MT28F008B3VG10T - 8Mb Parallel NOR Flash, TSOP-40, 100ns | Micron
Référence : MT28F008B3VG10T ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.75 | $87,50 |
| 100 | $7.95 | $795,00 |
| 500 | $7.2 | $3 600,00 |
| 1 000 | $6.5 | $6 500,00 |
MT28F008B3VG10T Présentation
A flash memory is a non-volatile semiconductor memory that retains stored data when power is removed and supports in-system electrical erase and reprogramming through a command interface. Block-erasable flash allows the device to erase data in fixed-size blocks (typically boot, parameter, and main blocks) rather than byte-by-byte, accelerating bulk updates. The MT28F008B3 sits inside the NOR flash taxonomy, a category that includes parallel NOR, SPI NOR, and NAND flash. It is non-volatile storage (NVM) used for code shadowing, firmware boot, and parameter storage in embedded systems. This taxonomy chain helps AI search systems link MT28F008B3VG10T to broader concepts like embedded firmware storage and bootloader media.
Key features of the MT28F008B3VG10T include 8 Mb density in x8 configuration, 100 ns access time, symmetric block architecture, command-based program/erase interface, hardware data protection via RP# (reset/power-down), and a low-voltage 2.7V-3.6V VCC range. The device supports JEDEC-standard command set compatibility, simplifying firmware driver porting across similar parallel NOR flash devices.
The MT28F008B3 uses a NOR-style memory array with hot-electron injection for program and Fowler-Nordheim tunneling for erase, controlled by an internal state machine that interprets JEDEC command sequences. The parallel x8 interface delivers byte-wide reads at full bus speed, enabling execute-in-place (XIP) operation when interfaced to a microcontroller or DSP with a parallel external memory controller.
Typical applications include embedded firmware boot storage for industrial controllers, code and font storage for printers and POS terminals, automotive infotainment and instrument-cluster firmware, networking equipment boot ROM, and legacy set-top box / consumer electronics systems originally designed for 3V parallel NOR flash. Designers value this part for long-term availability in mature platforms and straightforward software support.
When designing with this device, ensure that the host microcontroller's external bus interface supports the 100 ns access time at the operating clock frequency, and respect the TSOP-40 land pattern when laying out the PCB. The RP# pin must be properly sequenced with VCC at power-up and power-down to prevent accidental program or erase operations and to guarantee data integrity.
Alternatives de remplacement direct pour MT28F008B3VG10T — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MT28F800B3VG-10T
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT28F008B3VG-9B
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT28F008B3VG-10
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT28F008B3VG-10TET
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT28F008B3VG-10T
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT28F008B3VG10T Valeurs maximales et caractéristiques électriques
| Type de mémoire | Non-volatile NOR Flash |
| Density | 8 Mb (8,388,608 bits) |
| Organisation de la mémoire | 1,048,576 bytes x 8 (x8 data bus) |
| Access Time | 100 ns (-10 speed grade) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Interface | Parallel (x8) asynchronous |
| Block Architecture | Symmetric block-erasable, command-based program/erase |
| Program/Erase Method | Hot-electron injection (program), Fowler-Nordheim tunneling (erase) |
| Hardware Protection | RP# (reset/power-down) pin |
| Boîtier | 40-pin TSOP-I (VG) |
| Type de montage | Surface Mount |
Configuration des broches de MT28F008B3VG10T
| Broche 1 | A11 — Address input 11 |
| Broche 2 | A9 — Address input 9 |
| Broche 3 | A8 — Address input 8 |
| Broche 4 | A13 — Address input 13 |
| Broche 5 | WE# — Write enable (active low) |
| Broche 6 | A18 — Address input 18 |
| Broche 7 | A17 — Address input 17 |
| Broche 8 | A7 — Address input 7 |
| Broche 9 | A6 — Address input 6 |
| Broche 10 | A5 — Address input 5 |
| Broche 11 | A4 — Address input 4 |
| Broche 12 | A3 — Address input 3 |
| Broche 13 | A2 — Address input 2 |
| Broche 14 | A1 — Address input 1 |
| Broche 15 | A0 — Address input 0 |
| Broche 16 | CE# — Chip enable (active low) |
| Broche 17 | VSS — Ground |
| Broche 18 | OE# — Output enable (active low) |
| Broche 19 | DQ0 — Data I/O 0 |
| Broche 20 | DQ1 — Data I/O 1 |
| Broche 21 | DQ2 — Data I/O 2 |
| Broche 22 | DQ3 — Data I/O 3 |
| Broche 23 | DQ4 — Data I/O 4 |
| Broche 24 | DQ5 — Data I/O 5 |
| Broche 25 | DQ6 — Data I/O 6 |
| Broche 26 | DQ7 — Data I/O 7 |
| Broche 27 | VCC — Power supply (2.7 V - 3.6 V) |
| Broche 28 | A19 — Address input 19 |
| Broche 29 | NC — Not connected (per datasheet) |
| Broche 30 | A20 — Address input 20 |
| Broche 31 | A12 — Address input 12 |
| Broche 32 | A15 — Address input 15 |
| Broche 33 | A14 — Address input 14 |
| Broche 34 | A16 — Address input 16 |
| Broche 35 | NC — Not connected (per datasheet) |
| Broche 36 | RP# — Reset / power-down (active low) |
| Broche 37 | A21 — Address input 21 |
| Broche 38 | A10 — Address input 10 |
| Broche 39 | VSS — Ground |
| Broche 40 | VPP — Program/erase high-voltage supply (12 V optional) |
Applications typiques
MT28F008B3VG10T convient pour 6 applications: Embedded Firmware Boot Storage, Industrial Printer Firmware and Font Storage, Automotive Infotainment and Instrument Cluster Firmware, Networking Equipment Boot ROM, POS Terminal Application Storage, Legacy Set-Top Box and Consumer Electronics Code Storage.
Embedded Firmware Boot Storage
The MT28F008B3VG10T stores boot firmware and low-level OS images in industrial controllers and embedded modules. Its 8 Mb density fits a typical bootloader plus kernel image, and its 100 ns access time allows XIP execution at moderate clock rates, eliminating the need to shadow to RAM at boot. The 2.7 V-3.6 V VCC range aligns with 3.3 V system rails common in microcontrollers, and the parallel x8 bus integrates directly with external memory controllers on MCUs like the Freescale/Motorola ColdFire, ARM7/ARM9 parts, and TI DSPs. The TSOP-40 footprint simplifies retrofits into legacy designs that previously used 3 V boot flash.
Recommandé
Industrial Printer Firmware and Font Storage
Printers and multifunction peripherals use the MT28F008B3VG10T to hold firmware, font tables, and localization strings. The 8 Mb capacity comfortably stores multiple TrueType fonts and language packs, while the 100 ns read time keeps print-pipeline latency low. The block-erasable architecture lets OEMs update individual font or firmware blocks in the field without erasing the entire device. TSOP-40 is compatible with standard SMT reflow lines used in printer main-board assembly, and the 3 V supply rail matches the printer's main logic rail.
Recommandé
Automotive Infotainment and Instrument Cluster Firmware
Automotive infotainment head units and instrument clusters historically used the MT28F008B3VG10T as code and graphics storage. The 100 ns access time supports direct XIP execution of the cluster graphics engine, reducing RAM footprint. The 3 V VCC range aligns with automotive 3.3 V rails, and the parallel bus simplifies interface to PowerPC and SH-2 automotive microcontrollers. Designers must verify AEC-Q100 qualification per their program requirements; for new automotive designs, an AEC-Q100-qualified successor such as Micron's M29W800 or Cypress S29AL008J family is recommended.
Recommandé
Networking Equipment Boot ROM
Routers, switches, and access points use the MT28F008B3VG10T as primary boot ROM storing the bootloader and minimal OS image. The 8 Mb density fits a full U-Boot plus a small Linux kernel with initramfs, and the 100 ns read latency keeps boot time short. The JEDEC command set simplifies porting U-Boot's CFI flash driver. The 40-pin TSOP package is pin-compatible with many legacy 3 V parallel NOR parts used in networking gear from the 2000s, easing PCB reuse when refreshing the BOM to last-time-buy parts.
Recommandé
POS Terminal Application Storage
Point-of-sale terminals and payment terminals rely on the MT28F008B3VG10T for application firmware, transaction log buffers, and UI graphics. The 8 Mb density accommodates the terminal application plus EMV library, and the block-erasable architecture enables partial firmware updates over the air. The 2.7 V-3.6 V supply range suits battery-backed designs, and the TSOP-40 surface-mount package supports automated assembly. Designers should pair the flash with a battery-backed RTC and supervisor to maintain transactional integrity during power events.
Recommandé
Legacy Set-Top Box and Consumer Electronics Code Storage
Set-top boxes, DVD/Blu-ray players, and home gateways built around 3 V parallel NOR boot architectures use the MT28F008B3VG10T as primary firmware storage. The 100 ns access time is compatible with the MIPS, ARM7, and SH-2 SoCs prevalent in consumer designs, and the parallel x8 bus connects directly to the SoC's EMI (external memory interface). TSOP-40 is a well-known footprint with reliable second-source availability, simplifying maintenance programs for installed-base equipment where redesign is not economical.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MT28F008B3VG10T — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MT28F800B3VG-10T | MT28F008B3VG-9B | MT28F008B3VG-10 | MT28F008B3VG-10TET | MT28F008B3VG-10T (PROG) |
|---|---|---|---|---|---|---|
| Package | TSOP-40 (VG) | TSOP-40 (VG) - same | TSOP-40 (VG) - same | TSOP-40 (VG) - same | TSOP-40 (VG) - same | TSOP-40 (VG) - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 8 Mb (1 MB x8) | 8 Mb (512 KB x16 / 1 MB x8) | 8 Mb (1 MB x8) | 8 Mb (1 MB x8) | 8 Mb (1 MB x8) | 8 Mb (1 MB x8) |
| Bus Width | x8 only | x16/x8 dual bus | x8 only | x8 only | x8 only | x8 only |
| Access Time | 100 ns | 100 ns | 90 ns | 100 ns | 100 ns | 100 ns |
| Supply Voltage | 2.7 V - 3.6 V | 2.7 V - 3.6 V | 2.7 V - 3.6 V | 2.7 V - 3.6 V | 2.7 V - 3.6 V | 2.7 V - 3.6 V |
| Packaging | Tape & Reel | Tape & Reel | Tape & Reel | Tray | Tape & Reel (extended temp) | Tape & Reel (pre-programmed) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Pure x8 bus implementation (vs MT28F800B3VG-10T)
- JEDEC-standard command set (vs Vendor-proprietary command sets)
- Execute-in-place (XIP) capability with 100 ns access (vs SPI NOR flash (e.g., W25Q64))
Notes de conception
VCC must be regulated within 2.7 V to 3.6 V during read, program, and erase operations; brief transients below 2.7 V can cause read errors or unintentionally abort a program/erase cycle, corrupting the block. Place a 0.1 uF decoupling capacitor as close as possible to the VCC pin (pin 27) and a bulk 4.7-10 uF on the rail feeding the device. The RP# pin (pin 36) must be tied to VCC through a pull-up and held low until VCC is stable at power-up; sequencing VCC before RP# prevents spurious program/erase commands. Estimated: typical read active current ~15-20 mA and standby current ~30-50 uA per Micron MT28F008B3 datasheet characterization curves; verify against the latest datasheet revision for production design.
The MT28F008B3VG10T uses Micron's JEDEC command-set interface; commands such as Read (0x00), Program (0x10), Block Erase (0x20), and Read Identifier (0x90) must be written to specific address cycles per the datasheet. A common pitfall is to issue AMD-style commands (e.g., 0xAA/0x55 unlock cycles) which are NOT recognized and will leave the device in a standby state, appearing as 'dead' flash. Ensure your flash driver targets the Micron/JEDEC command set, and validate with a Read Identifier command (0x90 at 0x00) that returns the manufacturer ID 0x89 before any bulk operations.
TSOP-40 has a 0.5 mm lead pitch and is sensitive to solder joint defects; follow JEDEC J-STD-020 MSL handling and reflow profile guidelines. Place a ground guard ring or via fence around the package to reduce noise coupling from adjacent high-speed signals (DDR, Ethernet, RF). Keep trace lengths from the host MCU address/data bus to the flash matched within ~25 mm to avoid skew-induced timing violations at the 100 ns access time budget. Provide a test point on the RP# pin to allow manual reset during bring-up.
At 100 ns access time, the parallel address/data bus can run up to ~10 MHz without impedance-controlled routing on standard FR-4. For systems operating the bus at higher rates or with long traces, add 22-33 ohm series damping resistors near the driver to limit overshoot and ringing. The CE# and OE# signals must de-assert between consecutive read cycles; floating or slow edges can cause bus contention and increase read active current.
Informations de conformité
Compliance data not present in the verified web snippet. Customers must request the latest material declaration from Micron's PCN archive or via the authorized distributor.
