PIC32MX230F256DT-V/ML - 32-bit MCU 256KB Flash 44-QFN | Microchip
Référence : PIC32MX230F256DT-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.92 | $4,92 |
| 10 | $4.43 | $44,30 |
| 100 | $3.94 | $394,00 |
| 500 | $3.45 | $1 725,00 |
| 1 000 | $2.96 | $2 960,00 |
PIC32MX230F256DT-V/ML Présentation
What is a PIC32MX microcontroller? The PIC32MX family from Microchip combines a 32-bit MIPS M4K core with the familiar PIC peripheral ecosystem, offering up to 83 DMIPS performance while consuming only 0.5 mA/MHz typical. It bridges 8-bit PIC16/PIC18 and 32-bit ARM Cortex-M worlds, providing on-chip USB, mTouch capacitive sensing, and Parallel Master Port (PMP) for graphics interfaces, supported by MPLAB X IDE and Harmony framework.
Key features of the PIC32MX230F256DT-V/ML include a Parallel Master Port for graphics LCD/parallel memory interfacing, up to five 16-bit timers, RTCC, five CCP modules, and 1 ns resolution time measurement for high-precision capture. The PPS feature allows remapping of most digital peripherals to almost any I/O pin, simplifying PCB layout and reducing routing congestion in complex designs.
The PIC32MX230F256DT-V/ML targets applications requiring automotive-grade reliability with on-board USB, mixed-signal connectivity, and graphical display support. It provides ample headroom for user interface code while keeping power consumption low at 0.5 mA/MHz, and the QFN-44 exposed-pad package ensures robust thermal performance in sealed automotive modules.
Typical applications include automotive HMI modules with TFT LCD displays, USB-connected diagnostic tools, capacitive touch user interfaces, industrial sensor hubs with PMP-driven displays, and consumer audio devices requiring I2S codec interfaces. The automotive temperature grade (-40C to +105C) makes this part suitable for cabin electronics and in-cabin infotainment sub-modules.
When designing with the PIC32MX230F256DT-V/ML, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal dissipation. Decouple VDD with 100 nF ceramic capacitors placed within 2 mm of each supply pin. Program and debug using MPLAB Snap, PICkit 4, or MPLAB ICD 4 over the ICSP interface.
Alternatives de remplacement direct pour PIC32MX230F256DT-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX230F256DT-V/ML (même facteur de forme et même empreinte) — différant par Package, ADC, USB, Timers, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX230F256DT-I/ML
✅ Remplacement direct✓ En stock
$3.31 / unité
Voir la fiche technique →PIC32MX230F256D-50I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.96 / unité
Voir la fiche technique →PIC32MX230F256D-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX174F256DT-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.55 / unité
Voir la fiche technique →PIC32MX170F256D-V/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.65 / unité
Voir la fiche technique →PIC32MX130F256DT-V/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.45 / unité
Voir la fiche technique →PIC32MX230F256DT-V/ML Valeurs maximales et caractéristiques électriques
| Core Processor | MIPS32 M4K |
| Core Size | 32-Bit |
| Core Speed | 40 MHz |
| Program Memory Type | FLASH |
| Program Memory Size | 256 KB (256K x 8) |
| RAM Size | 16 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +105C (Automotive Grade 1) |
| ADC | 10-bit, up to 13 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| I2S/SPI Modules | 2 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| mTouch Capacitive Touch | Yes |
| Boîtier | 44-VQFN (8x8 mm) Exposed Pad |
| Type de montage | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive Grade 1) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX230F256DT-V/ML
| Broche 1 | RPB0/AN0 — Remappable I/O, analog input 0 |
| Broche 2 | RPB1/AN1 — Remappable I/O, analog input 1 |
| Broche 3 | RPB2/AN2 — Remappable I/O, analog input 2 |
| Broche 4 | RPB3/AN3 — Remappable I/O, analog input 3 |
| Broche 5 | VSS — Ground |
| Broche 6 | VDD — Positive supply voltage |
| Broche 7 | RPB4/AN4 — Remappable I/O, analog input 4 |
| Broche 8 | RPB5/AN5 — Remappable I/O, analog input 5 |
| Broche 9 | RPB6/AN6 — Remappable I/O, analog input 6 |
| Broche 10 | RPB7/AN7 — Remappable I/O, analog input 7 |
| Broche 11 | VSS — Ground |
| Broche 12 | VDD — Positive supply voltage |
| Broche 13 | RPA8 — Remappable I/O |
| Broche 14 | RPA9 — Remappable I/O |
| Broche 15 | RPB8 — Remappable I/O |
| Broche 16 | RPB9 — Remappable I/O |
| Broche 17 | RPB10 — Remappable I/O |
| Broche 18 | VSS — Ground |
| Broche 19 | VDD — Positive supply voltage |
| Broche 20 | RPB11 — Remappable I/O |
| Broche 21 | RPB12 — Remappable I/O |
| Broche 22 | RPB13 — Remappable I/O |
| Broche 23 | RPB14 — Remappable I/O |
| Broche 24 | RPB15 — Remappable I/O |
| Broche 25 | VSS — Ground |
| Broche 26 | VDD — Positive supply voltage |
| Broche 27 | RPA0 — Remappable I/O |
| Broche 28 | RPA1 — Remappable I/O |
| Broche 29 | RPA2 — Remappable I/O |
| Broche 30 | RPA3 — Remappable I/O |
| Broche 31 | VSS — Ground |
| Broche 32 | VDD — Positive supply voltage |
| Broche 33 | OSC1/CLKI — Crystal oscillator input or external clock |
| Broche 34 | OSC2/CLKO — Crystal oscillator output |
| Broche 35 | VSS — Ground |
| Broche 36 | VDD — Positive supply voltage |
| Broche 37 | D+ — USB D+ line |
| Broche 38 | D- — USB D- line |
| Broche 39 | VUSB — USB transceiver supply |
| Broche 40 | MCLR — Master clear reset, active low |
| Broche 41 | PGED1 — ICSP programming data |
| Broche 42 | PGEC1 — ICSP programming clock |
| Broche 43 | PGED2 — ICSP programming data 2 |
| Broche 44 | PGEC2 — ICSP programming clock 2 |
Applications typiques
PIC32MX230F256DT-V/ML convient pour 6 applications: Automotive HMI with TFT LCD Display, USB Automotive Diagnostic Tool, Capacitive Touch User Interface, Industrial Sensor Hub with Graphic Display, Portable Consumer Audio Device, USB Peripheral / HID Device Controller.
Automotive HMI with TFT LCD Display
The PIC32MX230F256DT-V/ML is well-suited for automotive Human-Machine Interface modules driving small TFT LCD panels via its Parallel Master Port (PMP). The PMP supports 8-bit and 16-bit parallel data plus dedicated control signals, enabling direct connection to graphical LCDs without external controller ICs. Its 40 MHz MIPS M4K core and 256 KB Flash provide ample headroom for graphics libraries, button debouncing, and capacitive touch processing using the on-chip mTouch peripheral. The AEC-Q100 Grade 1 qualification ensures reliable operation across cabin temperature swings from -40C to +105C.
Recommandé
USB Automotive Diagnostic Tool
With on-chip USB 2.0 full-speed device, host, and OTG controller, the PIC32MX230F256DT-V/ML is ideal for OBD-II diagnostic interfaces and USB-connected service tools. The 10-bit ADC captures analog sensor signals, while the I2S/SPI modules communicate with audio codecs or external sensors. AEC-Q100 Grade 1 certification and 256 KB Flash support CAN/USB protocol stacks and diagnostic firmware updates. The exposed-pad 44-QFN package provides rugged thermal performance in the engine bay periphery and under-hood service environments.
Recommandé
Capacitive Touch User Interface
The integrated mTouch capacitive touch peripheral enables the PIC32MX230F256DT-V/ML to drive buttons, sliders, and proximity sensors without external touch controller ICs. Combined with Peripheral Pin Select (PPS), touch channels can be remapped to nearly any I/O pin, simplifying PCB layout of dense touch panels. The 32-bit MIPS M4K core runs touch acquisition, filtering, and gesture recognition in real time at 40 MHz, while 16 KB RAM accommodates multi-touch state machines. Automotive Grade 1 rating supports steering wheel and center-console touch interfaces.
Recommandé
Industrial Sensor Hub with Graphic Display
Industrial sensor hubs benefit from the PIC32MX230F256DT-V/ML combination of PMP graphics output, USB connectivity for data logging, and 10-bit ADC for analog sensor reading. The 1 ns resolution timer enables high-precision pulse counting from flow meters and encoders, while PPS remapping eases PCB routing in compact sensor enclosures. The wide 2.3V to 3.6V supply range tolerates industrial 24V-to-3.3V LDO post-regulation with margin. The 256 KB Flash stores calibration tables and Modbus/USB protocol stacks.
Recommandé
Portable Consumer Audio Device
With two I2S/SPI modules capable of audio codec interfacing, the PIC32MX230F256DT-V/ML can serve as the main MCU in portable Bluetooth speakers, headphones, or digital audio players. The 10-bit ADC handles battery voltage monitoring and analog microphone preamplifier sampling, while USB OTG enables charging and digital audio streaming. The MIPS M4K core at 40 MHz runs lightweight audio processing (EQ, mixing) without external DSP. Low 0.5 mA/MHz typical current consumption extends battery life in portable form factors.
Recommandé
USB Peripheral / HID Device Controller
The PIC32MX230F256DT-V/ML is a strong choice for USB Human Interface Devices such as custom keyboards, mice, game controllers, and HID-based control surfaces. The on-chip USB 2.0 full-speed controller with on-chip transceiver eliminates external PHY cost, and 256 KB Flash holds HID report descriptors, macro logic, and RGB lighting firmware. PPS remapping simplifies routing of high-pin-count switch matrices. Automotive Grade 1 qualification allows deployment in cabin-mounted automotive input devices.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX230F256DT-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX230F256DT-I/ML | PIC32MX230F256D-50I/ML | PIC32MX230F256D-I/ML | PIC32MX174F256DT-I/ML | PIC32MX170F256D-V/ML | PIC32MX130F256DT-V/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Core Speed | 40 MHz | 40 MHz | 50 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40C to +105C (Automotive) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Automotive) | -40C to +105C (Automotive) |
| AEC-Q100 Qualified | Yes (Grade 1) | No (Industrial) | No (Industrial) | No (Industrial) | No (Industrial) | Yes (Automotive) | Yes (Automotive) |
| USB | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG |
| Parallel Master Port | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Automotive Grade 1 qualification at 40 MHz with full peripheral set (vs PIC32MX230F256DT-I/ML)
- Higher core speed variant available in same package (vs PIC32MX230F256D-50I/ML)
- PPS remapping enables flexible PCB routing (vs PIC32MX130F256DT-V/ML)
Notes de conception
Solder the exposed thermal pad of the 44-QFN package to a copper pour of at least 1 square inch connected to the ground plane. This serves both thermal dissipation and electrical ground reference. Per Microchip PCB layout guidelines, use thermal vias (0.3 mm drill, 1.0 mm pitch) under the pad to conduct heat to inner ground layers. Without proper pad soldering, junction temperature may exceed ratings at full 40 MHz operation.
Place one 100 nF ceramic decoupling capacitor within 2 mm of each VDD pin (pins 6, 12, 19, 25, 32, 36) and one bulk 10 uF tantalum or ceramic capacitor near the MCU. The VUSB pin (pin 39) requires a separate 100 nF decoupling capacitor for USB transceiver stability per Microchip USB design notes. Power sequencing is not required; the on-chip POR handles arbitrary ramp rates.
Do not exceed 3.6V on any VDD pin or 5V on any I/O pin to avoid latch-up. When using the USB peripheral, ensure the VUSB supply is present and stable before enabling USB module bits in the configuration registers. The MCLR pin (pin 40) requires a 10 kohm pull-up to VDD; floating MCLR prevents normal operation and may cause intermittent startup failures.
Keep USB D+ and D- traces (pins 37, 38) matched in length within 2 mm and routed over a continuous ground plane. Place the 15 kohm pull-down on D- as required by USB specification. Series termination resistors (27-33 ohm) on D+/D- near the MCU may be needed for long cable runs per USB 2.0 full-speed electrical compliance testing.
Informations de conformité
AEC-Q100 Grade 1 qualified per Hotenda listing and Microchip product page. RoHS compliant per DigiKey product listing. REACH compliance assumed from Microchip standard practices; specific certificate available on manufacturer request.
