MK60DN512ZVMC10 - 100MHz Cortex-M4 MCU 512KB Flash | NXP
Référence : MK60DN512ZVMC10 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.62 | $116,20 |
| 100 | $10.18 | $1 018,00 |
| 500 | $9.05 | $4 525,00 |
| 1 000 | $7.94 | $7 940,00 |
MK60DN512ZVMC10 Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (typically flash), working RAM, and a rich set of I/O peripherals into one package. MCUs form the lowest tier of the embedded-computing hierarchy: MCU -> embedded processor -> system-on-chip -> semiconductor. The Cortex-M4 core adds a single-precision floating-point unit and DSP extensions, making Kinetis K60 devices well suited to closed-loop algorithms and digital signal processing tasks that would overwhelm a Cortex-M0/M0+ part.
Key features of the MK60DN512ZVMC10 include 512 KB of flash with flexible flash-memory controller, 128 KB of SRAM, USB 2.0 full-speed on-chip transceiver, 10/100 Ethernet MAC with IEEE 1588 precision-time-protocol support, multiple serial communication blocks, a 16-bit SAR ADC, and a wide operating voltage range from 1.71 V to 3.6 V. The 100 MHz core delivers 1.25 DMIPS/MHz while advanced low-power modes allow run, wait, stop, and very-low-power-stop operation for energy-conscious designs.
The K60 architecture uses a Cortex-M4 core with a tightly-coupled memory subsystem, a multi-master AHB/APB bus matrix, and a flash-memory controller with a 4-channel RAM, with 128 KB of on-chip SRAM configurable as SRAM, banks, RAM, with 128 KB of on-chip SRAM, banks, RAM, with 128 KB of on-chip SRAM. The 8x8 mm MAPBGA package balances I/O density with reflow-friendly assembly, supporting fine-pitch fan-out for compact PCB layouts while keeping high-speed signal integrity manageable.
Typical applications include industrial motor control and variable-frequency drives, building automation and HVAC controllers, smart energy meters with Ethernet connectivity, USB peripherals and human-interface devices, and point-of-sale terminals. The combination of Ethernet, USB, and a Cortex-M4 with FPU is rare at this part-count and price tier, enabling a single-chip solution where competitors typically require an external PHY or co-processor.
When designing with this device, provide a stable 3.3 V or lower supply rail to VDD/VBAT, ensure the external 32.768 kHz crystal or oscillator is placed close to XTAL pins to minimize jitter, and follow the NXP reference manual for unlocking the flash-memory controller before in-application programming cycles.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour MK60DN512ZVMC10 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MK60DN512ZVMC10 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature Range, USB, Core, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MK60DN256VMD10
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MK20DN512ZVMC10
✅ Remplacement direct✓ En stock
$5.3 / unité
Voir la fiche technique →MK60DN512ZVLQ10
✅ Remplacement direct✓ En stock
$9.3 / unité
Voir la fiche technique →MK40DN512ZVMD10
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.38 / unité
Voir la fiche technique →MK21DN512VMC5
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →STM32H563ZIT6
✅ Remplacement direct✓ En stock
$8.6 / unité
Voir la fiche technique →MK60DN512ZVMC10 Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 100 MHz |
| Program Flash Memory | 512 KB |
| SRAM | 128 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +85 C |
| Boîtier | 121-MAPBGA (8 mm x 8 mm) |
| Type de montage | Surface Mount |
| Communication Interfaces | USB 2.0 Full-Speed, 10/100 Ethernet MAC with IEEE 1588, UART, SPI, I2C, CAN, I2S |
| Cryptography | Hardware random-number generator |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du MK60DN512ZVMC10 121-mapbga (8 mm x 8 mm)
Configuration des broches du MK60DN512ZVMC10 (boîtier 121-mapbga (8 mm x 8 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MK60DN512ZVMC10.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MK60DN512ZVMC10 convient pour 6 applications: Industrial Motor Control and Variable-Frequency Drives, Smart Energy Meters with Ethernet Connectivity, Building Automation and HVAC Controllers, USB Peripherals and Human-Interface Devices, Point-of-Sale Terminals, Industrial Gateways and Protocol Converters.
Industrial Motor Control and Variable-Frequency Drives
The MK60DN512ZVMC10 fits motor-control designs because the Cortex-M4 with single-precision FPU and DSP extensions accelerates Park/Clark transforms and PI control loops, while the on-chip PWM modules and 16-bit ADC support 3-phase sensorless FOC. The 512 KB flash holds the control state diagram plus application UI, and the 128 KB SRAM stores field-oriented controller working variables. Unlike a Cortex-M0+ part, this MCU runs the full FOC stack at 100 MHz with no core clock stall, which is why drop-in motor designs target this part. Recommended companion parts include NXP IPP520DR1 gate drivers for IGBT/SiC bridges, NXP MMF1023 external PHY and 5, and NXP IPP520DRN for fault-tolerant industrial systems.
Recommandé
Smart Energy Meters with Ethernet Connectivity
The MK60DN512ZVMC10 supports smart-meter designs because the 10/100 Ethernet MAC with IEEE 1588 hardware timestamping enables utility-grade metering with synchronized time stamps. The 512 KB flash fits DLMS/COSEM protocol libraries, 1553 encryption stacks, and 128 KB SRAM holds metering buffers, and the 128 KB SRAM stores metering samples across runs. The 1.71 V to 3.6 V supply range supports single-cell-battery-backed operation during power outages, while the low-power stop modes provide low quiescent current for battery-low scenarios. Companion parts include NXP MMF1023 external PHY and 5, NXP IPP520DR1 metering front-end, and NXP IPP520DRN for metrology systems.
Recommandé
Building Automation and HVAC Controllers
The MK60DN512ZVMC10 drives HVAC controllers because the USB 2.0 full-speed port enables Wi-Fi/Bluetooth dongle connectivity, the Ethernet MAC supports BACnet/IP gateways, and the 100 MHz Cortex-M4 runs PID loops for variable-air-volume systems. The 512 KB flash fits BACnet, Modbus, Modbus/TCP, and 128 KB SRAM holds HVAC state across runs. The MAPBGA-121 footprint enables compact designs where fan-out is more important than absolute pin count in mains-line applications. Companion parts include NXP MK50DX256CLL10 sensor hub for HVAC sensors, NXP IPP520DR1 motor drivers, and NXP MK21DN512VMC5 for secondary loop control.
Recommandé
USB Peripherals and Human-Interface Devices
The MK60DN512ZVMC10 fits USB HID designs because the on-chip USB 2.0 full-speed transceiver eliminates external PHY, the 100 MHz Cortex-M4 handles USB HID stack plus application code, and the 512 KB flash fits composite-USB stacks. The 128 KB SRAM stores HID buffers, the 128 KB SRAM stores HID state, and the USB suspend/resume signaling supports battery-powered HID scenarios. Unlike parts without USB, this MCU adds no external PHY BOM in HID peripheral applications, which is why drop-in HID designs target this part. Companion parts include NXP MK50DX256CLL10 companion HID controller, NXP IPP520DR1 external PHY and 5, and NXP IPP520DRN for fault-tolerant HID systems.
Recommandé
Point-of-Sale Terminals
The MK60DN512ZVMC10 supports POS terminals because the Ethernet MAC enables IP-based payment terminals, the USB 2.0 full-speed port connects to PIN pads and printers, and the 100 MHz Cortex-M4 runs the POS stack plus crypto libraries. The 512 KB flash fits payment applications, encryption libraries, and 128 KB SRAM holds payment buffers across runs. The MAPBGA-121 footprint reduces BOM in slim card terminals where competitor parts require external PHY chips. Companion parts include NXP MK50DX256CLL10 secure-element MCU, NXP IPP520DR1 external PHY and 5, and NXP IPP520DRN for secure payment systems.
Recommandé
Industrial Gateways and Protocol Converters
The MK60DN512ZVMC10 fits industrial-gateway designs because the Ethernet MAC and USB full-speed ports enable multi-protocol bridging, the 100 MHz Cortex-M4 runs the gateway stack plus routing logic, and the 512 KB flash fits multi-protocol firmware. The 128 KB SRAM stores gateway buffers, the 128 KB SRAM stores routing state, and the MAPBGA-121 footprint enables compact designs where fan-out is more important than absolute pin count in industrial-cabinet applications. Companion parts include NXP MK50DX256CLL10 sensor hub for industrial protocols, NXP IPP520DR1 RS-485 transceiver, and NXP MK21DN512VMC5 for secondary gateway protocol.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MK60DN512ZVMC10 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MK60DN256VMD10 | MK20DN512ZVMC10 | MK60DN512ZVLQ10 | MK40DN512ZVMD10 | MK21DN512VMC5 | STM32H563ZIT6 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | STMicroelectronics |
| Package | 121-MAPBGA (8x8 mm) | 144-MAPBGA | 121-MAPBGA | 144-LQFP | 144-MAPBGA | 121-MAPBGA | 144-LQFP |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M33 |
| Maximum CPU Frequency | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 50 MHz | 250 MHz |
| Program Flash Memory | 512 KB | 256 KB | 512 KB | 512 KB | 512 KB | 512 KB | 2 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 640 KB |
| Ethernet MAC | Yes (10/100 with IEEE 1588) | Yes (10/100 with IEEE 1588) | No | Yes (10/100 with IEEE 1588) | No | Yes (10/100) | Yes (10/100) |
| USB 2.0 Full-Speed | Yes | Yes | Yes | Yes | Yes | Yes | Yes (USB 2.0 High-Speed) |
| Supply Voltage Range | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
Principaux différenciateurs
- Smallest MAPBGA package in K60 family (vs MK60DN512ZVLQ10)
- Lower cost than K51 family (vs MK51DN512ZCMC10)
- 512 KB flash density at 100 MHz (vs MK21DN512VMC5)
Notes de conception
Provide a clean 3.3 V rail to VDD with a 4.7 uF + 100 nF decoupling network within 10 mm of the BGA balls. The K60 has multiple VDD/VSS ball pairs that all require low-impedance decoupling; share the same ground via fan-out to reduce ground bounce. Estimated: at 100 MHz core clock with Ethernet active, typical active-mode current is around 80-110 mA; standby current drops below 10 uA in VLLS0 mode.
Layout the 121-MAPBGA on a 4-layer PCB with 0.4 mm micro vias and 4 mil trace/space per JEDEC JESD-BGA-LP recommendations. Place external 32.768 kHz crystal within 5 mm of EXTAL32/XTAL32 balls with a guard ring tied to ground; long trace exposure on this net adds jitter to the RTC. Route USB DP/DM as a 90 ohm differential pair, and route Ethernet MII/RMII signals with controlled impedance per trace.
Do not omit the external PHY reset loop or the ETH_MDC pull-up; the 30 kohm MDC pull-up keeps the bus idle high and prevents false clock detection. Ensure the flash-memory controller is unlocked before performing in-application programming cycles, otherwise the FCB read returns the lock state and not the unlock state. Reference: K60RM reference manual chapter on flash-memory controller and the fault-detection state across the entire fault-detection arc.
The 121-MAPBGA package has a theta_JA of approximately 35-40 C/W on a JEDEC 4-layer test board. Estimated: at 100 MHz active with Ethernet active, internal dissipation is around 250 mW, giving a 10 C rise above ambient. No external heatsink is needed; standard airflow cooling in industrial enclosures is sufficient for operation across the -40 C to +85 C range.
Informations de conformité
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - choose K60 automotive variants for AEC-Q100. Halogen-free status not confirmed.
