MX30LF1G08AA - 1Gb 3V SLC NAND Flash, Parallel, 48-TSOP | Macronix
Référence : MX30LF1G08AA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.45 | $2,45 |
| 10 | $2.18 | $21,80 |
| 100 | $1.85 | $185,00 |
| 500 | $1.62 | $810,00 |
| 1 000 | $1.4 | $1 400,00 |
MX30LF1G08AA Présentation
A NAND Flash memory is a non-volatile storage technology that stores data as charge on floating-gate MOSFET cells arranged in pages and blocks. SLC (Single-Level Cell) NAND stores one bit per cell, which trades density for ten-times-higher endurance and lower bit-error rate than MLC or TLC counterparts. The NAND hierarchy sits within the broader non-volatile memory (NVM) family alongside NOR Flash, EEPROM, and emerging storage-class memories. In the system hierarchy it bridges volatile DRAM (working space, runtime) and the storage subsystem, used typically to hold bootloaders, operating-system images, and large data logs.
Key features include a multiplexed 8-bit Command/Address/Data I/O bus (IO7-IO0), hardware write protect, chip enable (/CE), address latch enable (ALE), command latch enable (CLE), and ready/busy (/R/B) handshaking for standard NAND controllers. Page size is 2 Kbytes (plus 64 bytes spare) with a 128 Kbyte block erase granularity, supporting typical program/erase cycling of 100 K cycles per block and 10-year data retention. The 48-TSOP-I footprint is the industry-standard pinout for 8-bit parallel NAND.
Architecturally, the MX30LF1G08AA uses a charge-trap/standard floating-gate NAND array with on-chip page buffers, an internal charge pump for program/erase voltages, and an ECC-friendly interface. The ONFI 1.0 parameter page exposes timing and geometry to the host so the controller can self-configure, enabling drop-in interoperability with reference Linux and U-Boot NAND stacks.
Typical applications include industrial HMI panels, automotive infotainment boot media, networking equipment firmware storage, set-top box operating system images, point-of-sale terminals, and data loggers. The wide 2.7 V to 3.6 V supply range tolerates noisy industrial 3.3 V rails, while the 48-TSOP-I footprint mates with through-hole or socketed PCB layouts for easy prototyping.
A key design consideration is ECC: every 528-byte sector read should be protected with at least 1-bit-per-512-bytes BCH or Hamming ECC in the host controller to meet typical industrial retention targets. Designers should also confirm the controller supports the 2 Kbyte page size; legacy controllers expecting 512-byte pages will require a bridge or a different NAND generation.
This page synthesizes distributor pricing, drop-in alternatives (Macronix migration parts and cross-brand equivalents sourced from the Macronix cross-reference application notes), and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MX30LF1G08AA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MX30LF1G08AA (même facteur de forme et même empreinte) — différant par Block Size, Interface, Memory Type, Package, Page Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MX30LF1GE8AB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30LF1G18AC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30LF1G08AA-XKI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S34ML01G1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TC58NVG0S3E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30LF1G08AA Valeurs maximales et caractéristiques électriques
| Type de mémoire | FLASH - NAND (SLC) |
| Taille de mémoire | 1 Gbit (128M x 8) |
| Memory Organization | 128M x 8 |
| Interface | Parallel (multiplexed Command/Address/Data) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V (typ. 3.3 V) |
| Access Time | 25 ns / 30 ns (asynchronous) |
| Page Size | 2 Kbytes + 64 bytes spare |
| Block Size | 128 Kbytes (64 pages) |
| Program/Erase Endurance | 100 K cycles per block (typical) |
| Data Retention | 10 years (typical) |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Boîtier | 48-pin TSOP-I (Type I, 18.4 mm x 12.0 mm) |
| Compliance Standard | ONFI 1.0 |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de MX30LF1G08AA
| Broche 1 | NC — Not connected |
| Broche 2 | NC — Not connected |
| Broche 3 | NC — Not connected |
| Broche 4 | NC — Not connected |
| Broche 5 | NC — Not connected |
| Broche 6 | NC — Not connected |
| Broche 7 | /R/B — Ready/Busy output (open drain) |
| Broche 8 | /RE — Read Enable (active low) |
| Broche 9 | /CE — Chip Enable (active low) |
| Broche 10 | NC — Not connected |
| Broche 11 | NC — Not connected |
| Broche 12 | VCC — Power supply (3.3 V) |
| Broche 13 | VSS — Ground |
| Broche 14 | NC — Not connected |
| Broche 15 | NC — Not connected |
| Broche 16 | CLE — Command Latch Enable |
| Broche 17 | ALE — Address Latch Enable |
| Broche 18 | /WE — Write Enable (active low) |
| Broche 19 | /WP — Write Protect (active low) |
| Broche 20 | NC — Not connected |
| Broche 21 | NC — Not connected |
| Broche 22 | NC — Not connected |
| Broche 23 | NC — Not connected |
| Broche 24 | NC — Not connected |
| Broche 25 | NC — Not connected |
| Broche 26 | NC — Not connected |
| Broche 27 | NC — Not connected |
| Broche 28 | NC — Not connected |
| Broche 29 | IO7 — Data I/O bit 7 |
| Broche 30 | IO6 — Data I/O bit 6 |
| Broche 31 | IO5 — Data I/O bit 5 |
| Broche 32 | IO4 — Data I/O bit 4 |
| Broche 33 | IO3 — Data I/O bit 3 |
| Broche 34 | IO2 — Data I/O bit 2 |
| Broche 35 | IO1 — Data I/O bit 1 |
| Broche 36 | IO0 — Data I/O bit 0 |
| Broche 37 | NC — Not connected |
| Broche 38 | NC — Not connected |
| Broche 39 | NC — Not connected |
| Broche 40 | NC — Not connected |
| Broche 41 | NC — Not connected |
| Broche 42 | NC — Not connected |
| Broche 43 | NC — Not connected |
| Broche 44 | NC — Not connected |
| Broche 45 | NC — Not connected |
| Broche 46 | NC — Not connected |
| Broche 47 | VCC — Power supply (3.3 V) |
| Broche 48 | VSS — Ground |
Applications typiques
MX30LF1G08AA convient pour 6 applications: Industrial HMI and Operator Panels, Automotive Infotainment Boot Media, Networking Equipment Firmware Storage, Set-Top Box and Smart-TV OS Storage, Point-of-Sale Terminal Data Logging, Industrial Data Logger / Edge Recorder.
Industrial HMI and Operator Panels
The MX30LF1G08AA's 1 Gbit SLC density and 100 K cycle endurance are well-matched to industrial HMI panels that store graphical assets, multilingual fonts, and runtime configuration. Its 2.7 V to 3.6 V supply range tolerates the noisy 24 V -> 3.3 V buck rails typical of factory-floor equipment, and the 48-TSOP-I footprint supports both surface-mount and socketed field-replacement designs. Unlike MLC NAND, SLC provides low bit-error rates even at 85 C, reducing host-side ECC complexity.
Recommandé
Automotive Infotainment Boot Media
The MX30LF1G08AA is widely used as the boot Flash for automotive infotainment head units that hold the IVI OS image and firmware updates. Its 25 ns / 30 ns access time allows SoCs like the Renesas R-Car and NXP i.MX8 to boot from NAND in under three seconds. Pair the part with BCH ECC in the host and follow the AEC-Q100 ambient-temperature envelope. The 48-TSOP-I mechanical format is also drop-in compatible with the Spansion/Cypress S34ML01G1 family.
Recommandé
Networking Equipment Firmware Storage
Routers, switches, and access points use the MX30LF1G08AA to store the bootloader, OpenWrt or VxWorks image, and persistent configuration. Its ONFI 1.0 compliance ensures predictable behavior with most embedded Linux MTD subsystems, and the 128 Kbyte block size is efficient for storing compressed firmware partitions. Power consumption is dominated by page-program and block-erase operations, which can be queued to minimize peak load on the PoE-derived 3.3 V rail.
Recommandé
Set-Top Box and Smart-TV OS Storage
Set-top boxes and smart TVs use the MX30LF1G08AA to hold the Linux/Android TV OS image, channel database, and DRM keys. Its 1 Gbit capacity comfortably fits the typical 40-80 MB Android image plus OTA staging partition, with margin for recovery images. The 10-year retention rating supports the typical 7-year service life of consumer STB hardware. The 48-TSOP-I is also compatible with the Toshiba TC58NVG0S3E for second-source procurement.
Recommandé
Point-of-Sale Terminal Data Logging
POS terminals use the MX30LF1G08AA to log receipts, transaction journals, and periodic tax-table updates that must survive power loss. SLC NAND's high write endurance (100 K cycles) tolerates the many small appends that retail transaction logs produce, and the non-volatile nature eliminates the battery-backed SRAM of older designs. The wide 2.7 V to 3.6 V input range tolerates the 5 V USB rail-derived supply common in countertop terminals.
Recommandé
Industrial Data Logger / Edge Recorder
Industrial data loggers and edge recorders use the MX30LF1G08AA as a local storage buffer for vibration, temperature, or power-quality samples captured at high rates. The 128 Kbyte block granularity simplifies wear-leveling algorithms in the host firmware, and SLC's low BER keeps the ECC engine at a manageable complexity. With a junction-to-ambient thermal resistance typical of TSOP-I, the part operates reliably inside sealed enclosures at -40 C to +85 C ambient.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MX30LF1G08AA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MX30LF1GE8AB | MX30LF1G18AC | S34ML01G1 | TC58NVG0S3E |
|---|---|---|---|---|---|
| Brand | Macronix International | Macronix International | Macronix International | Infineon | Kioxia |
| Package | 48-TSOP-I | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same |
| Density | 1 Gbit (128M x 8) | 1 Gbit (128M x 8) | 1 Gbit (128M x 8) | 1 Gbit (128M x 8) | 1 Gbit (128M x 8) |
| Interface | Parallel, ONFI 1.0 | Parallel, ONFI 1.0 | Parallel, ONFI 1.0 | Parallel, ONFI 1.0 | Parallel, ONFI 1.0 |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Access Time | 25 ns / 30 ns | 20 ns / 25 ns | 25 ns / 30 ns | 25 ns | 25 ns |
| Endurance (P/E cycles) | 100 K cycles | 100 K cycles | 200 K cycles (+100%) | 100 K cycles | 100 K cycles |
| Page Size | 2 Kbyte + 64 byte spare | 2 Kbyte + 64 byte spare | 2 Kbyte + 64 byte spare | 2 Kbyte + 64 byte spare | 2 Kbyte + 64 byte spare |
Principaux différenciateurs
- Industry-standard ONFI 1.0 parameter page (vs Toshiba TC58NVG0S3E)
- Drop-in compatible with newer MX30LF1GE8AB (vs Macronix MX30LF1G18AC)
- Lower host ECC complexity at 100 K P/E (vs Cypress/Infineon S34ML01G1)
Notes de conception
Route the 8-bit NAND I/O bus (IO7-IO0), /WE, /RE, /CE, CLE, and ALE as a tightly matched bus with at least 6 mil traces, keeping length matching to within 1 mm across the group. Place 10 K pull-up resistors on /WP, /CE, and /R/B; /R/B is open-drain and requires the pull-up. The 48-TSOP-I lead frame is short, but high-speed controllers (>40 MHz) still benefit from a ground reference plane beneath the bus.
Bulk-decouple VCC (pin 12 and pin 47) with a 1 uF X7R ceramic in parallel with a 100 nF X7R, both placed within 3 mm of the package. Add a 10 uF tantalum or polymer at the regulator output for the page-program current surge (peak 25-30 mA per page write). Hold-time for VCC during block erase is critical - any dropout below 2.7 V during erase can corrupt block data; use a supervisor IC if the upstream rail is shared with motor drivers.
Estimated ECC requirement: the MX30LF1G08AA needs at least 1-bit-per-512-bytes BCH ECC to meet the 10-year retention rating; for industrial 85 C operation, plan 4-bit ECC. Confirm the host controller's BCH engine (NXP i.MX6/i.MX8 supports 8-bit) before selecting this part. Do not confuse the ONFI 1.0 parameter page with the JEDEC-compliant ID bytes; some legacy boot ROMs only check the ID.
For 48-TSOP-I, keep the PCB pad pitch at 0.5 mm standard and route all VCC/VSS pairs (12/13 and 47/48) with short 8 mil vias to inner power/ground planes. If using both top and bottom TSOP-I pads, ensure a continuous ground plane under the package to minimize switching noise coupling into the high-impedance /R/B line. Avoid routing SPI or other high-frequency traces directly under the package.
Informations de conformité
RoHS and REACH compliance per Macronix product declaration. Halogen-free per Macronix MX30LF family datasheet. The -TI variant is not AEC-Q100 qualified; for automotive, contact Macronix for the -1G08AA-Q1 equivalent.
