PIC16F747-E/ML - 8-Bit MCU, 7KB Flash, 44-VQFN | Microchip
MPN: PIC16F747-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.72 | $3.72 |
| 10 | $3.45 | $34.50 |
| 100 | $3.18 | $318.00 |
| 500 | $2.99 | $1,495.00 |
| 1,000 | $2.85 | $2,850.00 |
PIC16F747-E/ML Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, RAM, non-volatile program memory, and programmable I/O peripherals into one package. PIC microcontrollers sit within the broader category of microcontrollers -> embedded controllers -> semiconductor ICs, and the PIC16F family in particular targets cost-sensitive 8-bit applications where deterministic execution and low power consumption matter more than raw compute throughput.
Key features include nanoWatt Technology for power-managed operation, an enhanced USART that supports RS-485, RS-232 and LIN 1.2, an ICD (In-Circuit Debug) interface, and an extended (-40 °C to +125 °C) operating temperature range denoted by the "/E" suffix. The device supports both internal and external oscillator modes and offers flash program memory that is self-programmable under firmware control.
The PIC16F747 employs a Harvard RISC-style architecture with separate program and data buses, enabling a one-instruction-per-cycle execution model. Combined with a 35-word instruction set and 8-level hardware stack, the architecture is upwardly compatible with the PIC16C5X, PIC12CXXX and PIC16C7X families, simplifying migration paths from legacy code bases.
Typical applications include industrial control nodes, automotive body and LIN sub-bus nodes, low-power sensor conditioning front-ends, and consumer appliance control boards where the 14-channel ADC and PWM-rich timer architecture replace several discrete analog components.
Designers should pay attention to the ICSP/ICD pin sharing on RB6/RB7, the need for adequate decoupling on VDD/VSS, and the exposed pad electrical connection requirement of the 44-VQFN package for proper thermal dissipation.
This page synthesizes distributor pricing, drop-in same-package substitutes, and practical engineering notes not found in the manufacturer datasheet alone, presented for engineers and buyers evaluating 8-bit Microchip MCU options.
Drop-in alternatives for PIC16F747-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F747-E/ML (same form factor and footprint) — differing in ADC, Package, Program Memory Size, Serial Interfaces, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F747-I/ML
✅ Drop-In✓ In Stock
$3.65 / Unit
View Datasheet →PIC16LF747-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F74-I/ML
✅ Drop-In✓ In Stock
$3.86 / Unit
View Datasheet →PIC16F74T-I/ML
✅ Drop-In✓ In Stock
$4.7 / Unit
View Datasheet →PIC16F77-I/ML
✅ Drop-In✓ In Stock
$3.95 / Unit
View Datasheet →PIC16F747-E/ML Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology |
| Series | PIC® 16F |
| Core Processor | PIC |
| Core Size | 8-bit |
| Program Memory Size | 7 KB (4K x 14) |
| RAM Size | 368 bytes |
| Number of I/O Pins | 36 |
| Speed | 20 MHz |
| Supply Voltage (VDD) | 2 V to 5.5 V (typical 5 V operation) |
| ADC | 10-bit, 14 channels |
| Timers | 3 |
| Capture/Compare/PWM | 3 modules |
| Serial Interfaces | MSSP (SPI / I²C) + Enhanced USART (RS-485/RS-232/LIN) |
| Package | 44-VQFN Exposed Pad (ML) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 °C to +125 °C (Extended, /E) |
| Instruction Set | 35-word RISC, 200 ns instruction cycle |
| ICSP / ICD | In-Circuit Serial Programming and In-Circuit Debug |
| Power Technology | nanoWatt Technology |
| RoHS Status | Compliant |
PIC16F747-E/ML Pin Configuration
| Pin 1 | RA0/AN0 — PORTA bit 0 / ADC input 0 |
| Pin 2 | RA1/AN1 — PORTA bit 1 / ADC input 1 |
| Pin 3 | RA2/AN2/VREF- — PORTA bit 2 / ADC input 2 / ADC negative reference |
| Pin 4 | RA3/AN3/VREF+ — PORTA bit 3 / ADC input 3 / ADC positive reference |
| Pin 5 | RA4/AN4 — PORTA bit 4 / ADC input 4 |
| Pin 6 | RA5/AN5/SS — PORTA bit 5 / ADC input 5 / SPI slave select |
| Pin 7 | RA6 — PORTA bit 6 |
| Pin 8 | OSC1/CLKIN — Crystal oscillator input / external clock input |
| Pin 9 | OSC2/CLKOUT — Crystal oscillator output / clock output |
| Pin 10 | RC0/T1OSO/T1CKI — PORTC bit 0 / Timer1 oscillator output / Timer1 clock input |
| Pin 11 | RC1/T1OSI/CCP2 — PORTC bit 1 / Timer1 oscillator input / CCP2 |
| Pin 12 | RC2/CCP1 — PORTC bit 2 / CCP1 |
| Pin 13 | RC3/SCK/SCL — PORTC bit 3 / SPI clock / I²C clock |
| Pin 14 | RC4/SDI/SDA — PORTC bit 4 / SPI data in / I²C data |
| Pin 15 | RC5/SDO — PORTC bit 5 / SPI data out |
| Pin 16 | RC6/TX/CK — PORTC bit 6 / USART TX / USART clock |
| Pin 17 | RC7/RX/DT — PORTC bit 7 / USART RX / USART data |
| Pin 18 | GND — Ground reference |
| Pin 19 | RD0 — PORTD bit 0 |
| Pin 20 | RD1 — PORTD bit 1 |
| Pin 21 | RD2 — PORTD bit 2 |
| Pin 22 | RD3 — PORTD bit 3 |
| Pin 23 | RD4 — PORTD bit 4 |
| Pin 24 | RD5 — PORTD bit 5 |
| Pin 25 | RD6 — PORTD bit 6 |
| Pin 26 | RD7 — PORTD bit 7 |
| Pin 27 | VSS — Ground (digital) |
| Pin 28 | VDD — Positive supply (2.0-5.5 V) |
| Pin 29 | RE0/RD — PORTE bit 0 / parallel slave port read control |
| Pin 30 | RE1/WR — PORTE bit 1 / parallel slave port write control |
| Pin 31 | RE2/CS — PORTE bit 2 / parallel slave port chip select |
| Pin 32 | RE3 — PORTE bit 3 (also MCLR in some modes) |
| Pin 33 | RB0/INT — PORTB bit 0 / external interrupt |
| Pin 34 | RB1 — PORTB bit 1 |
| Pin 35 | RB2 — PORTB bit 2 |
| Pin 36 | RB3/PGM — PORTB bit 3 / ICSP low-voltage programming |
| Pin 37 | RB4 — PORTB bit 4 |
| Pin 38 | RB5 — PORTB bit 5 |
| Pin 39 | RB6/PGC — PORTB bit 6 / ICSP clock |
| Pin 40 | RB7/PGD — PORTB bit 7 / ICSP data |
| Pin 41 | MCLR/VPP — Master clear reset / ICSP programming voltage |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | EP — Exposed thermal pad - must be soldered to PCB ground |
Typical Applications
PIC16F747-E/ML is suitable for 6 applications: Industrial Sensor Conditioning Front-End, Automotive LIN Sub-Bus Body Electronics, Consumer Appliance Control Board, Low-Power IoT Sensor Node (Wired), HVAC Damper / Valve Actuator Controller, User Interface / Keypad / Display Controller.
Industrial Sensor Conditioning Front-End
The PIC16F747-E/ML is well suited as the digital processing core for multi-channel sensor conditioning boards. With 14 channels of 10-bit ADC it can directly sample thermocouples, RTDs, pressure transducers, and 4-20 mA loops through external current-sense resistors. The 20 MHz core provides sufficient throughput to implement moving-average filtering and linearization algorithms at sub-millisecond cycle times. The 36 digital I/O pins drive status LEDs, alarm relays, and an RS-485 link via the Enhanced USART. nanoWatt Technology is critical here because industrial sensors are often loop-supplied and must minimize quiescent current. The 44-VQFN package occupies only 8 mm x 8 mm of PCB area, allowing compact DIN-rail mounted designs.
Recommended
Automotive LIN Sub-Bus Body Electronics
The PIC16F747-E/ML is a strong fit for automotive LIN 1.2 / 1.3 body sub-bus nodes such as mirror controllers, seat switches, and window lift modules. The Enhanced USART supports LIN master/slave with hardware address detection, eliminating the need for an external LIN transceiver on the slave side when paired with a discrete LIN phy. The 14 ADC channels read switch positions and potentiometer wiper voltages, while the 3 PWM modules drive small DC motors or LED backlights. The extended -40 °C to +125 °C temperature grade (denoted by /E) meets underhood and cabin thermal requirements. The 7 KB flash is sufficient for state-machine based LIN slaves with simple diagnostics.
Recommended
Consumer Appliance Control Board
The PIC16F747-E/ML integrates nearly all of the housekeeping logic required by white-goods control boards: 14 ADC channels read temperature sensors, water level probes, and user potentiometers; 3 PWM modules drive triacs for heater elements, fan speed control, or variable-speed pumps; and the MSSP drives an SPI or I²C display and EEPROM. The 7 KB flash comfortably fits state-machine control firmware plus lookup tables, and the 368 bytes of RAM handle small display buffers. The exposed thermal pad on the 44-VQFN package keeps the junction temperature manageable even when the MCU is mounted near hot power components, while the wide 2.0-5.5 V supply range allows direct connection to rectified mains-aux rails.
Recommended
Low-Power IoT Sensor Node (Wired)
Wired IoT edge nodes benefit from the PIC16F747-E/ML combination of nanoWatt Technology, sleep currents in the microamp range, and a wide supply range that supports direct battery connection. The 14 ADC channels multiplex multiple analog sensors, while the MSSP drives I²C peripheral sensors and the Enhanced USART provides RS-485 connectivity back to a wired backhaul. The 20 MHz CPU is fast enough to encrypt and transmit packets before returning to sleep. Because most battery-powered nodes have headroom for a 44-pin package, the 44-VQFN Exposed Pad provides robust thermal performance for outdoor enclosures.
Recommended
HVAC Damper / Valve Actuator Controller
In HVAC damper and proportional valve actuators, the PIC16F747-E/ML provides closed-loop position control using the 10-bit ADC to read the actuator potentiometer feedback, and the 3 PWM modules to drive the H-bridge FETs. The Enhanced USART supports Modbus RTU over RS-485 for communication with a building automation controller. The 36 I/O pins allow interfacing to multiple end-switches, manual override buttons, and status indicators. The wide -40 °C to +125 °C operating temperature ensures reliable operation in mechanical rooms and rooftop units, while nanoWalt Technology is essential for battery-backed or energy-harvested actuator designs.
Recommended
User Interface / Keypad / Display Controller
The PIC16F747-E/ML is well-matched as a scan-controller for medium-density matrix keypads and character/graphic LCDs. The 36 I/O pins are sufficient to scan an 8 x 8 key matrix directly, while the MSSP drives a serial LCD or OLED display. The 3 timers generate keypad debounce intervals and display refresh rates without CPU intervention. The 7 KB flash accommodates bitmap lookup tables for menu UIs, and 368 bytes of RAM are sufficient for key buffer and display frame buffers. The 44-VQFN Exposed Pad allows the MCU to be embedded behind the display PCB, saving front-panel space.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F747-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F747-I/ML | PIC16LF747-I/ML | PIC16F74-I/ML | PIC16F74T-I/ML | PIC16F77-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VQFN Exposed Pad (ML) | 44-VQFN Exposed Pad (ML) - same | 44-VQFN Exposed Pad (ML) - same | 44-VQFN Exposed Pad (ML) - same | 44-VQFN Exposed Pad (ML) - same | 44-VQFN Exposed Pad (ML) - same |
| Program Memory | 7 KB flash | 7 KB flash | 7 KB flash | 4 KB flash | 4 KB flash | OTP/EPROM |
| RAM Size | 368 bytes | 368 bytes | 368 bytes | 192 bytes | 192 bytes | 368 bytes |
| Max CPU Speed | 20 MHz | 20 MHz | 10 MHz | 20 MHz | 20 MHz | 20 MHz |
| Supply Voltage | 2.0-5.5 V | 2.0-5.5 V | 2.0-3.6 V | 2.0-5.5 V | 2.0-5.5 V | 2.0-5.5 V |
| Operating Temperature | -40 to +125 °C (Extended) | -40 to +85 °C (Industrial) | -40 to +85 °C (Industrial) | -40 to +85 °C (Industrial) | -40 to +85 °C (Industrial) | -40 to +85 °C (Industrial) |
| Program Memory Type | Flash (self-programmable) | Flash | Flash | Flash | Flash | OTP / EPROM |
| Number of I/O | 36 | 36 | 36 | 33 | 33 | 36 |
Key Differentiators
- Wider operating temperature range than industrial-grade siblings (vs PIC16F747-I/ML)
- 7 KB flash versus 4 KB on PIC16F74 family (vs PIC16F74-I/ML)
- Flash memory with self-programmability versus EPROM/OTP (vs PIC16F77-I/ML)
- Higher 20 MHz CPU speed versus 10 MHz LF variant (vs PIC16LF747-I/ML)
Design Notes
The 44-VQFN Exposed Pad (ML) package dissipates heat primarily through the exposed thermal pad on the underside of the IC. Per Microchip datasheet DS39609D, the EP must be soldered directly to a PCB ground copper pour of at least 1 square inch to keep junction temperature within safe limits. Estimating with theta_JA of approximately 28 °C/W on a 4-layer JEDEC test board: at 20 MHz and 5 V, typical active current is ~13 mA (0.065 W dissipation), which yields a junction temperature rise of ~1.8 °C above ambient - well within safe operating area. Industrial designs running near the +125 °C ceiling should still verify with a thermal probe in the final enclosure.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin and a bulk 10 µF tantalum or ceramic capacitor on the main VDD rail. Add a 10-100 nF cap on the MCLR/VPP pin if the pin is used in reset mode to filter noise spikes. For AD converter accuracy, keep analog traces short and isolated from digital switching traces, and add a ferrite bead between digital and analog VDD planes if shared. Per datasheet DS39609D, the AVdd pin (when present) should be tied to the same supply as VDD with its own 100 nF + 10 µF decoupling network.
RB6 and RB7 are shared between PORTB digital I/O and the ICSP/ICD programming pins (PGC and PGD respectively). Designs that wire these pins directly to LEDs without series resistors, or to relays without isolation, will fail to enter ICSP programming mode because the loading prevents the programmer from driving the lines. Series resistors of at least 4.7 kΩ, or buffers, are recommended. Additionally, the MCLR pin should be pulled high through a 10 kΩ resistor with a 100 nF cap to ground for noise immunity; never leave MCLR floating.
When using the Enhanced USART in LIN mode, route the TX/RX traces as a differential pair if the bus length exceeds 1 meter, with characteristic impedance of 100 Ω and termination at the master end only. For SPI peripherals running above 4 MHz, keep traces under 50 mm and add 22-33 Ω series damping resistors at the driver output. The MSSP I²C bus requires 4.7 kΩ-10 kΩ pull-ups on SCL and SDA; values depend on bus capacitance and speed grade per datasheet DS39609D, Section 15.
nanoWalt Technology provides multiple power-managed modes: Run, Idle, Sleep, and several watchdog-timed wake intervals. Per datasheet DS39609D, Sleep mode can reduce quiescent current to under 1 µA with the WDT disabled, but the ADC must be reconfigured after wake-up because its internal reference capacitor discharges. When using battery backup, route the backup supply through a Schottky diode OR-ing circuit and enable the Brown-out Reset (BOR) to avoid undefined execution at low VDD.
Compliance Information
RoHS compliance per Microchip product page. AEC-Q100 not qualified - select automotive-specific PIC16 variants if required. Halogen-free status not explicitly stated in verified web data.
