PIC32MX270F256DT-V/ML - 32-bit MCU 256KB Flash USB VQFN-44 | Microchip
Référence : PIC32MX270F256DT-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.86 | $5,86 |
| 10 | $5.27 | $52,70 |
| 100 | $4.69 | $469,00 |
| 500 | $4.21 | $2 105,00 |
| 1 000 | $3.78 | $3 780,00 |
PIC32MX270F256DT-V/ML Présentation
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a RISC processor core, Flash program memory, SRAM data memory, and a rich set of peripherals (ADC, timers, communication controllers, USB, etc.). The PIC32MX270 family sits at the intersection of Microchip's PIC16/PIC24 8-/16-bit heritage and the higher-performance MIPS32 M4K architecture, forming a hypernym path: PIC32MX270 -> PIC32MX2xx -> PIC32MX family -> PIC32 -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. Designers select this class of part when 8-bit cores run out of headroom for USB stacks, graphics, or audio processing but full application processors would over-shoot cost and power budgets.
Key features include two I2S/SPI modules for audio codec interfacing, Peripheral Pin Select (PPS) for flexible signal routing, a Parallel Master Port (PMP) for graphics or external memory, mTouch capacitive-touch support, and a 1 ns high-resolution time measurement. Typical current consumption is 0.5 mA/MHz active and deep-sleep currents in the microampere range enable battery-aware designs. Five 16-bit timers/capture inputs, comparators, and up to 45 I/O pins (subject to package) make the part adaptable to mixed-signal embedded boards.
Typical applications include automotive body and infotainment ECUs, USB HID/CDC peripherals, audio playback with I2S codecs, low-cost graphics HMIs driven through PMP, capacitive touch human-machine interfaces using mTouch, and industrial sensor hubs that need deterministic MIPS with low BOM cost. The combination of USB, PMP and I2S on one die keeps external glue logic low.
When designing with this device, pair a 12 MHz primary crystal (PLL-multiplied to 50 MHz) with two 0.1 uF decoupling caps placed within 3 mm of every VDD/VSS pair. For USB, route the D+/D- pair as a 90-ohm differential and add the mandatory 1.5 kohm pull-up on D+ for full-speed enumeration. The PPS feature lets you remap peripherals post-pinout, which is invaluable when migrating between package variants in the PIC32MX2xx family.
This page synthesizes distributor pricing (as of 2026-10-02), AEC-Q100 grade notes, drop-in same-package alternatives from the PIC32MX1XX/2XX family, and practical design considerations not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MX270F256DT-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX270F256DT-V/ML (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature Range, Maximum CPU Frequency, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX270F256DT-I/ML
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX270F256DT-50I/ML
✅ Remplacement direct✓ En stock
$4.61 / unité
Voir la fiche technique →PIC32MX270F256D-I/ML
✅ Remplacement direct✓ En stock
$4.18 / unité
Voir la fiche technique →PIC32MX270F256D-50I/ML
✅ Remplacement direct✓ En stock
$3.74 / unité
Voir la fiche technique →PIC32MX250F256D-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX254F128D-I/ML
✅ Remplacement direct✓ En stock
$2.65 / unité
Voir la fiche technique →PIC32MX270F256DT-V/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz / 83 DMIPS |
| Program Flash Memory | 256 KB |
| SRAM | 64 KB |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Active Current | 0.5 mA/MHz (Typical) |
| ADC | 10-bit, up to 1 Msps |
| USB | USB 2.0 full-speed device/host/OTG |
| SPI / I2S Modules | 2 |
| I2C Modules | 2 |
| UART Modules | 2 |
| Parallel Master Port (PMP) | Yes |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch Support | Yes |
| Timers | 5 x 16-bit |
| Operating Temperature Grade | -40C to +105C (V grade, automotive) |
| Boîtier | 44-pin VQFN (8x8x0.9 mm) with exposed pad |
| Automotive Qualification | AEC-Q100 (V grade) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MX270F256DT-V/ML
| Broche 1 | RB9 — General purpose I/O / PPS remappable |
| Broche 2 | RB10 — General purpose I/O / PPS remappable |
| Broche 3 | RB11 — General purpose I/O / PPS remappable |
| Broche 4 | VSS — Ground |
| Broche 5 | RB13 — General purpose I/O / AN11 |
| Broche 6 | RB14 — General purpose I/O / AN10 |
| Broche 7 | RB15 — General purpose I/O / AN9 |
| Broche 8 | VDD — Supply voltage 2.3-3.6 V |
| Broche 9 | RA0 — General purpose I/O / AN0 |
| Broche 10 | RA1 — General purpose I/O / AN1 |
| Broche 11 | RA2 — General purpose I/O / AN2 / VREF- |
| Broche 12 | RA3 — General purpose I/O / AN3 / VREF+ |
| Broche 13 | RA4 — General purpose I/O / AN4 |
| Broche 14 | RA5 — General purpose I/O / AN5 |
| Broche 15 | VSS — Ground |
| Broche 16 | RA6 — General purpose I/O |
| Broche 17 | RA7 — General purpose I/O |
| Broche 18 | RB0 — General purpose I/O / PGED1 |
| Broche 19 | RB1 — General purpose I/O / PGEC1 |
| Broche 20 | RB2 — General purpose I/O |
| Broche 21 | RB3 — General purpose I/O / AN8 |
| Broche 22 | RB4 — General purpose I/O / AN6 |
| Broche 23 | RB5 — General purpose I/O / AN7 |
| Broche 24 | RB6 — General purpose I/O / OC1 |
| Broche 25 | RB7 — General purpose I/O |
| Broche 26 | RB8 — General purpose I/O |
| Broche 27 | VCAP — Internal voltage regulator bypass cap |
| Broche 28 | VSS — Ground |
| Broche 29 | D+ — USB D+ data line |
| Broche 30 | D- — USB D- data line |
| Broche 31 | VDD — Supply voltage 2.3-3.6 V |
| Broche 32 | OSC1 — Crystal oscillator input |
| Broche 33 | OSC2 — Crystal oscillator output |
| Broche 34 | VSS — Ground |
| Broche 35 | RA8 — General purpose I/O |
| Broche 36 | RA9 — General purpose I/O |
| Broche 37 | RA10 — General purpose I/O |
| Broche 38 | RB12 — General purpose I/O |
| Broche 39 | TMS — JTAG test mode select |
| Broche 40 | TCK — JTAG test clock |
| Broche 41 | TDI — JTAG test data in |
| Broche 42 | TDO — JTAG test data out |
| Broche 43 | MCLR — Master clear reset (active low) |
| Broche 44 | VDD — Supply voltage 2.3-3.6 V |
Applications typiques
PIC32MX270F256DT-V/ML convient pour 6 applications: Automotive Body and Infotainment ECU, USB HID / CDC Peripheral Device, Audio Playback with I2S Codec, Low-Cost Graphics HMI via PMP, Capacitive Touch Interface (mTouch), Industrial Sensor Hub / Data Logger.
Automotive Body and Infotainment ECU
The PIC32MX270F256DT-V/ML's AEC-Q100 qualification and -40C to +105C operating range suit it for body controllers, HVAC panels and infotainment peripherals in vehicles. Its USB 2.0 full-speed OTG lets the ECU expose diagnostic or media interfaces to head units or service tools, while 256 KB Flash holds CAN-capable stacks, sensor calibration tables and small audio prompts. The 50 MHz / 83 DMIPS MIPS32 M4K core executes automotive communication stacks with margin. Pair it with a CAN transceiver such as MCP2515 or MCP2551 and a 3.3 V LDO from the same Microchip ecosystem (MIC29150, MIC5205) for a compact, qualified BOM.
Recommandé
USB HID / CDC Peripheral Device
Use the PIC32MX270F256DT-V/ML as a USB device host for HID peripherals, CDC virtual COM ports, or custom vendor-class endpoints. The on-chip USB 2.0 full-speed OTG eliminates external transceivers and PHY, while 64 KB SRAM is enough for HID ring buffers, CDC line coding state and small protocol stacks. PPS remaps USB pins when migrating between package variants, and the 50 MHz core decodes USB packets well below the 1 ms USB frame budget. Pair it with a USB Type-C controller or direct USB-C CC pulldowns for modern interfaces.
Recommandé
Audio Playback with I2S Codec
The two I2S/SP I modules of the PIC32MX270F256DT-V/ML connect directly to common audio CODECs like the SGTL5000, WM8960 and AIC23B for stereo playback and recording. With 64 KB SRAM the device can double-buffer a few seconds of compressed audio, while the 50 MHz MIPS32 M4K core decodes MP3, ADPCM or simple WAV streams. Designers typically feed the part from a USB drive, SD card over SPI, or stream over USB isochronous. mTouch buttons provide sealed-panel playback control without mechanical switches.
Recommandé
Low-Cost Graphics HMI via PMP
The PIC32MX270F256DT-V/ML's Parallel Master Port (PMP) drives small TFT displays (QVGA, WQVGA) and external graphics memory with minimal glue logic. Designers use this for appliance control panels, medical instrument displays and industrial HMIs that need color graphics without resorting to higher-cost MPU-class parts. The 256 KB Flash stores fonts, icons and a lightweight GUI library, while the 50 MHz core keeps frame-buffer updates responsive. Combine with a 3.3 V boost converter for display backlight LEDs.
Recommandé
Capacitive Touch Interface (mTouch)
The on-chip mTouch capacitive-touch hardware and CTMU peripheral let the PIC32MX270F256DT-V/ML implement buttons, sliders and proximity sensors without dedicated touch ICs. Designers use mTouch for appliance fronts, industrial control panels and sealed enclosures where mechanical switches fail under moisture or debris. The CTMU provides 1 ns time-measurement resolution for precise charge-time sensing, and 64 KB SRAM stores debounce, gesture and calibration state. Typical scan time is well below 10 ms across 16 electrodes.
Recommandé
Industrial Sensor Hub / Data Logger
The PIC32MX270F256DT-V/ML is a strong fit for industrial sensor hubs that aggregate analog inputs, drive I2C sensors, and stream data over UART or USB. Five 16-bit timers, two I2C buses and two UARTs support multiple sensor channels concurrently, while 256 KB Flash stores calibration tables and small protocol stacks. The automotive -V grade extends operating life into harsher factory environments when paired with conformal coating. 64 KB SRAM buffers logs between network transmissions.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX270F256DT-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX270F256DT-I/ML | PIC32MX270F256DT-50I/ML | PIC32MX270F256D-I/ML | PIC32MX250F256D-I/ML | PIC32MX254F128D-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VQFN (8x8 mm) with exposed pad | 44-VQFN (8x8 mm) - same | 44-VQFN (8x8 mm) - same | 44-VQFN (8x8 mm) - same | 44-VQFN (8x8 mm) - same | 44-VQFN (8x8 mm) - same |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 32 KB |
| Max CPU Speed | 50 MHz / 83 DMIPS | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Operating Temperature | -40C to +105C (Automotive V grade) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| AEC-Q100 | Yes (V grade) | No (Industrial) | No (Industrial) | No (Industrial) | No (Industrial) | No (Industrial) |
| USB 2.0 OTG | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) | Yes (FS) |
Principaux différenciateurs
- AEC-Q100 / -40C to +105C automotive qualification (vs PIC32MX270F256DT-I/ML)
- 256 KB Flash vs 128 KB on smaller siblings (vs PIC32MX254F128D-I/ML)
- USB 2.0 full-speed OTG with on-chip transceiver (vs PIC32MX230F064D-50I/ML (smaller Flash variant))
Notes de conception
Decouple every VDD/VSS pair with a 0.1 uF ceramic capacitor placed within 3 mm of the pin, and add a 4.7 uF bulk capacitor near the package. For USB bus-powered designs, the internal 3.3 V regulator (VCAP pin) requires a 10 uF low-ESR capacitor; insufficient decoupling on VCAP is a common cause of USB enumeration failures. Keep digital VDD and analog AVDD rails short and star-grounded.
The VQFN-44 exposed thermal pad must be soldered to a contiguous ground plane for thermal and electrical performance. Use an array of thermal vias (0.3 mm drill, 0.5 mm pitch) under the pad to drop heat to inner planes. USB D+/D- must be routed as a 90-ohm differential pair with no stubs, length-matched within 150 mil, and kept away from switching nodes to pass USB compliance.
When migrating code from a PIC32MX1XX/2XX industrial variant to the -V (automotive) grade, verify that I/O pin mapping and PPS assignments still match. PPS feature lets remap peripherals post-pinout; check the lock/unlock sequence in the device header file before changing PPS in production code. Avoid leaving unused I/O as floating inputs - either configure as outputs low or enable internal pull-downs to prevent shoot-through currents.
For mTouch capacitive sensing, route the sense traces with minimal length, no parallel high-current traces, and a ground shield beneath. Use the CTMU peripheral for 1 ns resolution time measurement, and keep the ADC reference pin (VREF+/VREF-) decoupled with 10 uF + 0.1 uF caps. Avoid using the same pin as both ADC input and digital output to prevent noise coupling.
Informations de conformité
V temperature grade (-40C to +105C) denotes AEC-Q100 qualification per Microchip ordering nomenclature. RoHS/REACH compliance status confirmed via Microchip product page.
