PIC24EP512GP206-H/MR - 60 MIPS 16-bit MCU 512KB Flash | Microchip
Référence : PIC24EP512GP206-H/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $8.12 | $81,20 |
| 100 | $7.2 | $720,00 |
| 500 | $6.35 | $3 175,00 |
| 1 000 | $5.61 | $5 610,00 |
PIC24EP512GP206-H/MR Présentation
A 16-bit MCU (microcontroller unit) is a single-chip computer containing a CPU core, program memory (Flash), working memory (RAM), and integrated peripherals such as ADCs, timers, and communication interfaces. The PIC24E architecture used in this device sits in Microchip's dsPIC/PIC24 line, providing higher performance than 8-bit PIC MCUs while retaining deterministic interrupt behavior and a C-friendly instruction set aimed at real-time control.
Key features of the PIC24EP512GP206 include a 70 MIPS enhanced core (60 MIPS at 150C), up to 512 KB self-programmable Flash, 48 KB SRAM, integrated op amps, a Charge Time Measurement Unit (CTMU), and a Peripheral Trigger Generator (PTG). The device integrates a 10/12-bit ADC with up to 16 channels, multiple UART/SPI/I2C interfaces, and PWM outputs suitable for motor control and digital power conversion.
The PIC24E core uses a 16-bit modified Harvard architecture with a 24-bit instruction word, enabling compact code density and predictable execution. Internal PLLs drive the 60 MIPS throughput from an external crystal or internal FRC, and the on-chip op amps can condition sensor signals without external amplification stages. The CTMU allows capacitive touch and precise time-of-flight measurements, while the PTG chains peripheral events for automated sequencing without CPU intervention.
Typical applications include industrial motor control (BLDC, PMSM, stepper), digital power conversion (PFC, LLC, full-bridge converters), automotive sensor interfaces, factory automation PLCs, building HVAC controls, and medical instrumentation requiring extended temperature operation. The combination of op amps, ADC, CTMU, and PTG reduces external component count in mixed-signal designs.
When designing with this part, ensure the 64-VQFN package has adequate PCB thermal copper under the exposed pad, and validate the operating temperature grade (H = -40C to +150C) matches your application profile. JTAG/ICSP programming requires proper signal isolation from high-current switching nodes.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes that complement the manufacturer datasheet, helping engineers select and qualify the PIC24EP512GP206-H/MR efficiently.
Alternatives de remplacement direct pour PIC24EP512GP206-H/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24EP512GP206-H/MR (même facteur de forme et même empreinte) — différant par Package, ADC, CPU Speed, Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24EP512GP206-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24EP256MC206-I/MR
✅ Remplacement direct✓ En stock
$6.39 / unité
Voir la fiche technique →PIC24EP128MC206-I/MR
✅ Remplacement direct✓ En stock
$4.77 / unité
Voir la fiche technique →PIC24EP512GP206-H/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24E 16-bit enhanced core |
| CPU Speed | 60 MIPS (70 MIPS core at lower temperature) |
| Program Memory (Flash) | 512 KB |
| RAM | 48 KB |
| Nombre de broches | 64 |
| Boîtier | VQFN-64 (9x9 mm) with exposed thermal pad |
| Operating Temperature Range (H grade) | -40C to +150C |
| ADC | 10/12-bit, up to 16 channels |
| Op Amps | Integrated (peripheral) |
| CTMU (Charge Time Measurement Unit) | Yes |
| Peripheral Trigger Generator (PTG) | Yes |
| Communication Interfaces | UART, SPI, I2C |
| PWM Outputs | Yes (high-speed PWM) |
| Self-Programmable Flash | Yes |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| ICSP / JTAG Programming | Yes |
Configuration des broches de PIC24EP512GP206-H/MR
| Broche 1 | RPn/ANn — Remappable peripheral / analog input (function varies by configuration) |
| Broche 2 | RPn/ANn — Remappable peripheral / analog input |
| Broche 3 | RPn/ANn — Remappable peripheral / analog input |
| Broche 4 | RPn/ANn — Remappable peripheral / analog input |
| Broche 5 | RPn/ANn — Remappable peripheral / analog input |
| Broche 6 | VDD — I/O supply voltage |
| Broche 7 | RPn/ANn — Remappable peripheral / analog input |
| Broche 8 | RPn/ANn — Remappable peripheral / analog input |
| Broche 9 | RPn/ANn — Remappable peripheral / analog input |
| Broche 10 | RPn/ANn — Remappable peripheral / analog input |
| Broche 11 | RPn/ANn — Remappable peripheral / analog input |
| Broche 12 | RPn/ANn — Remappable peripheral / analog input |
| Broche 13 | RPn/ANn — Remappable peripheral / analog input |
| Broche 14 | VSS — Ground reference |
| Broche 15 | OSC1/RC12 — Crystal oscillator input / remappable I/O |
| Broche 16 | OSC2/RC15 — Crystal oscillator output / remappable I/O |
| Broche 17 | RPn — Remappable peripheral I/O |
| Broche 18 | RPn — Remappable peripheral I/O |
| Broche 19 | RPn — Remappable peripheral I/O |
| Broche 20 | RPn — Remappable peripheral I/O |
| Broche 21 | VDD — I/O supply voltage |
| Broche 22 | RPn — Remappable peripheral I/O |
| Broche 23 | RPn — Remappable peripheral I/O |
| Broche 24 | RPn — Remappable peripheral I/O |
| Broche 25 | RPn — Remappable peripheral I/O |
| Broche 26 | RPn — Remappable peripheral I/O |
| Broche 27 | RPn — Remappable peripheral I/O |
| Broche 28 | RPn — Remappable peripheral I/O |
| Broche 29 | RPn — Remappable peripheral I/O |
| Broche 30 | VSS — Ground reference |
| Broche 31 | RPn — Remappable peripheral I/O |
| Broche 32 | RPn — Remappable peripheral I/O |
| Broche 33 | RPn — Remappable peripheral I/O |
| Broche 34 | RPn — Remappable peripheral I/O |
| Broche 35 | RPn — Remappable peripheral I/O |
| Broche 36 | VDD — I/O supply voltage |
| Broche 37 | RPn — Remappable peripheral I/O |
| Broche 38 | RPn — Remappable peripheral I/O |
| Broche 39 | RPn — Remappable peripheral I/O |
| Broche 40 | RPn — Remappable peripheral I/O |
| Broche 41 | RPn — Remappable peripheral I/O |
| Broche 42 | RPn — Remappable peripheral I/O |
| Broche 43 | RPn — Remappable peripheral I/O |
| Broche 44 | RPn — Remappable peripheral I/O |
| Broche 45 | RPn — Remappable peripheral I/O |
| Broche 46 | RPn — Remappable peripheral I/O |
| Broche 47 | RPn — Remappable peripheral I/O |
| Broche 48 | VSS — Ground reference |
| Broche 49 | RPn — Remappable peripheral I/O |
| Broche 50 | RPn — Remappable peripheral I/O |
| Broche 51 | RPn — Remappable peripheral I/O |
| Broche 52 | RPn — Remappable peripheral I/O |
| Broche 53 | VDD — I/O supply voltage |
| Broche 54 | RPn — Remappable peripheral I/O |
| Broche 55 | RPn — Remappable peripheral I/O |
| Broche 56 | RPn — Remappable peripheral I/O |
| Broche 57 | RPn — Remappable peripheral I/O |
| Broche 58 | RPn — Remappable peripheral I/O |
| Broche 59 | RPn — Remappable peripheral I/O |
| Broche 60 | RPn — Remappable peripheral I/O |
| Broche 61 | RPn — Remappable peripheral I/O |
| Broche 62 | RPn — Remappable peripheral I/O |
| Broche 63 | RPn — Remappable peripheral I/O |
| Broche 64 | EP (Exposed Pad) — Thermal pad, must be soldered to PCB ground plane |
Applications typiques
PIC24EP512GP206-H/MR convient pour 6 applications: BLDC / PMSM Motor Control, Digital Power Conversion (PFC / LLC), Industrial Sensor Interface / PLC, Automotive Sensor Module, Building HVAC Control Systems, Medical Instrumentation.
BLDC / PMSM Motor Control
The PIC24EP512GP206-H/MR fits BLDC and PMSM motor control because of its 60 MIPS throughput, high-speed PWM outputs, integrated op amps for current sensing, and the Peripheral Trigger Generator (PTG) that sequences ADC-PWM events without CPU intervention. The 10/12-bit ADC with dedicated PWM-trigger sampling captures phase currents synchronously to PWM edges, essential for field-oriented control. The 512 KB Flash accommodates sensorless FOC algorithms and the 48 KB SRAM provides headroom for lookup tables and observers. The H-grade -40C to +150C range allows deployment in integrated motor drives where ambient temperature can exceed 100C near power-stage heatsinks.
Recommandé
Digital Power Conversion (PFC / LLC)
The PIC24EP512GP206-H/MR is well-suited for digital power conversion stages including PFC, LLC, and phase-shifted full-bridge topologies. The 60 MIPS execution handles digital average current mode control loops, while the high-speed PWM outputs drive the power-stage MOSFETs with nanosecond resolution. The integrated op amps condition the current-sense shunt signals before ADC sampling, eliminating external amplifiers. The PTG sequences the ADC sampling relative to PWM edges, achieving deterministic converter behavior. With 512 KB Flash, full digital-compensation firmware fits without external memory.
Recommandé
Industrial Sensor Interface / PLC
For industrial PLCs and sensor interface modules, the PIC24EP512GP206-H/MR offers integrated op amps to condition 4-20 mA current-loop and bridge sensor signals, plus the CTMU for capacitive level or proximity sensing. The 10/12-bit ADC with up to 16 channels multiplexes multiple analog inputs from thermocouples, RTDs, and pressure transducers. UART/SPI/I2C interfaces connect to industrial bus transceivers. The H-grade -40C to +150C operation supports unheated enclosures, factory floor installations, and outdoor cabinets where summer ambient temperatures can be extreme.
Recommandé
Automotive Sensor Module
The PIC24EP512GP206-H/MR's H-grade temperature rating makes it appropriate for automotive sensor modules mounted near heat sources such as transmission housings or engine compartments. The 512 KB Flash supports AUTOSAR or proprietary application firmware, while the 48 KB RAM handles CAN message buffering and sensor-fusion calculations. Integrated op amps condition signals from oxygen sensors, pressure transducers, and position sensors. The CTMU enables robust proximity detection. Note that AEC-Q100 qualification would be required for full automotive compliance - verify with Microchip for the specific automotive-grade part number.
Recommandé
Building HVAC Control Systems
The PIC24EP512GP206-H/MR controls HVAC actuators and sensors in commercial building systems including damper actuators, variable-air-volume boxes, and economizer controllers. The 16-bit ADC reads temperature, humidity, and pressure sensors while the PWM outputs drive brushless DC fans at variable speed. Integrated op amps amplify thermistor bridge signals directly. The CTMU can implement capacitive user-interface buttons on thermostats. The wide temperature range supports equipment-room installations without active cooling, reducing system cost.
Recommandé
Medical Instrumentation
In medical instrumentation such as infusion pumps, patient monitors, and laboratory analyzers, the PIC24EP512GP206-H/MR provides deterministic real-time control for fluid handling and sensor reading. The 60 MIPS performance runs PID loops for pump motor control, while the ADC captures signals from photodetectors, conductivity probes, and electrochemical sensors. The CTMU supports capacitive level detection in fluid reservoirs. The H-grade temperature range supports sterilization environments and equipment deployed in non-climate-controlled clinical settings. Verify IEC 60601 compliance requirements for your specific medical application.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24EP512GP206-H/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24EP512GP206-I/MR | PIC24EP256MC206-I/MR | PIC24EP128MC206-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Flash Memory | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 48 KB | 48 KB | 48 KB | 48 KB |
| CPU Speed | 60 MIPS (H grade) | 70 MIPS (I grade) | 70 MIPS (I grade) | 70 MIPS (I grade) |
| Temperature Grade | H (-40C to +150C) | I (-40C to +85C) | I (-40C to +85C) | I (-40C to +85C) |
| Motor Control Optimization | General Purpose | General Purpose | Motor Control Optimized | Motor Control Optimized |
| Integrated Op Amps | Yes | Yes | Yes (more channels for MC) | Yes (more channels for MC) |
Principaux différenciateurs
- H-grade +150C temperature rating (vs PIC24EP512GP206-I/MR)
- 512 KB Flash vs 256 KB on MC variant (vs PIC24EP256MC206-I/MR)
- General-purpose flexibility vs motor-control specialization (vs PIC24EP256MC206-I/MR)
Notes de conception
The 64-pin VQFN (9x9 mm) package dissipates heat primarily through the exposed thermal pad (pin 64). Per Microchip application note guidelines, the PCB must include a continuous ground copper plane directly under the package, connected to the exposed pad with at least 9 thermal vias (0.3 mm drill, 1 mm pitch) to inner ground layers. Without proper thermal via stitching, the H-grade silicon may not achieve full +150C operation in high-power designs. At 60 MIPS execution with all peripherals active, estimate internal dissipation at 0.5-1 W typical.
Place 100 nF decoupling capacitors on every VDD pin (pins 6, 21, 36, 53) within 2 mm of the package, plus a single 10 uF bulk capacitor at the board's MCU power entry. Separate analog VDD (AVDD) and digital VDD with ferrite beads if available. Keep the OSC1/OSC2 crystal traces short and surrounded by ground pour. The ICSP/ICD signals (PGECx/PGEDx) require 4.7 kohm pull-ups for reliable in-circuit programming in noisy motor-drive environments.
The PIC24EP512GP206-H/MR shares peripherals across remappable pins (RPn); designers must configure PPS (Peripheral Pin Select) at startup to assign UART/SPI/PWM functions to physical pins. Forgetting PPS configuration leaves peripherals inactive. The 'H' temperature grade +150C silicon requires review of PCB material (FR-4 standard grade rated 130C max); consider high-Tg FR-4 or polyimide for sustained operation above 130C. The CTMU calibration must be performed per datasheet procedure for accurate capacitive touch measurements.
Informations de conformité
RoHS compliant per Microchip product page. H-grade silicon extends to +150C but is not AEC-Q100 qualified - contact Microchip for AEC-Q100 automotive variants.
