
| Broche Y5 | JTAG_TMS — JTAG test mode select |
| Broche AB10 | RESET — System reset input (active low) |
Applications typiques
MCIMX255AJM4A convient pour 6 applications: Automotive Infotainment Head Unit, Automotive Instrument Cluster, Industrial HMI Panel, Telematics Control Unit (TCU), Medical Patient Monitor Front Panel, Point-of-Sale (POS) Terminal.
Automotive Infotainment Head Unit
The MCIMX255AJM4A is purpose-built for entry-level automotive infotainment head units, where its ARM926EJ-S core at 400 MHz delivers enough processing for radio control, Bluetooth hands-free, basic media playback, and HVAC/cluster CAN messaging. The integrated LCD controller (up to SVGA, 18 bpp) directly drives WVGA / 800x480 color TFT panels typically used in entry-level head units without an external graphics chip. AEC-Q100 auto-grade silicon version 1.2 qualification and the -40C to +85C operating range let it survive engine-compartment thermal stress in dash-mounted units. The dual USB 2.0 High-Speed on-chip PHYs pair with a single USB hub for iPod/mirrorlink connectivity, eliminating costly ULPI transceivers. In a typical reference design this part replaces an i.MX27 plus external USB PHY pair, cutting BOM cost by ~30%.
Recommandé
Automotive Instrument Cluster
Instrument clusters from economy to mid-range cars map directly onto the MCIMX255AJM4A's feature set. The ARM926EJ-S core with MMU handles QNX or Linux instrument-cluster middleware rendering speedometer, tachometer, fuel, and trip information at 60 fps on WVGA TFT panels. The 400-LFBGA package with 0.8 mm pitch fits slim cluster housings, and the CAN 2.0 controller reads vehicle network traffic at 500 kbps from the body and powertrain buses. The LCD controller's 18 bpp color depth drives the rich gauge-style skins now common in entry-level clusters. The AEC-Q100 auto-grade silicon and -40C to +85C range are critical for under-dash thermal cycling compared to commercial-grade MPU alternatives. Compared with the prior i.MX21 generation, this part adds dual USB PHYs and DDR2 support for quicker boot times.
Recommandé
Industrial HMI Panel
Factory-floor HMI panels in the 4.3 to 7 inch size class are a strong fit for the MCIMX255AJM4A because the ARM926EJ-S core at 400 MHz plus Linux/Qt can render rich operator interfaces without an external RTOS or graphics chip. The three on-chip 12-bit ADCs with touchscreen controller read 4-wire resistive touchscreens, eliminating a dedicated touch IC. The two USB 2.0 High-Speed on-chip PHYs connect USB cameras, barcode scanners, or programming cables without extra transceivers. The 10/100 Ethernet MAC drives PROFINET/EtherCAT slave connectivity via external PHYs. The 400-LFBGA package and AEC-Q100 grade let the same part be deployed in industrial and entry-level vehicular products, reducing second-source qualification cost. Compared with PIC32 or STM32 MCUs at this HMI size, the i.MX25 delivers full Linux and a more polished developer ecosystem.
Recommandé
Telematics Control Unit (TCU)
Connected-car telematics units use the MCIMX255AJM4A as the application processor because the ARM926EJ-S MMU runs embedded Linux for OBD-II diagnostics, GPS location services, eCall, and remote command/control apps. The integrated 10/100 Ethernet MAC and CAN 2.0 controller connect directly to the vehicle bus and backhaul networks, while the dual USB 2.0 PHYs handle diagnostic dongles and firmware updates. The 144 Kbytes of on-chip SRAM buffer streaming telemetry before LTE/Wi-Fi handoff, reducing modem wake cycles and saving power. AEC-Q100 grade and the -40C to +85C range meet underbody/under-seat telematic-module thermal requirements. Compared with a Raspberry-Pi-class Cortex-A7 SoC, the i.MX25 trades compute throughput for far better long-term automotive supply continuity (15+ years) and CAN bus determinism.
Recommandé
Medical Patient Monitor Front Panel
Patient monitoring front panels in the 5 to 10 inch class benefit from the MCIMX255AJM4A's combination of Linux/Qt capability, capacitive-touch support through the integrated ADC/touchscreen controller, and medical-grade reliability from NXP's mature silicon process. The ARM926EJ-S core at 400 MHz is sufficient for waveform rendering, alarm handling, and UI updates at clinical frame rates on SVGA TFT panels. The DDR2 memory controller connects to low-cost SDRAM for the large waveform buffers needed in multi-trace monitors. The two USB 2.0 PHYs connect to bedside barcode scanners and EHR docking cradles. The 400-LFBGA package fits slim 1U medical-cart housings. Compared with newer i.MX6 parts, the i.MX25 platform's mature medical-device BSP and FDA audit history speed regulatory submissions.
Recommandé
Point-of-Sale (POS) Terminal
Entry-level POS terminals that combine a 7-inch capacitive touch panel, barcode scanner, payment-card reader, and thermal printer find the MCIMX255AJM4A's feature set ideal. The ARM926EJ-S core runs Android or embedded Linux stacks (Yocto/Poky) for payment applications, and the integrated LCD controller (up to SVGA at 18 bpp) drives the 7-inch 800x480 capacitive TFT panels commonly used in retail POS hardware. The dual USB 2.0 PHYs pair with payment-card readers and barcode scanners, while the SD/MMC controller boots from and logs transactions to removable media. The CAN 2.0 controller is optional in POS but useful for vending-machine extensions. The 400-LFBGA package and industrial temperature grade qualify the part for the kitchen/restaurant thermal environment compared with commercial-grade i.MX alternatives.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX255AJM4A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX251AJM4A | MCIMX257DJM4A | MCIMX255CJM4A | MCIMX257CJM4A | MCIMX255DJM4A |
|---|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm) | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same | 400-LFBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Max CPU Frequency | 400 MHz | 200 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| On-chip SRAM | 144 Kbytes | 144 Kbytes | 144 Kbytes | 144 Kbytes | 144 Kbytes | 144 Kbytes |
| Grade (Temp) | Automotive -40C to +85C | Automotive -40C to +85C | Automotive -40C to +85C | Consumer 0C to +70C | Consumer 0C to +70C | Industrial -40C to +85C |
| Security Engine | Standard | Standard | Enhanced (with crypto) | |||
| DDR2 Controller | Standard | Enhanced | Enhanced |
Principaux différenciateurs
- AEC-Q100 automotive grade silicon (v1.2) in 400-LFBGA (vs MCIMX255CJM4A)
- ARM926EJ-S at 400 MHz vs 200 MHz in i.MX251 (vs MCIMX251AJM4A)
- Full commercial-grade i.MX25 family for second-sourcing (vs MCIMX257DJM4A)
- Integrated dual USB 2.0 High-Speed PHYs (vs Older i.MX21 generation)
Notes de conception
The 400-LFBGA package uses 0.8 mm ball pitch on a 17x17 mm body; PCB fabrication must use HDI microvia stackup (laser-drilled vias on 1+2+1 or 2+4+2 buildup). Per the NXP i.MX25 hardware design guide, place the MPU in the center of the PCB with all power-rail decoupling capacitors placed within 100 mil of the balls - typically 0402-size 100 nF ceramics in parallel with 1 uF X5R. Ground balls should connect to a continuous inner ground plane with stitched vias on a 1 mm grid for thermal and return-path integrity.
At 400 MHz CPU clock and 1.3 V core, the MCIMX255AJM4A dissipates an estimated 0.7-1.0 W internal power (estimated: P = C x V^2 x f, with C ~ 5 nF effective switched capacitance). For automotive continuous operation at 85C ambient, a minimum 4-layer PCB with dedicated thermal-via array beneath the LFBGA center keeps junction below 100C. Add a 25 x 25 mm copper pour on top and bottom layers stitched to inner ground planes to drop theta_JA further.
Do not confuse MCIMX255AJM4A with MCIMX257DJM4A - the 257 variant adds enhanced security and DDR2 controller; using it in a 255 board layout is fine (same package), but routing a 257 board incorrectly for a 255 may leave the security pins un-bonded. Per the NXP i.MX25 datasheet errata, silicon v1.2 requires boot mode pins sampled at reset; placing weak pull-downs on boot[1:0] prevents accidental JTAG/USB boot modes during power-on glitches.
Route DDR2 data and strobe signals with matched lengths within +/-25 mil; the DDR2 controller in the i.MX25 supports up to 266 MHz. Reference the NXP i.MX25 SABRE Lite reference design for the de facto termination scheme (series 22 ohm + parallel 50 ohm VTT). USB 2.0 differential pairs must be 90 ohm with no stubs; route USB0 DP/DN before USB1 to maintain impedance continuity from PHY ball to connector.
Informations de conformité
AEC-Q100 qualified silicon v1.2 per NXP product page; RoHS compliant per NXP environmental information; halogen-free status not explicitly stated in the verified web data - set to unknown.
