MPC8270CZQMIBA - PowerQUICC II MPU, 266MHz, BGA-516 | NXP
Référence : MPC8270CZQMIBA ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.4 | $724,00 |
| 100 | $65.9 | $6 590,00 |
| 500 | $58.2 | $29 100,00 |
| 1 000 | $52.85 | $52 850,00 |
MPC8270CZQMIBA Présentation
A communications processor (CP) is a specialized microprocessor that combines a general-purpose CPU with dedicated hardware engines for packet processing, serial interfaces and bus bridging. Within the broader taxonomy, the MPC8270CZQMIBA sits inside the MPU (microprocessor unit) category, which belongs to integrated circuits for embedded control and networking. The PowerQUICC II line evolved from Freescale's earlier PowerQUICC I (MPC860) devices and was later superseded by PowerQUICC III, positioning this part in a mature, well-documented family.
Key features include 266 MHz core speed (process revisions reach up to 333 MHz in the family), 64-bit data bus architecture, integrated PCI 2.2 host/agent controller, USB 1.1 interface, 128-channel HDLC engine, 10/100 Ethernet MAC, and 1.5 V core supply with 3.3 V I/O. The HiPerMOS7 0.13-micron CMOS process lowers power dissipation versus its 0.18-micron predecessors while preserving binary compatibility with the earlier MPC8260/MPC8270 generations.
Architecturally, the device uses a dual-engine design: a PowerPC core running the operating system and control plane, while the CPM (Communications Processor Module) handles DMA-driven serial protocols independently. This separation enables line-rate processing on multiple TDM, Ethernet and PCI channels without burdening the CPU.
Typical applications include telecom line cards, DSLAMs, router control planes, industrial Ethernet bridges, VoIP gateways and cellular base station control boards. Designers select it where deterministic multi-channel serial throughput, PCI-based expansion, and long-term software reuse across PowerQUICC generations are required.
When selecting peripherals, ensure the host system provides the 1.5 V core regulator and the 3.3 V I/O rail required by the HiPerMOS7 process. PCB layout must allocate adequate BGA breakout routing and decoupling, and the JTAG/BDM interface should be brought out for production test.
This page synthesizes distributor pricing, last-time-buy availability, and a curated set of same-family drop-in alternatives not consolidated on a single manufacturer datasheet.
Alternatives de remplacement direct pour MPC8270CZQMIBA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC8270CZQMIBA (même facteur de forme et même empreinte) — différant par Process Technology, Core Architecture, Memory Controller, Package, Package Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC8270CVRMIBA
✅ Remplacement direct✓ En stock
$88.75 / unité
Voir la fiche technique →MPC8270ZQMIBA
✅ Remplacement direct✓ En stock
$54.25 / unité
Voir la fiche technique →MPC8275CZQMIBA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8280CZQMIB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC8280VVUPEA
✅ Remplacement direct✓ En stock
$102.3 / unité
Voir la fiche technique →MPC8270CZQMIBA Valeurs maximales et caractéristiques électriques
| Architecture | PowerPC G2_LE (PowerQUICC II) |
| Core Count | 1 |
| Largeur du bus de données | 64-bit |
| Core Clock Speed | 266 MHz (family up to 333 MHz) |
| Supply Voltage (Core) | 1.5 V |
| I/O Voltage | 3.3 V |
| Température de fonctionnement | -40 C to +105 C |
| Package Type | PBGA, 27 x 27 mm, 2.25 mm height, 1.0 mm pitch |
| Nombre de broches | 516 |
| Process Technology | HiPerMOS7 0.13-micron CMOS |
| Integrated Peripherals | PCI, USB, HDLC (128 ch), 10/100 Ethernet, UART |
| Memory Controller | Integrated SDRAM, Flash, ROM support |
| Type de montage | Surface Mount (BGA) |
| Lead Free | Yes (per datasheet) |
| Statut RoHS | Compliant |
Guide de configuration des broches du MPC8270CZQMIBA pbga, 27 x 27 mm, 2.25 mm height, 1.0 mm pitch
Configuration des broches du MPC8270CZQMIBA (boîtier pbga, 27 x 27 mm, 2.25 mm height, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC8270CZQMIBA.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC8270CZQMIBA convient pour 6 applications: Telecom Line Card Processing, DSLAM Control Plane, Router Control Plane, VoIP Gateway, Industrial Ethernet Bridge, Cellular Base Station Controller Board.
Telecom Line Card Processing
The MPC8270CZQMIBA integrates a PowerPC core and a CPM (Communications Processor Module) that together drive 128 HDLC channels, a 10/100 Ethernet MAC, USB 1.1, and a PCI 2.2 bus, suiting it for telecom line cards on legacy and installed DSLAM shelves. Its 266 MHz clock and 64-bit external memory bus handle aggregation of multiple E1/T1 framing streams without saturating the CPU, while the HiPerMOS7 0.13-micron process keeps junction rise safe in a fanless -40 C to +105 C industrial chassis. The 516-PBGA footprint supports dense backplane designs where routing budget is critical. Place decoupling caps inside the BGA keep-out, route the 64-bit memory bus with matched-length groups, and use the JTAG port for boundary-scan test on production units.
Recommandé
DSLAM Control Plane
Inside a DSLAM shelf, the MPC8270CZQMIBA acts as the control-plane supervisor, offloading ATM/HDLC aggregation from the central switch fabric. Its integrated PCI 2.2 controller bridges to backplane switch ASICs while the 10/100 Ethernet MAC terminates management traffic to the element manager. The PowerPC core runs the embedded RTOS and fault-management daemon, while the CPM services time-critical layer-1 framing. The 516-PBGA's 1.0 mm pitch suits high-density backplane cards, and the industrial temperature rating suits outdoor cabinet deployments. Recommend sequencing the 1.5 V core rail before the 3.3 V I/O rail to avoid latch-up in the HiPerMOS7 I/O cells.
Recommandé
Router Control Plane
For mid-range routers, the MPC8270CZQMIBA hosts the routing table database, the forwarding exception path, and management interfaces. Its PowerPC G2_LE core sustains 266 MHz with 64-bit memory bandwidth sufficient for route-table lookups, while the integrated PCI bus connects to forwarding engines and crypto accelerators. The 10/100 Ethernet MAC transports out-of-band management traffic. The BGA-516 package and industrial temperature range suit compact, fanless router chassis. Designers should isolate the PCI bus with a high-speed buffer if loading exceeds the 5-device slot budget, and verify power dissipation with the thermal model in the hardware specification.
Recommandé
VoIP Gateway
The MPC8270CZQMIBA's 128-channel HDLC engine and integrated Ethernet MAC make it well-suited for small and mid-scale VoIP gateway control processing. It aggregates signaling from T1/E1 spans, performs call-setup via the PowerPC core, and bridges RTP streams to the IP backbone over the 10/100 MAC. A USB 1.1 interface supports local diagnostics and console access. The HiPerMOS7 process keeps the part below 3 W typical dissipation, enabling compact, fanless gateway enclosures. Use the integrated memory controller with 64-bit SDRAM to maintain deterministic jitter under multi-channel load.
Recommandé
Industrial Ethernet Bridge
Industrial Ethernet bridges benefit from the MPC8270CZQMIBA's 10/100 MAC, robust peripheral mix, and industrial -40 C to +105 C temperature grade. The PowerPC core runs bridging and ring-protection protocols (e.g., proprietary industrial protocols), while the CPM handles real-time serial side-channels. The 516-PBGA provides the density needed for ring-network modules and the ruggedness required for DIN-rail enclosures. Use the JTAG for in-system test and boundary-scan across multi-card bridges, and pair the device with industrial-grade SDRAM specified for the same thermal envelope.
Recommandé
Cellular Base Station Controller Board
Base-station controller boards (BSC/BCP) historically used the PowerQUICC II family for backhaul processing. The MPC8270CZQMIBA's 64-bit memory bus and CPM offload E1/T1 aggregation, while the PowerPC core runs the layer-2/3 control stack. PCI bridges connect to channel cards, and USB serves as local service access. The industrial temperature rating and HiPerMOS7 efficiency suit outdoor cabinet and environmentally-controlled rooms. Power sequencing of the 1.5 V core before 3.3 V I/O is mandatory per the datasheet to prevent CMOS latch-up under cold-crank conditions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC8270CZQMIBA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC8270CVRMIBA | MPC8270ZQMIBA | MPC8275CZQMIBA | MPC8280CZQMIB | MPC8280VVUPEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | PBGA-516 (27x27, 1.0 mm pitch) | PBGA-516 (27x27) - same | PBGA-516 (27x27) - same | PBGA-516 (27x27) - same | PBGA-516 (27x27) - same | PBGA-516 (27x27) - same |
| Architecture | PowerPC G2_LE (PowerQUICC II) | PowerPC G2_LE - same | PowerPC G2_LE - same | PowerPC G2_LE - same | PowerPC G2_LE - same | PowerPC G2_LE - same |
| Process Technology | HiPerMOS7 0.13-micron | HiPerMOS7 0.13-micron - same | HiPerMOS7 0.13-micron - same | HiPerMOS7 0.13-micron - same | HiPerMOS7 0.13-micron - same | HiPerMOS7 0.13-micron - same |
| HDLC Channels | 128 | 128 | 128 | Reduced count | 128+ enhanced | Enhanced, higher throughput |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C (industrial) | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last-time-buy | Last-time-buy / NRND | Last-time-buy | Last-time-buy | Last-time-buy / NRND | Recommended successor |
Principaux différenciateurs
- Last same-package 266 MHz bin within the PowerQUICC II family (vs MPC8270CVRMIBA)
- Full HDLC channel count (128) vs cost-optimized variant (vs MPC8275CZQMIBA)
- Backward-compatible migration path to higher clock options (vs MPC8280VVUPEA / MPC8280CZQMIB)
Notes de conception
The MPC8270CZQMIBA requires a 1.5 V core rail and a separate 3.3 V I/O rail. Power sequencing mandates the 1.5 V core rising before or simultaneously with the 3.3 V I/O to avoid CMOS latch-up in the HiPerMOS7 I/O cells. Use a low-dropout regulator with a 3 A peak current rating to handle CPM burst loads during HDLC channel enable events. Place bulk ceramic capacitors (22 uF X5R minimum) at each BGA power quadrant and add 0.1 uF + 10 nF decoupling pairs within the keep-out.
The 516-PBGA at 1.0 mm pitch requires 4-6 mil-wide traces between balls using microvia or HDI stackup. Match the 64-bit memory bus within +/-50 mils and length-match the DDR-style address/command group separately. Assign the JTAG TAP signals (TCK, TMS, TDI, TDO, TRST) to a dedicated header for boundary-scan production test. Reference the NXP hardware specification section on board layout for escape routing and via-in-pad recommendations.
Estimated: typical power dissipation on a 266 MHz industrial PowerQUICC II with all CPM engines active is in the 2.5-3.5 W range (input values: 1.5 V at ~1.5-2 A core + 3.3 V I/O contribution). Designers migrating to the MPC8280 family must re-validate firmware because the enhanced CPM adds registers and modifies some DMA descriptor formats, even though the pinout is shared. Do not assume 516-PBGA footprint compatibility across all MPC82xx suffixes without checking the package mechanical drawing in the relevant datasheet revision.
At 3 W dissipation and a PBGA-516 with typical theta-JA of 12-15 C/W in still air, the junction rises 36-45 C above ambient; this is safe inside the industrial 105 C ceiling but leaves limited headroom for enclosed chassis. Derate by 1.5x in sealed enclosures and add thermal vias under the central BGA quadrant to spread heat to inner copper layers. In fanless telecom shelves, leave at least 5 mm clearance around the package for natural convection.
Informations de conformité
RoHS compliant and lead-free per NXP datasheet. AEC-Q100 not applicable for this MPU category. Halogen-free status was not present in the verified web data and is marked unknown.
