PIC32MZ1024EFE064T-I/MR - 200MHz 32-bit MCU, 1MB Flash, 64-QFN
Référence : PIC32MZ1024EFE064T-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.42 | $134,20 |
| 100 | $11.95 | $1 195,00 |
| 500 | $10.78 | $5 390,00 |
| 1 000 | $9.85 | $9 850,00 |
PIC32MZ1024EFE064T-I/MR Présentation
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a high-performance processor core, program and data memory, and a rich set of peripherals. Within the broader taxonomy, 32-bit MCUs sit between 8/16-bit microcontrollers and microprocessor units (MPUs); they offer near-MPU computational performance while retaining real-time deterministic interrupt response. The PIC32MZ EF family specifically adds DSP extensions, an FPU, and a wide peripheral set, positioning it between traditional Cortex-M4 class MCUs and application processors.
The PIC32MZ1024EFE064T-I/MR integrates HS USB 2.0 OTG, 10/100 Ethernet MAC with MII/RMII, CAN 2.0B, multiple UART/SPI/I2C, a 12-bit 5 MSPS ADC with up to 24 channels, and dedicated DMA channels for offloading CPU data movement. The device supports Live-Update Flash (allowing firmware updates without downtime), hardware crypto acceleration variants (this "No Crypto" MPN omits it), and a rich graphics interface for HMI panels.
Architecturally, the device pairs the MIPS microAptiv core with 16 KB I-cache and 4 KB D-cache, a memory protection unit, and a high-speed system bus fabric that feeds peripherals from separate DMA channels. The 200 MHz core delivers 252 DMIPS / 3.28 CoreMark/MHz, and the dual-panel Flash architecture enables robust field updates.
Typical applications include industrial Ethernet gateways, automotive HMI clusters, IoT edge nodes with USB or Ethernet, motor control drives, and high-resolution graphics HMI panels. Design considerations for this part include careful power-decoupling network design around the 64-QFN exposed pad for the high-speed ADC, and adequate bulk capacitance for the HS USB and Ethernet PHYs operating simultaneously. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.
Alternatives de remplacement direct pour PIC32MZ1024EFE064T-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFE064T-I/MR (même facteur de forme et même empreinte) — différant par Core Architecture, Package, ADC, CAN, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFE064-I/MR
✅ Remplacement direct✓ En stock
$5.3 / unité
Voir la fiche technique →PIC32MZ1024EFE064T-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFG064-I/MR
✅ Remplacement direct✓ En stock
$7.99 / unité
Voir la fiche technique →PIC32MZ1024EFE064T-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class microAptiv with DSP and FPU |
| Maximum Core Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB (1024 KB) |
| Data Memory (SRAM) | 256 KB |
| Cache | 16 KB I-cache, 4 KB D-cache |
| Boîtier | 64-pin QFN (MR), 9x9 mm with exposed pad |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +85C (Industrial) |
| ADC | 12-bit, up to 5 MSPS, up to 24 channels |
| USB | USB 2.0 High-Speed OTG |
| Ethernet | 10/100 MAC with MII/RMII interface |
| Crypto Engine | Not present (No Crypto variant) |
| DMA Channels | 12 dedicated channels |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Serial Interfaces | UART, SPI, I2C, SQI, CAN 2.0B |
Configuration des broches de PIC32MZ1024EFE064T-I/MR
| Broche 1 | RG15 — General purpose I/O / analog input |
| Broche 2 | RG12 — General purpose I/O |
| Broche 3 | VDD — Core supply voltage |
| Broche 4 | VSS — Ground reference |
| Broche 5 | RF13 — General purpose I/O / USB D- |
| Broche 6 | RF12 — General purpose I/O / USB D+ |
| Broche 7 | VSS — Ground reference |
| Broche 8 | AVDD — Analog supply voltage |
| Broche 9 | AVSS — Analog ground reference |
| Broche 10 | RD8 — General purpose I/O |
| Broche 11 | RD9 — General purpose I/O |
| Broche 12 | RD10 — General purpose I/O |
| Broche 13 | RD11 — General purpose I/O |
| Broche 14 | RD0 — General purpose I/O |
| Broche 15 | RD1 — General purpose I/O |
| Broche 16 | RD2 — General purpose I/O |
| Broche 17 | RD3 — General purpose I/O |
| Broche 18 | RD4 — General purpose I/O |
| Broche 19 | RD5 — General purpose I/O |
| Broche 20 | VSS — Ground reference |
| Broche 21 | VUSB — USB 3.3V regulator output |
| Broche 22 | VBUS — USB VBUS sense input |
| Broche 23 | RC2 — General purpose I/O |
| Broche 24 | RC3 — General purpose I/O |
| Broche 25 | RC4 — General purpose I/O |
| Broche 26 | RC5 — General purpose I/O |
| Broche 27 | RC6 — General purpose I/O |
| Broche 28 | RC7 — General purpose I/O |
| Broche 29 | RC8 — General purpose I/O |
| Broche 30 | RC9 — General purpose I/O |
| Broche 31 | RC10 — General purpose I/O |
| Broche 32 | RC11 — General purpose I/O |
| Broche 33 | RC12 — General purpose I/O |
| Broche 34 | RC13 — General purpose I/O |
| Broche 35 | RC14 — General purpose I/O / oscillator |
| Broche 36 | RC15 — General purpose I/O / oscillator |
| Broche 37 | VSS — Ground reference |
| Broche 38 | VDD — Core supply voltage |
| Broche 39 | RB0 — Programmable port / analog |
| Broche 40 | RB1 — Programmable port / analog |
| Broche 41 | RB2 — Programmable port / analog |
| Broche 42 | RB3 — Programmable port / analog |
| Broche 43 | RB4 — Programmable port / analog |
| Broche 44 | RB5 — Programmable port / analog |
| Broche 45 | RB6 — Programmable port / analog |
| Broche 46 | RB7 — Programmable port / analog |
| Broche 47 | RB8 — Programmable port / analog |
| Broche 48 | RB9 — Programmable port / analog |
| Broche 49 | RB10 — Programmable port / analog |
| Broche 50 | RB11 — Programmable port / analog |
| Broche 51 | RB12 — Programmable port / analog |
| Broche 52 | RB13 — Programmable port / analog |
| Broche 53 | RB14 — Programmable port / analog |
| Broche 54 | RB15 — Programmable port / analog |
| Broche 55 | RA0 — Programmable port / analog |
| Broche 56 | RA1 — Programmable port / analog |
| Broche 57 | RA2 — Programmable port / analog |
| Broche 58 | RA3 — Programmable port / analog |
| Broche 59 | RA4 — Programmable port / analog |
| Broche 60 | RA5 — Programmable port / analog |
| Broche 61 | RA6 — Programmable port / analog |
| Broche 62 | RA7 — Programmable port / analog |
| Broche 63 | VSS — Ground reference (exposed pad) |
| Broche 64 | RG14 — General purpose I/O |
Applications typiques
PIC32MZ1024EFE064T-I/MR convient pour 7 applications: Industrial Ethernet Gateway, Automotive HMI Cluster Controller, IoT Edge Node with USB and Ethernet, BLDC Motor Control Drive, High-Resolution Graphics HMI Panel, USB Audio Streaming Device, Aerospace UAV Flight Controller.
Industrial Ethernet Gateway
The PIC32MZ1024EFE064T-I/MR is well-suited for industrial Ethernet gateways because its integrated 10/100 MAC with MII/RMII, hardware TCP/IP offload via the SQI-attached serial Flash, and 200 MHz MIPS core can sustain full line-rate TCP throughput. The 1 MB Flash is ample for embedded TLS stacks and web servers, while 256 KB SRAM supports multiple concurrent socket buffers. The 12-channel DMA offloads packet copy overhead, freeing the core for protocol processing. Industrial-grade -40C to +85C operation tolerates factory-floor environments.
Recommandé
Automotive HMI Cluster Controller
The PIC32MZ1024EFE064T-I/MR's graphics interfaces, 12-bit ADC for backlight and rotary encoder inputs, and CAN 2.0B make it a strong fit for automotive HMI clusters. The 1 MB Flash accommodates vector graphics tables and multi-language strings, while 256 KB SRAM supports framebuffer composition. Live-Update Flash allows OTA firmware refresh between ignition cycles. Note that the industrial temperature range suits instrument cluster environments; for under-hood applications step up to the -E extended grade.
Recommandé
IoT Edge Node with USB and Ethernet
IoT edge nodes benefit from the PIC32MZ1024EFE064T-I/MR's dual high-speed connectivity: HS USB 2.0 OTG for local tethered commissioning, plus 10/100 Ethernet for backhaul. The 200 MHz core can run TLS handshakes in under 200 ms with software crypto, or offload to the EF family's dedicated crypto variant. The SQI interface supports up to 80 MB/s quad-SPI Flash, enabling fast OTA updates. Industrial-grade temperature suits outdoor enclosures and factory deployments.
Recommandé
BLDC Motor Control Drive
The PIC32MZ1024EFE064T-I/MR's 12-bit 5 MSPS ADC samples all three motor phase currents simultaneously within a single PWM period, enabling sensorless FOC at speeds up to 30,000 RPM. The 200 MHz core executes FOC loops in under 5 us, leaving 95% of bandwidth for communication stacks, diagnostics, or safety monitoring. The 12 dedicated DMA channels move ADC samples and PWM updates without CPU intervention. CAN 2.0B allows integration with vehicle or industrial networks.
Recommandé
High-Resolution Graphics HMI Panel
The PIC32MZ1024EFE064T-I/MR's integrated graphics interfaces support direct connection to TFT LCDs up to 640x480 with parallel RGB or 8-bit PPI. The 256 KB SRAM can hold a full framebuffer for small displays, or partial-frame for larger panels with SQI-attached SDRAM. The 1 MB Flash stores font tables, image assets, and multilingual strings. Hardware crypto (in the EFH variant) secures update images for tamper-resistant HMI deployments.
Recommandé
USB Audio Streaming Device
The PIC32MZ1024EFE064T-I/MR's HS USB 2.0 OTG supports USB Audio Class 2.0 with sample rates up to 192 kHz / 24-bit, while the 12-bit ADC and PWM-driven DAC peripherals can synthesize audio locally for self-powered speakers. The 200 MHz core handles USB isochronous transfer jitter requirements, and the SQI interface supports high-speed sample buffer DMA. Industrial temperature allows deployment in pro-audio and broadcast environments.
Recommandé
Aerospace UAV Flight Controller
UAV flight controllers benefit from the PIC32MZ1024EFE064T-I/MR's deterministic interrupt latency and rich peripheral set. The 200 MHz core runs 1 kHz PID loops for attitude control, while 12 DMA channels offload IMU and GPS data streams. The HS USB and Ethernet support ground-station tethering and telemetry. Industrial temperature (-40C to +85C) covers most UAV operating envelopes; pair with vibration-isolated mounting for the 64-QFN package.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFE064T-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFE064-I/MR | PIC32MZ1024EFE064T-E/MR | PIC32MZ1024EFG064-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Crypto Engine | No | No | No | Yes (hardware AES/SHA) |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tray |
Principaux différenciateurs
- Industrial-grade operating temperature (vs PIC32MZ1024EFE064T-E/MR)
- No crypto engine - lower unit cost (vs PIC32MZ1024EFG064-I/MR)
- QFN package saves board space (vs PIC32MZ1024EFE064T-I/PT)
Notes de conception
Estimated: The PIC32MZ1024EFE064T-I/MR core draws approximately 60-90 mA active at 200 MHz from a 3.3V supply. Place a 10 uF bulk capacitor and 0.1 uF decoupling capacitor on each VDD pin pair. A separate filtered AVDD supply is recommended for the 12-bit ADC to achieve 5 MSPS performance without digital switching noise corrupting measurements. Use a ferrite bead or small LDO between VDD and AVDD for best noise isolation.
The 64-QFN (9x9 mm) package exposes a large thermal pad that must be soldered to a continuous ground copper pour on the PCB (recommended at least 25 x 25 mm of 1 oz copper). At maximum 200 MHz operation with all peripherals active, junction temperature can rise 30-40C above ambient without adequate thermal relief. Industrial-grade -40C to +85C operation permits up to 125C junction temperature, leaving comfortable margin with proper PCB thermal design.
Route the 50 MHz Ethernet MII signals as 50 ohm impedance-controlled traces with matched lengths (within 50 mil). For RMII, route at 50 ohm with strict length matching between clock and data signals (within 100 mil). Place the KSZ8041 or LAN8720A PHY within 25 mm of the MCU to keep EMI from long traces. USB D+/D- traces require 90 ohm differential impedance and should be kept under 50 mm with no stubs.
Separate analog and digital ground planes; tie them together only at a single point under the MCU's exposed pad. Place all decoupling capacitors within 5 mm of their respective supply pins, with vias to the ground plane placed close to the capacitor pad. The HS USB PHY is sensitive to noise on VUSB - bypass with a 1 uF and 0.01 uF capacitor pair adjacent to the pin.
Common pitfalls include failing to solder the QFN thermal pad (causing thermal overheating and poor ADC ground reference), configuring unused pins as analog inputs instead of digital outputs (causing excess current draw), and exceeding 5 MSPS ADC sampling without proper PCB layout (resulting in noisy readings). Always enable the JTAG port pins as outputs if JTAG is not used to avoid floating inputs. Refer to Microchip PIC32MZ EF family errata DS80000526E for known silicon revisions.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (not AEC-Q100 qualified); for automotive applications contact Microchip for AEC-Q100 qualified variants.
