MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP
Référence : MPC870VR66 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.85 | $3 185,00 |
| 500 | $28.4 | $14 200,00 |
| 1 000 | $25.9 | $25 900,00 |
MPC870VR66 Présentation
A microprocessor (MPU) is an integrated circuit containing a full central processing unit, cache, memory controller, and peripheral interfaces on a single die, classified within the hierarchy CPU -> MPU -> embedded processor -> system-on-chip -> semiconductor. The PowerQUICC family combines a PowerPC core with the Communications Processor Module (CPM), enabling efficient handling of serial protocols and DMA alongside general-purpose control code, making the MPC870VR66 well-suited to router line cards, DSLAMs, industrial controllers, and legacy telecom infrastructure.
Key features include a 32-bit PowerPC core at 66 MHz, integrated memory controller supporting DRAM and SRAM, multiple serial communication controllers, DMA channels, timers, and general-purpose I/O. The device integrates the CPM co-processor that offloads communications-intensive processing from the main CPU, and it is specified for the commercial 0C to 95C operating range. Lead-free and RoHS-compliant packaging makes it suitable for modern assembly lines.
Typical applications include 10/100 Mbps Ethernet router line cards, ISDN terminal adapters, industrial serial-to-Ethernet bridges, set-top box controllers, and legacy telecommunications equipment. The integrated CPM allows the device to manage multiple HDLC channels, UART, and Ethernet MAC functions concurrently with the host CPU executing control-plane software.
When designing with the MPC870VR66, ensure proper power decoupling near the BGA balls and follow NXP reference designs for the memory controller timing. The 256-BGA package requires careful PCB layout with adequate via-in-pad or dog-bone fanout to maintain manufacturability with standard 0.8 mm pitch BGA processes.
Alternatives de remplacement direct pour MPC870VR66 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MPC870VR66 (même facteur de forme et même empreinte) — différant par Core Architecture, RoHS Status, Memory Controller, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MPC870CVR66
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →MPC870VR50
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC875VR133
✅ Remplacement direct✓ En stock
$27.9 / unité
Voir la fiche technique →MPC875CZT66
✅ Remplacement direct✓ En stock
$30.2 / unité
Voir la fiche technique →MPC860VR66
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MPC870VR66 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx |
| Core Processor | MPC8xx Power Architecture |
| Core Count | 1 |
| Largeur du bus de données | 32-bit |
| Speed | 66 MHz |
| Performance | 87 MIPS |
| Tension d'alimentation de fonctionnement | 3.3 V |
| Plage de température de fonctionnement | 0C to +95C |
| Boîtier / Format | 256-BGA (PBGA), 23x23 mm |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| Statut RoHS | RoHS Compliant |
| Processor Type | MPC8xx PowerQUICC Communications Processor |
Guide de configuration des broches du MPC870VR66 256-bga (pbga), 23x23 mm
Configuration des broches du MPC870VR66 (boîtier 256-bga (pbga), 23x23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPC870VR66.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPC870VR66 convient pour 6 applications: 10/100 Mbps Ethernet Router Line Cards, ISDN Terminal Adapters and Modems, Industrial Serial-to-Ethernet Bridges, Set-Top Box and Media Controllers, Legacy Telecom Infrastructure, Embedded Control with Communications Offload.
10/100 Mbps Ethernet Router Line Cards
The MPC870VR66's integrated Communications Processor Module (CPM) offloads Ethernet MAC, HDLC, and DMA processing from the 66 MHz PowerPC core, freeing the host CPU to run routing and management software. The 87 MIPS throughput handles wire-speed forwarding on 10/100 Mbps interfaces without an external communications controller, while the 256-PBGA package keeps line-card BOM low. Designers benefit from NXP's reference PowerQUICC designs and the mature U-Boot and VxWorks BSP ecosystem.
Recommandé
ISDN Terminal Adapters and Modems
The MPC870VR66 is well-matched to ISDN terminal adapters where multiple HDLC channels must be managed concurrently with terminal-control software. Its CPM supports up to two SCC channels plus serial DMA, allowing the device to handle ISDN BRI/U interfaces and the host-side control stack on a single chip. The 3.3 V supply simplifies power-tree design in compact CPE enclosures, and the 256-PBGA is mechanically robust for solder assembly.
Recommandé
Industrial Serial-to-Ethernet Bridges
Industrial automation gateways that bridge RS-232/485 serial ports to Ethernet benefit from the MPC870VR66's combination of multiple serial controllers, DMA, and Ethernet MAC in one package. The 66 MHz core runs control-plane web servers and protocol conversion stacks (Modbus TCP, EtherNet/IP) while the CPM handles the real-time serial DMA. The 0C to 95C commercial temperature range suits cabinet-mounted industrial equipment.
Recommandé
Set-Top Box and Media Controllers
Set-top box controllers leverage the MPC870VR66's PowerPC core for user-interface rendering and the CPM for transport-stream demultiplexing and smart-card interfaces. The 87 MIPS throughput is sufficient for SD-resolution menu rendering and MPEG transport handling in cost-sensitive STB designs. The integrated peripheral set eliminates the need for a separate transport IC, reducing PCB area and bill of materials.
Recommandé
Legacy Telecom Infrastructure
Long-life telecom platforms such as TDM cross-connects, channel banks, and central-office line cards continue to use the MPC870VR66 because of its proven reliability, extended temperature screening, and 15+ year NXP product lifecycle commitment. The integrated CPM handles T1/E1 framing and HDLC concentration without an external framer, while the PowerPC core runs OAM software. Designers maintain multi-year product support windows critical to carrier procurement.
Recommandé
Embedded Control with Communications Offload
Embedded systems that combine a control-plane OS with multiple serial peripherals (UART, SPI, I2C) and an Ethernet management port are a strong fit for the MPC870VR66. The CPM handles DMA-driven serial traffic while the host CPU runs real-time control loops on Linux or RTOS. The 3.3 V single-supply operation and 256-PBGA package simplify PCB design in space-limited enclosures such as industrial controllers and building automation gateways.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPC870VR66 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MPC870CVR66 | MPC870VR50 | MPC875VR133 | MPC875CZT66 | MPC860VR66 |
|---|---|---|---|---|---|---|
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 66 MHz | 66 MHz | 50 MHz | 133 MHz | 66 MHz | 66 MHz |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | PowerPC (MPC8xx) | PowerPC (MPC8xx) | PowerPC (MPC8xx) | PowerPC (MPC8xx) | PowerPC (MPC8xx) | PowerPC (MPC8xx) |
| Fast Ethernet Controller | No (standard Ethernet) | No | No | Yes | Yes | No |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- 66 MHz speed grade with full CPM peripheral integration (vs MPC870VR50)
- Integrated CPM offloads communications processing (vs MPC852TVR50A)
- No Fast Ethernet controller overhead for cost-sensitive designs (vs MPC875VR133)
Notes de conception
The MPC870VR66 requires a clean 3.3 V supply with bulk decoupling placed within 25 mm of the BGA balls. Estimated: with core current around 250 mA at 66 MHz and I/O current up to 350 mA, designers should provision at least 1 A of headroom on the 3.3 V regulator. Place 10 uF bulk capacitors near the package corners plus 0.1 uF high-frequency decoupling on every four balls.
The 256-PBGA at 1.27 mm pitch demands dog-bone or via-in-pad fanout on a minimum 4-layer PCB with continuous ground plane beneath the package. Match trace lengths for the memory controller data and address buses to within +/- 2.5 mm (estimated) to avoid setup/hold violations at the SDRAM interface. Refer to the NXP MPC870 hardware specification for the official memory controller routing guidelines.
Estimated: at 66 MHz with 3.3 V supply and typical activity, die power is approximately 0.8 W - 1.2 W depending on CPM utilization. The 256-PBGA theta_JA is in the range of 18-22 C/W on a standard JEDEC 4-layer test board; design copper pours beneath the package to keep junction temperature below 110 C in the 95 C ambient commercial range.
Do not assume the MPC875VR133 is a drop-in replacement for the MPC870VR66 without reviewing the ball map: the 875 adds Fast Ethernet signals on balls that the 870 leaves no-connect. Verify JTAG boundary-scan compatibility and reset configuration word (RCW) settings before substituting, because the 875 boots with a different default RCW.
Informations de conformité
RoHS compliant and lead-free per NXP product page and distributor listings. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable - this is a microprocessor for telecom/industrial, not automotive safety-critical.
