MPC5777C - 264MHz Dual-Core Power Architecture MCU | NXP
Référence : MPC5777C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.8 | $298,00 |
| 100 | $26.4 | $2 640,00 |
| 500 | $23.9 | $11 950,00 |
| 1 000 | $21.2 | $21 200,00 |
MPC5777C Présentation
A microcontroller (MCU) is a compact integrated circuit that governs a specific operation in an embedded system, combining a processor core, memory, and programmable I/O peripherals on one die. The MPC5777C belongs to the automotive MCU family within the broader embedded processor hierarchy, alongside DSPs and SoCs, and is specifically engineered for harsh, real-time, safety-critical environments such as under-hood powertrain control.
Key features include lockstep dual cores supporting ASIL-D (ISO 26262) and SIL-1 (IEC 61508) functional safety, a hardware security module (CSE with encryption and tamper detection) for secure boot and communication, ECC on both flash and SRAM, and a memory protection unit. Comprehensive connectivity covers CAN, LIN, FlexRay, and Ethernet, while high-resolution eMIOS PWM timers and multiple ADCs support precision motor and engine control.
Technically, the device is AEC-Q100 qualified and operates from -40C to +150C, ensuring reliability in demanding automotive thermal environments. NXP documents the family in the MPC5777C Data Sheet (Document Number MPC5777C Rev. 15, 03/2021) and the MPC5777C Reference Manual.
Typical applications include engine control units (ECUs), transmission control, hybrid and electric vehicle powertrain/inverter control, and industrial motor drives where deterministic real-time loops and functional safety are mandatory.
Design consideration: the MCU requires multiple supply rails (3.3V and 5V) with careful decoupling and a robust power sequencing scheme; at 264 MHz it can dissipate significant power, so thermal design with adequate copper pour on the MAPBGA land pattern is essential.
Alternatives de remplacement direct pour MPC5777C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC5746C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC5748G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC5777M
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC5775E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC5674F
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SPC5775CMMH3
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC5777C Valeurs maximales et caractéristiques électriques
| Core Architecture | Power Architecture e200z7 dual-core (lockstep) + e200z0 |
| Core Frequency | Up to 264 MHz |
| Flash Memory | 8 MB |
| SRAM | 768 KB |
| Largeur du bus de données | 32-bit |
| Functional Safety | ASIL-D (ISO 26262), SIL-1 (IEC 61508) via lockstep cores |
| Security | CSE hardware security module, tamper detection (TDM) |
| ECC | ECC on flash and SRAM |
| Communication Interfaces | CAN, LIN, FlexRay, Ethernet |
| Timers | eMIOS high-resolution PWM timers |
| ADC | Multiple on-chip ADCs |
| Memory Protection | MPU (Memory Protection Unit) |
| Température de fonctionnement | -40C to +150C |
| Qualification | AEC-Q100 |
| Tension d'alimentation | 3.3 V and 5 V rails |
| Boîtier | MAPBGA |
| Type de montage | Surface Mount |
Guide de configuration des broches du MPC5777C mapbga
Configuration des broches du MPC5777C (boîtier mapbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC5777C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC5777C convient pour 6 applications: Engine Control Units (ECU), Hybrid/EV Traction Inverter Control, Transmission Control, Functional Safety Processors (ASIL-D Systems), Industrial Motor Drives, Secure Automotive Gateways.
Engine Control Units (ECU)
The MPC5777C is purpose-built for advanced gasoline and diesel engine management. Its dual 264 MHz lockstep e200z7 cores execute combustion, knock, and torque-control algorithms with deterministic latency, while the e200z0 core offloads peripheral servicing. Eight megabytes of flash store calibration data sets and diagnostic stacks, and the CSE security engine protects against unauthorized ECU reprogramming. The -40C to +150C operating range and AEC-Q100 qualification tolerate under-hood thermal stress, and eMIOS timers provide the crank-angle-synchronized injection and ignition timing resolution required by Euro 6 and Tier 3 powertrain systems.
Recommandé
Hybrid/EV Traction Inverter Control
In traction inverters, the MPC5777C closes high-bandwidth motor current loops using its 264 MHz cores and multiple ADCs synchronized with high-resolution eMIOS PWM outputs. Lockstep dual cores plus ECC memories support ISO 26262 ASIL-D torque-safety architectures demanded in electric drivetrains. The MCU interfaces with gate drivers and isolated current sensors over SPI and CAN/FlexRay for functional-safety messaging. Its 768 KB SRAM handles field-oriented control state machines and diagnostic logging. Thermal design matters: at full clock the device dissipates meaningful power, requiring solid ground planes under the MAPBGA and junction temperature monitoring.
Recommandé
Transmission Control
Automatic and dual-clutch transmissions require millisecond-deterministic shift control, which the MPC5777C delivers through its z7 core pair executing pressure, clutch, and ratio-control algorithms while the z0 core manages sensors and solenoid drivers. Eight MB flash accommodates multiple shift-strategy calibrations, and CAN/LIN/FlexRay connectivity links the TCU to the engine ECU and vehicle gateways. The e200z7 lockstep mode supports ASIL-D gear-engagement safety monitoring. Multiple on-chip ADCs sample pressure and position sensors concurrently, reducing external component count in harsh underbody thermal environments up to +150C.
Recommandé
Functional Safety Processors (ASIL-D Systems)
The MPC5777C serves as the safety controller in systems certified to ISO 26262 ASIL-D or IEC 61508 SIL-1. Its lockstep e200z7 cores compare program flow cycle-by-cycle, while ECC on the 8 MB flash and 768 KB SRAM detects and corrects single-bit faults. The MPU partitions safety and non-safety software, and built-in self-test (BIST) engines validate RAM and logic at startup and runtime. Designers should implement the NXP safety concept, including clock monitoring and watchdog strategy, and budget diagnostic code overhead on the 264 MHz cores to meet fault detection time interval requirements.
Recommandé
Industrial Motor Drives
In industrial servo and industrial motor drives, the MPC5777C's Power Architecture delivers the field-oriented control performance of a DSP-class device with MCU integration. The 264 MHz dual cores run current, velocity, and position loops simultaneously, and eMIOS PWM modules generate complementary gate-drive signals with dead-time insertion at high resolution. Multiple ADCs provide simultaneous phase-current sampling, while CAN and Ethernet interface with PLCs and industrial networks. ECC memories and MPU partitioning bring SIL-1 process-safety capability per IEC 61508. Its wide -40C to +150C range also suits drives mounted near motors in harsh factory environments.
Recommandé
Secure Automotive Gateways
Thanks to its CSE cryptographic engine, tamper detection module, and rich connectivity (CAN, LIN, FlexRay, Ethernet), the MPC5777C can host secure gateway and secure on-board diagnostics (UDS 27/29) functions in vehicles. The 8 MB flash stores multiple protocol stacks plus cryptographic keys, and lockstep cores authenticate safety-relevant message routing. Secure boot ensures only authenticated firmware executes after power-up, protecting against supply-chain attacks. While the MPC5748G is more communication-focused, the MPC5777C suits gateways that also perform control duties and require ASIL-D processing alongside security services.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC5777C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC5746C | MPC5748G | MPC5674F |
|---|---|---|---|---|
| Package | MAPBGA | MAPBGA (516-ball compatible) | MAPBGA (516-ball compatible) | MAPBGA (516-ball compatible) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Configuration | Dual lockstep e200z7 @ 264 MHz + e200z0 | Dual z7 @ 160 MHz + z2 | Triple core z4 + 2x z2 @ 160 MHz | Single e200z6 @ 264 MHz |
| Flash Memory | 8 MB | 4 MB | 6 MB | 4 MB |
| SRAM | 768 KB | 768 KB | 1 MB | 164 KB |
| Functional Safety | ASIL-D lockstep | ASIL-D lockstep | ASIL-D lockstep | Not ASIL-D certified |
| Operating Temperature | -40C to +150C | -40C to +150C | -40C to +125C/+150C per grade | -40C to +150C |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified |
Principaux différenciateurs
- Highest compute in MPC57xx powertrain tier (vs MPC5746C)
- Dedicated safety auxiliary core (vs MPC5748G)
- Largest flash in family segment (vs MPC5674F)
Notes de conception
The MPC5777C requires multiple supply rails (3.3V for I/O and 5V domain with internal regulation for the core). Use an NXP-recommended system basis chip such as the MC33908 to guarantee correct power sequencing, reset supervision, and watchdog coverage. Decouple each supply pin pair with 100 nF ceramics placed within 2 mm of the ball via, plus bulk 10 uF per rail. Verify the 3.3V rail can supply peak I/O switching current during simultaneous FlexRay/CAN transmissions.
At 264 MHz with heavy flash execution, junction temperature in a +125C ambient can approach the +150C limit. Model power dissipation using NXP's power estimation spreadsheet, then design the MAPBGA land pattern with thermal vias to internal ground planes. Keep high-frequency core activity on the z0 core where possible to reduce z7-cluster dissipation, and monitor on-chip temperature sensors at runtime to derate clock frequency if Tj approaches the limit.
I/O signal mapping on the MPC5777C is not published in the datasheet itself: per NXP, the I/O Signal Description and Input Multiplexing Tables are contained in a Microsoft Excel file attached to the Reference Manual. Engineers who design pinouts from the datasheet alone will misconfigure pin muxing. Also note analog pins ANA0-ANA39 lack standard PCR registers - configuration differs from digital GPIO, a frequent issue raised in NXP Community forums.
Informations de conformité
AEC-Q100 qualification and ASIL-D/SIL-1 (ISO 26262/IEC 61508) support confirmed by NXP MPC5777C factsheet and datasheet Rev. 15. RoHS/REACH status not stated in provided data.
