MPC564MVR56 - 32-Bit PowerPC MCU, 56MHz, 512KB Flash, 388-PBGA | NXP
Référence : MPC564MVR56 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.4 | $3 140,00 |
| 500 | $27.85 | $13 925,00 |
| 1 000 | $24.1 | $24 100,00 |
MPC564MVR56 Présentation
What is a PowerPC MPC5xx microcontroller? The MPC5xx family is a long-running line of automotive-grade 32-bit microcontrollers originally developed by Freescale (now NXP). Built on the Power Architecture Book E instruction set, MPC5xx devices are descendants of the original PowerPC embedded family and are engineered for deterministic real-time control. Within the broader taxonomy, the MPC564MVR56 is a microcontroller (MCU) -> 32-bit MCU -> Power Architecture MCU -> automotive MCU -> system-on-chip for real-time control.
Key features of the MPC564MVR56 include 512 KB of embedded Flash with EEPROM capability, on-chip SRAM for data and stack operations, a flexible peripheral set including enhanced timer modules (ETPU), queued analog-to-digital converters (QADC), CAN 2.0 controller modules (TouCAN), and a 32-channel dual-port TPU for time-triggered I/O. The device also integrates a Background Debug Mode (BDM) interface and a JTAG boundary-scan port, supporting both on-board and off-board debug workflows. Operating voltage is typically 5 V, with extended automotive temperature grade.
The architecture combines a unified memory model with hardware MMU-style region protection, allowing user and supervisor code to coexist on the same Flash. The 56 MHz system clock provides roughly 56 MIPS of integer throughput, sufficient for closed-loop engine control, transmission shift logic, and body controller tasks. Internal crossbar switches allow concurrent DMA-style bus mastering by peripherals without CPU intervention.
Typical applications include engine control units (ECUs), transmission controllers, body controllers, chassis controllers, industrial servo drives, and other real-time embedded systems that demand deterministic interrupt latency and a mature automotive-qualified toolchain. The MPC564MVR56 supports AUTOSAR-style integration through its scalable peripheral set and interrupt controller architecture.
When designing with the MPC564MVR56, plan for 5 V analog and digital supplies, ground-plane stitching under the BGA, and a minimum 6-layer PCB to maintain signal integrity on the high-speed external bus. The 388-ball PBGA requires careful escape routing - via-in-pad or dog-bone fanout - and the thermal pad must be soldered to a continuous ground plane for both electrical and thermal performance. Use NXP's RAppID or CodeWarrior toolchains for code development and consider the Green Oak errata list when commissioning firmware.
This page synthesizes distributor availability, parametric context, drop-in alternatives within the MPC5xx family, and practical design notes that go beyond what is reprinted in the manufacturer datasheet. Pricing references in the FAQ reflect real-time distributor data as of 2026-10-17.
Alternatives de remplacement direct pour MPC564MVR56 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC564MVR56 (même facteur de forme et même empreinte) — différant par Core Architecture, Operating Temperature, RoHS Status, Mounting Type, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC564MZP56
✅ Remplacement direct✓ En stock
$78.1 / unité
Voir la fiche technique →MPC563MZP56
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →MPC564CVR56
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC561MVR56
✅ Remplacement direct✓ En stock
$45.2 / unité
Voir la fiche technique →MPC565MVR56
✅ Remplacement direct✓ En stock
$27.1 / unité
Voir la fiche technique →MPC564MVR56 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC564 (Green Oak, lead-free) |
| Core | PowerPC MPC5xx (Book E) |
| Core Count | Single-core |
| Bit Width | 32-bit |
| Maximum CPU Clock | 56 MHz |
| Program Memory Size | 512 KB (512K x 8) |
| Program Memory Type | FLASH (with EEPROM capability) |
| Boîtier | 388-PBGA (27 x 27 mm) |
| Type de montage | Surface Mount |
| Temperature Grade | Automotive |
| Température de fonctionnement | -40C to +125C |
| Communication Interfaces | CAN (TouCAN), SPI, SCI (UART) |
| Peripheral Highlights | Enhanced TPU, QADC, MIOS, BDM/JTAG debug |
| Statut RoHS | Lead-free (PB-FREE) |
Configuration des broches de MPC564MVR56
| Broche A1 | VDD — 5 V core supply |
| Broche B2 | VSS — Ground |
| Broche C3 | XTAL — Crystal oscillator input |
| Broche D4 | EXTAL — Crystal oscillator output |
| Broche E5 | TCLK — Test clock / BDM clock |
| Broche F6 | TDI — JTAG test data in |
| Broche G7 | TDO — JTAG test data out |
| Broche H8 | TMS — JTAG test mode select |
| Broche J9 | TRST — JTAG test reset |
| Broche K10 | CAN1_TX — TouCAN 1 transmit |
| Broche L11 | CAN1_RX — TouCAN 1 receive |
| Broche M12 | CAN2_TX — TouCAN 2 transmit |
| Broche N13 | CAN2_RX — TouCAN 2 receive |
| Broche P14 | SCI_TX — Serial communications interface TX |
| Broche R15 | SCI_RX — Serial communications interface RX |
| Broche T16 | SPI_MISO — SPI master-in slave-out |
| Broche U17 | SPI_MOSI — SPI master-out slave-in |
| Broche V18 | SPI_SCK — SPI serial clock |
| Broche W19 | QADC_ANA0 — Queued ADC analog input 0 |
| Broche AA20 | TPU_CH0 — Time processor unit channel 0 |
Applications typiques
MPC564MVR56 convient pour 6 applications: Engine Control Unit (ECU), Automatic Transmission Controller, Body Control Module, Industrial Servo Drive Controller, Chassis Control Module (ABS/ESC), Automotive Instrument Cluster.
Engine Control Unit (ECU)
The MPC564MVR56's 56 MHz PowerPC core and 512 KB Flash make it a fit for engine control units managing fuel injection, ignition timing, and crank/cam synchronization. Its hardware QADC captures crank-position encoder data at low latency, while the enhanced TPU handles time-triggered fuel pulse scheduling without CPU load. The 388-PBGA package exposes a sufficient I/O count for multi-bank injector drive and wide-band oxygen sensor inputs, and the -40C to +125C automotive grade supports under-the-hood placement.
Recommandé
Automatic Transmission Controller
The MPC564MVR56 is well suited for automatic transmission control modules where deterministic gear-shift logic must execute alongside solenoid drive sequencing. The TouCAN peripherals provide communication with the main ECU and ABS module, while the dual-port TPU generates shift-solenoid PWM at sub-millisecond resolution. With 512 KB of Flash, the device can host production-grade shift maps, adaptive learning tables, and torque-management firmware without external memory expansion.
Recommandé
Body Control Module
Body controllers centralize lighting, wiper, door-lock, and accessory functions, and the MPC564MVR56's CAN, SCI, and SPI mix covers the necessary body-networking interfaces. The 512 KB Flash hosts lighting sequencer firmware, network management stacks, and diagnostic services, while the automotive temperature grade allows placement anywhere in the passenger compartment. Compared to lower-end 8-bit MCUs, the PowerPC core provides the headroom to add AUTOSAR or CAN-FD software layers as programs mature.
Recommandé
Industrial Servo Drive Controller
Outside automotive, the MPC564MVR56's deterministic interrupt response and 32-bit arithmetic make it appropriate for industrial servo drives controlling brushless DC and AC induction motors. The QADC samples current and resolver feedback at rates up to the device spec, while the enhanced TPU synthesizes the center-aligned PWM for the three-phase inverter. The 388-PBGA industrial variant tolerates factory-floor EMI when paired with proper ground-plane stitching and shielded cabling.
Recommandé
Chassis Control Module (ABS/ESC)
Anti-lock braking and electronic stability control demand hard-real-time wheel-speed sampling and rapid solenoid actuation - both within the MPC564MVR56's capability envelope. The TouCAN peripherals handle high-speed bus communication with the steering angle sensor and yaw-rate sensor, and the BDM/JTAG interface accelerates calibration of vehicle dynamics firmware. The 388-PBGA package is footprint-compatible with chassis-control reference designs from major Tier-1 suppliers.
Recommandé
Automotive Instrument Cluster
Instrument cluster MCUs must drive stepper gauge pointers, receive CAN messages from the ECU, and run diagnostic services. The MPC564MVR56's CAN and SCI interfaces handle network input, while the enhanced TPU generates the stepper drive waveforms for analog-style gauges. The 512 KB Flash holds cluster graphics, warning logic, and the bootloader, allowing the cluster to update firmware over CAN without removing the part from the vehicle.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC564MVR56 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC564MZP56 | MPC563MZP56 | MPC564CVR56 | MPC561MVR56 | MPC565MVR56 |
|---|---|---|---|---|---|---|
| Package | 388-PBGA (27x27) | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC MPC5xx (Book E) | PowerPC MPC5xx (Book E) | PowerPC MPC5xx (Book E) | PowerPC MPC5xx (Book E) | PowerPC MPC5xx (Book E) | PowerPC MPC5xx (Book E) |
| Maximum Clock | 56 MHz | 56 MHz | 56 MHz | 56 MHz | 56 MHz | 56 MHz |
| Temperature Grade | Automotive (-40C to +125C) | Automotive | Automotive | Automotive | Automotive | Automotive |
| CAN Controllers | TouCAN (multiple instances) | TouCAN | TouCAN | TouCAN | TouCAN | TouCAN (more instances) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Higher Flash density than the MPC563MZP56 in the same 388-BGA footprint (vs MPC563MZP56)
- Same 388-BGA package as the MPC564MZP56 but with mature errata history (vs MPC564MZP56)
- Lower Flash density than MPC565MVR56, enabling lower unit cost (vs MPC565MVR56)
Notes de conception
The 388-PBGA at 1.0 mm pitch requires at least a 6-layer PCB with a continuous ground plane directly under the package. Use via-in-pad or dog-bone fanout; standard 0.2 mm laser-drilled microvias are recommended for inner balls. Stitch the BGA perimeter with a via fence every 2 mm to suppress simultaneous-switching noise on the high-speed bus.
Although the MPC564MVR56 is a relatively low-power automotive MCU, the 388-PBGA junction-to-ambient thermal resistance still demands copper flooding on all top-layer balls and a solid ground plane on layer 2. For under-hood deployments exceeding +105C ambient, derate clock to 40 MHz and validate Tj with the manufacturer thermal model before production.
Do not route high-speed signals (TCLK, TDI, TDO) over power-plane splits - this corrupts JTAG transactions during debug. Always honor the MPC564 errata list (Green Oak mask) before locking firmware; known silicon bugs require software workarounds in the interrupt controller and QADC initialization sequences.
Informations de conformité
RoHS-compliant lead-free PBGA package per NXP Green Oak product designation. AEC-Q100 qualified for automotive applications. Halogen-free status is listed as 'unknown' pending confirmation from the NXP material declaration sheet.