PIC16F777-E/ML - 14KB Flash, 8-bit MCU, 44-VQFN | Microchip
Référence : PIC16F777-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.13 | $8,13 |
| 10 | $7.42 | $74,20 |
| 100 | $6.51 | $651,00 |
| 500 | $5.84 | $2 920,00 |
| 1 000 | $5.21 | $5 210,00 |
PIC16F777-E/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable I/O peripherals. Within that hierarchy, the PIC16F777 belongs to the 8-bit PIC mid-range family, which sits between Microchip's baseline (PIC10/12/14) and enhanced mid-range (PIC18F) families. The PIC16F family is positioned for cost-sensitive embedded designs requiring moderate computational throughput, low power consumption (nanoWatt technology), and a rich analog/digital peripheral set.
The PIC16F777 features 14 channels of 10-bit Analog-to-Digital conversion, three 8/16-bit timers, three Capture/Compare/PWM modules, an MSSP configurable as SPI or I2C, an Enhanced USART with auto-baud detection, a parallel slave port, and nanoWatt power management. The on-chip 10-bit ADC with up to 14 input channels enables direct sensor interfacing without external ADCs, while the dual-oscillator nanoWatt technology supports primary, secondary, and internal oscillator modes for ultra-low-power operation.
Architecturally, the device uses a Harvard bus architecture with separate program and data paths, a 14-bit-wide instruction word, and a 14-level deep hardware stack. The integrated Brown-out Reset (BOR), Power-on Reset (POR), and Watchdog Timer with its own on-chip RC oscillator provide five operating modes that together make the PIC16F777 tolerant of noisy industrial power rails. Industrial-grade operating voltage range is 2.0V to 5.5V.
Typical applications include industrial control and sensor nodes, HVAC and building automation, motor control (BLDC, stepper), automotive body electronics, consumer appliance interfaces, instrumentation data logging, and USB-to-UART bridges when paired with an external FTDI or MCP2200 bridge IC. The wide peripheral integration reduces BOM cost for these designs.
When designing with the PIC16F777, plan for ICSP programming via PGC/PGD pins shared with RB6/RB7, verify the exposed pad is soldered to the ground plane for thermal dissipation, and use Microchip's MPLAB X IDE with the XC8 compiler for development. This page synthesizes drop-in alternatives, pricing tiers, and design notes that are not collected in the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a 360-degree reference for sourcing and engineering decisions.
Alternatives de remplacement direct pour PIC16F777-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16F777-E/ML (même facteur de forme et même empreinte) — différant par Package, ADC, Timers, I/O Pins, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16F777-I/ML
✅ Remplacement direct✓ En stock
$5.48 / unité
Voir la fiche technique →PIC16F747-E/ML
✅ Remplacement direct✓ En stock
$2.85 / unité
Voir la fiche technique →PIC16F767-I/ML
✅ Remplacement direct✓ En stock
$2.85 / unité
Voir la fiche technique →PIC16F727-E/ML
✅ Remplacement direct✓ En stock
$1.62 / unité
Voir la fiche technique →PIC16F777-E/ML Valeurs maximales et caractéristiques électriques
| Product Type | 8-bit Microcontroller (MCU) |
| Core Architecture | PIC16 (RISC, Harvard bus) |
| Program Memory (Flash) | 14 KB |
| Data Memory (SRAM) | 368 bytes |
| EEPROM | 256 bytes |
| Maximum CPU Speed | 20 MHz (200 ns instruction cycle) |
| Operating Voltage | 2.0 V to 5.5 V |
| Plage de température de fonctionnement | -40 C to +125 C (Extended, -E suffix) |
| I/O Pins | 36 (on 44-pin package) |
| ADC | 10-bit, 14 channels |
| Timers | 3 (Timer0, Timer1, Timer2) |
| Capture/Compare/PWM | 3 ECCP modules |
| Communication | MSSP (SPI / I2C), Enhanced USART, Parallel Slave Port |
| Boîtier | 44-pin QFN (8x8 mm) with exposed thermal pad (ML) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Power-Saving Modes | nanoWatt technology with multiple idle/sleep modes |
| Statut RoHS | Compliant |
Configuration des broches de PIC16F777-E/ML
| Broche 1 | RA0/AN0 — PORTA bit 0 / Analog input 0 |
| Broche 2 | RA1/AN1 — PORTA bit 1 / Analog input 1 |
| Broche 3 | RA2/AN2/CVREF — PORTA bit 2 / Analog input 2 / Comparator voltage reference |
| Broche 4 | RA3/AN3/VREF+ — PORTA bit 3 / Analog input 3 / ADC positive reference |
| Broche 5 | RA4/AN4/T0CKI — PORTA bit 4 / Analog input 4 / Timer0 clock input |
| Broche 6 | RA5/AN5/SS — PORTA bit 5 / Analog input 5 / SPI slave select |
| Broche 7 | RA6/OSC2 — PORTA bit 6 / Oscillator output |
| Broche 8 | RA7/OSC1 — PORTA bit 7 / Oscillator input |
| Broche 9 | RE0/RD/AN6 — PORTE bit 0 / Parallel slave port read / Analog input 6 |
| Broche 10 | RE1/WR/AN7 — PORTE bit 1 / Parallel slave port write / Analog input 7 |
| Broche 11 | RE2/CS/AN8 — PORTE bit 2 / Parallel slave port chip select / Analog input 8 |
| Broche 12 | VDD — Positive power supply |
| Broche 13 | VSS — Ground reference |
| Broche 14 | OSC1/CLKI — External oscillator input / external clock input |
| Broche 15 | OSC2/CLKO — External oscillator output / clock output |
| Broche 16 | RC0/T1OSO/T1CKI — PORTC bit 0 / Timer1 oscillator output / Timer1 clock input |
| Broche 17 | RC1/T1OSI/CCP2 — PORTC bit 1 / Timer1 oscillator input / CCP2 module |
| Broche 18 | RC2/CCP1 — PORTC bit 2 / CCP1 module |
| Broche 19 | RC3/SCK/SCL — PORTC bit 3 / SPI clock / I2C clock |
| Broche 20 | RD0/PSP0 — PORTD bit 0 / Parallel slave port data bit 0 |
| Broche 21 | RD1/PSP1 — PORTD bit 1 / Parallel slave port data bit 1 |
| Broche 22 | RD2/PSP2 — PORTD bit 2 / Parallel slave port data bit 2 |
| Broche 23 | RD3/PSP3 — PORTD bit 3 / Parallel slave port data bit 3 |
| Broche 24 | RD4/PSP4 — PORTD bit 4 / Parallel slave port data bit 4 |
| Broche 25 | RD5/PSP5 — PORTD bit 5 / Parallel slave port data bit 5 |
| Broche 26 | RD6/PSP6 — PORTD bit 6 / Parallel slave port data bit 6 |
| Broche 27 | RD7/PSP7 — PORTD bit 7 / Parallel slave port data bit 7 |
| Broche 28 | VSS — Ground reference |
| Broche 29 | VDD — Positive power supply |
| Broche 30 | RB0/INT0/AN12 — PORTB bit 0 / External interrupt 0 / Analog input 12 |
| Broche 31 | RB1/INT1/AN10 — PORTB bit 1 / External interrupt 1 / Analog input 10 |
| Broche 32 | RB2/INT2/AN8 — PORTB bit 2 / External interrupt 2 / Analog input 8 |
| Broche 33 | RB3/CCP2/AN9 — PORTB bit 3 / CCP2 / Analog input 9 |
| Broche 34 | RB4/AN11 — PORTB bit 4 / Analog input 11 |
| Broche 35 | RB5/AN13 — PORTB bit 5 / Analog input 13 |
| Broche 36 | RB6/PGC — PORTB bit 6 / In-Circuit Serial Programming clock |
| Broche 37 | RB7/PGD — PORTB bit 7 / In-Circuit Serial Programming data |
| Broche 38 | RC4/SDI/SDA — PORTC bit 4 / SPI data in / I2C data |
| Broche 39 | RC5/SDO — PORTC bit 5 / SPI data out |
| Broche 40 | RC6/TX/CK — PORTC bit 6 / USART transmit / USART clock |
| Broche 41 | RC7/RX/DT — PORTC bit 7 / USART receive / USART data |
| Broche 42 | RC8/CCP3 — PORTC bit 8 / CCP3 module |
| Broche 43 | RC9/CCP4 — PORTC bit 9 / CCP4 module |
| Broche 44 | EP — Exposed thermal pad - connect to VSS for thermal dissipation |
Applications typiques
PIC16F777-E/ML convient pour 6 applications: Industrial Sensor Interface Node, HVAC and Building Automation Controller, Small Motor Control (Brushed DC, Stepper), Automotive Body Electronics, Consumer Appliance Interface, Instrumentation Data Logger.
Industrial Sensor Interface Node
The PIC16F777-E/ML fits industrial sensor-interface nodes because it integrates 14 channels of 10-bit ADC alongside three Enhanced CCP PWM modules and dual I2C/SPI. This combination lets a single chip read multiple analog sensors (temperature, pressure, humidity) and drive PWM outputs for control loops, eliminating the need for an external ADC. The 44-pin QFN package exposes 36 GPIO - enough for digital inputs, status LEDs, and multiple communication buses concurrently. The 2.0V-5.5V VDD window tolerates industrial 24V-derived rails after regulation, and the -40 C to +125 C extended grade covers outdoor and factory-floor environments.
Recommandé
HVAC and Building Automation Controller
For HVAC and building automation the PIC16F777-E/ML provides enough Flash (14 KB) and peripheral integration (USART, MSSP, three PWM) to handle thermostat logic, damper/motor control, and serial communication with a central BMS over RS-485. The 14-channel ADC reads multiple temperature zones and pressure sensors concurrently. nanoWatt technology allows deep-sleep current below 1 uA when the system is idle, which is critical for battery-backed thermostats. The 44-QFN package is well suited to the slim, fanless form factor of wall-mounted controllers.
Recommandé
Small Motor Control (Brushed DC, Stepper)
The PIC16F777-E/ML is a practical fit for small brushed-DC and stepper motor control where the three Enhanced CCP modules can generate up to three PWM channels with complementary outputs and programmable dead-band. The 14-channel 10-bit ADC samples current-sense amplifiers for basic torque limiting or stall detection. The 20 MHz instruction rate supports 8 kHz PWM at 50 MHz-equivalent update rates. For high-RPM sensorless BLDC with FOC, upgrade to a dsPIC33; for low-cost brushed DC under 1 A, the PIC16F777 in 44-QFN is more than sufficient.
Recommandé
Automotive Body Electronics
Body-electronics modules such as seat controllers, mirror adjusters, and interior lighting benefit from the PIC16F777-E/ML's 14 KB Flash, three PWM channels, and the -40 C to +125 C extended temperature range. Combined with a LIN or CAN transceiver, the MCU serves as a low-cost body-domain slave. The 44-QFN package fits within tight PCB areas. Note that this part is not AEC-Q100 qualified; for AEC-Q100 body electronics choose PIC16F15344-I/ML or PIC16F18855-I/ML from the newer PIC16F1 enhanced family.
Recommandé
Consumer Appliance Interface
Consumer appliances (washing machines, dishwashers, microwave ovens, coffee machines) use the PIC16F777-E/ML for its integrated ADC, PWM, and serial ports that connect to user-interface keypads, LCDs, and triac-driven heaters or pumps. The PIC16F777's 256 bytes EEPROM stores user settings and cycle counts without battery backup. The Extended -40 C to +125 C grade handles the high-temperature environment inside appliance enclosures. The 44-QFN package's small footprint fits the dense control boards of modern white goods.
Recommandé
Instrumentation Data Logger
The PIC16F777-E/ML is an effective controller for portable instrumentation data loggers because of its 14-channel 10-bit ADC, 256-byte on-chip EEPROM for parameter storage, and dual serial ports (USART plus MSSP) for SD card or external sensor interfaces. The Extended temperature grade enables outdoor or industrial logging. nanoWatt sleep modes drop the average current to single-digit microamps for battery-powered deployments. The 368-byte RAM is the limiting factor - log a sample at a time and stream to SD rather than buffering large blocks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16F777-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16F777-I/ML | PIC16F747-E/ML | PIC16F767-I/ML | PIC16F727-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 28-pin QFN (6x6 mm) - different | 44-pin QFN (8x8 mm) - same |
| Flash Memory | 14 KB | 14 KB | 7 KB (-50%) | 14 KB | 14 KB |
| SRAM | 368 bytes | 368 bytes | 368 bytes | 368 bytes | 368 bytes |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Maximum CPU Speed | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| ADC Channels | 14 (10-bit) | 14 (10-bit) | 14 (10-bit) | 11 (10-bit) - 21% fewer channels | 14 (10-bit) |
| I/O Pins | 36 | 36 | 36 | 25 (28-pin pkg) | 36 |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) |
Principaux différenciateurs
- Highest ADC channel count in the PIC16F 28/40/44-pin family (vs PIC16F767-I/ML)
- Doubled Flash memory vs lower-cost family variant (vs PIC16F747-E/ML)
- Extended industrial temperature grade -40 C to +125 C (vs PIC16F777-I/ML)
- Three Enhanced CCP/PWM modules versus two on baseline PIC16F (vs PIC16F727-E/ML)
Notes de conception
The exposed thermal pad on the 44-pin QFN (ML) package must be soldered to a grounded copper pour of at least 0.5 square inches for mechanical reliability and thermal dissipation. Skipping the EP solder connection can cause intermittent failures during thermal cycling, because the package relies on the EP for stress relief. The EP must be electrically connected to VSS - never leave it floating.
Add a 0.1 uF ceramic decoupling capacitor as close as possible to the VDD pin (pin 12 or 29) and a bulk 10 uF tantalum or ceramic on the same rail. For analog-sensitive applications place a separate 10 uH ferrite bead between the digital and analog VDD rails, plus a 10 uF cap on AVdd. Brown-out Reset should be enabled in configuration bits to prevent code execution at unsafe VDD levels below 4.0 V (BOR @ 2.0-4.0 V threshold range).
ICSP programming pins RB6 (PGC) and RB7 (PGD) must be brought out to a 2x3 or 1x6 header for in-system firmware updates. Add ESD protection diodes or series resistors on RB6/RB7 if they are exposed to user-accessible connectors. Keep clock traces (OSC1/OSC2 or external crystal) short - less than 5 mm - and surround them with a ground guard ring to reduce radiated emissions and noise injection.
Estimated: at 20 MHz CPU clock and 5 V VDD with all peripherals active, the PIC16F777-E/ML draws approximately 10 mA, dissipating about 50 mW. The QFN package's theta_JA is approximately 30 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of only 1.5 C above ambient. No heatsink is required, but verify on the actual PCB layout because thermal pad design and copper area dramatically change this value.
The Enhanced USART supports auto-baud detection but requires a calibration byte sequence at startup. Configure the EUSART with BRGH=1 for higher baud-rate accuracy at 20 MHz. For RS-485 networks add 120-ohm termination at both ends and a fail-safe bias resistor network. The MSSP in I2C mode requires 4.7 kohm pull-ups on SCL/SDA for 100 kHz standard mode and 3.3 kohm for 400 kHz fast mode.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for AEC-Q100 automotive applications choose PIC16F18855-I/ML or PIC16F15344-I/ML from the enhanced PIC16F1 family. Lead-free (Pb-free) per JEDEC J-STD-020 MSL-3 rating.
