PIC32MX270F256BT-V/ML - 32-bit MCU 256KB Flash 40MHz QFN-28 | Microchip
Référence : PIC32MX270F256BT-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.18 | $61,80 |
| 100 | $5.47 | $547,00 |
| 500 | $4.92 | $2 460,00 |
| 1 000 | $4.38 | $4 380,00 |
PIC32MX270F256BT-V/ML Présentation
What is a PIC32MX microcontroller? PIC32MX is Microchip's family of 32-bit MIPS-based microcontrollers that bridges 8-bit PIC and 32-bit ARM architectures, providing higher performance (up to 83 DMIPS at 50 MHz) while maintaining PIC ecosystem compatibility. These MCUs target cost-sensitive embedded applications requiring USB connectivity, graphical interfaces, and DSP-like performance without the complexity of full ARM Cortex-M designs. The PIC32MX270F256B series sits in the mid-range of this family, optimized for general-purpose embedded control with USB 2.0 full-speed On-The-Go (OTG) support.
Key features include two I2S/SPI modules for audio codec and serial communications, Peripheral Pin Select (PPS) functionality for flexible I/O mapping, a Parallel Master Port (PMP) for graphics and external memory interfacing, and hardware support for mTouch capacitive touch buttons and sliders. The device also integrates a 10-bit ADC with up to 1 Msps sampling rate, multiple timer modules with 1 ns high-resolution time measurement capability, and on-chip temperature measurement for system monitoring.
The PIC32MX270F256B-V variant (denoted by -V suffix) is qualified for automotive applications operating from -40C to +105C, while the standard -I variant operates from -40C to +85C. The -T suffix indicates tape-and-reel packaging. The 28-QFN package provides compact 6x6 mm footprint with exposed thermal pad for improved heat dissipation.
Typical applications include automotive body electronics and infotainment systems, industrial control and HMI (human-machine interface) with PMP-driven graphical LCDs, USB peripherals and bridges, sensor hub and IoT edge nodes, and consumer devices requiring capacitive touch interfaces. The combination of USB OTG, PMP, and PPS makes this MCU particularly suited for connected embedded products with display requirements.
Design consideration: The automotive-grade -V temperature range and AEC-Q100 qualification make this part suitable for under-hood and cabin automotive applications. Engineers should leverage PPS to remap peripheral functions to available I/O pins, simplifying PCB layout and BOM standardization across product variants.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MX270F256BT-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX270F256BT-V/ML (même facteur de forme et même empreinte) — différant par Package, ADC, USB, Timers, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX270F256B-V/ML
✅ Remplacement direct✓ En stock
$2.78 / unité
Voir la fiche technique →PIC32MX270F256BT-I/ML
✅ Remplacement direct✓ En stock
$3.66 / unité
Voir la fiche technique →PIC32MX250F256BT-V/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX170F256BT-V/ML
✅ Remplacement direct✓ En stock
$3.65 / unité
Voir la fiche technique →PIC32MX230F256BT-V/ML
✅ Remplacement direct✓ En stock
$3.62 / unité
Voir la fiche technique →PIC32MX270F256DT-V/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX270F256BT-V/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K |
| CPU Bit Width | 32-bit |
| Maximum CPU Frequency | 50 MHz |
| Performance | 83 DMIPS |
| Program Memory (Flash) | 256 KB |
| Data Memory (RAM) | 64 KB |
| Operating Voltage Range | 2.5 V to 3.6 V |
| Active Current Consumption | 0.5 mA/MHz (typical) |
| Plage de température de fonctionnement | -40C to +105C (automotive -V grade) |
| Boîtier | 28-pin QFN (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| ADC | 10-bit, up to 1 Msps |
| USB Interface | USB 2.0 Full-Speed OTG |
| Automotive Qualification | AEC-Q100 (V variant) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX270F256BT-V/ML
| Broche 1 | RPB0/AN0 — Remappable I/O, analog input 0 |
| Broche 2 | RPB1/AN1 — Remappable I/O, analog input 1 |
| Broche 3 | RPB2/AN2 — Remappable I/O, analog input 2 |
| Broche 4 | RPB3/AN3 — Remappable I/O, analog input 3 |
| Broche 5 | VSS — Ground reference |
| Broche 6 | VDD — Positive supply voltage (2.5V-3.6V) |
| Broche 7 | RPB4/AN4 — Remappable I/O, analog input 4 |
| Broche 8 | RPB5/AN5 — Remappable I/O, analog input 5 |
| Broche 9 | RPB6/AN6 — Remappable I/O, analog input 6 |
| Broche 10 | RPB7/AN7 — Remappable I/O, analog input 7 |
| Broche 11 | VSS — Ground reference |
| Broche 12 | VDD — Positive supply voltage (2.5V-3.6V) |
| Broche 13 | VBUS — USB VBUS detect input |
| Broche 14 | D- — USB D- data line |
| Broche 15 | D+ — USB D+ data line |
| Broche 16 | RPG6 — General purpose I/O |
| Broche 17 | RPG7 — General purpose I/O |
| Broche 18 | RPG8 — General purpose I/O |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Positive supply voltage (2.5V-3.6V) |
| Broche 21 | RPG9 — General purpose I/O |
| Broche 22 | RPF0 — Remappable I/O |
| Broche 23 | RPF1 — Remappable I/O |
| Broche 24 | RPF2 — Remappable I/O |
| Broche 25 | RPF3 — Remappable I/O |
| Broche 26 | RPF4 — Remappable I/O |
| Broche 27 | RPF5 — Remappable I/O |
| Broche 28 | OSC1/CLKI — Crystal oscillator input or external clock |
Applications typiques
PIC32MX270F256BT-V/ML convient pour 6 applications: Automotive Body Electronics, Industrial HMI with PMP Graphics, USB Peripheral Devices and Bridges, Sensor Hub and IoT Edge Nodes, Audio Devices with I2S Codec Interface, Capacitive Touch User Interfaces.
Automotive Body Electronics
The PIC32MX270F256BT-V/ML's AEC-Q100 qualification and -40C to +105C operating range make it ideal for automotive body control modules including door modules, seat controllers, and lighting systems. The 256 KB Flash accommodates CAN/LIN stack, body-specific firmware, and diagnostic routines. With USB OTG integrated, it enables USB diagnostic interfaces for dealer service tools. The 28-QFN 6x6 mm package fits space-constrained body electronics housings, while PPS allows flexible I/O assignment for varying pinout requirements across vehicle platforms. Typical designs leverage the 10-bit ADC for sensor inputs and PWM outputs for motor/LED control.
Recommandé
Industrial HMI with PMP Graphics
The PIC32MX270F256BT-V/ML's Parallel Master Port (PMP) enables direct interface to graphical LCDs and TFT displays in industrial human-machine interface applications. With 256 KB Flash and 64 KB RAM, it stores complex graphical assets, fonts, and multilingual UI strings without external memory. The 50 MHz MIPS M4K core delivers responsive touch response for mTouch capacitive buttons and sliders, while Peripheral Pin Select simplifies PCB layout by remapping display control signals to available I/O pins. Industrial operating range and AEC-Q100 qualification support factory floor deployment in control panels.
Recommandé
USB Peripheral Devices and Bridges
The PIC32MX270F256BT-V/ML's integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver simplifies USB peripheral designs including USB-to-UART bridges, USB HID input devices, and USB CDC communication class devices. The 12 Mbps Full-Speed signaling rate meets most peripheral data throughput needs, while the dedicated USB PLL ensures jitter-compliant signaling. With 256 KB Flash, designers implement USB stacks (Microchip Harmony or MLA), vendor-specific class drivers, and application firmware on a single chip. The automotive qualification enables USB-equipped infotainment accessories.
Recommandé
Sensor Hub and IoT Edge Nodes
The PIC32MX270F256BT-V/ML serves as an effective sensor hub controller for IoT edge devices aggregating multiple sensor inputs through its 10-bit ADC (up to 1 Msps) and I2C/SPI interfaces. The 64 KB RAM buffers sensor data before USB or serial transmission, while 256 KB Flash stores edge processing algorithms and protocol stacks. The 0.5 mA/MHz active current consumption enables battery-powered sensor deployments with sleep current optimization. PPS allows flexible sensor I/O assignment, and the automotive-grade temperature range supports outdoor and industrial IoT installations.
Recommandé
Audio Devices with I2S Codec Interface
The PIC32MX270F256BT-V/ML's two I2S/SPI modules enable direct interface to audio codecs for consumer audio products, intercom systems, and automotive audio head units. The 50 MHz core provides sufficient DSP performance for basic audio processing (volume control, EQ, mixing), while 64 KB RAM supports audio buffer management. USB OTG enables USB Audio Class device implementation for USB speakers and headsets. The automotive AEC-Q100 qualification supports in-vehicle audio applications where reliability under thermal stress is required.
Recommandé
Capacitive Touch User Interfaces
The PIC32MX270F256BT-V/ML supports mTouch capacitive touch buttons and sliders through Microchip's charge-time measurement unit (CTMU) peripheral. This enables sleek touch-based user interfaces for appliances, automotive interior controls, and consumer electronics without mechanical buttons. The 256 KB Flash stores touch firmware libraries, while PPS simplifies PCB layout by allowing touch channels to be assigned to convenient I/O pins. With on-chip temperature measurement, the MCU can compensate touch sensitivity across the automotive -40C to +105C range.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX270F256BT-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX270F256B-V/ML | PIC32MX270F256BT-I/ML | PIC32MX250F256BT-V/ML | PIC32MX170F256BT-V/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Max CPU Frequency | 50 MHz (40 MHz at 3.3V) | 50 MHz (40 MHz at 3.3V) | 50 MHz (40 MHz at 3.3V) | 50 MHz (40 MHz at 3.3V) | 50 MHz (40 MHz at 3.3V) |
| USB OTG | Yes (USB 2.0 Full-Speed) | Yes | Yes | No | No |
| Temperature Grade | Automotive -40C to +105C | Automotive -40C to +105C | Industrial -40C to +85C | Automotive -40C to +105C | Automotive -40C to +105C |
| AEC-Q100 Qualified | Yes | Yes | No | Yes | Yes |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed OTG with on-chip transceiver (vs PIC32MX250F256BT-V/ML)
- Automotive AEC-Q100 qualification with -V temperature grade (vs PIC32MX270F256BT-I/ML)
- Tape and Reel packaging for high-volume SMT assembly (vs PIC32MX270F256B-V/ML)
Notes de conception
The PIC32MX270F256BT-V/ML operates from 2.5V to 3.6V with three VDD pins (6, 12, 20) and three VSS pins (5, 11, 19) that must all be properly decoupled. Use a minimum 0.1 uF ceramic bypass capacitor on each VDD pin, placed within 5 mm of the pin trace. Add a bulk 10 uF tantalum or ceramic capacitor at the main supply input. The USB VBUS pin (13) requires a separate 0.1 uF decoupling capacitor when USB is used. Avoid routing high-frequency signals near the VDD pins to minimize supply noise coupling.
The 28-QFN package features an exposed thermal pad (EP) on the underside that must be soldered to a PCB thermal pad of at least the same size, with thermal vias connecting to an internal ground plane. At 50 MHz full operation with all peripherals active, typical power dissipation is approximately 25 mA * 3.3V = 82.5 mW, which the EP can dissipate without additional cooling. For automotive applications at 105C ambient, ensure the PCB thermal pad has at least 100 mm2 of copper area to maintain junction temperature within safe limits per the family datasheet DS60001168.
Route the USB D+ and D- traces as a 90-ohm differential pair with matching length within 2 mm, keeping trace length under 50 mm total for Full-Speed USB compliance. The crystal oscillator traces (OSC1/OSC2 if used) should be short and surrounded by ground pour to minimize EMI. Place the decoupling capacitors as close as possible to their respective VDD pins. Use a 4-layer PCB with dedicated ground and power planes for best signal integrity, especially for USB and PMP interfaces.
Do not leave any VDD/VSS pin floating - all three VDD and three VSS pins must be connected to maintain proper operation. The VBUS pin should not be left unconnected if USB is unused; tie it to ground or VDD through a resistor to prevent floating input. When using Peripheral Pin Select (PPS), ensure the input/output mapping is configured via the PPS registers before enabling the peripheral to avoid glitches. The configuration words must be programmed correctly to enable the internal oscillator or select the correct clock source before code execution.
Informations de conformité
AEC-Q100 qualified per -V automotive temperature grade designation. RoHS and REACH compliant per Microchip product documentation. Halogen-free per Microchip environmental compliance statements.
