PIC32MK0512GPD064-E/MR - 120MHz 512KB Flash MCU | Microchip
Référence : PIC32MK0512GPD064-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.4 | $8,40 |
| 10 | $7.55 | $75,50 |
| 100 | $6.72 | $672,00 |
| 500 | $6.05 | $3 025,00 |
| 1 000 | $5.38 | $5 380,00 |
PIC32MK0512GPD064-E/MR Présentation
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a programmable peripheral set around a common bus. The PIC32MK family sits inside the broader PIC32 portfolio and is built on the MIPS32 microAptiv core, which places it under the larger category hierarchy: MCU -> microcontroller -> embedded processor -> semiconductor. The MK sub-family specifically extends PIC32 with high-performance analog, motor-control PWMs, and CAN-FD connectivity for industrial control.
Key features of the PIC32MK0512GPD064-E/MR include: 512KB Flash program memory, 128KB SRAM, a 12-bit ADC module with up to 42 analog inputs, multiple CAN-FD ports, six UART, six SPI, four I2C, and a USB Full-Speed interface. The device also integrates DSP extensions and a single-precision FPU, enabling signal-processing workloads directly on the MCU. The -E temperature grade extends operating range to -40C to +125C for harsh-environment designs.
Architecturally, the PIC32MK leverages the microAptiv pipeline with hardware multiply/divide and DSP ASE for efficient fixed-point signal processing. The advanced PWM module supports complementary outputs with programmable dead-time, ideal for driving three-phase motor inverters and digital power converters. The integrated op-amps and comparators reduce external analog count for current-shunt and BEMF sensing.
Typical applications include BLDC and PMSM motor control (field-oriented control), industrial servo drives, solar inverters, PLCs, IIoT edge nodes, and automotive body/comfort controllers. The combination of CAN-FD, USB, and high-resolution PWM makes the PIC32MK well-suited to connected industrial equipment. When designing with this part, verify the -E temperature grade covers your thermal envelope and budget sufficient Flash for a fail-safe bootloader alongside the application image.
Alternatives de remplacement direct pour PIC32MK0512GPD064-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MK0512GPD064-E/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Operating Temperature, Core Architecture, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MK0512GPD064-I/MR
✅ Remplacement direct✓ En stock
$5.4 / unité
Voir la fiche technique →PIC32MK0512GPD064T-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MK0512GPK064-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MK0512MCJ064-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MK1024GPD064-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MK0512GPD064-E/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv with FPU and DSP ASE |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB |
| Data Memory (SRAM) | 128 KB |
| Operating Voltage | 3.3 V typical |
| Boîtier | 64-pin QFN (MR) 9x9 mm with EP |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +125C (-E grade) |
| ADC | 12-bit, up to 42 analog channels |
| UART | 6 |
| SPI | 6 |
| I2C | 4 |
| USB | USB Full-Speed |
| CAN | CAN-FD |
| PWM Outputs | Multiple high-resolution PWM channels |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MK0512GPD064-E/MR
| Broche 1 | RB0 — GPIO/AN0/C1INA/RPB0 |
| Broche 2 | RB1 — GPIO/AN1/RPB1 |
| Broche 3 | RB2 — GPIO/AN2/C1INB/RPB2 |
| Broche 4 | RB3 — GPIO/AN3/C1INC/RPB3 |
| Broche 5 | VSS — Ground |
| Broche 6 | RB4 — GPIO/AN4/C1IND/RPB4 |
| Broche 7 | RB5 — GPIO/AN5/RPB5 |
| Broche 8 | RB6 — GPIO/AN6/RPB6 |
| Broche 9 | RB7 — GPIO/AN7/RPB7 |
| Broche 10 | RB8 — GPIO/AN8/RPB8 |
| Broche 11 | RB9 — GPIO/AN9/RPB9 |
| Broche 12 | RB10 — GPIO/AN10/RPB10 |
| Broche 13 | RB11 — GPIO/AN11/RPB11 |
| Broche 14 | RB12 — GPIO/AN12/RPB12 |
| Broche 15 | RB13 — GPIO/AN13/RPB13 |
| Broche 16 | RB14 — GPIO/AN14/RPB14 |
| Broche 17 | RB15 — GPIO/AN15/RPB15 |
| Broche 18 | VSS — Ground |
| Broche 19 | VDD — 3.3V core supply |
| Broche 20 | RC0 — GPIO/RPC0 |
| Broche 21 | RC1 — GPIO/RPC1 |
| Broche 22 | RC2 — GPIO/RPC2 |
| Broche 23 | RC3 — GPIO/RPC3 |
| Broche 24 | RC4 — GPIO/RPC4 |
| Broche 25 | RC5 — GPIO/RPC5 |
| Broche 26 | RC6 — GPIO/RPC6 |
| Broche 27 | RC7 — GPIO/RPC7 |
| Broche 28 | RC8 — GPIO/RPC8 |
| Broche 29 | RC9 — GPIO/RPC9 |
| Broche 30 | RC10 — GPIO/RPC10 |
| Broche 31 | RC11 — GPIO/RPC11 |
| Broche 32 | RC12 — GPIO/RPC12 |
| Broche 33 | RC13 — GPIO/RPC13 |
| Broche 34 | RC14 — GPIO/RPC14 |
| Broche 35 | RC15 — GPIO/RPC15 |
| Broche 36 | VSS — Ground |
| Broche 37 | VDD — 3.3V core supply |
| Broche 38 | RD0 — GPIO/RPD0 |
| Broche 39 | RD1 — GPIO/RPD1 |
| Broche 40 | RD2 — GPIO/RPD2 |
| Broche 41 | RD3 — GPIO/RPD3 |
| Broche 42 | RD4 — GPIO/RPD4 |
| Broche 43 | RD5 — GPIO/RPD5 |
| Broche 44 | RD6 — GPIO/RPD6 |
| Broche 45 | RD7 — GPIO/RPD7 |
| Broche 46 | RD8 — GPIO/RPD8 |
| Broche 47 | RD9 — GPIO/RPD9 |
| Broche 48 | RD10 — GPIO/RPD10 |
| Broche 49 | RD11 — GPIO/RPD11 |
| Broche 50 | VSS — Ground |
| Broche 51 | VDD — 3.3V core supply |
| Broche 52 | RE0 — GPIO/RPE0 |
| Broche 53 | RE1 — GPIO/RPE1 |
| Broche 54 | RE2 — GPIO/RPE2 |
| Broche 55 | RE3 — GPIO/RPE3 |
| Broche 56 | RE4 — GPIO/RPE4 |
| Broche 57 | RE5 — GPIO/RPE5 |
| Broche 58 | RE6 — GPIO/RPE6 |
| Broche 59 | RE7 — GPIO/RPE7 |
| Broche 60 | RF0 — GPIO/RPF0 |
| Broche 61 | RF1 — GPIO/RPF1 |
| Broche 62 | RF2 — GPIO/RPF2 |
| Broche 63 | RF3 — GPIO/RPF3 |
| Broche 64 | EP — Exposed thermal pad, must be soldered to VSS plane |
Applications typiques
PIC32MK0512GPD064-E/MR convient pour 6 applications: BLDC / PMSM Motor Control, Industrial Servo Drives, Solar Inverters and Digital Power, Programmable Logic Controllers (PLC), IIoT Edge Nodes, Automotive Body and Comfort Controllers.
BLDC / PMSM Motor Control
The PIC32MK0512GPD064-E/MR is purpose-built for three-phase BLDC and PMSM motor control. Its high-resolution PWM module with complementary outputs and programmable dead-time drives the gate drivers of a 3-phase inverter directly, while six on-chip op-amps condition current-shunt and BEMF feedback signals. The 120MHz MIPS32 core with DSP ASE runs field-oriented control (FOC) at sub-10us loop rates; the -E +125C grade supports under-hood automotive and industrial servo enclosures. The 64-pin QFN package keeps the inverter PCB compact.
Recommandé
Industrial Servo Drives
Industrial servo drives demand deterministic control loops, multi-axis synchronization, and industrial networking. The PIC32MK0512GPD064-E/MR integrates CAN-FD for real-time communication with PLC masters, plus high-resolution PWM and quadrature encoder interfaces for closed-loop position control. The 128KB SRAM buffers trajectory tables and the 512KB Flash holds the servo control law plus safety logic. The -40C to +125C thermal range matches IEC 60068 industrial cabinet environments and servo amplifier heat-sink adjacency.
Recommandé
Solar Inverters and Digital Power
Solar inverters and digital power converters rely on high-resolution PWM and fast ADC sampling for MPPT and grid-tie synchronization. The PIC32MK0512GPD064-E/MR combines 12-bit ADC with up to 42 channels (sampling PV string voltages and currents) with DSP-capable 120MHz MIPS32 core for real-time control algorithms. The integrated op-amps condition current-shunt signals without external analog. The 64-pin QFN exposes sufficient GPIO for relay control, grid-sync zero-cross detection, and isolated comms interfaces.
Recommandé
Programmable Logic Controllers (PLC)
PLC digital and analog I/O modules require a mix of high-speed comms, deterministic I/O scanning, and reliable Flash-backed firmware updates. The PIC32MK0512GPD064-E/MR provides six UART (for RS-485 / RS-232 channels), six SPI (for ADC/DAC expanders), and four I2C (for I/O modules) plus USB Full-Speed for engineering tooling. The 512KB Flash accommodates ladder-logic runtimes plus bootloaders, and the +125C -E grade supports unventilated cabinet installations common in factory automation.
Recommandé
IIoT Edge Nodes
Industrial IoT edge nodes aggregate sensor data, run local analytics, and publish results over CAN-FD, USB, or UART to higher-level systems. The PIC32MK0512GPD064-E/MR delivers 120MHz DSP performance for vibration analysis, FFT-based condition monitoring, and predictive maintenance routines. The 128KB SRAM holds circular sensor buffers, and the 512KB Flash fits full TLS stacks plus application logic. The -E temperature grade and 64-pin QFN footprint suit DIN-rail mounted edge gateways in factory environments.
Recommandé
Automotive Body and Comfort Controllers
Automotive body controllers manage seat adjustment, HVAC blend doors, lighting, and mirror functions. The PIC32MK0512GPD064-E/MR integrates CAN-FD for communication with the vehicle bus, six UART for actuator modules, and four I2C for sensor clusters. The -E +125C grade handles under-dash thermal exposure, while the 64-pin QFN fits compact PCBAs behind trim panels. The DSP-capable core runs acoustic algorithms for ANC and active sound design without an external DSP chip.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MK0512GPD064-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MK0512GPD064-I/MR | PIC32MK0512GPD064T-E/MR | PIC32MK0512GPK064-E/MR | PIC32MK0512MCJ064-E/MR | PIC32MK1024GPD064-E/MR |
|---|---|---|---|---|---|---|
| Package | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Max CPU Speed | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 1024 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB |
| Temperature Grade | -40C to +125C (-E) | -40C to +85C (-I) | -40C to +125C (-E) | -40C to +125C (-E) | -40C to +125C (-E) | -40C to +125C (-E) |
| CAN-FD | Yes | Yes | Yes | Yes (extended instances) | Yes | Yes |
Principaux différenciateurs
- Extended -E +125C temperature grade for harsh environments (vs PIC32MK0512GPD064-I/MR)
- Microchip-recommended drop-in upgrade path with more peripherals (vs PIC32MK0512GPK064-E/MR)
- Doubled memory for firmware expansion (vs PIC32MK1024GPD064-E/MR)
Notes de conception
The 64-pin QFN package exposes a thermal pad (pin 64 / EP) that MUST be soldered to a copper pour to meet the -E +125C rating. Microchip recommends a minimum 1 square inch of 1oz copper on the top layer connected by at least 9 thermal vias (0.3mm drill, 1oz plating) to the bottom ground plane. Without proper EP soldering the junction temperature can exceed limits under sustained PWM switching loads.
Decouple VDD pins with 100nF X7R ceramic capacitors placed within 3mm of each supply pin. Add a single 4.7uF or 10uF bulk capacitor on the main 3.3V rail. The PIC32MK core draws transient currents up to 200mA during DSP instruction peaks, so local decoupling is essential for ADC and PWM accuracy. Place a ferrite bead between the analog AVDD supply and digital VDD if available.
Route the USB D+/D- pair as a 90-ohm differential with continuous ground reference and length matching within 2mm. Keep analog ADC traces away from PWM switching signals by at least 3x the trace width to minimize coupled noise. The exposed thermal pad via array should be placed on a 1mm pitch grid to maximize heat extraction without violating QFN solder-mask dam rules.
Do not exceed 3.6V on any VDD pin; the PIC32MK core is NOT 5V tolerant. When migrating firmware between PIC32MK variants, verify the device ID register because the GPD, GPK, and MCJ sub-families have different peripheral maps even at the same pin count. Always configure unused pins as outputs driven low to minimize current leakage, especially in low-power motor-control standby states.
Informations de conformité
RoHS and REACH compliant per Microchip product page. AEC-Q100 grade not explicitly stated; the -E temp grade supports automotive cabin environments. For AEC-Q100 qualified PIC32MK parts, contact Microchip sales for automotive-qualified order codes.
