MT48LC16M16A2P-7E:D - 256Mbit SDRAM x16 133MHz 54-TSOP II | Micron
Référence : MT48LC16M16A2P-7E:D ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.4 | $8,40 |
| 10 | $7.55 | $75,50 |
| 100 | $6.72 | $672,00 |
| 500 | $6.05 | $3 025,00 |
| 1 000 | $5.4 | $5 400,00 |
MT48LC16M16A2P-7E:D Présentation
What is SDRAM? Synchronous DRAM is a generation of dynamic random-access memory whose read, write, and refresh operations are timed by a free-running system clock rather than by asynchronous control signals. SDRAM occupies a position in the memory hierarchy above asynchronous DRAM and below subsequent generations such as DDR, DDR2, and DDR3; it is the parent category that includes PC66, PC100, and PC133 variants used in late-1990s and early-2000s computing, networking, and embedded systems. Within a system-on-chip or processor board, SDRAM typically functions as the main off-chip working memory, sitting between the CPU/ASIC and any non-volatile storage.
Key features of the MT48LC16M16A2P-7E:D include a 5.4 ns clock access time, an internal pipelined architecture that allows the column address to be changed every clock cycle, four internal banks for concurrent operation, programmable CAS latency (2 or 3), programmable burst length (1, 2, 4, 8, or full page), and auto-refresh plus self-refresh modes. The 16-bit data bus supports PC100 and PC133 compliance, while a deep, pipelined internal organization enables sustained throughput approaching the theoretical peak for the chosen bus width.
Typical applications include industrial controllers, networking line cards, set-top boxes, printers, and legacy PC mainboards where 256 Mbit of low-cost, high-density, byte- or word-oriented working memory is required. The wide x16 data interface is convenient for color LCD frame buffers, DSP program/data stores, and 16-bit or 32-bit microprocessor external memory expansions. PC133 timing ensures compatibility with legacy host controllers and the Via/Intel chipsets of that era.
When designing with this device, ensure that VDD and VDDQ are decoupled with 0.1 uF and 0.01 uF capacitors placed close to the pins, that all address/control traces are length-matched for clean clock-edge capture, and that a proper SSTL- or LVTTL-compatible clock with controlled impedance is provided. The self-refresh current should be budgeted for battery-backed or low-power standby use.
This page synthesizes distributor pricing for the Micron MT48LC16M16A2P-7E:D, drop-in equivalent SDRAM candidates from Micron's own catalogue and cross-brand Alliance Memory alternatives, plus practical design notes not consolidated on any single manufacturer page.
Alternatives de remplacement direct pour MT48LC16M16A2P-7E:D — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MT48LC16M16A2P-7E:G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT48LC16M16A2P-6A:D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT48LC16M16A2P-7E IT:D
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT48LC16M16A2P-7E AIT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
AS4C16M16SA-7TCN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT48LC16M16A2P-7E:D Valeurs maximales et caractéristiques électriques
| Type de mémoire | SDRAM (Synchronous DRAM) |
| Taille de mémoire | 256 Mbit |
| Organisation de la mémoire | 16M x 16 |
| Number of Internal Banks | 4 |
| Fréquence d'horloge maximale | 133 MHz (PC133) |
| Access Time (tCK) | 5.4 ns |
| Interface | Parallel, LVTTL |
| Supply Voltage (VDD/VDDQ) | 3.0 V to 3.6 V (3.3 V typ) |
| Boîtier / Format | 54-TSOP II (400 mil, 10.16 mm) |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Statut RoHS | Compliant (Pb-free, matte-tin) |
| JEDEC Compliance | PC100- and PC133-compliant |
| Latence CAS | Programmable, 2 or 3 |
| Burst Length | Programmable, 1 / 2 / 4 / 8 / full page |
| Refresh | Auto-refresh and self-refresh |
Guide de configuration des broches du MT48LC16M16A2P-7E:D 54-tsop ii (400 mil, 10.16 mm)
Configuration des broches du MT48LC16M16A2P-7E:D (boîtier 54-tsop ii (400 mil, 10.16 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MT48LC16M16A2P-7E:D.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MT48LC16M16A2P-7E:D convient pour 6 applications: Industrial Controller Main Memory, Networking Line-Card Packet Buffer, Set-Top Box MPEG Decoder Memory, Laser Printer Image Memory, DSP Program and Data Memory, Legacy Industrial PC/104 Main Memory.
Industrial Controller Main Memory
The MT48LC16M16A2P-7E:D supplies 256 Mbit of synchronous working memory for industrial controllers, PLCs, and HMI panels where deterministic PC133 timing and a wide 16-bit data bus are needed. The 54-TSOP II outline keeps the PCB area compact, while 4-bank interleaving lets the controller sustain concurrent DMA, stack, and frame-buffer accesses without page-miss stalls. The lead-free matte-tin finish meets current RoHS assembly requirements, and the LVTTL interface mates directly with legacy 3.3 V microcontrollers and ASICs. Designers typically pair this SDRAM with an external refresh controller or an on-chip SDRAM controller inside the host MCU to manage periodic refresh and power-down entry.
Recommandé
Networking Line-Card Packet Buffer
In legacy Fast Ethernet and early-Gigabit router line cards, the MT48LC16M16A2P-7E:D acts as a 256 Mbit packet buffer, taking advantage of its 133 MHz parallel interface to feed line-rate traffic to a network processor. The 16-bit bus width and PC133 compliance match the SDRAM controllers embedded in classic network ASICs and FPGAs, while the pipelined architecture supports page-mode bursts that keep queue descriptors and packet payloads streaming efficiently. The 3.3 V LVTTL interface simplifies level shifting to 3.3 V ASIC I/O, and the 54-TSOP II package is straightforward to route on multi-layer backplane PCBs. Engineering teams value the part's long-term Micron availability and the Alliance Memory second-source for long-life telecom deployments.
Recommandé
Set-Top Box MPEG Decoder Memory
Set-top boxes and digital-TV receivers of the early-2000s used 16-bit wide SDRAM like the MT48LC16M16A2P-7E:D to hold decompressed MPEG-2 frame buffers, on-screen display bitmaps, and program-guide databases. The 256 Mbit density is sufficient for one full 1920x1080 frame plus audio buffers, and the 133 MHz clock keeps pace with 60 Mbps video streams when CAS latency is set to 3. The 54-TSOP II footprint fits the compact chassis layouts typical of consumer STBs, while the 3.3 V supply rails match the decoder ASICs of that era. Long-life industrial and consumer variants make this SDRAM a reliable choice for retrofit and legacy support programs.
Recommandé
Laser Printer Image Memory
Electrophotographic printers store compressed page bitmaps in external SDRAM like the MT48LC16M16A2P-7E:D before expanding them onto the photoconductor drum at engine speed. The 16-bit x16 organization delivers two bytes per clock, matching the bus width of typical printer ASICs, while the 256 Mbit capacity supports 600 dpi letter-size pages at full color depth. PC133 timing keeps the data pipeline full during double-sided duplex printing, and the 54-TSOP II package drops easily onto printer controller boards with conservative 4-layer stack-ups. RoHS compliance allows the printer to ship globally, and the long Micron product life cycle supports decade-long service commitments.
Recommandé
DSP Program and Data Memory
Fixed- and floating-point DSPs of the PC133 era (and many modern DSPs with legacy SDRAM controllers) use the MT48LC16M16A2P-7E:D as combined program and data memory, exploiting its 4-bank architecture to hide row-precharge latency while the DSP fetches instructions from one bank and reads/writes samples in another. The 133 MHz peak clock and 16-bit bus keep audio and baseband pipelines fed without stalls, and the 3.3 V LVTTL interface connects directly to the DSP's external memory port. Industrial-temp variants (suffix IT:D) extend operating range for outdoor and automotive DSP applications such as audio amplifiers and baseband modems.
Recommandé
Legacy Industrial PC/104 Main Memory
PC/104 and EPIC single-board computers of the late-1990s/early-2000s paired x86 SoCs with PC133 SDRAM chips like the MT48LC16M16A2P-7E:D as the main system memory. Two chips in parallel provide a 32-bit data path supporting the chipset's full memory bandwidth. The 54-TSOP II package is straightforward to hand-solder or rework, an important consideration in long-life industrial systems. The part's continued Micron availability and the existence of a qualified Alliance Memory drop-in alternative mean that PC/104 SBCs can be sustained in service for decades.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MT48LC16M16A2P-7E:D — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MT48LC16M16A2P-7E:G | MT48LC16M16A2P-6A:D | MT48LC16M16A2P-7E IT:D | MT48LC16M16A2P-7E AIT | AS4C16M16SA-7TCN |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Alliance Memory |
| Package | 54-TSOP II | 54-TSOP II - same | 54-TSOP II - same | 54-TSOP II - same | 54-TSOP II - same | 54-TSOP II - same |
| Density | 256 Mbit | 256 Mbit | 256 Mbit | 256 Mbit | 256 Mbit | 256 Mbit |
| Organization | 16M x 16 | 16M x 16 | 16M x 16 | 16M x 16 | 16M x 16 | 16M x 16 |
| Max Clock Frequency | 133 MHz (-7E) | 133 MHz (-7E) | 166 MHz (-6A, faster) | 133 MHz (-7E) | 133 MHz (-7E) | 143 MHz (-7) |
| Supply Voltage | 3.0 V - 3.6 V | 3.0 V - 3.6 V | 3.0 V - 3.6 V | 3.0 V - 3.6 V | 3.0 V - 3.6 V | 3.0 V - 3.6 V |
| Packaging | Tray | Tape & Reel | Tray | Tray | Tray | Tray |
| RoHS / Lead-Free | Yes (matte-tin, :D) | Yes (Pb-free, :G) | Yes (matte-tin, :D) | Yes (matte-tin, :D) | Yes (Pb-free, AIT) | Yes (Pb-free) |
Principaux différenciateurs
- Tray-packaged lead-free matte-tin finish with active Micron catalogue status (vs MT48LC16M16A2P-7E:G)
- Qualified by Micron as production-active with documented Alliance Memory second source (vs AS4C16M16SA-7TCN)
- PC133 133 MHz -7E speed grade with a documented faster -6A upgrade path (vs MT48LC16M16A2P-6A:D)
Notes de conception
The MT48LC16M16A2P-7E:D draws its supply from VDD and VDDQ pins tied to a common 3.3 V rail; place 0.1 uF and 0.01 uF decoupling capacitors as close as possible to each VDD/VDDQ pin and a single bulk 10-22 uF tantalum or ceramic capacitor near the device. Reference the Micron 256Mb SDRAM datasheet power-decoupling section for the recommended layout. Self-refresh current should be budgeted separately from active operating current for battery-backed or low-power standby designs.
Route all SDRAM signals (clock, address, command, data, DQM, CKE) with controlled impedance (typically 50 ohm single-ended to a reference plane) and length-match the clock to within +/- 50 ps of the strobe signals on the host side. Use a 4-layer PCB with continuous VDD/ground planes to provide a low-inductance return path. Avoid routing SDRAM signals across split planes or near noisy switching signals; the 54-TSOP II outline gives a small but workable escape area for hand-routing or moderate-density automation.
Failure to honour the SDRAM refresh requirements is the most common field issue: the host controller must issue auto-refresh (REF) commands at the datasheet-mandated average interval (typically 15.6 us for 64 ms / 4096 rows) and must keep CKE asserted in idle conditions if self-refresh is desired. Driving CKE low before tCKE(min) after power-up or violating the tRP/tRFC timing during bank management leads to intermittent read/write errors. Always run a margin sweep (Vdd +/- 5%, temperature corners) on prototype boards before committing to volume.
The MT48LC16M16A2P-7E:D uses an LVTTL interface with a single-ended clock; to preserve signal integrity on a 133 MHz bus, terminate clock and strobe (DQS) lines in series with a 22-33 ohm resistor placed close to the driver. Place a small damping resistor in series with heavily-loaded address/command buses if overshoot/undershoot exceeds the datasheet absolute maximum (typically VDDQ + 0.5 V). A 100 MHz - 133 MHz SDRAM bus is still susceptible to reflections on long, un-terminated traces.
Informations de conformité
RoHS-compliant per Micron :D suffix (Pb-free matte-tin); JEDEC JESD22 / J-STD-020 reflow profile compliance implied by Micron product family standards. AEC-Q100 not applicable for this consumer/industrial commercial-grade order code (choose AIT/IT variants for automotive/industrial temp).
