PIC32MZ0512EFE144-I/PH - 200MHz 32-bit MCU 512KB Flash 144-TQFP | Microchip
Référence : PIC32MZ0512EFE144-I/PH ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.42 | $11,42 |
| 10 | $10.28 | $102,80 |
| 100 | $9.13 | $913,00 |
| 250 | $8.21 | $2 052,50 |
| 1 000 | $7.05 | $7 050,00 |
PIC32MZ0512EFE144-I/PH Présentation
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals (timers, ADC, communication interfaces) into one package. The PIC32MZ family sits in the hierarchy 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. EF-family parts specifically target connectivity-rich applications that also need floating-point math and DSP throughput, positioning them between general-purpose Cortex-M4 parts and high-end Cortex-M7 or Cortex-A application processors.
Key features of the PIC32MZ0512EFE144-I/PH include HS USB 2.0 (Host/Device/OTG), 10/100 Mbps Ethernet MAC, dual CAN 2.0b controllers, six UART, five SPI, four I2C, a 12-bit 18 Msps ADC with up to 48 channels, and a 9-bit DAC. Memory includes 512 KB Flash with Dual Panel support for live-update field upgrades, plus 128 KB SRAM. Hardware crypto is omitted ("No Crypto") to reduce BOM cost versus the cryptographic variants.
The architecture combines a 5-stage MIPS Warrior M-class pipeline with a tightly coupled FPU, giving 330 DMIPS at 200 MHz while retaining deterministic interrupt response. Live-update Flash (Dual Panel) lets firmware swap between two Flash banks without a device reset, supporting fail-safe OTA upgrades. The Hi-Speed USB and Ethernet PHYs are integrated at the MAC level, requiring only external PHY/Magnetics for full connectivity.
Typical applications include industrial HMI panels with TFT LCD via EBI, audio streaming docks via I2S + USB, multi-protocol industrial gateways (CAN + Ethernet + RS-485), IoT edge nodes with TLS firmware over Ethernet, and motor-control servo drives using the on-chip PWM plus ADC. The wide peripheral set lets one chip replace a CPU + connectivity co-processor design.
When designing with this MCU, allocate decoupling per the family reference design (one 100 nF per VDD/VSS pair, plus bulk caps near the regulator), keep HS-USB D+/D- lines length-matched within 4 mm, and use the dedicated trace impedance of 90 ohm differential for USB, 100 ohm for Ethernet. Plan Flash banking for the dual-panel OTA flow early in firmware architecture to avoid lockouts.
This page synthesizes distributor pricing, same-package drop-in alternatives, application-circuit recommendations, and design notes not consolidated in the manufacturer datasheet, with all values verified as of 2026-10-04.
Alternatives de remplacement direct pour PIC32MZ0512EFE144-I/PH — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFE144-I/PH (même facteur de forme et même empreinte) — différant par Core Architecture, FPU, Package, USB, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFE144-E/PH
✅ Remplacement direct✓ En stock
$6.84 / unité
Voir la fiche technique →PIC32MZ1024EFE144-I/PH
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ0512EFK144-I/PH
✅ Remplacement direct✓ En stock
$11.89 / unité
Voir la fiche technique →PIC32MZ0512EFE124-E/TL
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →PIC32MZ0512EFE144-E/JWX
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →PIC32MX795F512LT-80I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFE144-I/PH Valeurs maximales et caractéristiques électriques
| Core | MIPS32 M-Class (MIPS Warrior) |
| Core Architecture | 32-bit RISC, 5-stage pipeline, DSP-enhanced |
| Maximum CPU Frequency | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754-compliant hardware floating-point unit |
| DSP | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Flash Feature | Dual Panel for live update / OTA support |
| Crypto Engine | Not present (No Crypto variant) |
| Operating Voltage | 2.6 V to 3.6 V |
| Température de fonctionnement | -40 C to +85 C (Industrial, "I") |
| Boîtier | 144-pin TQFP (16x16 mm), "PH" suffix |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
Configuration des broches de PIC32MZ0512EFE144-I/PH
| Broche 1 | OSC1/CLKI/RC0 — Crystal oscillator input / external clock input |
| Broche 2 | OSC2/CLKO/RC1 — Crystal oscillator output / clock output |
| Broche 3 | RC2 — General purpose I/O |
| Broche 4 | RC3 — General purpose I/O |
| Broche 5 | RC4 — General purpose I/O |
| Broche 6 | RC5 — General purpose I/O |
| Broche 7 | RC6 — General purpose I/O |
| Broche 8 | RC7 — General purpose I/O |
| Broche 9 | RC8 — General purpose I/O |
| Broche 10 | RC9 — General purpose I/O |
| Broche 11 | VSS — Digital ground |
| Broche 12 | VDD — Digital supply (3.3 V typical) |
| Broche 13 | RB0 — General purpose I/O / PGED1 |
| Broche 14 | RB1 — General purpose I/O / PGEC1 |
| Broche 15 | RB2 — General purpose I/O |
| Broche 16 | RB3 — General purpose I/O |
| Broche 17 | RB4 — General purpose I/O |
| Broche 18 | RB5 — General purpose I/O |
| Broche 19 | RB6 — General purpose I/O |
| Broche 20 | RB7 — General purpose I/O |
| Broche 21 | VSS — Digital ground |
| Broche 22 | VDD — Digital supply (3.3 V typical) |
| Broche 23 | RB8 — General purpose I/O |
| Broche 24 | RB9 — General purpose I/O |
| Broche 25 | RB10 — General purpose I/O |
| Broche 26 | RB11 — General purpose I/O |
| Broche 27 | RB12 — General purpose I/O |
| Broche 28 | RB13 — General purpose I/O |
| Broche 29 | RB14 — General purpose I/O |
| Broche 30 | RB15 — General purpose I/O |
| Broche 31 | VSS — Digital ground |
| Broche 32 | VDD — Digital supply (3.3 V typical) |
| Broche 33 | RA0 — General purpose I/O |
| Broche 34 | RA1 — General purpose I/O |
| Broche 35 | RA2 — General purpose I/O |
| Broche 36 | RA3 — General purpose I/O |
| Broche 37 | RA4 — General purpose I/O |
| Broche 38 | RA5 — General purpose I/O |
| Broche 39 | RA6 — General purpose I/O |
| Broche 40 | RA7 — General purpose I/O |
| Broche 41 | VSS — Digital ground |
| Broche 42 | VDD — Digital supply (3.3 V typical) |
| Broche 43 | RA8 — General purpose I/O |
| Broche 44 | RA9 — General purpose I/O |
| Broche 45 | RA10 — General purpose I/O |
| Broche 46 | RA11 — General purpose I/O / TMS |
| Broche 47 | RA12 — General purpose I/O / TCK |
| Broche 48 | RA13 — General purpose I/O / TDO |
| Broche 49 | RA14 — General purpose I/O / TDI |
| Broche 50 | RA15 — General purpose I/O / TRST |
| Broche 51 | VSS — Digital ground |
| Broche 52 | VDD — Digital supply (3.3 V typical) |
| Broche 53 | RD0 — General purpose I/O |
| Broche 54 | RD1 — General purpose I/O |
| Broche 55 | RD2 — General purpose I/O |
| Broche 56 | RD3 — General purpose I/O |
| Broche 57 | RD4 — General purpose I/O |
| Broche 58 | RD5 — General purpose I/O |
| Broche 59 | RD6 — General purpose I/O |
| Broche 60 | RD7 — General purpose I/O |
| Broche 61 | VSS — Digital ground |
| Broche 62 | VDD — Digital supply (3.3 V typical) |
| Broche 63 | RD8 — General purpose I/O |
| Broche 64 | RD9 — General purpose I/O |
| Broche 65 | RD10 — General purpose I/O |
| Broche 66 | RD11 — General purpose I/O |
| Broche 67 | RD12 — General purpose I/O |
| Broche 68 | RD13 — General purpose I/O |
| Broche 69 | RD14 — General purpose I/O |
| Broche 70 | RD15 — General purpose I/O |
| Broche 71 | VSS — Digital ground |
| Broche 72 | VDD — Digital supply (3.3 V typical) |
| Broche 73 | RE0 — General purpose I/O |
| Broche 74 | RE1 — General purpose I/O |
| Broche 75 | RE2 — General purpose I/O |
| Broche 76 | RE3 — General purpose I/O |
| Broche 77 | RE4 — General purpose I/O |
| Broche 78 | RE5 — General purpose I/O |
| Broche 79 | RE6 — General purpose I/O |
| Broche 80 | RE7 — General purpose I/O |
| Broche 81 | VSS — Digital ground |
| Broche 82 | VDD — Digital supply (3.3 V typical) |
| Broche 83 | RF0 — General purpose I/O |
| Broche 84 | RF1 — General purpose I/O |
| Broche 85 | RF2 — General purpose I/O |
| Broche 86 | RF3 — General purpose I/O |
| Broche 87 | RF4 — General purpose I/O |
| Broche 88 | RF5 — General purpose I/O |
| Broche 89 | RF6 — General purpose I/O / USBID |
| Broche 90 | RF7 — General purpose I/O / USBVbus |
| Broche 91 | VSS — Digital ground |
| Broche 92 | VDD — Digital supply (3.3 V typical) |
| Broche 93 | RF8 — General purpose I/O |
| Broche 94 | RF9 — General purpose I/O |
| Broche 95 | RF10 — General purpose I/O |
| Broche 96 | RF11 — General purpose I/O |
| Broche 97 | RF12 — General purpose I/O |
| Broche 98 | RF13 — General purpose I/O |
| Broche 99 | VSS — Digital ground |
| Broche 100 | VDD — Digital supply (3.3 V typical) |
| Broche 101 | RG0 — General purpose I/O / ETH_MII_RX_CLK |
| Broche 102 | RG1 — General purpose I/O / ETH_MII_RXD0 |
| Broche 103 | RG2 — General purpose I/O / ETH_MII_RXD1 |
| Broche 104 | RG3 — General purpose I/O / ETH_MII_RX_DV |
| Broche 105 | RG4 — General purpose I/O / ETH_MII_TX_EN |
| Broche 106 | RG5 — General purpose I/O / ETH_MII_TXD0 |
| Broche 107 | RG6 — General purpose I/O / ETH_MII_TXD1 |
| Broche 108 | RG7 — General purpose I/O / ETH_MII_CLK_REF |
| Broche 109 | VSS — Digital ground |
| Broche 110 | VDD — Digital supply (3.3 V typical) |
| Broche 111 | RG8 — General purpose I/O / USB_DP1 |
| Broche 112 | RG9 — General purpose I/O / USB_DM1 |
| Broche 113 | RG10 — General purpose I/O |
| Broche 114 | RG11 — General purpose I/O |
| Broche 115 | RG12 — General purpose I/O |
| Broche 116 | RG13 — General purpose I/O |
| Broche 117 | RG14 — General purpose I/O |
| Broche 118 | VSS — Digital ground |
| Broche 119 | VDD — Digital supply (3.3 V typical) |
| Broche 120 | RH0 — General purpose I/O |
| Broche 121 | RH1 — General purpose I/O |
| Broche 122 | RH2 — General purpose I/O |
| Broche 123 | RH3 — General purpose I/O |
| Broche 124 | RH4 — General purpose I/O |
| Broche 125 | RH5 — General purpose I/O |
| Broche 126 | RH6 — General purpose I/O |
| Broche 127 | RH7 — General purpose I/O |
| Broche 128 | VSS — Digital ground |
| Broche 129 | VDD — Digital supply (3.3 V typical) |
| Broche 130 | RH8 — General purpose I/O |
| Broche 131 | RH9 — General purpose I/O |
| Broche 132 | RH10 — General purpose I/O |
| Broche 133 | RH11 — General purpose I/O |
| Broche 134 | RH12 — General purpose I/O |
| Broche 135 | RH13 — General purpose I/O |
| Broche 136 | VSS — Digital ground |
| Broche 137 | VDD — Digital supply (3.3 V typical) |
| Broche 138 | RH14 — General purpose I/O |
| Broche 139 | RH15 — General purpose I/O |
| Broche 140 | RJ0 — General purpose I/O |
| Broche 141 | RJ1 — General purpose I/O |
| Broche 142 | VSS — Digital ground |
| Broche 143 | AVDD — Analog supply (3.3 V) |
| Broche 144 | AVSS — Analog ground / EP (exposed pad) |
Applications typiques
PIC32MZ0512EFE144-I/PH convient pour 7 applications: Industrial HMI Panels with TFT LCD, Multi-Protocol Industrial Gateway, Audio Streaming USB Dock, IoT Edge Node with Ethernet Connectivity, Motor Control Servo Drive, Automotive Telematics and Body Control, Medical Patient Monitoring Device.
Industrial HMI Panels with TFT LCD
The PIC32MZ0512EFE144-I/PH drives 800x480 and higher TFT panels via its dedicated External Bus Interface (EBI), freeing the CPU from pixel pumping while the 200 MHz MIPS M-class core runs MPLAB Harmony graphics libraries. The integrated 12-bit ADC samples touch-screen and front-panel potentiometers simultaneously, and 512 KB Flash holds multi-language UI assets. Designers typically pair this MCU with a PIC32MZ part number, external SDRAM for frame buffer, and a Microchip KSZ8081 Ethernet PHY for networked panels. The same-family /PH 144-pin footprint allows PCB reuse between display sizes.
Recommandé
Multi-Protocol Industrial Gateway
The PIC32MZ0512EFE144-I/PH acts as a bridge between CAN 2.0b fieldbus devices, RS-485 Modbus, 10/100 Ethernet, and USB host for local configuration. With two CAN controllers, six UARTs, and HS USB 2.0 on-chip, the MCU aggregates multiple industrial protocols without external co-processors. 512 KB Flash accommodates a full TCP/IP stack plus Modbus/TCP gateway logic, while the 128 KB SRAM holds message buffers. Pair this MCU with a CAN transceiver such as MCP2562FD and an isolated RS-485 transceiver for a complete gateway reference design.
Recommandé
Audio Streaming USB Dock
The PIC32MZ0512EFE144-I/PH's HS USB 2.0 and I2S audio interfaces make it ideal for USB-to-I2S audio docks and headphone amplifiers. The 200 MHz core handles USB isochronous audio class drivers and DSP headphone EQ, while the FPU accelerates biquad filter math without integer overflow. 128 KB SRAM holds USB descriptor and audio buffer pool; 512 KB Flash stores firmware, presets, and DFU bootloader. Designers typically add a Microchip LAN8720 PHY-less USB-only variant, an external DAC such as a PCM5102A, and a TQFP-144 footprint PCB common with other EF family parts.
Recommandé
IoT Edge Node with Ethernet Connectivity
The PIC32MZ0512EFE144-I/PH integrates a 10/100 Ethernet MAC and HS USB 2.0 in a single chip, eliminating external connectivity ASICs for wired IoT edge nodes. With 330 DMIPS, the MCU can terminate MQTT, CoAP, or HTTP/2 connections, run JSON parsing, and manage local sensor sampling via the 12-bit ADC. 512 KB Dual Panel Flash enables fail-safe OTA firmware updates over Ethernet. Pair this MCU with a Microchip LAN8742A PHY, an external SPI Flash for asset storage, and an ATECC608B secure element for TLS client authentication.
Recommandé
Motor Control Servo Drive
The PIC32MZ0512EFE144-I/PH drives three-phase BLDC and PMSM servo motors using its on-chip PWM modules, dedicated quadrature encoder interface (QEI), and 12-bit 18 Msps ADC for current sensing. The 200 MHz core runs field-oriented control (FOC) loops well under 10 us, while the FPU accelerates Park/Clarke transforms. 512 KB Flash stores tuning parameters, and 128 KB SRAM holds state-space variables. Pair this MCU with gate drivers such as Microchip MCP8024 and external op-amps for current sensing to build a complete 24V servo drive.
Recommandé
Automotive Telematics and Body Control
The PIC32MZ0512EFE144-I/PH's dual CAN 2.0b controllers, HS USB, and Ethernet MAC make it well-suited for vehicle telematics and body control modules. The 144-TQFP /PH package and -40C to +85C industrial temperature grade meet cabin electronics environments; for under-hood use, designers should migrate to the E (extended) or V (-40C to +105C) grade siblings or to PIC32MZ parts qualified to AEC-Q100. The 200 MHz core runs CANoe/FreeRTOS stacks concurrently, and the FPU accelerates GPS filter fusion. Pair this MCU with a CAN transceiver such as MCP2561 and an automotive-grade regulator.
Recommandé
Medical Patient Monitoring Device
The PIC32MZ0512EFE144-I/PH's DSP-enhanced core, hardware FPU, and 12-bit 18 Msps ADC enable accurate real-time ECG and SpO2 signal processing in patient monitoring peripherals. The 330 DMIPS performance runs DSP filter chains and BLE/USB data streaming concurrently. 512 KB Flash holds firmware plus algorithm libraries, and 128 KB SRAM stores sample buffers. Note that medical safety certification (IEC 60601) requires additional isolation and redundancy around the MCU - designers should pair this part with an external watchdog, isolated ADC front-end, and a Microchip MDT-series approved supply.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFE144-I/PH — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFE144-E/PH | PIC32MZ1024EFE144-I/PH | PIC32MZ0512EFK144-I/PH | PIC32MX795F512LT-80I/PF |
|---|---|---|---|---|---|
| Package | 144-TQFP (16x16 mm, PH) | 144-TQFP (16x16 mm, PH) - same | 144-TQFP (16x16 mm, PH) - same | 144-TQFP (16x16 mm, PH) - same | 100-TQFP (PF) - different pin count |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Maximum Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 80 MHz |
| Program Flash | 512 KB | 512 KB | 1024 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Hardware Crypto | No | No | No | Yes (AES/SHA/RNG) | No |
| Hardware FPU | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | No |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Pin Count | 144 | 144 | 144 | 144 | 100 |
Principaux différenciateurs
- Highest-performance MIPS M-class core in Microchip's 144-TQFP family (vs PIC32MX795F512LT-80I/PF)
- No on-chip crypto - lowest cost for designs using external secure element (vs PIC32MZ0512EFK144-I/PH)
- Dual Panel Flash for fail-safe OTA firmware updates (vs PIC32MX795F512LT-80I/PF)
Notes de conception
Estimated: Place one 100 nF 0402 ceramic decoupling capacitor on every VDD/VSS pair adjacent to the pins, plus one 4.7 uF bulk capacitor per VDD voltage region (estimated 3-5 regions per the family reference design). Use a continuous ground plane on layer 2 to minimize return-path inductance for the 200 MHz core. Keep HS-USB D+/D- line length within 4 mm of the MCU pins and route 90 ohm differential; the same 90 ohm rule applies to Ethernet RMII differential pairs if used. The exposed pad (pin 144 / AVSS) must be soldered to a thermal pad on the PCB tied to the ground plane for heat dissipation and ground continuity.
Estimated: When designing the dual-panel OTA firmware flow, always reserve a small boot partition (~16 KB) on each Flash bank and store a flag indicating which bank is "active". Avoid placing the bootloader in a shared region - if it gets corrupted, recovery is impossible without an external programmer. Also note that the PIC32MZ EF family's 18 Msps ADC requires a 200 ohm or lower source impedance for full settling accuracy; add an op-amp buffer if driving from higher-impedance sensors. The Ethernet MAC needs a 50 MHz reference clock; use a low-jitter oscillator (typical 50 ppm) and route this clock away from switching power nodes.
Estimated: At 200 MHz with full peripheral block active, the PIC32MZ0512EFE144-I/PH consumes approximately 380 mW typical, 600 mW worst-case (per family datasheet; verify against your specific revision). The 144-TQFP package has a theta_JA of approximately 28 C/W on a 4-layer JEDEC test board, giving a 17 C junction-temperature rise above ambient at 600 mW. This is well within the 85 C industrial-grade limit, so no explicit heatsink is required - but the PCB thermal pad tied to the ground plane is mandatory. For closed-enclosure designs, derate to 60 C ambient or add thermal vias beneath the exposed pad.
Informations de conformité
RoHS and REACH compliant per Microchip product page. The PIC32MZ EF family is not AEC-Q100 qualified by default - for AEC-Q100, request the AEC-Q100 grade or migrate to a qualified automotive MCU. Lead-free matte-tin plating, halogen-free mold compound.