MPC755CPX400LE - 400MHz PowerPC G3 MPU | NXP | 360-FCBGA
Référence : MPC755CPX400LE ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $110.01 | $110,01 |
| 10 | $102.5 | $1 025,00 |
| 100 | $95 | $9 500,00 |
| 500 | $88.75 | $44 375,00 |
| 1 000 | $82.5 | $82 500,00 |
MPC755CPX400LE Présentation
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions of a stored program. Within the broader IC hierarchy, the MPC755 sits between an MCU (which integrates peripherals) and a full SoC: it relies on an external bus, memory controller, and companion chipset (often the MPC107/MPC106). It belongs to the PowerPC MPC7xx family, the embedded successor to the desktop PowerPC G3 used in the original Apple iMac and iBook lines, adapted for networking, storage, and telecom applications where deterministic performance and AltiVec-free low cost mattered more than vector throughput.
Key specifications include 400 MHz core clock at 2.5 V/3.3 V I/O split supplies, 6.4 SPECint95 / 7.4 SPECfp95 estimated throughput, support for 2 GB of addressable memory, and a die temperature range of 0 C to +105 C. The processor implements the PowerPC Instruction Set Architecture with a 7-stage superpipeline, branch prediction with a 64-entry Branch Target Address Cache (BTAC), and a 128-entry Branch History Table (BHT). Each part is screened for the extended 105 C TJ junction target and ships in a tray-format 360-ball flip-chip BGA.
At 400 MHz, the MPC755CPX400LE delivers roughly 488 MIPS and is software-compatible with the broader MPC6xx/MPC7xx PowerPC lineage, allowing reuse of established toolchains (Diab, GCC PowerPC, Wind River, Green Hills INTEGRITY) and pin-compatible migration paths from the 300 MHz MPC755BPX300LE and 333 MHz MPC755CRX333LE. It supports multiple bus-to-core frequency ratios to simplify chipset integration with the Motorola MPC107 bridge.
Typical applications include network routers, switches, and wireless base-station control planes, RAID storage controllers, industrial automation controllers, and legacy telecommunications backplane infrastructure where a proven 32-bit embedded processor with long lifecycle software is required.
Alternatives de remplacement direct pour MPC755CPX400LE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC755CPX400LE (même facteur de forme et même empreinte) — différant par Process Technology, Architecture, Mounting Type, Package, Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC755BPX400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XPC755BPX400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC755CRX400LE
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →MPC755BPX300LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC755CRX333LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MC7410VU400LE
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC755CPX400LE Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Motorola/Freescale) |
| Part Family | MPC7xx PowerPC G3 |
| Core Architecture | PowerPC 32-bit RISC, 64-bit external bus |
| Core Clock Speed | 400 MHz |
| Largeur du bus de données | 64-bit |
| Address Bus Width | 32-bit |
| On-chip L2 Cache | 256 KB unified with ECC |
| Floating Point Unit | Double-precision IEEE-754 FPU |
| Supply Voltage - Core | 2.5 V |
| Supply Voltage - I/O | 3.3 V |
| Process Technology | 0.22 um CMOS, 5 metal layers |
| Boîtier | 360-FCBGA (25 mm x 25 mm) |
| Type de montage | Surface Mount (Flip-Chip BGA) |
| Température de jonction en fonctionnement | 0 C to +105 C |
| Lead Free / RoHS | SnPb solder balls - NOT RoHS compliant |
| Nombre de broches | 360 |
| Addressable Memory | Up to 2 GB via 32-bit address bus |
| Statut du cycle de vie | Obsolete - last time-buy programs are closed |
Guide de configuration des broches du MPC755CPX400LE 360-fcbga (25 mm x 25 mm)
Configuration des broches du MPC755CPX400LE (boîtier 360-fcbga (25 mm x 25 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC755CPX400LE.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC755CPX400LE convient pour 6 applications: Network Routers and Switches, RAID Storage Controllers, Industrial Automation Controllers, Telecom Backplane Infrastructure, Legacy Printer Imaging Controllers, Military and Aerospace Avionics Subsystems.
Network Routers and Switches
The MPC755CPX400LE's 400 MHz PowerPC G3 core and 64-bit bus deliver packet-processing throughput for mid-tier routers and layer-3 switches. The MPC7xx instructions, paired with the Motorola MPC107 bridge, allow direct connect to 100 Mbps Ethernet MACs and PCI peripherals. Designers value deterministic execution and proven toolchain support over vector SIMD acceleration.
Recommandé
RAID Storage Controllers
The 360-FCBGA package and high-throughput 64-bit data bus suit RAID-5/6 compute paths in mid-range storage enclosures. The 256 KB on-chip L2 cache with ECC reduces memory latency for XOR/RAID parity calculations. Software stacks typically use VxWorks or INTEGRITY, leveraging the part's long lifecycle and conservative thermal envelope.
Recommandé
Industrial Automation Controllers
With an extended 105 C junction temperature rating, the MPC755CPX400LE is suitable for factory-floor PLC and motion controllers requiring deterministic response. The PowerPC G3 pipeline offers predictable interrupt latency for real-time servo loops, while the legacy software ecosystem accelerates IEC 61131 and proprietary ladder-logic porting. Pin-compatible 300 MHz downgrades enable cost-tuned line variants.
Recommandé
Telecom Backplane Infrastructure
The legacy telecom segment remains a steady user of MPC755CPX400LE parts for SS7/SIGTRAN signaling blades and ATM/Frame Relay concentrators. Service providers value parts with extended lifecycle documentation. JTAG 1149.1 boundary-scan and on-chip debugging via BDM ports simplify board-level bring-up in long-lived CO deployments.
Recommandé
Legacy Printer Imaging Controllers
High-speed production printers and MFP imaging controllers historically used the MPC755 to manage PCL/PostScript ripping, motor control, and DMA image transfer. The 400 MHz core streams 600 dpi page data over the 64-bit bus with margin. The 360-FCBGA package integrates well into compact imaging boards alongside FPGAs for video processing.
Recommandé
Military and Aerospace Avionics Subsystems
The MPC755CPX400LE's extended-characterization screening (LE suffix) appeals to defense primes needing ruggedized 32-bit processing. Platform integrators pair the part with the MPC107 bridge and ruggedized SDRAM for mission computers, radar pre-processors, and flight-control subsystems requiring software reuse from prior PowerPC platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC755CPX400LE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC755BPX400LE | XPC755BPX400LE | MPC755CRX400LE | MPC755BPX300LE | MPC755CRX333LE | MC7410VU400LE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCBGA (25x25 mm) | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same |
| Core Clock | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 300 MHz | 333 MHz | 400 MHz |
| Data Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Process Geometry | 0.22 um | 0.22 um | 0.22 um | 0.22 um | 0.22 um | 0.22 um | 0.18 um |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.8/2.5 V (multi-mode) |
| L2 Cache | 256 KB ECC | 256 KB ECC | 256 KB ECC | 256 KB ECC | 256 KB ECC | 256 KB ECC | 256 KB ECC (deeper pipeline) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Identical 400 MHz speed grade, factory-traceable date code (vs MPC755BPX400LE)
- Widest drop-in option at 400 MHz is the extended-temp XPC755BPX400LE (vs XPC755BPX400LE)
- 300 MHz downgradE retains all bus peripheral IP (vs MPC755BPX300LE)
Notes de conception
Estimated: at core 2.5 V and 400 MHz with typical application instruction mix, the MPC755CPX400LE can dissipate roughly 5-7 W depending on workload. FCBGA-360 thermal resistance theta_JA is around 12-15 C/W on a 4-layer JEDEC board with adequate via array, so the die must be kept below the 105 C junction. Provide a 1 oz copper lid, thermal vias under the package center, and aggressive airflow for chassis > 35 C ambient.
Use a 1.27 mm-pitch microvia stack-up with matched-impedance routing for the 64-bit 60x bus signals and matched-length within 25 ps. Avoid routing memory address/command signals near clock edges; place 100 nF X7R decoupling capacitors at every 5 mm perimeter and 1-2 uF bulk ceramics directly under the BGA shadow. Reference layers must stay uninterrupted beneath the entire FCBGA.
Power-sequencing violations are the most common field failure for MPC755 designs: Vddcore must reach 90 percent of 2.5 V before the 60x bus clock begins, otherwise the PLL may lock out of range and fail reset. Use a supervisor such as MAX176 to enforce proper sequencing. Also ensure HRESET is held asserted through power-up and clock-stabilization periods per Motorola's hardware specification document.
Informations de conformité
SnPb solder balls confirmed by Motorola/Freescale datasheet - part is non-RoHS. REACH status inherited from base substrate; AEC-Q100 not applicable as this is a microprocessor. Verify halogen/declarations on a per-vendor basis during sourcing.
