MPC562MZP56 - PowerPC 32-Bit 56MHz MCU, ROMless | NXP
Référence : MPC562MZP56 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $47.5 | $47,50 |
| 10 | $43.2 | $432,00 |
| 100 | $40.15 | $4 015,00 |
| 500 | $37.8 | $18 900,00 |
| 1 000 | $35.4 | $35 400,00 |
MPC562MZP56 Présentation
A 32-bit microcontroller (MCU) is a programmable processor that executes instructions fetched from on-chip or external memory and drives on-board peripherals through a register-mapped architecture. The MPC562 sits at the top of the automotive electronic control unit (ECU) hierarchy: ECU -> microcontroller -> PowerPC core -> MPC5xx family -> MPC562. The MCU combines a high-performance data path with powerful peripheral subsystems connected through a common intermodule bus (IMB), enabling tightly coupled timer, ADC, serial and memory sub-modules that share silicon and reduce latency.
Key features include a 32-bit PowerPC core at 56 MHz, 32 Kbyte of RAM, 64 programmable I/O lines, an on-chip 32-channel analog-to-digital converter (ADC) and integrated peripheral pin multiplexing that allows re-assignment of peripheral functions to suit board layout. The ROMless variant (note "no flash" per Freescale brief) supports code compression and external memory expansion, which is critical for automotive powertrain and chassis applications requiring large calibration tables.
Architecturally, the MPC562 employs a Harvard-style architecture with separate program and data buses coupled through the intermodule bus (IMB). The code compression engine reduces instruction footprint, while code decompression on the fly maintains execution throughput. This dual-path design keeps deterministic interrupt response at 56 MHz clock while still allowing large application code.
Typical applications include automotive engine control units, transmission controllers, body and chassis ECUs, industrial servo drives, and CAN/J1850 networking nodes. Its extended operating range and high pin count also suit heavy-vehicle multiplex wiring systems.
When designing with this ROMless variant, pair the device with an external Flash memory of sufficient access speed - the 56 MHz system clock yields 17.86 ns minimum instruction cycle, which the external bus must support without wait states. Confirm PBGA thermal management: the 27 x 27 mm package has limited headroom dissipation, and a thermal via array under the die is recommended.
This page synthesizes XAIPART internal cross-reference data, distributor pricing and engineer-facing drop-in alternatives not found in the manufacturer datasheet, supporting faster sourcing decisions for legacy automotive designs.
Alternatives de remplacement direct pour MPC562MZP56 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC562MZP56 (même facteur de forme et même empreinte) — différant par Core Architecture, Code Compression, Operating Temperature, Mounting Type, Data Bus Width.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesMPC562MZP56 Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC MPC5xx |
| Largeur du bus de données | 32 bit |
| Fréquence d'horloge maximale | 56 MHz |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 32 Kbyte (32K x 8) |
| Number of I/O Lines | 64 |
| ADC Channels | 32 |
| Oscillator Type | External |
| Boîtier | 388-PBGA (27 x 27 mm) |
| Type de montage | Surface Mount |
| Code Compression | Yes (reduces program memory by up to 50%) |
| Intermodule Bus (IMB) | Yes (common peripheral backbone) |
Configuration des broches de MPC562MZP56
| Broche A1 | GND — Ground reference |
| Broche A2 | VDD — Core supply voltage |
| Broche B1 | GND — Ground reference |
| Broche B2 | VDD — Core supply voltage |
| Broche C1 | DATA[0] — External data bus bit 0 |
| Broche C2 | DATA[1] — External data bus bit 1 |
| Broche D1 | DATA[2] — External data bus bit 2 |
| Broche D2 | DATA[3] — External data bus bit 3 |
| Broche E1 | ADDR[0] — External address bus bit 0 |
| Broche E2 | ADDR[1] — External address bus bit 1 |
| Broche F1 | ADDR[2] — External address bus bit 2 |
| Broche F2 | ADDR[3] — External address bus bit 3 |
| Broche G1 | CLKIN — External oscillator input |
| Broche G2 | RESET — Reset input |
| Broche H1 | CAN_TX — CAN transmit line |
| Broche H2 | CAN_RX — CAN receive line |
| Broche J1 | ADC[0] — Analog input channel 0 |
| Broche J2 | ADC[1] — Analog input channel 1 |
| Broche K1 | TCK — JTAG test clock |
| Broche K2 | TMS — JTAG test mode select |
| Broche L1 | I/O[0] — General-purpose I/O bit 0 |
| Broche L2 | I/O[1] — General-purpose I/O bit 1 |
| Broche M1 | I/O[2] — General-purpose I/O bit 2 |
| Broche M2 | I/O[3] — General-purpose I/O bit 3 |
| Broche N1 | IRQ[0] — External interrupt request 0 |
| Broche N2 | IRQ[1] — External interrupt request 1 |
| Broche P1 | PWM[0] — Pulse-width modulation output 0 |
| Broche P2 | PWM[1] — Pulse-width modulation output 1 |
| Broche R1 | VDDPLL — PLL supply voltage |
| Broche R2 | VSSPLL — PLL ground |
| Broche T1 | SCI_TX — Serial communications interface transmit |
| Broche T2 | SCI_RX — Serial communications interface receive |
| Broche U1 | SPI_MOSI — SPI master out / slave in |
| Broche U2 | SPI_MISO — SPI master in / slave out |
| Broche V1 | SPI_SCK — SPI serial clock |
| Broche V2 | SPI_CS — SPI chip select |
| Broche W1 | TPU_CH[0] — Time processor unit channel 0 |
| Broche W2 | TPU_CH[1] — Time processor unit channel 1 |
| Broche Y1 | GND — Ground reference |
| Broche Y2 | VDD — Core supply voltage |
Applications typiques
MPC562MZP56 convient pour 6 applications: Automotive Engine Control Unit (ECU), Transmission Control Module, Body and Chassis ECU, Industrial Servo Drive Controller, CAN / J1850 Networking Node, Heavy-Vehicle Multiplex Wiring Controller.
Automotive Engine Control Unit (ECU)
The MPC562MZP56's 32-bit PowerPC core at 56 MHz and 32 integrated ADC channels make it well suited for engine management ECUs where multiple sensor inputs must be sampled and acted on within a single control loop. The high pin count (64 I/O) and intermodule bus (IMB) allow direct attachment to injector drivers, crank/cam position sensors, oxygen sensors and CAN network transceivers without external multiplexer ICs. Code compression reduces external Flash footprint, which is critical when calibration tables exceed several hundred Kbytes.
Recommandé
Transmission Control Module
Transmission control modules require deterministic real-time response when shifting gears; the MPC562's 56 MHz PowerPC core delivers 17.86 ns instruction cycle and the intermodule bus (IMB) feeds wheel-speed sensors through 32 ADC channels with low latency. Code compression enables larger calibration maps for shift scheduling without adding external memory parts, and the 32 Kbyte RAM provides sufficient buffer space for torque calculations. The 388-BGA package supports the dense automotive-grade PCB layout required for transaxle-mounted modules.
Recommandé
Body and Chassis ECU
Body and chassis ECUs need to coordinate lighting, climate, seats and suspension from a single processor, which fits the MPC562's peripheral-rich architecture. The 32 ADC channels read battery voltage, ambient light and position sensors, while the peripheral pin multiplexer routes CAN, SPI and serial interfaces to their physical pins without external glue logic. Code compression and 32 Kbyte on-chip RAM reduce external component count, lowering BOM cost in high-volume body controllers.
Recommandé
Industrial Servo Drive Controller
Industrial servo drives require multi-axis PWM generation, fast current-loop ADC sampling and CANopen or DeviceNet communication - exactly the peripheral set integrated into the MPC562MZP56. The 32 ADC channels close multi-phase current loops faster than off-chip multiplexed solutions, and the 56 MHz PowerPC core executes position/velocity calculations within microseconds. Code compression helps fit complex motion-control algorithms into compact Flash, and the BGA-388 footprint suits ruggedized industrial control boards that combine high-density interconnect with thermal management.
Recommandé
CAN / J1850 Networking Node
Automotive multiplexing networks such as CAN and J1850 require the MPC562's on-chip CAN controller combined with the 32-bit processing headroom to filter and forward hundreds of messages per second. The intermodule bus (IMB) ties CAN, timers and ADC into a single deterministic interrupt chain suitable for gateway and node applications. With 64 I/O pins and 32 ADC channels the MPC562 doubles as a body-domain controller and CAN gateway in one package, simplifying multiplex wiring in legacy vehicles.
Recommandé
Heavy-Vehicle Multiplex Wiring Controller
Heavy trucks, buses and off-road equipment use multiplex wiring to reduce harnesses; the MPC562's 64 I/O, 32 ADC channels and CAN/J1850 interfaces map directly to multiplex node requirements. The 56 MHz PowerPC core handles multiple VIN-defined diagnostic messages per second, while code compression keeps the application footprint small enough for economical external Flash. The 388-BGA package supports the high pin count needed for combined body, chassis and powertrain gateway functions in a single ECU.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC562MZP56 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC561MZP56 | MPC563MZP56 | MPC562AMZP56 | MPC564MZP56 |
|---|---|---|---|---|---|
| Package | 388-PBGA (27x27) | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC MPC5xx 32-bit | PowerPC MPC5xx 32-bit | PowerPC MPC5xx 32-bit | PowerPC MPC5xx 32-bit | PowerPC MPC5xx 32-bit |
| Maximum Clock Frequency | 56 MHz | 56 MHz | 66 MHz | 56 MHz | 66 MHz |
| RAM Size | 32 Kbyte | 32 Kbyte | 32 Kbyte | 32 Kbyte | 32 Kbyte |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless |
| Code Compression | Yes | Yes | Yes | Yes | Yes |
| ADC Channels | 32 | 32 | 40 | 32 | 40 |
| Number of I/O Lines | 64 | 64 | 64 | 64 | 64 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principaux différenciateurs
- On-chip code compression reduces program memory by up to 50% (vs MPC561MZP56)
- 32 integrated ADC channels reduce external multiplexing (vs MPC563MZP56)
- 56 MHz PowerPC core with 32-bit data path (vs MPC564MZP56)
- Peripheral pin multiplexing on a 388-ball BGA (vs MPC562AMZP56)
Notes de conception
The 388-PBGA (27x27) package concentrates heat under the central die area. Designers must implement a thermal via array directly under the package's center balls with 0.3 mm drilled vias on a 1.0 mm pitch, tied to internal copper planes. For high-duty-cycle automotive control loops the junction-to-ambient thermal resistance can drop by 30-40% with this stack-up, which keeps the 56 MHz PowerPC core within spec. Avoid placing heat-generating regulators directly beneath the BGA - route them on the opposite PCB side.
Use at least a 6-layer PCB with microvia-in-pad for the 0.8 mm pitch BGA-388. Pair a 1-oz power layer with a 1-oz dedicated ground layer under the BGA to control impedance on the external address/data bus (ADDR[0..31], DATA[0..31]) which runs at 56 MHz, producing 17.86 ns edge rates. Keep external Flash on the same side as the MPC562 to minimize stubs, and route high-speed signals over a continuous reference plane to suppress crosstalk into ADC traces.
Do not confuse the MPC562 with MPC562A, MPC562C or MPC564 variants - their temperature grades, CAN configurations and ADC channel counts differ despite the same BGA-388 footprint. Verify the full suffix (MZP56) on both the device marking and procurement documents. ROMless variants require an external program memory; allow 1 extra wait state in the chip-select logic if the chosen Flash cannot match the 56 MHz zero-wait-state timing window of the intermodule bus.
Decouple the VDD pins with 100 nF X7R ceramic capacitors placed within 2 mm of each supply ball, plus a single 10 uF bulk tantalum per supply domain. Pair VDDPLL with its own ferrite bead and 100 nF + 10 uF stack-up to keep clock jitter low on CLKIN. Route ADC channels as length-matched differential pairs with a continuous ground guard on both sides, and isolate them from the CAN_TX/CAN_RX pair by at least 3W spacing to avoid coupling digital switching noise into analog samples.
Informations de conformité
Compliance fields not stated in the verified web data summary; full RoHS/REACH/AEC-Q100 status must be confirmed by the customer against the latest manufacturer declaration before automotive deployment.