MPC855TZQ80D4 vs MPC860DPZQ80D4 Comparaison

Comparaison détaillée côte à côte de MPC855TZQ80D4 par NXP Semiconductors et MPC860DPZQ80D4 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MPC855TZQ80D4 MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 - PowerQUICC 32-Bit MPU, 80MHz | NXP 357-PBGA

MPC855TZQ80D4 ✗ Fin de vie
NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete

Comparaison des spécifications

Paramètre MPC855TZQ80D4 MPC860DPZQ80D4
Marque NXP Semiconductors NXP Semiconductors
Catégorie Microcontrollers Microcontrollers
Statut du cycle de vie Fin de vie Obsolete
Statut du stock In Stock In Stock
Prix unitaire (USD) $61,40 $13,85
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Type Microprocessor Unit (MPU) —
Series PowerQUICC MPC8xx (MPC855T) —
Core Architecture Power Architecture MPC8xx, 32-bit PowerPC 603-class single core
Core Clock Frequency 80 MHz —
Communication Processor Module (CPM) Integrated RISC engine with FCC/ATM/HDLC —
Ethernet Support 10/100 Mbps Fast Ethernet MAC —
Serial Protocols ATM, HDLC, SS#7 (via CPM) —
PCMCIA Interface Yes (1 or 2 slots) —
Memory Bus Width 32-bit (external) —
Largeur du bus de données 32 bit —
Process Technology 0.32 um CMOS 0.32 um CMOS
Température de fonctionnement 0 °C to +95 °C (commercial 'Z' grade) [DATA_NEEDED: operating temperature range]
Boîtier 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) —
Type de montage Surface Mount, BGA Surface Mount
Statut RoHS Not compliant (SnPb-ball BGA, pre-RoHS generation) Non-Compliant
Lead-Free No (SnPb solder balls) —
Lifecycle Discontinued — see Discontinuance PCN —
Processor Type — MPC8xx PowerQUICC, 32-bit RISC MPU
Maximum Core Clock — 80 MHz
Core Voltage — 2.2 V
I/O Voltage — 3.3 V
Communications Processor Module (CPM) — Integrated 32-bit RISC CPM with SCC/SMC
Serial Communication Controllers (SCC) — Up to 4 channels (Ethernet, HDLC, UART)
Serial Management Controllers (SMC) — 2 channels (UART/SPI/I2C)
Ethernet MAC — 10/100 Mbps Fast Ethernet
DMA Channels — 4 channels
Memory Controller — Integrated, up to 4 DRAM banks
Boîtier / Format — 357-PBGA (25x25 mm)
Packaging — Tray
Lead Status — Contains Lead
Niveau MSL — [DATA_NEEDED: MSL rating]

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