MPC870CVR66 - MPC8xx 66MHz PowerQUICC MPU | NXP Semiconductors
Référence : MPC870CVR66 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 500 | $24.15 | $12 075,00 |
| 1 000 | $21.4 | $21 400,00 |
MPC870CVR66 Présentation
An MPU (Microprocessor Unit) is an integrated circuit that contains a central processing unit together with associated peripherals on a single die. Within the broader taxonomy, an MPU belongs to microprocessors -> embedded processors -> integrated circuits -> semiconductors. PowerQUICC is NXP's (formerly Motorola/Freescale) family of integrated communications processors combining a Power Architecture CPU with system peripherals such as CPM (Communications Processor Module), timers, and memory controllers on a single chip, which historically simplified designs of routers, DSLAMs, and PBX systems.
Key features of the MPC870CVR66 include a 32-bit RISC core, 66 MHz operation, 256-pin PBGA package, integrated CPM for HDLC/SDLC and UART support, and a 3.3 V I/O supply with 1.8 V core voltage. The communications processor module offloads protocol handling from the CPU core, enabling simultaneous data plane and control plane processing, while the integrated memory controller supports DRAM, SRAM, and ROM/Flash. Operating temperature range spans -40C to +100C, qualifying the part for extended-industrial and outdoor telecom deployments.
Typical applications include networking routers and switches, telecommunications switching equipment, industrial control systems, and embedded communications controllers where deterministic protocol handling and Power Architecture software compatibility are essential design requirements.
When designing with the MPC870CVR66, ensure adequate decoupling on both 3.3 V and 1.8 V rails per the MPC875/MPC870 hardware specifications, and verify JTAG chain integrity before firmware bring-up. Designers migrating from older MPC8xx devices should review errata documents for any silicon revisions affecting CPM behavior.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping procurement and engineering teams make informed decisions when sourcing this legacy communications processor.
Alternatives de remplacement direct pour MPC870CVR66 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC870CVR66 (même facteur de forme et même empreinte) — différant par Mounting Type, Manufacturer, Operating Temperature, RoHS Status, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC870CZT66
✅ Remplacement direct✓ En stock
$32.1 / unité
Voir la fiche technique →MPC853TVR66A
✅ Remplacement direct✓ En stock
$31.1 / unité
Voir la fiche technique →MPC875CVR66
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MPC870VR66
✅ Remplacement direct✓ En stock
$25.9 / unité
Voir la fiche technique →MPC870CVR66 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx |
| Core Processor | MPC8xx (Power Architecture, 32-Bit) |
| Number of Cores | 1 |
| Speed | 66 MHz |
| Performance | 87 MIPS |
| Operating Voltage | 3.3 V I/O, 1.8 V core |
| Boîtier / Format | 256-BGA (PBGA, 23 x 23 mm) |
| Température de fonctionnement | -40C to +100C |
| Type de montage | Surface Mount |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
| Packaging | Tray |
| Communications Features | CPM (HDLC/SDLC, UART), Timers |
| Memory Controller | DRAM, SRAM, ROM/Flash support |
Guide de configuration des broches du MPC870CVR66 256-bga (pbga, 23 x 23 mm)
Configuration des broches du MPC870CVR66 (boîtier 256-bga (pbga, 23 x 23 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC870CVR66.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC870CVR66 convient pour 6 applications: Networking Router, Telecommunications Switching Equipment, Industrial Control System, Embedded Communications Controller, DSL Access Multiplexer (DSLAM) Line Card, Legacy Printer and Imaging Controller.
Networking Router
The MPC870CVR66 suits legacy fixed-function routers and branch-office gateways where deterministic HDLC/SDLC frame handling is required. The integrated CPM module offloads protocol encapsulation from the Power Architecture core, freeing CPU cycles for routing table lookups and forwarding-plane processing. At 66 MHz delivering 87 MIPS, the part handles sub-100 Mbps WAN interfaces comfortably, including frame-relay and PPP over Ethernet links. NXP's CPM peripheral provides hardware-accelerated HDLC, UART, and BISYNC channels, dramatically reducing host-core interrupt load in multi-link routers. The 256-BGA package is footprint-compatible with sibling MPC8xx devices, so router OEMs reusing existing PCB layouts can drop in the MPC870CVR66 with minimal hardware rework.
Recommandé
Telecommunications Switching Equipment
The MPC870CVR66 was widely deployed in legacy TDM-based telecom switching systems, including PBX line cards, channel banks, and small-to-medium Central Office switches. Its integrated CPM module provides hardware-accelerated HDLC for SS7 signalling links and T1/E1 framer interfacing, which is critical for legacy PSTN gateway applications. With 87 MIPS at 66 MHz, the part sustains full-duplex T1/E1 channel aggregation without CPU saturation. The -40C to +100C operating range suits outdoor cabinet deployments (e.g., roadside DSLAMs). Designers should pair the MPC870CVR66 with NXP's SCC (Serial Communications Controller) channels and external T1/E1 framer ICs for complete line-card designs.
Recommandé
Industrial Control System
The MPC870CVR66 fits industrial control applications requiring deterministic serial protocol support, including Modbus masters, PROFIBUS DP gateways, and SCADA remote terminal units (RTUs). The CPM's hardware HDLC and UART channels enable precise timing for industrial fieldbus protocols without software jitter. At 87 MIPS, the core executes real-time control loops with cycle times in the sub-millisecond range. The extended -40C to +100C temperature range suits factory-floor, substation, and outdoor industrial installations. Industrial OEMs benefit from the long-term software investment in the PowerQUICC architecture and the extensive third-party RTOS support (VxWorks, Green Hills INTEGRITY, and Linux derivatives for Power Architecture).
Recommandé
Embedded Communications Controller
The MPC870CVR66 serves as the host processor in embedded communications controllers, including serial-port servers, protocol converters, and remote sensor aggregators. Its combination of Power Architecture core and integrated CPM provides a single-chip solution for serial-to-Ethernet bridging applications, eliminating the need for separate protocol co-processors. The 87 MIPS performance level handles multiple simultaneous serial channels running at full T1/E1 rates. The 256-BGA package provides ample I/O for multi-channel serial designs while keeping the PCB footprint compact. Legacy industrial IoT gateways built on this platform continue in field deployment, requiring ongoing spare-parts support.
Recommandé
DSL Access Multiplexer (DSLAM) Line Card
The MPC870CVR66 was a workhorse CPU in legacy DSLAM line cards, where it managed ATM/HDLC backhaul and per-line QoS scheduling. The integrated CPM handles ATM AAL5 segmentation and reassembly offload, which is critical for sustained DSL line-rate aggregation across multiple subscriber ports. At 66 MHz, the part manages 24-48 DSL channels per card depending on line profile. The 256-BGA footprint shares the mechanical envelope with other MPC8xx family members, simplifying card-revision upgrades within the DSLAM chassis. The -40C to +100C operating range suits central-office and outdoor-cabinet DSLAM deployments. Maintenance of installed DSLAM base requires ongoing MPC870CVR66 supply.
Recommandé
Legacy Printer and Imaging Controller
The MPC870CVR66 was deployed in high-speed production-line printer controllers and commercial imaging equipment requiring deterministic DMA-driven data transfer. Its memory controller supports high-bandwidth DRAM access for image rasterization buffers, while the CPM handles parallel-port and serial-channel peripherals common in imaging subsystems. At 87 MIPS the part sustains real-time raster image processor (RIP) workloads at production-printer throughput. The Power Architecture toolchain support (GCC, Wind River, Green Hills) provides a mature software development environment for embedded imaging OEMs. Sourcing through authorized distributors with counterfeit-screening remains essential given the part's NRND status and dwindling authorized inventory.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC870CVR66 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC870CZT66 | MPC853TVR66A | MPC875CVR66 | MPC870VR66 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-BGA (PBGA, 23x23 mm) | 256-BGA (PBGA, 23x23 mm) - same | 256-BGA (PBGA, 23x23 mm) - same | 256-BGA (PBGA, 23x23 mm) - same | 256-BGA (PBGA, 23x23 mm) - same |
| Core Speed | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Performance | 87 MIPS | 87 MIPS | 87 MIPS | 87 MIPS | 87 MIPS |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Core Architecture | Power Architecture (MPC8xx) | Power Architecture (MPC8xx) | Power Architecture (MPC8xx) | Power Architecture (MPC8xx) | Power Architecture (MPC8xx) |
| CPM Channels | Standard CPM (HDLC, UART) | Standard CPM (HDLC, UART) | Enhanced networking peripherals | CPM + 10/100 Ethernet MAC | Standard CPM (HDLC, UART) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Same 256-BGA footprint across MPC8xx family (vs MPC870CZT66)
- Lower peripheral count than MPC875CVR66 (vs MPC875CVR66)
- Proven CPM integration for protocol offload (vs MPC853TVR66A)
Notes de conception
The MPC870CVR66 requires dual voltage rails: 3.3 V for I/O and 1.8 V for the internal core. Per NXP's hardware specification, both rails must reach regulation within the power-sequencing window defined in the datasheet, otherwise internal logic may latch up. Place 10 uF tantalum + 0.1 uF ceramic decoupling on each rail, distributed across the BGA footprint. Bulk capacitance of 100 uF or larger is recommended near the package to suppress transient current spikes during CPM DMA bursts.
At maximum operating conditions (66 MHz, full CPM load, 100C ambient), power dissipation approaches 2 W. The 256-BGA package requires thermal vias to inner copper planes to maintain junction temperature within spec. Design for a theta_JA of approximately 20 C/W with a 4-layer PCB and stitched thermal via array under the exposed die pad. Forced airflow is recommended for sealed enclosures above 85C ambient.
The 256-BGA at 1.27 mm pitch demands 4-layer PCB stack-up with controlled-impedance routing for the external memory bus. Microstrip impedance of 50 ohm single-ended and 100 ohm differential is typical for the address/data bus. Use laser-drilled or mechanically drilled microvias for inner-row BGA breakout; dog-bone fanout with via-in-pad is acceptable when filled and plated per IPC-7095. Maintain 50 mil keep-out under the BGA shadow for via fanout.
Do not confuse the MPC870 with the MPC860 family - the MPC870 lacks the CPM RISC engine present in MPC860. Also, do not assume all MPC8xx derivatives share the same BGA ball map; only the same-family pin-compatible variants (e.g., MPC870, MPC875, MPC850) drop in cleanly. When migrating from older Motorola-branded MPC8xx parts, verify the silicon revision against the latest errata document from NXP.
Informations de conformité
RoHS compliant and Lead Free per NXP product page and Octopart listing. REACH SVHC declaration status to be confirmed with NXP for specific lot date codes. AEC-Q100 not applicable - this is a communications MPU not designed for automotive safety.
