PIC24EP512GP206-H/MR - 60 MIPS 16-bit MCU 512KB Flash | Microchip
부품 번호: PIC24EP512GP206-H/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.92 | $8.92 |
| 10 | $8.12 | $81.20 |
| 100 | $7.2 | $720.00 |
| 500 | $6.35 | $3,175.00 |
| 1,000 | $5.61 | $5,610.00 |
PIC24EP512GP206-H/MR 개요
A 16-bit MCU (microcontroller unit) is a single-chip computer containing a CPU core, program memory (Flash), working memory (RAM), and integrated peripherals such as ADCs, timers, and communication interfaces. The PIC24E architecture used in this device sits in Microchip's dsPIC/PIC24 line, providing higher performance than 8-bit PIC MCUs while retaining deterministic interrupt behavior and a C-friendly instruction set aimed at real-time control.
Key features of the PIC24EP512GP206 include a 70 MIPS enhanced core (60 MIPS at 150C), up to 512 KB self-programmable Flash, 48 KB SRAM, integrated op amps, a Charge Time Measurement Unit (CTMU), and a Peripheral Trigger Generator (PTG). The device integrates a 10/12-bit ADC with up to 16 channels, multiple UART/SPI/I2C interfaces, and PWM outputs suitable for motor control and digital power conversion.
The PIC24E core uses a 16-bit modified Harvard architecture with a 24-bit instruction word, enabling compact code density and predictable execution. Internal PLLs drive the 60 MIPS throughput from an external crystal or internal FRC, and the on-chip op amps can condition sensor signals without external amplification stages. The CTMU allows capacitive touch and precise time-of-flight measurements, while the PTG chains peripheral events for automated sequencing without CPU intervention.
Typical applications include industrial motor control (BLDC, PMSM, stepper), digital power conversion (PFC, LLC, full-bridge converters), automotive sensor interfaces, factory automation PLCs, building HVAC controls, and medical instrumentation requiring extended temperature operation. The combination of op amps, ADC, CTMU, and PTG reduces external component count in mixed-signal designs.
When designing with this part, ensure the 64-VQFN package has adequate PCB thermal copper under the exposed pad, and validate the operating temperature grade (H = -40C to +150C) matches your application profile. JTAG/ICSP programming requires proper signal isolation from high-current switching nodes.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes that complement the manufacturer datasheet, helping engineers select and qualify the PIC24EP512GP206-H/MR efficiently.
드롭인 대체품: PIC24EP512GP206-H/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24EP512GP206-H/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, CPU Speed, Core Architecture, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24EP512GP206-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC24EP256MC206-I/MR
✅ 드롭인✓ 재고 있음
$6.39 / 개
데이터시트 보기 →PIC24EP128MC206-I/MR
✅ 드롭인✓ 재고 있음
$4.77 / 개
데이터시트 보기 →PIC24EP512GP206-H/MR 최대 정격 & 전기적 특성
| Core Architecture | PIC24E 16-bit enhanced core |
| CPU Speed | 60 MIPS (70 MIPS core at lower temperature) |
| Program Memory (Flash) | 512 KB |
| RAM | 48 KB |
| 핀 수 | 64 |
| 패키지 | VQFN-64 (9x9 mm) with exposed thermal pad |
| Operating Temperature Range (H grade) | -40C to +150C |
| ADC | 10/12-bit, up to 16 channels |
| Op Amps | Integrated (peripheral) |
| CTMU (Charge Time Measurement Unit) | Yes |
| Peripheral Trigger Generator (PTG) | Yes |
| Communication Interfaces | UART, SPI, I2C |
| PWM Outputs | Yes (high-speed PWM) |
| Self-Programmable Flash | Yes |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| ICSP / JTAG Programming | Yes |
PIC24EP512GP206-H/MR 핀 구성
| 핀 1 | RPn/ANn — Remappable peripheral / analog input (function varies by configuration) |
| 핀 2 | RPn/ANn — Remappable peripheral / analog input |
| 핀 3 | RPn/ANn — Remappable peripheral / analog input |
| 핀 4 | RPn/ANn — Remappable peripheral / analog input |
| 핀 5 | RPn/ANn — Remappable peripheral / analog input |
| 핀 6 | VDD — I/O supply voltage |
| 핀 7 | RPn/ANn — Remappable peripheral / analog input |
| 핀 8 | RPn/ANn — Remappable peripheral / analog input |
| 핀 9 | RPn/ANn — Remappable peripheral / analog input |
| 핀 10 | RPn/ANn — Remappable peripheral / analog input |
| 핀 11 | RPn/ANn — Remappable peripheral / analog input |
| 핀 12 | RPn/ANn — Remappable peripheral / analog input |
| 핀 13 | RPn/ANn — Remappable peripheral / analog input |
| 핀 14 | VSS — Ground reference |
| 핀 15 | OSC1/RC12 — Crystal oscillator input / remappable I/O |
| 핀 16 | OSC2/RC15 — Crystal oscillator output / remappable I/O |
| 핀 17 | RPn — Remappable peripheral I/O |
| 핀 18 | RPn — Remappable peripheral I/O |
| 핀 19 | RPn — Remappable peripheral I/O |
| 핀 20 | RPn — Remappable peripheral I/O |
| 핀 21 | VDD — I/O supply voltage |
| 핀 22 | RPn — Remappable peripheral I/O |
| 핀 23 | RPn — Remappable peripheral I/O |
| 핀 24 | RPn — Remappable peripheral I/O |
| 핀 25 | RPn — Remappable peripheral I/O |
| 핀 26 | RPn — Remappable peripheral I/O |
| 핀 27 | RPn — Remappable peripheral I/O |
| 핀 28 | RPn — Remappable peripheral I/O |
| 핀 29 | RPn — Remappable peripheral I/O |
| 핀 30 | VSS — Ground reference |
| 핀 31 | RPn — Remappable peripheral I/O |
| 핀 32 | RPn — Remappable peripheral I/O |
| 핀 33 | RPn — Remappable peripheral I/O |
| 핀 34 | RPn — Remappable peripheral I/O |
| 핀 35 | RPn — Remappable peripheral I/O |
| 핀 36 | VDD — I/O supply voltage |
| 핀 37 | RPn — Remappable peripheral I/O |
| 핀 38 | RPn — Remappable peripheral I/O |
| 핀 39 | RPn — Remappable peripheral I/O |
| 핀 40 | RPn — Remappable peripheral I/O |
| 핀 41 | RPn — Remappable peripheral I/O |
| 핀 42 | RPn — Remappable peripheral I/O |
| 핀 43 | RPn — Remappable peripheral I/O |
| 핀 44 | RPn — Remappable peripheral I/O |
| 핀 45 | RPn — Remappable peripheral I/O |
| 핀 46 | RPn — Remappable peripheral I/O |
| 핀 47 | RPn — Remappable peripheral I/O |
| 핀 48 | VSS — Ground reference |
| 핀 49 | RPn — Remappable peripheral I/O |
| 핀 50 | RPn — Remappable peripheral I/O |
| 핀 51 | RPn — Remappable peripheral I/O |
| 핀 52 | RPn — Remappable peripheral I/O |
| 핀 53 | VDD — I/O supply voltage |
| 핀 54 | RPn — Remappable peripheral I/O |
| 핀 55 | RPn — Remappable peripheral I/O |
| 핀 56 | RPn — Remappable peripheral I/O |
| 핀 57 | RPn — Remappable peripheral I/O |
| 핀 58 | RPn — Remappable peripheral I/O |
| 핀 59 | RPn — Remappable peripheral I/O |
| 핀 60 | RPn — Remappable peripheral I/O |
| 핀 61 | RPn — Remappable peripheral I/O |
| 핀 62 | RPn — Remappable peripheral I/O |
| 핀 63 | RPn — Remappable peripheral I/O |
| 핀 64 | EP (Exposed Pad) — Thermal pad, must be soldered to PCB ground plane |
일반적인 애플리케이션
PIC24EP512GP206-H/MR 적합 용도: 6 애플리케이션s: BLDC / PMSM Motor Control, Digital Power Conversion (PFC / LLC), Industrial Sensor Interface / PLC, Automotive Sensor Module, Building HVAC Control Systems, Medical Instrumentation.
BLDC / PMSM Motor Control
The PIC24EP512GP206-H/MR fits BLDC and PMSM motor control because of its 60 MIPS throughput, high-speed PWM outputs, integrated op amps for current sensing, and the Peripheral Trigger Generator (PTG) that sequences ADC-PWM events without CPU intervention. The 10/12-bit ADC with dedicated PWM-trigger sampling captures phase currents synchronously to PWM edges, essential for field-oriented control. The 512 KB Flash accommodates sensorless FOC algorithms and the 48 KB SRAM provides headroom for lookup tables and observers. The H-grade -40C to +150C range allows deployment in integrated motor drives where ambient temperature can exceed 100C near power-stage heatsinks.
추천
Digital Power Conversion (PFC / LLC)
The PIC24EP512GP206-H/MR is well-suited for digital power conversion stages including PFC, LLC, and phase-shifted full-bridge topologies. The 60 MIPS execution handles digital average current mode control loops, while the high-speed PWM outputs drive the power-stage MOSFETs with nanosecond resolution. The integrated op amps condition the current-sense shunt signals before ADC sampling, eliminating external amplifiers. The PTG sequences the ADC sampling relative to PWM edges, achieving deterministic converter behavior. With 512 KB Flash, full digital-compensation firmware fits without external memory.
추천
Industrial Sensor Interface / PLC
For industrial PLCs and sensor interface modules, the PIC24EP512GP206-H/MR offers integrated op amps to condition 4-20 mA current-loop and bridge sensor signals, plus the CTMU for capacitive level or proximity sensing. The 10/12-bit ADC with up to 16 channels multiplexes multiple analog inputs from thermocouples, RTDs, and pressure transducers. UART/SPI/I2C interfaces connect to industrial bus transceivers. The H-grade -40C to +150C operation supports unheated enclosures, factory floor installations, and outdoor cabinets where summer ambient temperatures can be extreme.
추천
Automotive Sensor Module
The PIC24EP512GP206-H/MR's H-grade temperature rating makes it appropriate for automotive sensor modules mounted near heat sources such as transmission housings or engine compartments. The 512 KB Flash supports AUTOSAR or proprietary application firmware, while the 48 KB RAM handles CAN message buffering and sensor-fusion calculations. Integrated op amps condition signals from oxygen sensors, pressure transducers, and position sensors. The CTMU enables robust proximity detection. Note that AEC-Q100 qualification would be required for full automotive compliance - verify with Microchip for the specific automotive-grade part number.
추천
Building HVAC Control Systems
The PIC24EP512GP206-H/MR controls HVAC actuators and sensors in commercial building systems including damper actuators, variable-air-volume boxes, and economizer controllers. The 16-bit ADC reads temperature, humidity, and pressure sensors while the PWM outputs drive brushless DC fans at variable speed. Integrated op amps amplify thermistor bridge signals directly. The CTMU can implement capacitive user-interface buttons on thermostats. The wide temperature range supports equipment-room installations without active cooling, reducing system cost.
추천
Medical Instrumentation
In medical instrumentation such as infusion pumps, patient monitors, and laboratory analyzers, the PIC24EP512GP206-H/MR provides deterministic real-time control for fluid handling and sensor reading. The 60 MIPS performance runs PID loops for pump motor control, while the ADC captures signals from photodetectors, conductivity probes, and electrochemical sensors. The CTMU supports capacitive level detection in fluid reservoirs. The H-grade temperature range supports sterilization environments and equipment deployed in non-climate-controlled clinical settings. Verify IEC 60601 compliance requirements for your specific medical application.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24EP512GP206-H/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24EP512GP206-I/MR | PIC24EP256MC206-I/MR | PIC24EP128MC206-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Flash Memory | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 48 KB | 48 KB | 48 KB | 48 KB |
| CPU Speed | 60 MIPS (H grade) | 70 MIPS (I grade) | 70 MIPS (I grade) | 70 MIPS (I grade) |
| Temperature Grade | H (-40C to +150C) | I (-40C to +85C) | I (-40C to +85C) | I (-40C to +85C) |
| Motor Control Optimization | General Purpose | General Purpose | Motor Control Optimized | Motor Control Optimized |
| Integrated Op Amps | Yes | Yes | Yes (more channels for MC) | Yes (more channels for MC) |
주요 차별점
- H-grade +150C temperature rating (vs PIC24EP512GP206-I/MR)
- 512 KB Flash vs 256 KB on MC variant (vs PIC24EP256MC206-I/MR)
- General-purpose flexibility vs motor-control specialization (vs PIC24EP256MC206-I/MR)
설계 노트
The 64-pin VQFN (9x9 mm) package dissipates heat primarily through the exposed thermal pad (pin 64). Per Microchip application note guidelines, the PCB must include a continuous ground copper plane directly under the package, connected to the exposed pad with at least 9 thermal vias (0.3 mm drill, 1 mm pitch) to inner ground layers. Without proper thermal via stitching, the H-grade silicon may not achieve full +150C operation in high-power designs. At 60 MIPS execution with all peripherals active, estimate internal dissipation at 0.5-1 W typical.
Place 100 nF decoupling capacitors on every VDD pin (pins 6, 21, 36, 53) within 2 mm of the package, plus a single 10 uF bulk capacitor at the board's MCU power entry. Separate analog VDD (AVDD) and digital VDD with ferrite beads if available. Keep the OSC1/OSC2 crystal traces short and surrounded by ground pour. The ICSP/ICD signals (PGECx/PGEDx) require 4.7 kohm pull-ups for reliable in-circuit programming in noisy motor-drive environments.
The PIC24EP512GP206-H/MR shares peripherals across remappable pins (RPn); designers must configure PPS (Peripheral Pin Select) at startup to assign UART/SPI/PWM functions to physical pins. Forgetting PPS configuration leaves peripherals inactive. The 'H' temperature grade +150C silicon requires review of PCB material (FR-4 standard grade rated 130C max); consider high-Tg FR-4 or polyimide for sustained operation above 130C. The CTMU calibration must be performed per datasheet procedure for accurate capacitive touch measurements.
규정 준수 정보
RoHS compliant per Microchip product page. H-grade silicon extends to +150C but is not AEC-Q100 qualified - contact Microchip for AEC-Q100 automotive variants.
