MPC8245ARZU400D - PowerPC 603e MPU, 400MHz, 352-TBGA | NXP
Référence : MPC8245ARZU400D ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $178.5 | $178,50 |
| 10 | $162.3 | $1 623,00 |
| 100 | $145.75 | $14 575,00 |
| 500 | $132.4 | $66 200,00 |
| 1 000 | $119.95 | $119 950,00 |
MPC8245ARZU400D Présentation
An integrated host processor (IHP) is a class of embedded SoC that combines a CPU core, memory controller, peripheral bridges and I/O on a single die. Within the broader taxonomy, the MPC8245 sits below a general-purpose microprocessor and above a microcontroller in integration level: it is a power-managed application-specific processor aimed at networking and storage equipment. The MPC82xx family is the lineage derived from Freescale's PowerQUICC I architecture and later carried under NXP's embedded portfolio.
Key features include a 400 MHz PowerPC 603e core, a 64-bit local bus supporting up to 2 GB of addressable memory, a 32-bit/33 MHz PCI 2.2 interface, integrated DMA, two UARTs, and a 0.25-micron CMOS process operating from a 3.3 V supply. Commercial-grade operating range is 0 C to 85 C, suitable for indoor networking and storage enclosures. According to the NXP part-number specification, the ARZU400D suffix denotes 400 MHz speed, Z = lead-free TBGA, U = tray packaging, and D = commercial temperature range.
The MPC8245ARZU400D architecture pairs the 603e's dual-issue superscalar pipeline with an on-chip memory controller and PCI bridge, eliminating the cost of a discrete north-bridge chip. Memory-side ECC support and parity checking allow reliable operation in long-life-cycle networking gear, while integrated timers and interrupt logic reduce BOM count on the carrier board.
Typical applications include PCI-based networking infrastructure (routers, switches, DSLAM line cards), RAID/HBA storage controllers, industrial control boards requiring PCI expansion, and embedded printers or imaging peripherals. The integrated host-processor design cuts component count versus a CPU-plus-discrete-chipset solution.
When designing with this part, allocate PCB area for the 35x35 mm TBGA and follow the NXP reference layout for the memory and PCI buses; signal integrity on the 64-bit local bus dominates layout effort. Designers should also evaluate newer MPC83xx/MPC85xx parts for new designs since the MPC8245 line is in end-of-life status.
This page synthesizes distributor stock, lead-time, and cross-reference data together with practical thermal and PCB layout notes that are not collected in a single location on the NXP datasheet.
Alternatives de remplacement direct pour MPC8245ARZU400D — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8245ARZU400D (même facteur de forme et même empreinte) — différant par PCI Interface, Package, RoHS Status, Series, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8245ARZU466D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8245ARZU300D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8245AZU400D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8245TZU400D
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8245VRZU400D
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC8245ARZU400D Valeurs maximales et caractéristiques électriques
| Core Architecture | PowerPC 603e |
| Core Count | 1 |
| Largeur du bus de données | 32-bit (PowerPC), 64-bit (system/local bus) |
| Fréquence d'horloge maximale | 400 MHz |
| Series | MPC82xx |
| Tension d'alimentation | 3.3 V |
| Process Technology | 0.25 micron CMOS |
| Plage de température de fonctionnement | 0 C to +85 C (commercial) |
| PCI Interface | PCI 2.2, 32-bit, 33 MHz |
| Integrated Peripherals | DMA, 2x UART, memory controller, PCI bridge |
| Boîtier | 352-TBGA (35x35) |
| Type de montage | Surface Mount |
| Packaging | Tray (U suffix) |
| Statut RoHS | Compliant (lead-free Z suffix) |
| Part Number Suffix Decode | ARZU400D = 400 MHz, Z lead-free, U tray, D commercial temp |
Guide de configuration des broches du MPC8245ARZU400D 352-tbga (35x35)
Configuration des broches du MPC8245ARZU400D (boîtier 352-tbga (35x35)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8245ARZU400D.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8245ARZU400D convient pour 6 applications: PCI Networking Infrastructure, RAID / HBA Storage Controllers, Industrial PCI Expansion Boards, Embedded Printers and Imaging Peripherals, DSLAM Line Cards, Single-Board Computers (SBC).
PCI Networking Infrastructure
The MPC8245ARZU400D fits PCI networking line cards because its integrated PCI 2.2 bridge at 33 MHz removes the need for an external north-bridge ASIC, while the 400 MHz PowerPC 603e core handles routing-table lookups and packet classification at line-rate. The 64-bit local bus sustains burst DMA transfers to SDRAM with ECC protection, which is essential for sustained packet buffering at gigabit rates. Designers typically place the part on a custom PCI add-in card or a line-card daughter board and connect the 33 MHz PCI bus to a downstream Ethernet MAC such as the NXP BCM5464 PHY family. The 0 to 85 C commercial temperature range suits indoor rack chassis with forced-air cooling.
Recommandé
RAID / HBA Storage Controllers
The MPC8245ARZU400D serves as the I/O controller CPU in RAID and HBA cards because its PowerPC 603e core combined with integrated PCI bridge supports firmware-driven disk-array management without an external bridge chip. ECC on the local memory bus protects against soft errors in always-on storage equipment, while the 64-bit bus sustains DMA to host memory at peak PCI 132 MB/s rates. The part drives SATA or SCSI phys via downstream PCI controller chips, and the commercial 0 to 85 C range fits server backplanes. Thermal design must keep the 35x35 mm TBGA below 110 C junction in the card's airflow envelope.
Recommandé
Industrial PCI Expansion Boards
Industrial automation chassis use the MPC8245ARZU400D as the host CPU on PCI-104 or CompactPCI peripheral boards, where its integrated bridge reduces BOM and the 400 MHz core handles deterministic control loops. The on-chip DMA engine offloads bulk data movement from the CPU, freeing the PowerPC 603e to run real-time control code. Designers benefit from the lead-free TBGA (Z suffix) for RoHS-compliant industrial products and from the 64-bit ECC memory controller for unattended operation. The commercial 0 to 85 C temperature grade aligns with most factory-floor enclosure specifications when paired with active cooling.
Recommandé
Embedded Printers and Imaging Peripherals
High-end networked printers and multi-function imaging devices use the MPC8245ARZU400D as the embedded host because its PowerPC core can run the rendering pipeline while the integrated PCI bridge drives scanner, fax, and network controller ASICs. The 400 MHz clock and 64-bit SDRAM interface sustain per-page render buffering, and the on-chip DMA channels move compressed image data without burdening the CPU. Lead-free solder and the commercial temperature range suit office-equipment deployments. Compared with a discrete CPU-plus-chipset, the integrated host processor shrinks the main board by tens of square centimeters in a cost-sensitive printer design.
Recommandé
DSLAM Line Cards
DSL access multiplexer line cards historically used the MPC8245ARZU400D as the control-plane processor because its integrated PCI and memory bridge cut the BOM cost per line-card slot, while the PowerPC 603e at 400 MHz handled xDSL link-layer state machines and OAM processing. The 64-bit local bus with ECC meets carrier-grade reliability targets and the 0 to 85 C range covers central-office ambient. The part interfaces to T1/E1 or ADSL framer chips via PCI. New deployments should evaluate the PowerQUICC II MPC8272 successor family, but existing installed DSLAMs continue to use this part for spares and last-time-buy replacement.
Recommandé
Single-Board Computers (SBC)
SBC platforms for industrial and medical OEMs use the MPC8245ARZU400D as the main processor because its 400 MHz core plus integrated bridge enables a complete PCI-based system on a single board, eliminating the cost and complexity of a north-bridge ASIC. The 64-bit local bus supports up to 2 GB of addressable memory, sufficient for Linux and VxWorks embedded deployments. Lead-free TBGA packaging aligns with RoHS-compliant OEM builds, and the commercial temperature range covers most indoor and lightly-controlled industrial environments. The part pairs naturally with PCI-based Ethernet, SCSI, or video capture peripherals in a single SBC slot.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8245ARZU400D — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8245ARZU466D | MPC8245ARZU300D | MPC8245AZU400D | MPC8245TZU400D | MPC8245VRZU400D |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35x35) | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same |
| Core Clock Frequency | 400 MHz | 466 MHz | 300 MHz | 400 MHz | 400 MHz | 400 MHz |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature Range | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) |
| Process Technology | 0.25 micron CMOS | 0.25 micron CMOS | 0.25 micron CMOS | 0.25 micron CMOS | 0.25 micron CMOS | 0.25 micron CMOS |
| PCI Interface | PCI 2.2, 32-bit, 33 MHz | PCI 2.2, 32-bit, 33 MHz | PCI 2.2, 32-bit, 33 MHz | PCI 2.2, 32-bit, 33 MHz | PCI 2.2, 32-bit, 33 MHz | PCI 2.2, 32-bit, 33 MHz |
| RoHS Status | Compliant (lead-free Z) | Compliant (lead-free Z) | Compliant (lead-free Z) | Compliant (lead-free Z) | Compliant (lead-free Z) | Compliant (lead-free Z) |
Principaux différenciateurs
- Pin-compatible higher-frequency upgrade path (vs MPC8245ARZU466D)
- Identical silicon, alternative revision code (vs MPC8245AZU400D)
- Lower-power pin-compatible option (vs MPC8245ARZU300D)
- Note: not all MPC82xx are drop-in (vs MPC8248CVRTIEA)
Notes de conception
The 352-TBGA package at 35x35 mm demands a high-density PCB stack-up, typically 6 to 8 layers with microvia-in-pad construction. Fan-out the 64-bit local memory bus on the top layers with length-matched impedance-controlled traces; route the 33 MHz PCI bus on inner stripline layers. Use the NXP reference layout for the TBGA escape pattern and place a continuous thermal copper plane under the BGA with thermal via arrays at the ball grid to conduct heat into the inner-plane copper.
Estimated: at core VDD = 1.8 V (internal), 400 MHz, with a typical PowerPC 603e core power dissipation on the order of 1.5 W and additional bridge/uncore power around 1 W, total package dissipation is roughly 2.5 W. With junction-to-ambient thermal resistance on a 35x35 mm TBGA around 15 C/W on a 4-layer PCB, the junction rises approximately 37 C above ambient. For enclosed chassis with limited airflow, add a heatsink or specify a higher-layer-count PCB to drop theta_JA below 10 C/W. Always validate against the NXP datasheet junction-to-ambient figures for the specific PCB stack-up.
Do not assume the MPC8245 line is in full production: it is in EOL status per NXP's discontinuance notice. Place last-time-buy orders well in advance of the formal discontinuance date and qualify a second source from the MPC8245ARZU466D or MPC8245ARZU300D variants which share the same package and pinout. When migrating to a new design, do not select the MPC8248 family or MPC8270 family as drop-ins: both require PCB rework. Validate pinout against the NXP datasheet mechanical drawing before substituting.
Differential pair routing and length matching dominate layout effort on the 64-bit local bus. Use series-stitched decoupling (one 0.1 uF X7R per power pin pair) placed as close to the BGA balls as the microvia stack permits. Keep the 33 MHz PCI clock trace at 50 ohm controlled impedance and isolate it from the memory bus. The NXP MPC8245 hardware specifications document (Order No. MPC8245EC) provides reference schematics and layout checklists that should be followed verbatim for first-pass success.
Informations de conformité
RoHS compliance indicated by the 'Z' suffix (lead-free TBGA per NXP part-number specification). REACH, halogen-free and conflict-minerals status not published in the verified web data; AEC-Q100 is not applicable for a commercial-grade integrated host processor.
