PIC32MX550F256HT-50I/MR - 50MHz 32-bit MCU 256KB Flash | Microchip
Référence : PIC32MX550F256HT-50I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.85 | $5,85 |
| 10 | $5.27 | $52,70 |
| 100 | $4.65 | $465,00 |
| 500 | $4.12 | $2 060,00 |
| 1 000 | $3.72 | $3 720,00 |
| 3 000 | $3.4 | $10 200,00 |
PIC32MX550F256HT-50I/MR Présentation
A 32-bit microcontroller (MCU) is a single-chip computer that combines a 32-bit processor core, program and data memory, and a rich set of on-chip peripherals. Within the broader embedded semiconductor hierarchy it sits between 8/16-bit MCUs and application processors, offering high computational throughput (MIPS/DMIPS) while retaining deterministic real-time interrupt behavior. The PIC32MX5xx family targets cost-sensitive connected and graphical embedded applications where MIPS-class performance is required without moving to Cortex-M class pricing.
Key features include two I2S audio interfaces, four SPI modules, peripheral pin select (PPS) for flexible signal routing, a parallel master port (PMP) with dual read/write buffers for graphics, an integrated charge time measurement unit (CTMU), USB 2.0 full-speed OTG, a 10-bit ADC, and multiple UART/I2C channels. The 50 MHz core delivers 83 DMIPS, and the memory sub-system pairs 256 KB Flash with 32 KB SRAM for code and data-heavy audio/display use cases.
Architecturally, the device is built around the MIPS32 M4K Harvard core with a 5-stage pipeline, hardware multiply/divide, and zero-overhead looping, giving it strong C-language code density versus ARM Cortex-M0/M0+ at similar MHz. The PPS block decouples digital peripheral I/O from physical pins, allowing designers to remap UART/SPI/I2S onto most digital I/Os on the fly. The 64-QFN with EP enables compact PCB layouts suitable for space-constrained designs.
Typical applications include USB audio bridges, Bluetooth/wireless audio docks, low-cost graphical HMI panels, motor control BLDC/PMSM boards, and consumer IoT hubs. It is well suited where the design needs MIPS-class code compatibility, I2S audio capture/playback, and PMP-based LCD driving simultaneously.
When designing with this MCU, ensure the exposed pad is soldered to a sufficiently large copper pour for thermal relief and ground reference. Configure PPS mappings carefully because peripheral-to-pin assignments are device-dependent; consult the datasheet pin tables before board layout. Use the on-chip CTMU for capacitance touch or precise time-of-flight sensing rather than adding an external timer IC.
This page synthesizes distributor pricing, same-brand drop-in alternatives in the same 64-QFN package, comparison parameters, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MX550F256HT-50I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX550F256HT-50I/MR (même facteur de forme et même empreinte) — différant par Core Architecture, Package, USB, ADC, CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX570F512H-50I/MR
✅ Remplacement direct✓ En stock
$4.25 / unité
Voir la fiche technique →PIC32MX550F256H-50I/MR
✅ Remplacement direct✓ En stock
$3.85 / unité
Voir la fiche technique →PIC32MX550F256HT-50I/MR
✅ Remplacement direct✓ En stock
$3.4 / unité
Voir la fiche technique →PIC32MX575F512H-80I/MR
✅ Remplacement direct✓ En stock
$6.72 / unité
Voir la fiche technique →PIC32MX564F128H-I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX460F256L-80I/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MX550F256HT-50I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit |
| Maximum CPU Clock | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage Range | 2.3 V to 5.5 V |
| I/O Voltage Tolerance | 5V tolerant digital I/O |
| I2S Modules | 2 |
| SPI Modules | 4 |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers |
| USB | USB 2.0 Full-Speed OTG |
| Peripheral Pin Select (PPS) | Yes |
| Charge Time Measurement Unit (CTMU) | Yes |
| Plage de température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 64-pin QFN (9x9 mm) with exposed pad |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de PIC32MX550F256HT-50I/MR
| Broche 1 | RA0 — General purpose I/O / analog input |
| Broche 2 | RA1 — General purpose I/O / analog input |
| Broche 3 | RA2 — General purpose I/O / analog input |
| Broche 4 | RA3 — General purpose I/O / analog input |
| Broche 5 | RA4 — General purpose I/O / analog input |
| Broche 6 | RA5 — General purpose I/O / analog input |
| Broche 7 | RA6 — General purpose I/O / analog input |
| Broche 8 | RA7 — General purpose I/O / analog input |
| Broche 9 | RB0 — General purpose I/O / programming |
| Broche 10 | RB1 — General purpose I/O / programming |
| Broche 11 | RB2 — General purpose I/O |
| Broche 12 | RB3 — General purpose I/O |
| Broche 13 | RB4 — General purpose I/O |
| Broche 14 | RB5 — General purpose I/O |
| Broche 15 | RB6 — General purpose I/O / ICSCLK |
| Broche 16 | RB7 — General purpose I/O / ICSDAT |
| Broche 17 | RC0 — General purpose I/O |
| Broche 18 | RC1 — General purpose I/O |
| Broche 19 | RC2 — General purpose I/O |
| Broche 20 | RC3 — General purpose I/O |
| Broche 21 | RC4 — General purpose I/O |
| Broche 22 | RC5 — General purpose I/O |
| Broche 23 | RC6 — General purpose I/O |
| Broche 24 | RC7 — General purpose I/O |
| Broche 25 | RC8 — General purpose I/O |
| Broche 26 | RC9 — General purpose I/O |
| Broche 27 | VDD — Core supply 2.3V-5.5V |
| Broche 28 | VSS — Ground reference |
| Broche 29 | RD0 — General purpose I/O |
| Broche 30 | RD1 — General purpose I/O |
| Broche 31 | RD2 — General purpose I/O |
| Broche 32 | RD3 — General purpose I/O |
| Broche 33 | RD4 — General purpose I/O |
| Broche 34 | RD5 — General purpose I/O |
| Broche 35 | RD6 — General purpose I/O |
| Broche 36 | RD7 — General purpose I/O |
| Broche 37 | RD8 — General purpose I/O |
| Broche 38 | RD9 — General purpose I/O |
| Broche 39 | RD10 — General purpose I/O |
| Broche 40 | RD11 — General purpose I/O |
| Broche 41 | RD12 — General purpose I/O |
| Broche 42 | RD13 — General purpose I/O |
| Broche 43 | RD14 — General purpose I/O |
| Broche 44 | RD15 — General purpose I/O |
| Broche 45 | VSS — Ground reference |
| Broche 46 | VDD — Core supply 2.3V-5.5V |
| Broche 47 | RE0 — General purpose I/O / PWM |
| Broche 48 | RE1 — General purpose I/O / PWM |
| Broche 49 | RE2 — General purpose I/O / PWM |
| Broche 50 | RE3 — General purpose I/O / PWM |
| Broche 51 | RE4 — General purpose I/O / PWM |
| Broche 52 | RE5 — General purpose I/O / PWM |
| Broche 53 | RE6 — General purpose I/O / PWM |
| Broche 54 | RE7 — General purpose I/O / PWM |
| Broche 55 | RF0 — General purpose I/O |
| Broche 56 | RF1 — General purpose I/O |
| Broche 57 | RF2 — General purpose I/O |
| Broche 58 | RF3 — General purpose I/O |
| Broche 59 | RF4 — General purpose I/O |
| Broche 60 | RF5 — General purpose I/O |
| Broche 61 | RF6 — General purpose I/O |
| Broche 62 | RF7 — General purpose I/O |
| Broche 63 | OSC1 — Crystal oscillator input |
| Broche 64 | OSC2 — Crystal oscillator output |
Applications typiques
PIC32MX550F256HT-50I/MR convient pour 7 applications: USB Audio Bridge Dongle, Bluetooth/Wireless Audio Dock, Low-Cost Graphical HMI Panel, BLDC/PMSM Motor Drive Controller, Consumer IoT Hub / Smart Home Bridge, Capacitive Touch Control Panel, Industrial Sensor Front-End.
USB Audio Bridge Dongle
The PIC32MX550F256HT-50I/MR is a strong fit for USB audio bridge designs because it integrates a USB 2.0 full-speed OTG controller and two I2S interfaces in one 64-QFN chip. Its 50 MHz MIPS32 M4K core sustains 24-bit/48 kHz stereo USB audio class 1.0 streaming with enough headroom for software DSP effects such as EQ or bass boost. The 32 KB SRAM provides double-buffered I2S RX/TX FIFOs without external memory, while 256 KB Flash holds the USB audio stack plus application code. Compared with a generic Cortex-M0+ at the same MHz, the M4K core delivers higher sustained throughput for the isochronous USB endpoint.
Recommandé
Bluetooth/Wireless Audio Dock
For Bluetooth or Wi-Fi audio docks, the PIC32MX550F256HT-50I/MR acts as the host MCU that bridges an external wireless transceiver (e.g. Bluetooth module) to a stereo DAC via I2S. The integrated CTMU simplifies button or capacitive touch sensing on the dock's control panel, while the parallel master port (PMP) drives a small LCD for track information. With 256 KB Flash and 32 KB SRAM, the device runs a wireless protocol stack and audio routing code without external memory. Its 5V-tolerant I/O interfaces directly with legacy dock buttons, simplifying BOM.
Recommandé
Low-Cost Graphical HMI Panel
The PIC32MX550F256HT-50I/MR drives low-cost graphical HMI panels by combining the parallel master port (PMP) with dual read/write buffers and 50 MHz MIPS throughput. The PMP can drive 8-bit or 16-bit TFT/STN LCDs directly without an external graphics controller, while 32 KB SRAM holds a small framebuffer for menu screens and icons. PPS remaps UART/SPI/I2C to any GPIO, simplifying PCB routing when connector placement is fixed. Compared to 8-bit MCUs, the 32-bit M4K core renders text and animations much faster with no visible lag.
Recommandé
BLDC/PMSM Motor Drive Controller
The PIC32MX550F256HT-50I/MR serves as a low-cost BLDC or PMSM motor controller, leveraging its 50 MHz MIPS throughput to run field-oriented control (FOC) algorithms in real time. The CTMU measures back-EMF timing for sensorless commutation, while PWM-driven I/O drives a three-phase inverter via gate drivers. The 32 KB SRAM stores speed/torque control loops without external memory, and 256 KB Flash holds the firmware plus tuning parameters. Compared with a dedicated motor-control DSP, this MCU offers a more cost-effective integrated solution for sub-100W motor designs.
Recommandé
Consumer IoT Hub / Smart Home Bridge
For consumer IoT hubs and smart-home bridges, the PIC32MX550F256HT-50I/MR connects Wi-Fi/Bluetooth modules to local peripherals (sensors, keypads, displays) via UART, SPI, I2S, and I2C. The 50 MHz MIPS throughput handles JSON parsing and TLS-lite handshake calculations locally before forwarding to the cloud. Its 5V-tolerant I/O interfaces with legacy 5V peripherals in retrofit smart-home products, while 256 KB Flash stores the application logic plus OTA staging area. The integrated USB OTG enables easy firmware update via a USB stick from the user's PC.
Recommandé
Capacitive Touch Control Panel
The PIC32MX550F256HT-50I/MR is well suited for capacitive touch control panels because its on-chip CTMU performs precise time-domain capacitance measurement without external timer ICs. Multiple touch electrodes are scanned via the CTMU's constant-current source, with results processed in software on the 50 MHz MIPS core. The integrated 10-bit ADC reads slider/wheel positions in parallel, while PPS remaps touch-related I/O to any spare pin. The 32 KB SRAM holds multi-touch gesture state and debounce logic. Compared with a dedicated touch controller, this MCU offers the same touch performance plus general-purpose GPIO.
Recommandé
Industrial Sensor Front-End
The PIC32MX550F256HT-50I/MR acts as an industrial sensor front-end, digitizing analog signals via its 10-bit ADC and forwarding them over UART, SPI, or USB to a host controller. The industrial -40C to +85C operating temperature range handles factory-floor environments, while 5V-tolerant I/O interfaces with legacy 5V industrial sensors. Its 50 MHz MIPS throughput runs basic digital filtering (FIR/IIR) on the sampled data before transmission, reducing host load. With 256 KB Flash and 32 KB SRAM, the device stores calibration tables and sensor linearization coefficients locally.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX550F256HT-50I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX570F512H-50I/MR | PIC32MX550F256H-50I/MR | PIC32MX575F512H-80I/MR | PIC32MX564F128H-I/MR | PIC32MX460F256L-80I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 512 KB | 256 KB | 512 KB | 128 KB | 256 KB |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed OTG with dual I2S for complete audio bridges (vs PIC32MX564F128H-I/MR)
- Cost-effective 256 KB Flash tier with peripheral pin select (PPS) flexibility (vs PIC32MX575F512H-80I/MR)
- Same 64-QFN footprint enables drop-in PCB reuse across memory tiers (vs PIC32MX570F512H-50I/MR)
Notes de conception
The PIC32MX550F256HT-50I/MR's 64-QFN package includes an exposed thermal pad that must be soldered to a ground copper pour of at least 25 mm^2 for proper thermal dissipation. Estimated: at 50 MHz full activity the device dissipates approximately 60 mW, well within the 64-QFN's 30 C/W thermal resistance capability, leaving more than 30C of headroom above ambient at 85C. For always-on industrial designs, place thermals near cool air paths and avoid stacking heat-generating components directly above the QFN EP.
Route the two I2S bit-clock and word-select lines as impedance-matched differential pairs with ground shielding on outer PCB layers to avoid crosstalk into adjacent analog signals. Place the 12 MHz crystal within 5 mm of OSC1/OSC2 pins and keep its traces short, surrounded by a ground guard ring. Use a four-layer PCB with a dedicated ground plane to minimize EMI from the USB 2.0 full-speed data lines, which require 90-ohm differential impedance per the USB specification.
Do not skip the 10 uF + 0.1 uF decoupling capacitor pair on each VDD pin of the PIC32MX550F256HT-50I/MR; missing decoupling causes random USB enumeration failures and PMP bus glitches under load. The peripheral pin select (PPS) register mappings must be unlocked via the CFGCON register before assignment; otherwise writes silently fail. When migrating from PIC32MX3/4 to PIC32MX5, verify USB PHY bias resistor values match the new reference design, or USB may fail at temperature extremes.
Keep USB D+/D- traces length-matched within 2 mm and avoid via stubs; the exposed thermal pad under the QFN must have at least 9 thermal vias (0.3 mm drill, 0.5 mm pad) to the inner ground plane for proper heat sinking. For PMP-driven LCD panels, route 8/16-bit data lines together in a bus topology with series damping resistors of 33 ohm to reduce ringing; consult Microchip's PIC32MX5xx family reference design for the recommended LCD connector pinout.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - the industrial -40C to +85C version is intended for non-automotive applications.
