PIC16LF15355-E/SS - 32MHz 8-bit MCU, 14KB Flash, 28-SSOP | Microchip
Référence : PIC16LF15355-E/SS ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.21 | $2,21 |
| 10 | $1.96 | $19,60 |
| 100 | $1.62 | $162,00 |
| 500 | $1.42 | $710,00 |
| 1 000 | $1.28 | $1 280,00 |
PIC16LF15355-E/SS Présentation
A microcontroller, commonly abbreviated MCU, is a single-chip computer that integrates a CPU core, program memory (FLASH/ROM), data memory (RAM), and programmable peripherals. The PIC16F architecture falls under the 8-bit MCU hierarchy, sitting below 16-bit PIC24/dsPIC and 32-bit ARM Cortex-M families. XLP (eXtreme Low-Power) is Microchip's branding for current-managing techniques that target battery-powered applications. SSOP (Shrink Small Outline Package) is a surface-mount plastic package family with 0.65 mm pitch, descended from SOIC and occupying less board area.
Key features include 32 MHz MIPS performance, 14 KB self-programmable FLASH, 1 KB SRAM, 4 PWMs (10-bit), a 5-bit DAC, an ADC with computation engine (ADC2), comparators, a Configurable Logic Cell (CLC), Complementary Waveform Generator (CWG), and 2 EUSART modules plus SPI and I2C. XLP technology delivers deep-sleep currents in the nanoampere range, enabling coin-cell and energy-harvesting deployments.
Typical applications include low-power IoT sensor nodes, battery-powered consumer electronics, industrial control loops, and automotive body modules. The 28-pin SSOP footprint and rich peripheral set make it attractive for compact mixed-signal designs that require multiple communication buses.
When designing with this device, ensure proper decoupling (typically 100 nF plus 1-10 uF bulk) near VDD, and verify the chosen programming/debug header (e.g., ICSP) reaches all required pins. The 32 MHz internal oscillator permits operation without an external crystal in many use cases.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a one-stop reference for engineers evaluating this part.
Alternatives de remplacement direct pour PIC16LF15355-E/SS — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC16LF15355-E/SS (même facteur de forme et même empreinte) — différant par ADC, Package, DAC, Operating Temperature, PWM Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC16LF15354-E/SS
✅ Remplacement direct✓ En stock
$0.95 / unité
Voir la fiche technique →PIC16LF15356-E/SS
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC16F15355-E/SS
✅ Remplacement direct✓ En stock
$1.18 / unité
Voir la fiche technique →PIC16LF15344-E/SS
✅ Remplacement direct✓ En stock
$1.05 / unité
Voir la fiche technique →PIC16LF15354T-I/SS
✅ Remplacement direct✓ En stock
$1.16 / unité
Voir la fiche technique →PIC16LF15354-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.95 / unité
Voir la fiche technique →PIC16LF15345T-I/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$0.78 / unité
Voir la fiche technique →PIC16LF15355-E/SS Valeurs maximales et caractéristiques électriques
| Core Architecture | 8-bit PIC16 |
| Program Memory (FLASH) | 14 KB (8K x 14) |
| RAM | 1 KB |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V (LF variant) |
| Boîtier | 28-pin SSOP (5.30 mm body) |
| Terminal Pitch | 0.65 mm |
| Number of PWM Channels | 4 (10-bit) |
| Number of Comparators | Yes |
| DAC | Yes (5-bit) |
| ADC | Yes (with computation, ADC2) |
| EUSART | 2 |
| SPI / I2C | 1 SPI, 1 I2C |
| Configurable Logic Cell (CLC) | 4 |
| Complementary Waveform Generator (CWG) | Yes |
| Low-Power Technology | XLP (nanoWatt XLP) |
| Plage de température de fonctionnement | -40C to +125C (E suffix = extended) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| CPU Bit Width | 8-bit |
Configuration des broches de PIC16LF15355-E/SS
| Broche 1 | RA0/ANA0/ICSPCLK — Bidirectional I/O, analog input, ICSP clock |
| Broche 2 | RA1/ANA1/ICSPDAT — Bidirectional I/O, analog input, ICSP data |
| Broche 3 | RA2/ANA2 — Bidirectional I/O, analog input |
| Broche 4 | RA3/MCLR/VPP — Bidirectional I/O, Master Clear (reset), programming voltage input |
| Broche 5 | RA4/ANB3 — Bidirectional I/O, analog input |
| Broche 6 | RA5/ANB2 — Bidirectional I/O, analog input |
| Broche 7 | VSS — Ground reference |
| Broche 8 | RA7/OSC1/CLKIN — I/O, oscillator input, external clock input |
| Broche 9 | RA6/OSC2/CLKOUT — I/O, oscillator output, clock output |
| Broche 10 | RC0 — Bidirectional I/O |
| Broche 11 | RC1 — Bidirectional I/O |
| Broche 12 | RC2 — Bidirectional I/O |
| Broche 13 | RC3 — Bidirectional I/O |
| Broche 14 | RC4 — Bidirectional I/O |
| Broche 15 | RC5 — Bidirectional I/O |
| Broche 16 | RC6 — Bidirectional I/O |
| Broche 17 | RC7 — Bidirectional I/O |
| Broche 18 | VSS — Ground reference |
| Broche 19 | RB0 — Bidirectional I/O |
| Broche 20 | RB1 — Bidirectional I/O |
| Broche 21 | RB2 — Bidirectional I/O |
| Broche 22 | RB3 — Bidirectional I/O |
| Broche 23 | RB4 — Bidirectional I/O, interrupt-on-change |
| Broche 24 | RB5 — Bidirectional I/O, interrupt-on-change |
| Broche 25 | RB6 — Bidirectional I/O, interrupt-on-change, ICSP clock |
| Broche 26 | RB7 — Bidirectional I/O, interrupt-on-change, ICSP data |
| Broche 27 | AVDD — Analog supply voltage |
| Broche 28 | VDD — Digital supply voltage |
Applications typiques
PIC16LF15355-E/SS convient pour 6 applications: Battery-Powered IoT Sensor Node, Industrial Process Sensor Interface, Consumer Electronics UI Controller, Automotive Body and Lighting Module, Energy-Harvesting Wireless Switch, Medical Wearable Sensor Hub.
Battery-Powered IoT Sensor Node
The PIC16LF15355-E/SS is well matched to battery-powered IoT sensor nodes where standby current dominates the energy budget. Its XLP technology delivers deep-sleep currents in the tens of nanoamps, while the 32 MHz MIPS core bursts active-mode processing in milliseconds, then returns to sleep. The integrated ADC with ADC2 computation engine samples analog sensors autonomously, waking the CPU only when threshold crossings occur. In a typical coin-cell deployment, the 1.8V minimum supply enables use with single-cell alkaline or rechargeable chemistries without boosting. The 14 KB FLASH comfortably hosts BLE command stacks, sensor-fusion code, and OTA update plumbing for nodes that report periodically over SPI/I2C peripherals.
Recommandé
Industrial Process Sensor Interface
For industrial 4-20 mA loop-powered or 24V-bus transducer interfaces, the PIC16LF15355-E/SS provides the analog front-end integration that simplifies BOM. The 5-bit DAC plus ADC2 computation engine captures sensor readings and conditions them locally, while 4 PWMs drive H-bridge actuators or analog signal-conditioning op-amps. Two EUSART interfaces handle parallel RS-485 or RS-232 buses, and SPI enables high-speed digital sensor interfaces. The -40C to +125C extended industrial temperature range (E suffix) supports factory-floor and outdoor enclosures. Engineers typically pair it with isolation barriers and TVS protection to meet IEC 61000-4 surge/ESD immunity requirements for industrial sensors.
Recommandé
Consumer Electronics UI Controller
For consumer products with capacitive touch and LED feedback, the PIC16LF15355-E/SS brings together CWG, 4 PWMs, comparator, and 4 CLC blocks to handle actuator timing without external logic. The 4 Configurable Logic Cells synthesize glue logic - flip-flops, AND/OR gates, edge detectors - offloading tiny but timing-critical chores from the CPU. Designers use the CWG to produce complementary PWMs for motor half-bridges or LED drivers in wearable form factors. The 28-SSOP footprint is compact enough for sub-1-square-inch PCBs in headphones, razors, or smart-home wall switches where cost, size, and low standby drain jointly determine platform choice.
Recommandé
Automotive Body and Lighting Module
In body-electronics modules (e.g., LED rear-lamps, mirror controllers, HVAC knobs), the PIC16LF15355-E/SS can serve non-safety sub-systems. Its 4 PWMs drive N-channel MOSFETs in LED string current sinks, and CWG produces the dead-time insertion critical for half-bridge switching. The 32 MHz core handles LIN bus communication via EUSART plus a software-implemented LIN protocol stack, which fits comfortably in the 14 KB FLASH. For regulated automotive rails (12V), the device operates from a pre-regulated 3.3V supply through a TVS-protected LDO such as the MCP1790. Designers reserve AEC-Q100-graded variants like PIC16F15355T-I/SS for safety-relevant sub-systems.
Recommandé
Energy-Harvesting Wireless Switch
Energy-harvesting wireless wall switches depend on sub-100 nA standby current and microsecond wake-to-transmit times - both delivered by the PIC16LF15355-E/SS XLP architecture. The 1.8V minimum input aligns with low-voltage harvester rectifiers and small supercap reservoirs. Designers typically build the wake-up circuit with the on-chip comparator to detect button presses without CPU wake, hold the event in a CLC latch, then bring up the CPU and a companion RF transmitter for a single millisecond. The 14 KB FLASH supports dynamic RF protocol tuning and AES-light encryption, while the tiny 28-SSOP package fits behind the rocker actuator with minimal intrusion depth.
Recommandé
Medical Wearable Sensor Hub
Wearable medical devices such as continuous-glucose-monitor (CGM) patches, pulse oximeters, and temperature bands benefit from the PIC16LF15355-E/SS low leakage and tight analog integration. The ADC2 computation engine averages, filters, and threshold-detects onboard so the main CPU sleeps until a meaningful event arrives, drastically extending the sensor life on coin cells. SPI interfaces to digital biosensors (e.g., MAX30102 heart-rate IC), and the 5-bit DAC drives bias networks for analog optical sub-systems. Designers appreciate the small 28-SSOP footprint for ultra-thin form factors, while the -40C to +125C rating supports cryogenic shipping logistics and skin-temperature steady-state operation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC16LF15355-E/SS — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC16LF15354-E/SS | PIC16LF15356-E/SS | PIC16F15355-E/SS | PIC16LF15344-E/SS |
|---|---|---|---|---|---|
| Package | 28-SSOP (5.30 mm body, 0.65 mm pitch) | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Memory | 14 KB (8K x 14) | 7 KB | 28 KB | 14 KB | 7 KB |
| RAM | 1 KB | 1 KB | 2 KB | 1 KB | 1 KB |
| Supply Voltage | 1.8V to 3.6V (LF) | 1.8V to 3.6V | 1.8V to 3.6V | 2.3V to 5.5V (F non-LF) | 1.8V to 3.6V |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| PWM Channels | 4 (10-bit) | 4 (10-bit) | 4 (10-bit) | 4 (10-bit) | 4 (10-bit) |
| EUSART | 2 | 2 | 2 | 2 | 2 |
| AEC-Q100 Automotive Qualified | No (E suffix = -40C to +125C extended only) | No | No | No | No |
Principaux différenciateurs
- Highest memory tier while keeping the same 28-SSOP footprint within the family (vs PIC16LF15354-E/SS)
- Same peripheral set as larger FLASH variant without the BOM premium (vs PIC16LF15356-E/SS)
- Symmetric pin compatibility with the 5V-capable PIC16F15355-E/SS (vs PIC16F15355-E/SS)
Notes de conception
Estimated: at 3.3V VDD and 32 MHz active CPU with all peripherals running, the PIC16LF15355-E/SS typically draws 2-5 mA. Sleep current can fall to tens of nanoamps using the on-chip low-power modes; the datasheet's XLP section specifies maximum deep-sleep current under 100 nA typical. Place a 100 nF decoupling capacitor as close as possible to pin 28 (VDD) and pin 18 (VSS), and add a 1-10 uF bulk cap on VDD to handle 32 MHz transient loads during peripheral activation.
The MCLR pin (pin 4) cannot be left floating - it must be tied to VDD through a 10-50 kohm pull-up for normal operation, or to a push-button for manual reset. Decoupling is mandatory: missing 100 nF caps on VDD/AVDD cause erratic ADC readings and spurious watchdog resets. When using ICSP with debugger attached, ensure no load on ICSPCLK (pin 1) or ICSPDAT (pin 2) exceeds 25 pF or high-speed programming may fail intermittently.
Estimated: at 32 MHz and 3.3V, the PIC16LF15355-E/SS core dissipates well below 100 mW continuous, far inside the SSOP thermal envelope. However, designer must respect the maximum junction temperature of 150C. In enclosed IoT devices at 60C ambient, the small SSOP package has theta_JA around 80-100 C/W for the SSOP pad pattern in still air. The PIC16LF15355-E/SS is not normally a thermal-design driver.
Informations de conformité
RoHS compliant and lead-free per Microchip product page. E suffix denotes extended temperature grade -40C to +125C but is NOT AEC-Q100 automotive qualified; for AEC-Q100 use the PIC16F15355T-E/SNA, PIC16F15355T-I/SS, or PIC16F15355-E/SS automotive-graded MPNs. REACH and halogen-free status not surfaced in distributor data - see Microchip compliance letter for definitive values.
