MPC852TVR50A - PowerQUICC 32-Bit MPU, 50 MHz, 256-PBGA | NXP
Référence : MPC852TVR50A ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2 980,00 |
| 500 | $26.5 | $13 250,00 |
| 1 000 | $23.9 | $23 900,00 |
MPC852TVR50A Présentation
A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, register set, and memory interfaces of a computer's central processing unit on a single chip. In the broader hierarchy, the MPC852TVR50A belongs to the category of embedded microprocessors, which sit above microcontrollers in complexity and above DSPs in general-purpose programmability. The PowerQUICC family specifically targets telecom and networking infrastructure where deterministic communication processing offloads work from the main CPU.
Key features include a 50 MHz core frequency, integrated CPM with Ethernet and HDLC support, and 16 KB unified instruction/data cache. The device integrates peripherals such as UARTs, timers, and parallel I/O, reducing the need for external components on the system board. It operates from a 3.3 V supply and supports a 0 to 95 C industrial temperature range, suitable for central office and edge networking equipment.
The architecture combines a Power Architecture core with a separate RISC-based CPM that handles serial protocols independently, freeing the main core for higher-layer processing. This dual-processor design delivers superior performance over single-core architectures in networking-intensive tasks such as Fast Ethernet bridging, PPP termination, and HDLC/SDLC processing.
Typical applications include Ethernet-to-Ethernet line cards, ISDN router interfaces, T1/E1 framer controllers, industrial protocol bridges, and low-end networking gateways. The integrated CPM makes it particularly efficient for multi-port serial and packet processing.
When designing, ensure PCB layout follows PBGA thermal and signal-integrity guidelines, including multiple ground vias under the thermal pad and matched impedance for Ethernet traces. Note that this part is marked EOL by NXP—last-time-buy planning should align with your product lifecycle needs.
This page synthesizes distributor pricing, drop-in alternatives, and lifecycle status not consolidated on the manufacturer product page.
Alternatives de remplacement direct pour MPC852TVR50A — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC852TVR50A (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Manufacturer, Series, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC852TVR66A
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →MPC852TCVR50A
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →MPC852TZT50A
✅ Remplacement direct✓ En stock
$13.5 / unité
Voir la fiche technique →MPC850SRZQ50BU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC855TVR80D4
✅ Remplacement direct✓ En stock
$64.5 / unité
Voir la fiche technique →MPC852TVR50A Valeurs maximales et caractéristiques électriques
| Processor Series | MPC8xx PowerQUICC |
| Core | MPC8xx, 1 Core |
| Largeur du bus de données | 32 bit |
| Fréquence d'horloge maximale | 50 MHz |
| Tension d'alimentation de fonctionnement | 3.3 V |
| Boîtier | 256-PBGA (23x23 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 C to +95 C |
| Instruction/Data Cache | 16 KB unified |
| Communications Processor Module | Integrated (CPM with Ethernet, HDLC, UART) |
| On-Chip Peripherals | UART, Timers, Parallel I/O, SCC |
| Lifecycle | End of Life / Last Time Buy (per NXP product page) |
Guide de configuration des broches du MPC852TVR50A 256-pbga (23x23 mm)
Configuration des broches du MPC852TVR50A (boîtier 256-pbga (23x23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC852TVR50A.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC852TVR50A convient pour 6 applications: Ethernet-to-Ethernet Line Card, ISDN Router / Gateway Interface, T1/E1 Framer Controller, Industrial Protocol Bridge, Low-End Networking Gateway, POS Terminal Backplane Controller.
Ethernet-to-Ethernet Line Card
The MPC852TVR50A is purpose-built for Ethernet line cards in telecom and enterprise networking gear. Its integrated Communications Processor Module (CPM) handles 10/100 Ethernet MAC on multiple SCC channels independently of the Power Architecture core, freeing the host CPU for higher-layer bridging and routing logic. At 50 MHz the CPM sustains multiple Fast Ethernet ports without external MAC silicon, reducing BOM cost. The 256-PBGA package exposes all required MII/RMII signals and supports glueless PHY interface. Designers should add proper magnetics and follow the NXP reference design for PHY strap and clock-routing guidance.
Recommandé
ISDN Router / Gateway Interface
Small-office ISDN routers and SOHO gateways benefit from the MPC852TVR50A's integrated HDLC support, which offloads PPP framing and ISDN D-channel processing. The on-chip CPM SCCs terminate multiple ISDN BRI links without external protocol chips, and the 50 MHz Power Architecture core runs the IP routing stack. Compared to discrete CPU-plus-comm-controller designs, the single-chip integration shrinks PCB area and power. The 0 to +95 C operating range supports indoor central-office deployment, and the 3.3 V supply simplifies power tree design.
Recommandé
T1/E1 Framer Controller
In T1/E1 framer and multiplexer designs the MPC852TVR50A's HDLC-capable SCCs terminate multiple 1.544 Mbps or 2.048 Mbps links while the core handles framing and channelized data aggregation. The CPM's bit-rate capabilities match T1/E1 payloads exactly, eliminating external framer silicon. The 256-PBGA package supports all required TDM clocking pins for backplane synchronization. For higher-density designs the MPC852TVR66A at 66 MHz adds headroom for multi-link aggregation.
Recommandé
Industrial Protocol Bridge
Industrial protocol bridges—such as EtherNet/IP to Modbus TCP gateways—leverage the MPC852TVR50A's mix of Ethernet MACs and UART/SCC peripherals for fieldbus connectivity. The 50 MHz core is sufficient for protocol translation in mid-density PLCs and remote terminal units. The 0 to +95 C industrial temperature range supports factory-floor enclosures. For outdoor or harsher deployments consider the extended-temperature variants from NXP or migrate to the PowerQUICC II MPC82xx family. The integrated peripherals remove the need for external UART chips, cutting system cost.
Recommandé
Low-End Networking Gateway
Low-end networking gateways such as DSL/cable routers, VPN concentrators, and small-firewall appliances use the MPC852TVR50A as the main processor. The 50 MHz Power Architecture core runs embedded Linux or VxWorks, while the CPM handles WAN-side serial and Ethernet traffic deterministically. The 256-PBGA package provides enough I/O for USB, Ethernet, and serial ports. The integrated 16 KB cache keeps memory latency low for packet-processing workloads. For next-generation designs requiring higher throughput, the MPC852TVR66A at 66 MHz is a pin-compatible upgrade.
Recommandé
POS Terminal Backplane Controller
POS (Packet-over-SONET/SDH) terminal backplanes use the MPC852TVR50A's CPM to terminate HDLC channels carrying POS traffic at 51.84 Mbps or 155 Mbps aggregate rates. The Power Architecture core performs overhead processing and alarm management. The 256-PBGA package provides dedicated TDM and clock pins required for backplane synchronization. Although the part is marked Last Time Buy, existing telecom infrastructure continues to rely on it. Long-term, NXP recommends the PowerQUICC II / PowerQUICC III families for new POS designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC852TVR50A — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC852TVR66A | MPC852TCVR50A | MPC852TZT50A | MPC859DSLCVR50A | MPC850SRZQ50BU | MPC855TVR80D4 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 357-PBGA (25x25 mm) - larger | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Maximum Clock Frequency | 50 MHz | 66 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 80 MHz |
| Core Architecture | PowerQUICC (MPC8xx) | PowerQUICC (MPC8xx) | PowerQUICC (MPC8xx) | PowerQUICC (MPC8xx) | PowerQUICC (MPC8xx) | PowerQUICC (MPC8xx) | PowerQUICC (MPC8xx) |
| Data Bus Width | 32 bit | 32 bit | 32 bit | 32 bit | 32 bit | 32 bit | 32 bit |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V / 5 V | 3.3 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Pin-compatible 66 MHz drop-in upgrade available within same family (vs MPC852TVR66A)
- Dual-processor CPM offload architecture (vs MPC850SRZQ50BU)
- Compact 256-PBGA package vs larger MPC859 footprint (vs MPC859DSLCVR50A)
Notes de conception
The 256-PBGA package requires a PCB footprint with 1.27 mm pitch solder-ball pads. Add a central thermal/ground pad array and stitch multiple ground vias beneath the BGA for heat dissipation and return-path integrity. Use 4-layer or 6-layer stack-up with continuous ground planes beneath the device to control impedance on Ethernet MII/RMII traces. Reference the NXP PowerQUICC design checklist for via-in-pad recommendations.
The MPC852TVR50A requires a clean 3.3 V core supply plus I/O rail sequencing per the NXP datasheet. Decouple each power pin with a 0.1 uF ceramic placed within 50 mils of the BGA ball. A bulk 47-100 uF tantalum or polymer cap near the device handles CPM transient current when Ethernet ports switch. Power-rail sequencing must match the datasheet's power-on-reset timing to avoid latch-up.
At 50 MHz core with active CPM and Ethernet ports, power dissipation is approximately 1.0-1.5 W. The 256-PBGA package relies on PCB copper pour and the central thermal pad for heat spreading—use at least 4 thermal vias (0.3 mm drill) beneath the thermal pad to inner ground planes. Estimated: junction-to-ambient thermal resistance on a 4-layer 1 oz copper board is approximately 18-22 C/W, giving a junction rise of 18-33 C above 50 C ambient.
Do not assume the MPC852TVR50A is pin-compatible with the MPC859DSLCVR50A - the 859 family uses a larger 357-PBGA (25x25 mm) package. Verify the full datasheet revision before substituting. The part is Last Time Buy, so lock in production quantities now if your design depends on it. New designs should target the PowerQUICC II / MPC82xx family or current LS-series communications processors.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not explicitly stated in the verified web data; consult NXP product page or contact manufacturer for current compliance attestations. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part.