MIC23201YML - 2A 2MHz Sync Buck Regulator w/ HSC | Microchip
Référence : MIC23201YML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.18 | $21,80 |
| 100 | $1.78 | $178,00 |
| 500 | $1.45 | $725,00 |
| 1 000 | $1.18 | $1 180,00 |
MIC23201YML Présentation
A synchronous buck regulator (also called a step-down switching regulator) is a type of DC-DC converter that uses PWM-controlled MOSFET switches and an LC output filter to produce a lower output voltage than its input with very high efficiency - typically 90-95% versus 30-60% for a linear (LDO) regulator. Synchronous designs replace the conventional Schottky rectifier with a low-side MOSFET to further reduce conduction losses. Within the broader power-management hierarchy, buck regulators sit between simple LDOs and more complex multi-phase controllers; they are the workhorse of point-of-load (POL) conversion in nearly every portable, embedded, and SoC-based system.
The MIC23201YML differentiates itself through its Hyper Speed Control loop, which adapts the switching behavior cycle-by-cycle rather than relying on a fixed-frequency PWM modulator. This produces a transient response that recovers from a load step in microseconds - critical when powering ASICs, FPGAs, and SoCs whose core voltages may demand hundreds of milliamps of step current in nanoseconds. Internal MOSFETs (typical 65 mΩ high-side / 65 mΩ low-side) minimize the need for external switches, and the part requires only a small inductor, a few ceramic capacitors, and feedback resistors to form a complete 2 A supply.
Key specifications include a 2.7 V to 5.5 V input range, 0.95 V to 3.6 V adjustable output, 2 A continuous output current, 2 MHz typical switching frequency, internal soft-start, thermal-shutdown and current-limit protection, and a junction operating temperature up to +125 °C. The exposed-pad package provides low thermal resistance (θJA ≈ 60 °C/W) for reliable 2 A operation from a single 3.3 V or 5 V rail.
Typical applications include FPGA/ASIC/MCU core-voltage rails, set-top box and cable modem SoC supplies, portable consumer electronics, point-of-load conversion in distributed power systems, and any embedded design that requires a compact, high-efficiency 2 A step-down supply from a single Li-Ion or 5 V rail.
When designing with this device, select a 1 µH to 4.7 µH shielded inductor with low DCR, place input/output ceramic capacitors close to the IC, and use the exposed pad as the primary thermal path - 4 thermal vias under the pad are recommended. The feedback resistors should use 1% tolerance parts to maintain VOUT accuracy. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MIC23201YML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MIC23201YML-TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MIC23201YML-T5
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MIC23201YML-TR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MIC23201YML Valeurs maximales et caractéristiques électriques
| Topologie | Synchronous Buck (Step-Down) |
| Plage de tension d'entrée | 2.7 V to 5.5 V |
| Plage de tension de sortie | 0.95 V to 3.6 V (adjustable) |
| Output Current | 2 A continuous |
| Fréquence de commutation | 2 MHz typical |
| Control Architecture | Hyper Speed Control (HSC) |
| Internal MOSFETs | Synchronous (HS + LS, typ. 65 mΩ each) |
| Feedback Reference Voltage | 0.95 V (adjustable version) |
| Rendement | Up to ~95% (VIN=5 V, VOUT=1.8 V, IOUT=1 A) |
| Démarrage progressif | Internal |
| Arrêt thermique | Yes (internal) |
| Limitation de courant | Yes (internal) |
| Température de jonction en fonctionnement | -40 °C to +125 °C |
| Boîtier | 10-pin MLF/VFQFN Exposed Pad (3 mm × 3 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de MIC23201YML
| Broche 1 | SW — Switch node - connect to power inductor |
| Broche 2 | VIN — Input supply voltage (2.7 V to 5.5 V) |
| Broche 3 | VIN — Input supply voltage (2.7 V to 5.5 V) |
| Broche 4 | EN — Enable input (active-high, internally pulled up) |
| Broche 5 | PGND — Power ground |
| Broche 6 | PGND — Power ground |
| Broche 7 | FB — Feedback voltage input (0.95 V reference) |
| Broche 8 | AGND — Analog ground |
| Broche 9 | BST — Bootstrap supply for high-side gate driver |
| Broche 10 | VDD — Internal LDO output (bypass with 1 µF ceramic) |
| Broche 11 | EP — Exposed thermal pad - connect to PGND |
Applications typiques
MIC23201YML convient pour 6 applications: FPGA Core Voltage Rail, ASIC / SoC Core Supply, Point-of-Load Conversion (POL) for Distributed Power, Portable Consumer Electronics, USB-Powered 5 V to 3.3 V / 1.8 V Rail, Industrial Sensor / Data-Acquisition Module.
FPGA Core Voltage Rail
The MIC23201YML is well suited for FPGA core rails in the 0.95 V to 1.8 V range, where its 2 A continuous current and Hyper Speed Control (HSC) transient response handle the rapid load-step demands of FPGA logic fabric. HSC adapts cycle-by-cycle rather than using fixed-frequency PWM, recovering from a load step in microseconds - essential when an FPGA block switches from idle to active and demands hundreds of milliamps in nanoseconds. Placed between the 3.3 V rail and the FPGA VCCINT pin with a 1.5 µH inductor and 22 µF ceramic output caps, it forms a complete POL supply under 50 mm².
Recommandé
ASIC / SoC Core Supply
For ASIC and SoC core rails, the MIC23201YML delivers the 0.95 V to 1.5 V typical supply voltage with 2 A capability and adaptive HSC control. The part's internal synchronous MOSFETs (typ. 65 mΩ each) minimize conduction loss, while 2 MHz switching keeps the output filter compact. This makes it a practical choice for processor cores, DSP cores, and SoC subsystems in networking and industrial platforms. A typical BOM includes 1.5 µH inductor, 22 µF input/output ceramics, and 1% feedback resistors for VOUT accuracy.
Recommandé
Point-of-Load Conversion (POL) for Distributed Power
In distributed-power architectures the MIC23201YML serves as a local point-of-load (POL) converter, stepping 3.3 V or 5 V down to 1.0 V to 1.8 V at the load. Its 2 MHz switching stays above the AM-band and enables use of small ceramic-only output capacitors, simplifying EMI filter design. The exposed thermal pad and 60 °C/W θJA support full 2 A continuous operation from a single 5 V rail without an external heatsink. This makes it ideal for telecom line cards, router switching ASICs, and industrial control boards.
Recommandé
Portable Consumer Electronics
For battery-powered portable devices, the MIC23201YML operates from a single Li-Ion cell (2.7 V to 4.2 V) and produces a stable 1.2 V to 3.3 V rail. Synchronous operation yields up to 95% efficiency at light loads, preserving battery life in standby. Internal soft-start prevents inrush current during hot-plug events, and thermal shutdown protects against overloads. This suits wearables, handheld instruments, and single-cell Li-Po devices that need a compact 2 A synchronous buck.
Recommandé
USB-Powered 5 V to 3.3 V / 1.8 V Rail
USB-powered systems typically derive a 5 V rail from the VBUS line; the MIC23201YML can step this down to 3.3 V or 1.8 V at 2 A for downstream MCUs, sensors, or radios. The 2.7 V to 5.5 V input range accommodates the full USB-supplied tolerance window. According to the Microchip datasheet, the part is suitable for USB-powered designs that need a compact, high-efficiency buck; the 2 MHz switching frequency also falls outside the 27 MHz USB 2.0 band, easing EMI compliance.
Recommandé
Industrial Sensor / Data-Acquisition Module
Industrial sensor modules often need a clean 3.3 V or 5 V to 1.8 V core rail for precision ADCs, sensors, and signal-conditioning ASICs. The MIC23201YML's HSC adaptive control produces low output ripple and fast transient response, helping preserve ADC SNR. Its 125 °C max junction temperature and exposed-pad cooling make it robust in sealed industrial enclosures. The part suits 4-20 mA loop-powered transmitters, PLC analog input modules, and factory-sensor interfaces.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MIC23201YML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MIC23201YML-TR | MIC23201YML-T5 |
|---|---|---|---|
| Package | 10-MLF/VFQFN EP (3x3 mm) | 10-MLF/VFQFN EP (3x3 mm) | 10-MLF/VFQFN EP (3x3 mm) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Input Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Output Current | 2 A | 2 A | 2 A |
| Switching Frequency | 2 MHz | 2 MHz | 2 MHz |
| Output Voltage Range | 0.95 V to 3.6 V | 0.95 V to 3.6 V | 0.95 V to 3.6 V |
| Control Architecture | Hyper Speed Control | Hyper Speed Control | Hyper Speed Control |
| Shipping Format | Tray | Tape & Reel (standard) | Tape & Reel (500-unit reel) |
Principaux différenciateurs
- Hyper Speed Control adaptive architecture (vs MIC23201YML-TR (same die, identical spec))
- 2 A output with synchronous rectification (vs MIC23201YML-T5 (same die, identical spec))
Notes de conception
Estimated: at VIN=5 V, VOUT=1.8 V, and full 2 A load, power dissipation is approximately (5-1.8) V × 2 A = 6.4 W. With the MLF-10 exposed-pad package (θJA ≈ 60 °C/W when soldered to a moderate copper pour), the junction temperature rise above ambient is roughly 60 °C/W × 6.4 W = 384 °C - this clearly exceeds the 125 °C limit. Practical guidance: keep VIN-VOUT × IOUT under about 1.5 W for safe operation with a minimal copper pour, and add 4 thermal vias under the EP and at least 100 mm² of top-layer copper for 2 A continuous operation at high VIN. If your application needs 2 A from a 5 V rail, derate to 1 A or step down VIN upstream.
Place the 22 µF input ceramic capacitor within 2 mm of the VIN pins, the 22 µF output capacitor within 2 mm of the SW/PGND loop, and the 1 µF BST capacitor as close to the BST/VDD pair as possible. Use wide (≥0.5 mm) power traces for VIN, SW, and PGND to minimize DC losses. The exposed pad (EP) MUST be soldered to the PCB ground plane with at least 4 thermal vias to provide the primary thermal path - omitting the EP solder connection will cause thermal shutdown under load. Keep the FB trace short and away from the SW node to avoid noise injection.
Estimated: do not exceed the maximum VIN of 5.5 V - the internal MOSFETs are rated for 6 V abs max and any transient above 6 V will permanently damage the part. Use 1% tolerance resistors for the FB divider (R1 and R2) to maintain VOUT accuracy; 5% parts can cause VOUT to drift by several percent. The MIC23201YML uses Hyper Speed Control which is a variable-frequency architecture - EMI filters should be designed for a switching band of approximately 1.5 MHz to 3 MHz, not the nominal 2 MHz only. Finally, do not operate above 125 °C junction - derate based on actual board thermal measurement, not just θJA.
Informations de conformité
RoHS compliant and lead-free per Microchip product page. Not AEC-Q100 qualified - choose MIC23201YML-Q1 or AEC-Q100 equivalent for automotive applications. Halogen-free per JEDEC JS709B definition.
