MPC852TCVR50A - 50MHz PowerQUICC MPU, 256-BGA | NXP
Référence : MPC852TCVR50A ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.75 | $2 875,00 |
| 250 | $25.4 | $6 350,00 |
| 500 | $22.1 | $11 050,00 |
MPC852TCVR50A Présentation
A PowerQUICC microprocessor is a member of the PowerPC embedded family that pairs a CPU core with a dedicated communications engine for offloading packet processing. Conceptually it sits within the broader taxonomy: microprocessor -> embedded processor -> communications processor (PowerQUICC). The CPM, driven by microcoded RISC controllers, executes protocol tasks for serial, Ethernet, and ATM layers while the main core handles control-plane code, allowing deterministic throughput without high host CPU utilization.
Key features of the MPC852TCVR50A include 50 MHz core/CPM operation, 32-bit data path, integrated 10/100-capable Ethernet (10 Mbps Ethernet port), 8 KB unified cache, and DRAM controller support. The device supports industrial-grade temperature operation up to +100C, and exposes PCI, UPM, and GPCM external bus interfaces alongside on-chip CPM serial channels (SCC/SMC) for serial protocol bridging.
Architecturally, the MPC852T pairs an embedded PowerPC core with a CPM built around dedicated RISC serial controllers, achieving deterministic wire-rate serial handling. The part is fabricated on a 0.18 um CMOS process and operates from a 3.3 V I/O supply with separate 1.7 V to 1.9 V core rails typically generated by an external controller; this dual-rail design reduces power dissipation versus single-rail 5 V predecessors.
Typical applications include ISDN router line cards, DSLAM control planes, Ethernet-to-serial bridging, low-end industrial routers, and legacy PBX/VoIP gateway control. The MPC852T's CPM is well suited to SS7 signaling, HDLC/PPP termination, and small-frame packet forwarding.
When designing with this part, pair the 3.3 V and 1.8 V rails with proper sequencing and bulk decoupling per the PowerQUICC reference design, and remember the MPC852TCVR50A is end-of-life per NXP; long-life designs should consider current PowerQUICC III successors with active-roadmap silicon.
This page combines verified distributor pricing, drop-in alternatives from the same MPC8xx family, and engineering design notes that distill practical experience not always obvious from the manufacturer datasheet alone.
Alternatives de remplacement direct pour MPC852TCVR50A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC852TCVR50A (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Core Architecture, Core Frequency, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC852TVR50A
✅ Remplacement direct✓ En stock
$23.9 / unité
Voir la fiche technique →MPC852TCZT66A
✅ Remplacement direct✓ En stock
$49.95 / unité
Voir la fiche technique →MPC852TVR66A
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.4 / unité
Voir la fiche technique →MPC852TZVR66A
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC850DEZQ50BU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC852TCVR50A Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | MPC8xx (PowerQUICC) |
| Core Processor | MPC8xx Power Architecture |
| Number of Cores | 1 core, 32-bit |
| Core Frequency | 50 MHz |
| Co-Processors/DSP | Communications; CPM |
| RAM Controllers | DRAM |
| Graphics Acceleration | No |
| Ethernet | 10 Mbps (1 channel) |
| SATA / USB | None on-chip |
| Tension d'alimentation de fonctionnement | 3.3 V |
| Core Voltage | 1.7 V to 1.9 V |
| Température de fonctionnement | -40C to +100C |
| Boîtier | 256-PBGA (23 mm x 23 mm) |
| Type de montage | Surface Mount |
| Part Status (NXP) | End of Life - Discontinued |
Guide de configuration des broches du MPC852TCVR50A 256-pbga (23 mm x 23 mm)
Configuration des broches du MPC852TCVR50A (boîtier 256-pbga (23 mm x 23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC852TCVR50A.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC852TCVR50A convient pour 6 applications: ISDN Router Line Card Controller, DSLAM Control Plane Module, Industrial Ethernet-to-Serial Bridge, Low-End VoIP Gateway Control, PBX Backplane Controller, Serial Protocol Concentrator.
ISDN Router Line Card Controller
The MPC852TCVR50A's integrated CPM handles HDLC framing, multi-channel E1/T1 termination, and 10 Mbps Ethernet bridging for ISDN router line cards. Its 50 MHz PowerPC core runs management-plane routing protocols at wire rate without overloading the CPU, while 8 KB cache and DRAM controller interface to external SDRAM for routing tables. The 256-PBGA package supports the dense PCB layout needed for multi-line shelves where 16-32 line cards stack into a backplane chassis, and the industrial -40C to +100C rating handles non-conditioned central office environments.
Recommandé
DSLAM Control Plane Module
DSL Access Multiplexers (DSLAMs) require a deterministic control plane to manage subscriber provisioning, OAM&P, and backhaul Ethernet aggregation. The MPC852TCVR50A's CPM offloads ATM/DSL framing from the host CPU while the PowerPC core runs SNMP/HTTP management stacks. The integrated 10 Mbps Ethernet MAC provides the bridge to the upstream aggregation switch, and the DRAM controller supports the subscriber management table structures typical in mid-sized DSLAMs.
Recommandé
Industrial Ethernet-to-Serial Bridge
Factory automation gateways that bridge Ethernet to RS-485/RS-232 device networks benefit from the MPC852TCVR50A's SCC/SMC serial channels combined with Ethernet MAC. The CPM's RISC controllers handle poll-response protocols like Modbus RTU without host CPU intervention, while the 50 MHz core runs Modbus TCP and EtherNet/IP gateway logic. Industrial -40C to +100C temperature support allows deployment on factory floors without extra thermal conditioning.
Recommandé
Low-End VoIP Gateway Control
Small-business VoIP gateways need a low-cost controller handling signaling protocols such as H.248, MGCP, or SIP alongside the voice DSP subsystem. The MPC852TCVR50A delivers CPM-based SS7/ISDN signaling termination while the main core runs the SIP user agent and DHCP/NAT functionality. The 256-PBGA fits within compact PBX form factors, and the dual-rail 3.3 V/1.8 V design keeps total board power under 5 W - well within small-office thermal envelopes.
Recommandé
PBX Backplane Controller
Legacy PBX backplanes needing deterministic TDM-to-packet bridging benefit from the MPC852TCVR50A's combination of SCC channels, PCM highway interface, and PowerPC core. The CPM handles H.100/H.110 TDM bus timeslot management at zero host CPU load, while DRAM controller support lets the on-board call-processing database fit in external SDRAM. The 256-PBGA footprint allows drop-in placement on legacy PBX line card PCBs that conform to the MPC8xx family.
Recommandé
Serial Protocol Concentrator
Industrial protocol concentrators aggregating multiple serial lines into a single Ethernet uplink use the MPC852TCVR50A's multi-SCC architecture to handle numerous HDLC or async streams in parallel. The CPM's RISC-based serial controllers offload frame-by-frame parsing while the 50 MHz core runs concentration logic. The industrial -40C to +100C rating and PBGA package meet the ruggedization needs of sub-station and roadside cabinet deployments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC852TCVR50A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC852TVR50A | MPC852TCZT66A | MPC852TVR66A | MPC852TZVR66A | MPC850DEZQ50BU |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Core Speed | 50 MHz | 50 MHz | 66 MHz | 66 MHz | 66 MHz | 50 MHz |
| Operating Temperature | -40C to +100C (industrial) | 0C to +70C (commercial) | -40C to +100C (industrial) | 0C to +70C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Core Processor | MPC8xx Power Architecture | MPC8xx Power Architecture | MPC8xx Power Architecture | MPC8xx Power Architecture | MPC8xx Power Architecture | MPC8xx Power Architecture |
| Ethernet | 10 Mbps (1 channel) | 10 Mbps (1 channel) | 10 Mbps (1 channel) | 10 Mbps (1 channel) | 10 Mbps (1 channel) | 10 Mbps (1 channel) |
| RAM Controllers | DRAM | DRAM | DRAM | DRAM | DRAM | DRAM |
| Operating Supply Voltage | 3.3 V I/O + 1.7-1.9 V core | 3.3 V I/O + 1.7-1.9 V core | 3.3 V I/O + 1.7-1.9 V core | 3.3 V I/O + 1.7-1.9 V core | 3.3 V I/O + 1.7-1.9 V core | 3.3 V I/O + 1.7-1.9 V core |
Principaux différenciateurs
- Industrial temperature grade with same silicon (vs MPC852TVR50A)
- Higher throughput option with same footprint (vs MPC852TCZT66A)
- Same MPC852T silicon die across all variants (vs MPC850 family)
Notes de conception
The MPC852TCVR50A requires a dual-rail supply (3.3 V I/O plus a separate 1.7 V to 1.9 V core rail), and both rails must be sequenced with the 3.3 V rail reaching regulation before the core rail to prevent internal latch-up of the ESD structures. Designers commonly pair the part with an NXP MC13777 or similar dual-rail controller; the reference design provides bulk-decoupling C_in and C_core placement guidance. Hold time for the POR signals must respect PowerQUICC datasheet limits - typically 100us minimum after both rails settle.
Although the 256-PBGA package has reasonable thermal mass, operation at the upper industrial-temperature limit +100C with 50 MHz continuous activity pushes junction temperature into ranges that require PCB thermal relief. Estimate (based on datasheet typical I/O power): I/O rail current around 350 mA at 50 MHz driving 60 pF loads, plus core around 320 mA at 1.8 V, for a total power near 1.1 W. Use at least a 4-layer PCB with a continuous ground plane beneath the BGA to spread heat, and consider 6-layer constructions if the system chassis has limited airflow.
The 256-PBGA (23x23 mm) requires precise PCB solder-mask defined (SMD) pads or NSMD pads depending on assembly house preference. Use 0.5 mm pitch via-in-pad micro-via structures on a 4-layer stack-up to route inner balls out cleanly. Place 100 nF decoupling within 5 mm of every power pin, plus bulk 10 uF/22 uF tantalum/poly caps near the center of the BGA ghost plane. The PowerQUICC Hardware Specifications manual provides specific high-speed bus routing rules - SDRAM traces should be length-matched within 0.5 inches across the byte lanes.
The PCI interface and DRAM bus on the MPC852TCVR50A both operate at full 50 MHz edges with significant harmonic content. Series-damping resistors (typically 22-33 ohm) at the PCI segment source-reference clock buffer help damp reflection on slot-based implementations. For SDRAM interface, keep all DQ/DQS trace lengths within the timing-budget window defined in the MPC852T datasheet - typically 1 inch (25 mm) max length from BGA to SDRAM paddle with the clock trace stretched by 0.5 inch to account for the SDRAM's internal delay.
When migrating from legacy Freescale tooling, remember the JTAG TAP expects 5 V tolerant signals - new designs must include a 5 V-tolerant JTAG buffer or rely on a 3.3 V-only JTAG probe. The CPM's serial channel configuration is volatile across reset - the boot ROM area must initialize SCC/SMC pins before handing control to the application, or the system will appear to hang on first power-up. Industrial designers should also enable the on-chip thermal monitoring junction sensor and validate against the +100C industrial-temp ceiling rather than relying on commercial-temp power estimates.
Informations de conformité
Specific RoHS/REACH status was not provided in the verified web data for the legacy MPC852T family. Compliance fields are marked unknown per the data authenticity rules. Designers should obtain the latest material-declaration document from NXP for compliance confirmation.
