PIC32MX270F256DT-50I/ML - 50MHz 32-bit MCU, 256KB Flash, USB | Microchip
Référence : PIC32MX270F256DT-50I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.48 | $64,80 |
| 100 | $5.78 | $578,00 |
| 500 | $5.2 | $2 600,00 |
| 1 000 | $4.61 | $4 610,00 |
PIC32MX270F256DT-50I/ML Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and peripherals on one IC. The PIC32MX family belongs to the 32-bit MCU hierarchy: 32-bit MCU -> MIPS M4K core -> PIC32MX2xx subfamily -> Microchip 8/16/32-bit microcontrollers -> embedded semiconductors. By merging BIOS-level state machines and CPU subsystems onto one silicon die, an MCU replaces discrete logic that previously required external memory, bus controllers, and glue logic - reducing BOM count, PCB area, and power consumption.
Key features of this device include a 50 MHz/83 DMIPS MIPS32 M4K core, USB 2.0 full-speed device/host/OTG, two I2S/SPI modules for codec interfacing, a Parallel Master Port (PMP) for graphics, Peripheral Pin Select (PPS) for flexible I/O mapping, mTouch capacitive-touch support, and a 1 ns high-resolution time-capture peripheral (SCCP) suitable for precise event timing. It integrates 256 KB Flash, 64 KB SRAM, a 10-bit 1 Msps ADC, five 16-bit timers, two UART, two I2C, and a Charge Time Measurement Unit (CTMU). The 44-QFN 0.5 mm pitch package enables compact designs with a thermal pad for improved heat dissipation.
Architecturally the PIC32MX270 family uses the MIPS32 M4K Harvard core with separate Flash and SRAM buses for predictable instruction fetch and data access, supported by a prefetch cache and a 7-channel DMA controller. A 10-bit ADC must register to the analog domain, while USB 2.0 full-speed OTG adds a serial interface engine and dedicated DMA. The 0.5 mA/MHz typical active current at 50 MHz places steady-state draw near 25 mA, with multiple low-power modes (Idle, Sleep) and a real-time clock calendar running from an external 32.768 kHz crystal for sub-microamp standby. A 5-bit Peripheral Pin Select (PPS) remapping table allows most digital peripherals to be assigned to most digital I/O pins, easing PCB routing in mixed-signal boards.
Typical applications include USB HID/CDC devices such as PC peripherals and game controllers, audio playback and recording boards using the I2S interface, low-cost graphical HMI panels leveraging the PMP for TFT or OLED displays, capacitive-touch key/slider front panels, and industrial sensor hubs requiring USB plus UART/CAN bridging. Designers should pay attention to the exposed-pad PCB land pattern: the thermal pad must be soldered to a sufficiently large copper pour for thermal dissipation and signal-ground return, and decoupling must include 0.1 uF and 1 uF ceramics near each power pin. Programming requires either an ICSP header or the JTAG boundary-scan interface, and the USB-IF-pin D+/D– traces must be routed as a 90 ohm differential pair on the PCB top layer.
This page synthesizes distributor stock data, drop-in alternative cross-reference, and practical design notes that are not consolidated in the manufacturer datasheet. According to the Microchip PIC32MX1XX/2XX 28/36/44-pin family datasheet (DS60001168L), this part supports industrial -40C to +85C operation (I-suffix).
Alternatives de remplacement direct pour PIC32MX270F256DT-50I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX270F256DT-50I/ML (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Operating Temperature Range, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX270F256D-50I/ML
✅ Remplacement direct✓ En stock
$3.74 / unité
Voir la fiche technique →PIC32MX250F256DT-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX230F256DT-50I/ML
✅ Remplacement direct✓ En stock
$3.32 / unité
Voir la fiche technique →PIC32MX170F256DT-50I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX270F256DT-I/ML
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →PIC32MX254F128DT-I/ML
✅ Remplacement direct✓ En stock
$2.62 / unité
Voir la fiche technique →PIC32MX130F256DT-50I/ML
✅ Remplacement direct✓ En stock
$2.55 / unité
Voir la fiche technique →PIC32MX270F256DT-50I/ML Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M4K (32-bit) |
| Maximum CPU Clock | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| SRAM | 64 KB |
| Operating Voltage Range | 2.3 V to 3.6 V |
| I/O Pins | 34 (approximate, package-dependent) |
| ADC | 10-bit, up to 1 Msps, 13 channels (approximate) |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| I2S/SPI Modules | 2 (for codec and serial communications) |
| UART | 2 |
| I2C | 2 |
| Timers | 5 x 16-bit |
| Parallel Master Port (PMP) | Yes (for graphics interfaces) |
| Peripheral Pin Select (PPS) | Yes |
| mTouch Capacitive Touch | Supported (CTMU) |
| DMA Channels | 7 (approximate) |
| Plage de température de fonctionnement | -40C to +85C (I-grade) |
| Boîtier | 44-QFN (8x8 mm) with exposed pad (HVQCCN) |
| Type de montage | Surface Mount |
| Lead-Free / RoHS | Lead-free, RoHS-compliant |
Configuration des broches de PIC32MX270F256DT-50I/ML
| Broche 1 | RP5 — Remappable peripheral pin (I/O) |
| Broche 2 | RP4 — Remappable peripheral pin (I/O) |
| Broche 3 | RP3 — Remappable peripheral pin (I/O) |
| Broche 4 | RP2 — Remappable peripheral pin (I/O) |
| Broche 5 | RP1 — Remappable peripheral pin (I/O) |
| Broche 6 | RP0 — Remappable peripheral pin (I/O) |
| Broche 7 | VDD — Core logic supply (2.3-3.6 V) |
| Broche 8 | VSS — Ground reference |
| Broche 9 | OSC1 — Crystal oscillator input |
| Broche 10 | OSC2 — Crystal oscillator output |
| Broche 11 | D+ — USB D+ data line |
| Broche 12 | D- — USB D- data line |
| Broche 13 | VBUS — USB VBUS sense |
| Broche 14 | VUSB — USB 3.3 V regulator input |
| Broche 15 | AN0 — Analog input / GPIO |
| Broche 16 | AN1 — Analog input / GPIO |
| Broche 17 | AN2 — Analog input / GPIO |
| Broche 18 | AN3 — Analog input / GPIO |
| Broche 19 | AN4 — Analog input / GPIO |
| Broche 20 | AN5 — Analog input / GPIO |
| Broche 21 | AN6 — Analog input / GPIO |
| Broche 22 | AN7 — Analog input / GPIO |
| Broche 23 | AN8 — Analog input / GPIO |
| Broche 24 | AN9 — Analog input / GPIO |
| Broche 25 | AN10 — Analog input / GPIO |
| Broche 26 | AN11 — Analog input / GPIO |
| Broche 27 | AN12 — Analog input / GPIO |
| Broche 28 | AN13 — Analog input / GPIO |
| Broche 29 | VDD — I/O supply (2.3-3.6 V) |
| Broche 30 | VSS — Ground reference |
| Broche 31 | RP6 — Remappable peripheral pin (I/O) |
| Broche 32 | RP7 — Remappable peripheral pin (I/O) |
| Broche 33 | RP8 — Remappable peripheral pin (I/O) |
| Broche 34 | RP9 — Remappable peripheral pin (I/O) |
| Broche 35 | RP10 — Remappable peripheral pin (I/O) |
| Broche 36 | RP11 — Remappable peripheral pin (I/O) |
| Broche 37 | RP12 — Remappable peripheral pin (I/O) |
| Broche 38 | RP13 — Remappable peripheral pin (I/O) |
| Broche 39 | RP14 — Remappable peripheral pin (I/O) |
| Broche 40 | RP15 — Remappable peripheral pin (I/O) |
| Broche 41 | MCLR — Master clear reset (active low) |
| Broche 42 | PGEC1 — Programming clock / ICSP |
| Broche 43 | PGED1 — Programming data / ICSP |
| Broche 44 | EP — Exposed thermal pad (connect to VSS) |
Applications typiques
PIC32MX270F256DT-50I/ML convient pour 6 applications: USB HID / CDC Peripheral Device, Audio Playback / Recording Board, Low-Cost Graphical HMI / Display Panel, Capacitive-Touch Key / Slider Front Panel, Industrial Sensor Hub with USB/UART Bridging, IoT Edge Node with USB Diagnostics.
USB HID / CDC Peripheral Device
The PIC32MX270F256DT-50I/ML is ideal for USB Human Interface Device (HID) and Communication Device Class (CDC) peripherals thanks to its integrated USB 2.0 full-speed OTG controller and 50 MHz/83 DMIPS MIPS32 M4K core. The on-chip USB module includes a serial interface engine plus internal pull-up, eliminating the external 1.5K pull-up typically needed on MCUs without USB peripherals. The 256 KB Flash stores USB stack plus HID report descriptors plus boot-time application codes; the 64 KB SRAM provides headroom for HID report buffer and CDC eventing. Place the part with the D+/D- pins routed as a 90 ohm differential pair, and use 0.1 uF plus 1 uF ceramic decoupling on each VDD/VSS pair.
Recommandé
Audio Playback / Recording Board
The PIC32MX270F256DT-50I/ML supports audio playback and recording applications through its two I2S/SPI modules designed for codec interfacing. The 50 MHz MIPS32 M4K core delivers sufficient throughput for 48 kHz/16-bit stereo audio streaming with DMA, while the 64 KB SRAM buffers a full audio frame at low CPU overhead. The Parallel Master Port (PMP) connects to a TFT or OLED display for status and menu rendering. Pair the MCU with a low-power audio codec such as the Microchip MCP4725 for a complete audio recording chain. The 44-QFN exposed pad keeps thermal dissipation low even with continuous DMA activity.
Recommandé
Low-Cost Graphical HMI / Display Panel
The PIC32MX270F256DT-50I/ML drives low-cost TFT or OLED graphical Human-Machine Interface (HMI) panels through the PMP parallel master port, providing 8/16-bit parallel data plus control lines for typical small-display controllers. The 50 MHz core renders graphical menus at 60 Hz with sufficient headroom for capacitive-touch UI processing using the on-chip CTMU. The 256 KB Flash stores fonts plus image assets plus application logic. The exposed thermal pad keeps the part cool even at full 50 MHz CPU activity during continuous UI rendering.
Recommandé
Capacitive-Touch Key / Slider Front Panel
The PIC32MX270F256DT-50I/ML supports capacitive-touch key and slider front panels using the on-chip mTouch CTMU peripheral, which provides hardware-based charge-time measurement for up to 13 touch channels. The 1 ns high-resolution time-capture peripheral (SCCP) enables precise event timing for slider position decoding. The 50 MHz CPU runs Microchip's mTouch library plus UI rendering plus communications simultaneously. The 256 KB Flash stores touch calibration plus UI assets plus protocol stacks.
Recommandé
Industrial Sensor Hub with USB/UART Bridging
The PIC32MX270F256DT-50I/ML serves as an industrial sensor hub with USB-to-UART bridging using its integrated USB 2.0 full-speed plus two UARTs. The 50 MHz/83 DMIPS MIPS32 M4K throughput supports command-rate forwarding, sensor-data aggregation, and protocol translation at line rates up to 115200 baud. The 256 KB Flash stores sensor processing plus protocol stacks plus firmware update handler. The -40C to +85C industrial operating temperature range (I-grade) supports plant-floor deployment without thermal management.
Recommandé
IoT Edge Node with USB Diagnostics
The PIC32MX270F256DT-50I/ML powers IoT edge nodes that use USB as a diagnostics/configuration channel plus UART/UART for sensor interfaces. The Primary UART plus Secondary UART provide dual-channel sensor aggregation, while the USB OTG port acts as a CDC-ACM device for host-side diagnostics, firmware update, and log dump. The 256 KB Flash stores IoT protocol plus secure-boot handler plus application logic. The I2S/SPI modules provide additional peripheral options. The 64 KB SRAM supports TLS/DTLS context plus data buffers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX270F256DT-50I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX270F256D-50I/ML | PIC32MX250F256DT-I/ML | PIC32MX230F256DT-50I/ML | PIC32MX170F256DT-50I/ML | PIC32MX130F256DT-50I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) with exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum CPU Clock | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz | 50 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB 2.0 OTG | Yes (Full-Speed Device/Host/OTG) | Yes | No | No | No | No |
| ADC Channels (10-bit) | 13 channels | 13 | 13 | 9 | 13 | 10 |
| Operating Temperature | -40C to +85C (I-grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Core Architecture | MIPS32 M4K (32-bit) | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed OTG with on-chip transceiver (vs PIC32MX250F256DT-I/ML)
- 50 MHz / 83 DMIPS performance grade (vs PIC32MX270F256DT-I/ML)
- 13-channel 10-bit ADC with CTMU capacitive touch (vs PIC32MX230F256DT-50I/ML)
Notes de conception
The 44-QFN exposed thermal pad (pin 44 / EP) must be soldered to a PCB copper pour of at least 25 mm x 25 mm of 1 oz copper for reliable thermal dissipation under continuous 50 MHz operation. Estimated: at 50 MHz CPU active current of 25 mA typical at 3.3 V, the MCU dissipates approximately 0.08 W worst-case steady state; the exposed pad provides adequate thermal relief when properly connected to a ground pour. For high-ambient-temperature industrial deployments, increase the copper area to 35 mm x 35 mm.
Decoupling capacitors must be placed as close as possible to each VDD/VSS pin pair. Use one 0.1 uF ceramic (X7R) plus one 1 uF ceramic (X5R) per power pin to handle both high-frequency transient noise and bulk-decoupling requirements. The USB D+/D- traces must be routed as a 90 ohm differential pair on the PCB top layer with ground reference, kept as short as practical, and isolated from high-speed digital signals to maintain USB signal quality.
The USB VBUS pin must be connected through a voltage divider or direct connection (per USB-OTG specification) so the MCU can sense VBUS presence. The crystal oscillator traces (OSC1/OSC2) must be kept short and surrounded by a ground guard ring to minimize EMI; the load capacitors should be placed adjacent to the MCU pins and connected to ground. The ICSP programming pins (PGEC1/PGED1) require a 4-pin header for in-circuit programming access.
Do not exceed the maximum operating voltage of 3.6 V on any VDD pin - the PIC32MX270F256DT-50I/ML is NOT 5 V tolerant on digital I/O pins, and over-voltage can permanently damage the device. Always insert a level series protection on any external signals interfacing to 5 V logic. Programming pin sequencing and current profiles must match the device datasheet's POR flash specification to avoid partial Flash programming during firmware update.
Informations de conformité
RoHS compliant per Microchip product page. Lead-free 44-QFN (8x8 mm) package. Halogen-free per Microchip environmental compliance documentation.
