PIC32MM0128GPM048-E/PT - 32-bit 25MHz 128KB Flash MCU | Microchip
Référence : PIC32MM0128GPM048-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.42 | $3,42 |
| 10 | $3.08 | $30,80 |
| 100 | $2.74 | $274,00 |
| 500 | $2.42 | $1 210,00 |
| 1 000 | $2.18 | $2 180,00 |
PIC32MM0128GPM048-E/PT Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. Microcontrollers sit at the heart of embedded systems, sitting one tier above simple 8/16-bit MCUs and one tier below application processors. The PIC32MM GPM family extends Microchip's PIC32MX heritage with microAptiv core enhancements for low-power, mixed-signal applications and provides a smooth upward migration path from smaller PIC32MM variants and from legacy PIC24/PIC32MX designs.
Key features of the PIC32MM0128GPM048-E/PT include: 128 KB (128K x 8) ECC Flash, 16 KB SRAM, USB 2.0 full-speed device, 79 CoreMark performance, multiple low-power sleep modes typical of the eXtreme low power family, and an industrial-grade peripheral set including 12-bit ADC, comparators, timers, UART/SPI/I2C, and PMP. The 48-pin TQFP-EP exposes a substantial ground pad for thermal dissipation and offers ample GPIO for connectivity.
The microAptiv core implements the MIPS32 instruction set with hardware multiply/divide and a tightly-coupled interrupt controller, achieving 79 CoreMark at 25 MHz while remaining in a low active-power envelope. ECC on Flash improves reliability in industrial environments exposed to single-event upsets, and the on-chip USB 2.0 full-speed device controller simplifies connectivity for HID, CDC, vendor-class, or custom USB peripherals.
Typical applications include low-power USB peripherals, IoT sensor nodes, industrial sensor interfaces, home automation gateways, and battery-powered consumer devices. The wide 3.0-3.6 V supply range is well matched to both Li-Ion and regulated 3.3 V rails.
When designing with this part, prefer the exposed pad (EP) connected to a continuous ground plane for both thermal relief and signal integrity. For USB designs, follow the USB transceiver PCB guidelines for 90-ohm differential impedance and ensure VUSB 3.3 V is well decoupled.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical low-power and USB design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MM0128GPM048-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MM0128GPM048-E/PT (même facteur de forme et même empreinte) — différant par Core Architecture, Package, ADC, Mounting Type, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MM0128GPM048-I/PT
✅ Remplacement direct✓ En stock
$2.74 / unité
Voir la fiche technique →PIC32MM0064GPM048T-I/M4
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.98 / unité
Voir la fiche technique →PIC32MK1024MCM100-E/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.2 / unité
Voir la fiche technique →PIC32MM0128GPM048-E/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (PIC32MM) |
| Core Size | 32-bit |
| Max CPU Frequency | 25 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) with ECC |
| Data Memory (SRAM) | 16 KB |
| CoreMark Score | 79 |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| Température de fonctionnement | -40C to +125C (Extended) |
| USB Interface | USB 2.0 Full-Speed Device |
| Boîtier | 48-pin TQFP-EP (7x7 mm) with exposed pad |
| Type de montage | Surface Mount |
| Flash ECC | Yes |
| Family | PIC32MM GPM (eXtreme Low Power) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MM0128GPM048-E/PT
| Broche 1 | RPB0/AN0/C1IND/C2INB/PMPD0 — GPIO/AN0 |
| Broche 2 | RPB1/AN1/C1INC/C3INB/PMPD1 — GPIO/AN1 |
| Broche 3 | RPB2/AN2/C2IND/C3INC/PMPD2 — GPIO/AN2 |
| Broche 4 | RPB3/AN3/C1INA/C2INA/PMPD3 — GPIO/AN3 |
| Broche 5 | RPB4/AN4/C1INB/VBUS/USBD-/PMPD4 — GPIO/AN4/USB D- |
| Broche 6 | RPB5/AN5/C1INA/VBUS/USBD+/PMPD5 — GPIO/AN5/USB D+ |
| Broche 7 | VDD — Core supply (3.0-3.6 V) |
| Broche 8 | VSS — Ground |
| Broche 9 | RPC0/PMPD6 — GPIO/PMP |
| Broche 10 | RPC1/PMPD7 — GPIO/PMP |
| Broche 11 | RPC2/PMPWR — GPIO/PMP write strobe |
| Broche 12 | RPC3/PMPRD — GPIO/PMP read strobe |
| Broche 13 | RPC4/PMPBEE — GPIO/PMP enable |
| Broche 14 | RPC5/PMPCS — GPIO/PMP chip select |
| Broche 15 | RPC6/PMPD8 — GPIO/PMP |
| Broche 16 | RPC7/PMPD9 — GPIO/PMP |
| Broche 17 | VUSB — USB 3.3 V supply |
| Broche 18 | VSS — Ground |
| Broche 19 | RPG6/SOSC2 — Secondary oscillator / GPIO |
| Broche 20 | RPG7/SOSC1 — Secondary oscillator / GPIO |
| Broche 21 | RPG8/RF3/PMPD15 — GPIO |
| Broche 22 | RPG9/RF2 — GPIO |
| Broche 23 | VDD — Core supply |
| Broche 24 | VSS — Ground |
| Broche 25 | OSC1/CLKI/RA0 — Crystal input or ext clock |
| Broche 26 | OSC2/CLKO/RA1 — Crystal output |
| Broche 27 | RPA8/PMPA8 — GPIO/PMP |
| Broche 28 | RPA9/PMPA9 — GPIO/PMP |
| Broche 29 | RPC8/PMPD10 — GPIO/PMP |
| Broche 30 | RPC9/PMPD11 — GPIO/PMP |
| Broche 31 | RPB6/PMPA14/PGC — GPIO/ICSP clock |
| Broche 32 | RPB7/PMPA15/PGD — GPIO/ICSP data |
| Broche 33 | RPB8/USBOEN — GPIO/USB output enable |
| Broche 34 | RPB9/SDA1/SDAA1 — I2C1 data / GPIO |
| Broche 35 | RPB10/SCL1 — I2C1 clock / GPIO |
| Broche 36 | RPB11/PMPD12 — GPIO/PMP |
| Broche 37 | RPB12/PMPD13 — GPIO/PMP |
| Broche 38 | RPB13/PMPD14 — GPIO/PMP |
| Broche 39 | RPB14/AN6/C2INB — GPIO/AN6 |
| Broche 40 | RPB15/AN7/C3INB — GPIO/AN7 |
| Broche 41 | VDD — Core supply |
| Broche 42 | VSS — Ground |
| Broche 43 | RPD0/RTCC — GPIO/RTCC |
| Broche 44 | RPD1/REFI — GPIO/reference input |
| Broche 45 | RPD2/REFO — GPIO/reference output |
| Broche 46 | RPD3/RPF0 — GPIO |
| Broche 47 | RPD4/RPF1 — GPIO |
| Broche 48 | RPD5/RPF2 — GPIO |
Applications typiques
PIC32MM0128GPM048-E/PT convient pour 6 applications: USB HID Peripheral Devices, IoT Sensor Nodes and Edge Devices, Industrial Sensor Interfaces, Home Automation Gateways and Bridges, Battery-Powered Consumer Devices, Human Interface Devices (HID) and Custom USB Peripherals.
USB HID Peripheral Devices
Recommandé
IoT Sensor Nodes and Edge Devices
Recommandé
Industrial Sensor Interfaces
Recommandé
Home Automation Gateways and Bridges
Recommandé
Battery-Powered Consumer Devices
Recommandé
Human Interface Devices (HID) and Custom USB Peripherals
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MM0128GPM048-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MM0128GPM048-I/PT | PIC32MM0064GPM048T-I/M4 | PIC32MK1024MCM100-E/PT |
|---|---|---|---|---|
| Package | 48-TQFP-EP (7x7) | 48-TQFP-EP (7x7) - same | 48-TQFP-EP - same footprint | 100-TQFP - NOT pin-compatible with 48-TQFP-EP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 microAptiv | MIPS32 microAptiv - same | MIPS32 microAptiv - same | MIPS32 M-Class (higher perf) |
| Max CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 120 MHz (much higher) |
| Flash | 128 KB ECC | 128 KB ECC - same | 64 KB ECC (-50%) | 1 MB ECC (8x larger) |
| SRAM | 16 KB | 16 KB | 8 KB (-50%) | 256 KB (16x larger) |
| USB | USB 2.0 FS Device | USB 2.0 FS Device - same | USB 2.0 FS Device - same | USB 2.0 HS + FS + dual role |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) |
Principaux différenciateurs
- Higher temperature grade than industrial (I) variant (vs PIC32MM0128GPM048-I/PT)
- Double the Flash with ECC of the 64 KB family variant (vs PIC32MM0064GPM048T-I/M4)
- Lower power profile than PIC32MK (vs PIC32MK1024MCM100-E/PT)
Notes de conception
Connect the 48-TQFP-EP exposed thermal pad to a continuous ground plane with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) for both thermal dissipation and low-inductance ground. Per Microchip AN-1267, this is required for reliable operation in extended temperature (E) variants. Keep high-speed USB traces (D+/D-) at 90 ohms differential and route over a continuous ground reference plane.
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin; add a bulk 4.7 uF capacitor near the MCU. VUSB requires its own 100 nF plus a 4.7 uF bulk per Microchip USB hardware design guidelines. Failing to decouple VUSB independently can cause USB enumeration failures even if VDD is clean. Use ferrite beads if the USB bus is shared with noisy regulators.
Do not leave unused pins floating; configure them as digital outputs or inputs with the internal weak pull-up enabled. Floating analog pins (ANx) can cause shoot-through current in the analog mux and degrade ADC accuracy. Always set the JTAG/ICSP pins (PGECx/PGEDx) to their debug configuration before programming, or use the ICSP pairs explicitly (PGEC2/PGED2, etc.) as noted in the datasheet.
Route USB D+ and D- as a 90-ohm differential pair with matched lengths (<2 mm skew) and no stubs. Place the common-mode choke and ESD protection array within 5 mm of the USB connector. Avoid running the USB pair near switching regulator inductors or other noisy traces; cross only at 90 degrees if necessary. Keep the USB shield ground connection to the board ground within 5 mm of the connector entry.
Informations de conformité
RoHS compliant per Microchip product page and distributor listings. Not AEC-Q100 qualified; for automotive designs, evaluate PIC32MM AEC-Q100 variants or higher-grade PIC32MK families. Lead-free and halogen-free per Microchip material declaration.