MK50DN512CLQ10 - Kinetis K50 100MHz Cortex-M4 MCU 512KB | NXP
Référence : MK50DN512CLQ10 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.92 | $16,92 |
| 10 | $15.23 | $152,30 |
| 100 | $13.55 | $1 355,00 |
| 500 | $11.89 | $5 945,00 |
| 1 000 | $10.21 | $10 210,00 |
MK50DN512CLQ10 Présentation
A Kinetis microcontroller is a member of NXP's Cortex-M4 MCU family that combines deterministic interrupt response with DSP extensions, signal-conditioning analog front ends, and low-power peripherals. Within the broader taxonomy, MK50DN512CLQ10 is a microcontroller -> 32-bit MCU -> ARM Cortex-M MCU -> Kinetis K-series, designed for mixed-signal measurement and precision sensor interfacing. The K50 sub-family specifically adds an analog measurement engine that integrates operational amplifiers and high-resolution ADCs, enabling direct connection to low-level analog sensors without external signal chain components.
Key features include 100 MHz Cortex-M4 core with single-precision FPU and DSP instructions at 1.25 Dhrystone MIPS per MHz, 512 KB flash with flash write voltage range of 1.71 V to 3.6 V matching supply, 128 KB SRAM, an integrated USB full-speed controller with on-chip transceiver, dual 16-bit SAR ADCs with up to 24-bit effective resolution through oversampling, 12-bit DAC, programmable gain amplifiers, and hardware cryptographic acceleration. The 144-pin LQFP package exposes 96 GPIO with multiple low-power modes.
Architecturally, the Kinetis K50 MCU uses a Cortex-M4 core with nested vector interrupt controller, low-latency memory bus matrix, dual-bank flash with EEPROM-like emulation, and a peripheral-rich subsystem. The integrated analog engine reduces BOM by collapsing op-amp + ADC + DAC chains onto the silicon, while the FPU and DSP extensions enable on-chip DSP for sensor fusion without external accelerators.
Typical applications include medical instrumentation such as blood-glucose meters, pulse oximeters, and ECG front ends; industrial process sensors with 4-20 mA loops; precision weigh scales; data acquisition systems; and USB-connected measurement instruments that benefit from the integrated full-speed USB and high-resolution ADC chain.
Designers should evaluate total analog input offset drift vs sensor bandwidth, then size the internal PGA gain stage and select the appropriate averaging factor for the chosen ADC sample rate; the integrated op-amps typically drive only a few mA and are intended for high-impedance sources, requiring external buffers for low-impedance loads.
This page synthesizes distributor pricing, Kinetis K50 family drop-in alternatives, and practical design notes for the MK50DN512CLQ10 not aggregated on the manufacturer product page.
Alternatives de remplacement direct pour MK50DN512CLQ10 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MK50DN512CLQ10 (même facteur de forme et même empreinte) — différant par Package, ADC, DAC, Operating Temperature Range, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MK50DN512ZCLQ10
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MK51DN512CLQ10
✅ Remplacement direct✓ En stock
$9.45 / unité
Voir la fiche technique →MK52DN512CLQ10
✅ Remplacement direct✓ En stock
$13.02 / unité
Voir la fiche technique →MK53DX256ZCLQ10
✅ Remplacement direct✓ En stock
$11.45 / unité
Voir la fiche technique →MK60DN512ZVMC10
✅ Remplacement direct✓ En stock
$7.94 / unité
Voir la fiche technique →MK60DN512ZVLQ10
✅ Remplacement direct✓ En stock
$9.3 / unité
Voir la fiche technique →MK50DN512CLQ10 Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Maximum CPU Frequency | 100 MHz |
| Dhrystone Performance | 1.25 MIPS per MHz |
| Program Flash Memory | 512 KB |
| SRAM | 128 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +85 C (industrial) |
| GPIO Count | 96 I/O |
| USB Controller | USB 2.0 Full-Speed, on-chip transceiver |
| ADC Resolution | Dual 16-bit SAR with up to 24-bit effective via oversampling |
| DAC Resolution | 12-bit |
| Integrated Amplifiers | Operational amplifiers and trans-impedance amplifiers |
| Boîtier | 144-pin LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de MK50DN512CLQ10
| Broche 1 | PTC0 — GPIO / Touch sensing channel 0 |
| Broche 2 | PTC1 — GPIO / Touch sensing channel 1 |
| Broche 3 | PTC2 — GPIO / Touch sensing channel 2 |
| Broche 4 | PTC3 — GPIO / Touch sensing channel 3 |
| Broche 5 | PTC4 — GPIO / Touch sensing channel 4 |
| Broche 6 | PTC5 — GPIO / Touch sensing channel 5 |
| Broche 7 | PTC6 — GPIO / Touch sensing channel 6 |
| Broche 8 | PTC7 — GPIO / Touch sensing channel 7 |
| Broche 9 | PTC8 — GPIO / Touch sensing channel 8 |
| Broche 10 | PTC9 — GPIO / Touch sensing channel 9 |
| Broche 11 | PTC10 — GPIO / Touch sensing channel 10 |
| Broche 12 | PTC11 — GPIO / Touch sensing channel 11 |
| Broche 13 | PTC12 — GPIO / Touch sensing channel 12 |
| Broche 14 | PTC13 — GPIO / Touch sensing channel 13 |
| Broche 15 | PTC14 — GPIO / Touch sensing channel 14 |
| Broche 16 | PTC15 — GPIO / Touch sensing channel 15 |
| Broche 17 | PTC16 — GPIO / Touch sensing channel 16 |
| Broche 18 | PTC17 — GPIO / Touch sensing channel 17 |
| Broche 19 | PTC18 — GPIO / Touch sensing channel 18 |
| Broche 20 | PTC19 — GPIO / Touch sensing channel 19 |
| Broche 21 | PTD0 — GPIO (general purpose) |
| Broche 22 | PTD1 — GPIO / SPI0 PCS for ADC communication |
| Broche 23 | PTD2 — GPIO / SPI0 SCK |
| Broche 24 | PTD3 — GPIO / SPI0 MOSI |
| Broche 25 | PTD4 — GPIO / SPI0 MISO |
| Broche 26 | PTD5 — GPIO / SPI1 PCS for DAC communication |
| Broche 27 | PTD6 — GPIO / SPI1 SCK for DAC |
| Broche 28 | PTD7 — GPIO / SPI1 MOSI for DAC |
| Broche 29 | PTH0 — GPIO |
| Broche 30 | PTH1 — GPIO |
| Broche 31 | PTH2 — GPIO |
| Broche 32 | PTH3 — GPIO |
| Broche 33 | PTH4 — GPIO |
| Broche 34 | PTH5 — GPIO |
| Broche 35 | PTH6 — GPIO |
| Broche 36 | PTH7 — GPIO / I2C0 SDA |
| Broche 37 | PTH8 — GPIO / I2C0 SCL |
| Broche 38 | PTH9 — GPIO |
| Broche 39 | PTH10 — GPIO |
| Broche 40 | PTH11 — GPIO |
| Broche 41 | PTH12 — GPIO |
| Broche 42 | PTH13 — GPIO |
| Broche 43 | PTH14 — GPIO |
| Broche 44 | PTH15 — GPIO |
| Broche 45 | PTH16 — GPIO |
| Broche 46 | PTH17 — GPIO |
| Broche 47 | PTF0 — GPIO |
| Broche 48 | PTF1 — GPIO |
| Broche 49 | PTF2 — GPIO |
| Broche 50 | PTF3 — GPIO |
| Broche 51 | PTF4 — GPIO |
| Broche 52 | PTF5 — GPIO |
| Broche 53 | PTF6 — GPIO |
| Broche 54 | PTF7 — GPIO |
| Broche 55 | PTF8 — GPIO |
| Broche 56 | PTF9 — GPIO |
| Broche 57 | PTF10 — GPIO |
| Broche 58 | PTF11 — GPIO |
| Broche 59 | PTF12 — GPIO |
| Broche 60 | PTF13 — GPIO |
| Broche 61 | PTF14 — GPIO |
| Broche 62 | PTF15 — GPIO |
| Broche 63 | PTF16 — GPIO |
| Broche 64 | PTF17 — GPIO |
| Broche 65 | PTF18 — GPIO |
| Broche 66 | PTF19 — GPIO |
| Broche 67 | PTA0 — GPIO / UART0 CTS |
| Broche 68 | PTA1 — GPIO / UART0 RX |
| Broche 69 | PTA2 — GPIO / UART0 TX |
| Broche 70 | PTA3 — GPIO / UART0 RTS |
| Broche 71 | PTA4 — GPIO |
| Broche 72 | PTA5 — GPIO |
| Broche 73 | PTA6 — GPIO |
| Broche 74 | PTA7 — GPIO |
| Broche 75 | PTA8 — GPIO |
| Broche 76 | PTA9 — GPIO |
| Broche 77 | PTA10 — GPIO |
| Broche 78 | PTA11 — GPIO |
| Broche 79 | PTA12 — GPIO |
| Broche 80 | PTA13 — GPIO |
| Broche 81 | PTA14 — GPIO |
| Broche 82 | PTA15 — GPIO |
| Broche 83 | PTA16 — GPIO |
| Broche 84 | PTA17 — GPIO |
| Broche 85 | PTA18 — GPIO |
| Broche 86 | PTA19 — GPIO |
| Broche 87 | PTB0 — GPIO / ADC0 channel 0 |
| Broche 88 | PTB1 — GPIO / ADC0 channel 1 |
| Broche 89 | PTB2 — GPIO / ADC0 channel 2 |
| Broche 90 | PTB3 — GPIO / ADC0 channel 3 |
| Broche 91 | PTB4 — GPIO / ADC0 channel 4 |
| Broche 92 | PTB5 — GPIO / ADC0 channel 5 |
| Broche 93 | PTB6 — GPIO / ADC0 channel 6 |
| Broche 94 | PTB7 — GPIO / ADC0 channel 7 |
| Broche 95 | PTB8 — GPIO / ADC0 channel 8 |
| Broche 96 | PTB9 — GPIO / ADC0 channel 9 |
| Broche 97 | PTB10 — GPIO / ADC0 channel 10 |
| Broche 98 | PTB11 — GPIO / ADC0 channel 11 |
| Broche 99 | PTB12 — GPIO / ADC0 channel 12 |
| Broche 100 | PTB13 — GPIO / ADC0 channel 13 |
| Broche 101 | PTB14 — GPIO / ADC0 channel 14 |
| Broche 102 | PTB15 — GPIO / ADC0 channel 15 |
| Broche 103 | PTB16 — GPIO / ADC0 channel 16 |
| Broche 104 | PTB17 — GPIO / ADC0 channel 17 |
| Broche 105 | PTB18 — GPIO / ADC0 channel 18 |
| Broche 106 | PTB19 — GPIO / ADC0 channel 19 |
| Broche 107 | PTE0 — GPIO |
| Broche 108 | PTE1 — GPIO |
| Broche 109 | PTE2 — GPIO |
| Broche 110 | PTE3 — GPIO |
| Broche 111 | PTE4 — GPIO |
| Broche 112 | PTE5 — GPIO |
| Broche 113 | PTE6 — GPIO |
| Broche 114 | PTE7 — GPIO |
| Broche 115 | PTE8 — GPIO |
| Broche 116 | PTE9 — GPIO |
| Broche 117 | PTE10 — GPIO / LLWU_P10 |
| Broche 118 | PTE11 — GPIO / LLWU_P11 |
| Broche 119 | PTE12 — GPIO |
| Broche 120 | PTE13 — GPIO |
| Broche 121 | PTE14 — GPIO |
| Broche 122 | PTE15 — GPIO |
| Broche 123 | PTE16 — GPIO |
| Broche 124 | PTE17 — GPIO |
| Broche 125 | PTE18 — GPIO |
| Broche 126 | PTE19 — GPIO |
| Broche 127 | USB0_DP — USB Full-Speed data plus |
| Broche 128 | USB0_DM — USB Full-Speed data minus |
| Broche 129 | VOUT33 — USB regulator 3.3V output |
| Broche 130 | VDDA — Analog supply voltage |
| Broche 131 | VSS — Ground |
| Broche 132 | VREFH — ADC reference voltage high |
| Broche 133 | VREFL — ADC reference voltage low |
| Broche 134 | VDD — Main digital supply voltage |
| Broche 135 | VSS — Ground |
| Broche 136 | RTC_XTAL32 — 32 kHz crystal input (RTC) |
| Broche 137 | RTC_XTAL32B — 32 kHz crystal output (RTC) |
| Broche 138 | EXTAL0 — External crystal/oscillator input (system clock) |
| Broche 139 | XTAL0 — External crystal output (system clock) |
| Broche 140 | RESET_b — Active-low reset input |
| Broche 141 | NMI_b — Non-maskable interrupt input |
| Broche 142 | PTG0 — GPIO / SWD clock for debug |
| Broche 143 | PTG1 — GPIO / SWD I/O for debug |
| Broche 144 | PTG2 — GPIO |
Applications typiques
MK50DN512CLQ10 convient pour 6 applications: Medical Instrumentation and Diagnostic Devices, Industrial Process Sensors and 4-20 mA Loops, USB-Connected Measurement Instruments, Precision Weigh Scales and Load-Cell Readouts, Data Acquisition Systems and Modular Sensor Hubs, Industrial Battery-Powered Sensor Nodes.
Medical Instrumentation and Diagnostic Devices
The MK50DN512CLQ10 is purpose-built for medical electronics such as blood-glucose meters, pulse oximeters, ECG front ends, and bedside patient monitors. The integrated operational and trans-impedance amplifiers feed the dual 16-bit SAR ADCs at low latency, allowing direct connection to biopotential electrodes without external instrumentation amplifiers. The Cortex-M4 with single-precision FPU runs on-chip DSP filter and FFT routines for heart-rate variability and SpO2 calculation, while 128 KB SRAM accommodates waveform buffers. USB full-speed enables tethered firmware updates and patient-data sync to a host PC; 512 KB flash stores application code, calibration tables, and lookup arrays. The 144-LQFP package supports the 96 GPIO count needed for display, keypad, and serial sensor expansion.
Recommandé
Industrial Process Sensors and 4-20 mA Loops
The Kinetis K50 analog front end makes MK50DN512CLQ10 ideal for industrial process sensors: pressure transmitters, flow meters, RTD-based temperature probes, and weigh-scale load cells. The integrated op-amps implement programmable-gain and trans-impedance stages; the 16-bit ADCs oversampled to 24-bit effective resolution handle millivolt-level sensor outputs directly. The Cortex-M4 DSP extensions convert raw ADC samples into filtered engineering units, while 512 KB flash stores calibration coefficients and lookup tables. The 96 GPIO fan-out supports parallel keypad, LCD, and HART modem interfaces. Robustness for factory environments is addressed by the -40 C to +85 C industrial temperature range and 1.71 V to 3.6 V supply tolerance accommodating 24V loop-powered rails down to 3.6V regulated rails.
Recommandé
USB-Connected Measurement Instruments
The MK50DN512CLQ10 integrates a USB full-speed controller with on-chip transceiver, eliminating external PHY chips and reducing BOM for tethered laboratory instruments. With 100 MHz Cortex-M4 and floating-point DSP, the part acquires signals from bench DMMs, oscilloscope front ends, and USB data loggers, then streams processed data over USB to a host PC. The 512 KB flash accommodates firmware with USB class drivers, lookup tables, and calibration matrices, while 128 KB SRAM buffers packet transfers. The integrated op-amp/ADC chain allows direct sensing of thermocouples, strain gauges, and photodiodes. The 144-LQFP package provides 96 GPIO for front-panel encoder switches, function keys, and segment displays commonly found in bench instruments.
Recommandé
Precision Weigh Scales and Load-Cell Readouts
Load-cell signal chains typically require low-noise amplifiers and a high-resolution ADC. The MK50DN512CLQ10 combines both on-chip: trans-impedance op-amps condition microvolt-class load-cell signals and the dual 16-bit SAR ADCs operate with averaging to achieve 24-bit effective resolution. The Cortex-M4 DSP performs digital filtering, linearization against calibration weights, and tare computation in real time. 512 KB flash stores application code, country-specific firmware locales, and calibration coefficients; 128 KB SRAM buffers the rolling display refresh. The 144-LQFP with 96 GPIO accommodates LCD segment drivers, keypad matrices, and serial ports for retail-POS integration, while the industrial -40 C to +85 C temperature range withstands harsh weighing environments.
Recommandé
Data Acquisition Systems and Modular Sensor Hubs
Modular data acquisition systems aggregate analog and digital sensor inputs over USB or CAN interfaces. The MK50DN512CLQ10's analog measurement engine supports up to a dozen sensor channels per device through the GPIO-driven external analog multiplexer; the 12-bit DAC outputs excitation signals for strain gauges and RTDs. USB full-speed connectivity to a host PC is built in, removing the external PHY cost that single-channel ADCs often require. The 100 MHz Cortex-M4 core runs SPI, I2C, and UART stacks simultaneously for sensor networking. 512 KB flash and 128 KB SRAM cover complex protocol stacks (USB, I2C device drivers, CANopen, Modbus) in production modules.
Recommandé
Industrial Battery-Powered Sensor Nodes
The MK50DN512CLQ10's 1.71 V to 3.6 V supply range accommodates direct battery operation from a single lithium primary cell or two AA cells through end-of-life discharge. Low-leakage modes permit multi-year operation of remote gas detectors, water-quality probes, and structural-health monitors. The integrated op-amps and dual 16-bit ADCs digitize analog sensors at low quiescent current without external instrumentation amplifiers that would otherwise drain the battery. USB charging and diagnostics ports use the integrated full-speed USB controller for periodic tethered log retrieval, eliminating a discrete charge-management IC. The 144-LQFP package suits outdoor enclosures with adequate thermal mass, and the industrial -40 C to +85 C temperature range handles cold-start and high-ambient outdoor deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MK50DN512CLQ10 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MK50DN512ZCLQ10 | MK51DN512CLQ10 | MK52DN512CLQ10 | MK53DX256ZCLQ10 | MK60DN512ZVLQ10 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) |
| Core | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz | ARM Cortex-M4 100 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Integrated Op-Amps | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | Yes (op-amp + trans-impedance) | No (K60 series) |
| Integrated Ethernet MAC | No | No | No | Yes (10/100 with MII/RMII) | No | Yes (10/100) |
| Approx. Price at qty-1000 (USD) | $10.21 | Similar to MK50DN512CLQ10 | Higher (crypto adds cost) | Higher (Ethernet adds cost) | Lower (smaller flash) | Higher (K60 features) |
Principaux différenciateurs
- Integrated analog measurement engine with op-amps and trans-impedance amplifiers (vs MK60DN512ZVLQ10)
- Same 144-LQFP pinout across K50/K51/K52 families (vs MK51DN512CLQ10)
- Drop-in tape-and-reel packaging variant (vs MK50DN512ZCLQ10)
Notes de conception
Estimated: The K50 analog front end is sensitive to supply ripple; place a 0.1uF ceramic bypass capacitor within 5 mm of each VDDA pin and a 10uF bulk capacitor near VDD, with separate analog and digital ground returns joined at a single point under the MCU. USB VOUT33 pin requires a 1uF decoupling capacitor to ground; do not draw load current from VOUT33 other than MCU-internal use.
The 144-LQFP exposes analog and digital supply pins interspersed across the package; route VDDA traces as wide as possible to the analog section and keep ADC reference pins (VREFH/VREFL) guarded by a ground pour. Place external 32.768 kHz RTC crystal within 5 mm of the RTC_XTAL32 pins; load capacitors (10-20 pF typical) are mandatory and must be sized per crystal manufacturer datasheet, not generic values.
Do not exceed 3.6 V on any MCU pin including USB DP/DM - excessive voltage injects latch-up risk. When enabling AES or Ethernet on MK51/MK52 alternatives, ensure firmware re-validates the security/connectivity stacks during in-field firmware updates; the integrated op-amps have limited drive current (~1 mA) and must not be used to directly drive low-impedance loads like speakers or relay coils. The MCG (multipurpose clock generator) configuration must explicitly transition through FEI -> FBI -> FBE -> PBE states when switching to external reference; attempting a direct switch fails the lock detect.
Estimated: At maximum 100 MHz operation with all peripherals active and USB running, the 144-LQFP dissipates approximately 200-300 mW. The package has theta_JA of approximately 40-50 C/W on a 4-layer 2 oz PCB, yielding junction-to-ambient rise of 10-15 C - well within industrial -40 to +85 C ambient. For tight enclosure designs, allocate at least 100 mm² of unbroken copper ground plane under the MCU to keep junction rise below 10 C.
USB DP/DM traces must be routed as a 90-ohm differential pair with continuous reference plane, length-matched within 2 mm. Keep the pair away from switching regulators or RF traces - cross coupling on USB data lines causes enumeration failures and EN_GOOD errors. For low-impedance analog sensor inputs to the integrated op-amps, route differential traces together and place a low-pass RC filter (1 kohm + 1 nF typical) within 3 mm of the input pin for EMI suppression.
Informations de conformité
RoHS compliant per NXP product page. Industrial temperature grade -40 C to +85 C. AEC-Q100 not applicable - this is an industrial part; choose KEA or S32K automotive MCU families for AEC-Q100 qualified parts.