PIC32MZ1024EFE064-I/MR - 200MHz 32-bit MCU 1MB Flash | Microchip
Référence : PIC32MZ1024EFE064-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.2 | $8,20 |
| 10 | $7.45 | $74,50 |
| 100 | $6.62 | $662,00 |
| 500 | $5.94 | $2 970,00 |
| 1 000 | $5.3 | $5 300,00 |
PIC32MZ1024EFE064-I/MR Présentation
A PIC32MZ EF microcontroller is a 32-bit MIPS-based MCU designed for embedded connectivity applications requiring high computational throughput, large memory and rich peripheral integration. Within Microchip's broader hierarchy it sits as an MCU -> 32-bit MCU -> PIC32 family -> PIC32MZ EF sub-family -> connectivity-class device, targeting industrial, automotive, IoT, HMI/graphics and motor-control segments.
Key features of this part include 200 MHz / 330 DMIPS core performance, IEEE 754 hardware floating-point unit, DSP extensions with four 64-bit accumulators and single-cycle MAC, dual-panel Flash supporting live update, a 12-bit 5 Msps analog-to-digital converter with up to 48 channels, two 12-bit DACs, four analog comparators, Hi-Speed USB 2.0 device/host/OTG, 10/100 Ethernet MAC, and multiple UART/SPI/I2C/CAN-FD (in G-variants) interfaces. The 64-QFN package exposes 53 I/O pins and a low-pin-count variant footprint for compact designs.
Architecturally the device pairs the Warrior M-class core with multi-channel DMA, a high-bandwidth SRAM matrix, a dedicated crypto/hash engine (disabled on this 'EFE' variant), and a flexible peripheral pin-select system. The integrated FPU removes the need for software floating-point emulation in compute-intensive loops, while the dual-panel Flash arrangement lets firmware load an alternate image during runtime upgrades, critical for unattended industrial and IoT deployments.
Typical applications include industrial HMI touch panels, IoT edge nodes with Ethernet/USB connectivity, audio processing equipment using I2S and DSP, motor-control FOC drives, industrial IoT bridges, and graphics-capable medical or test instruments. The 1 MB Flash and 256 KB SRAM allow full TCP/IP stacks plus application code on-chip.
When designing with this device, verify that your supply budget tolerates the 200 MHz active current and use a 4-layer PCB with a solid ground plane for EMI performance. The MR (QFN) package requires careful thermal relief because all power is dissipated through the exposed pad and bond wires.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ1024EFE064-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFE064-I/MR (même facteur de forme et même empreinte) — différant par Core Architecture, Package, ADC, USB, SRAM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFE064T-I/MR
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →PIC32MZ1024EFE064-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFG064-I/MR
✅ Remplacement direct✓ En stock
$7.99 / unité
Voir la fiche technique →PIC32MZ1024EFE064-I/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class Warrior |
| Core Frequency (max) | 200 MHz |
| Performance | 330 DMIPS |
| Program Flash | 1024 KB (1M x 8) |
| SRAM | 256 KB |
| Floating Point Unit | IEEE 754 hardware FPU |
| DSP Extensions | 4x 64-bit accumulators, single-cycle MAC |
| Température de fonctionnement | -40 C to +85 C |
| Boîtier | 64-QFN (MR) 9x9 mm |
| I/O Pins | 53 |
| ADC | 12-bit, up to 48 channels, 5 Msps |
| DAC | 2x 12-bit |
| Comparators | 4x analog comparators |
| USB | Hi-Speed USB 2.0 device/host/OTG |
| Ethernet | 10/100 MAC |
| Crypto Accelerator | Not present (EFE variant) |
| CAN | Not present (EFE variant) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFE064-I/MR
| Broche 1 | RB14 — Port B bit 14 / AN14 / SDA3 |
| Broche 2 | RB15 — Port B bit 15 / AN15 / SCL3 |
| Broche 3 | VSS — Ground reference |
| Broche 4 | VDD — Digital supply voltage |
| Broche 5 | RC1 — Port C bit 1 |
| Broche 6 | RC2 — Port C bit 2 |
| Broche 7 | RC3 — Port C bit 3 |
| Broche 8 | RC4 — Port C bit 4 |
| Broche 9 | VBUS — USB VBUS sense |
| Broche 10 | VUSB3V3 — USB 3.3V reference |
| Broche 11 | D+ — USB D+ data line |
| Broche 12 | D- — USB D- data line |
| Broche 13 | RC14 — Port C bit 14 |
| Broche 14 | RC15 — Port C bit 15 |
| Broche 15 | OSC1 — Crystal oscillator input |
| Broche 16 | OSC2 — Crystal oscillator output |
| Broche 17 | VSS — Ground reference |
| Broche 18 | VDD — Digital supply voltage |
| Broche 19 | RD1 — Port D bit 1 |
| Broche 20 | RD2 — Port D bit 2 |
| Broche 21 | RD3 — Port D bit 3 |
| Broche 22 | RD4 — Port D bit 4 |
| Broche 23 | RD5 — Port D bit 5 |
| Broche 24 | RD6 — Port D bit 6 |
| Broche 25 | RD7 — Port D bit 7 |
| Broche 26 | RD8 — Port D bit 8 |
| Broche 27 | RD9 — Port D bit 9 |
| Broche 28 | RD10 — Port D bit 10 |
| Broche 29 | RD11 — Port D bit 11 |
| Broche 30 | RD12 — Port D bit 12 |
| Broche 31 | RD13 — Port D bit 13 |
| Broche 32 | RD14 — Port D bit 14 |
| Broche 33 | RD15 — Port D bit 15 |
| Broche 34 | VSS — Ground reference |
| Broche 35 | VDD — Digital supply voltage |
| Broche 36 | RE0 — Port E bit 0 |
| Broche 37 | RE1 — Port E bit 1 |
| Broche 38 | RE2 — Port E bit 2 |
| Broche 39 | RE3 — Port E bit 3 |
| Broche 40 | RE4 — Port E bit 4 |
| Broche 41 | RE5 — Port E bit 5 |
| Broche 42 | RE6 — Port E bit 6 |
| Broche 43 | RE7 — Port E bit 7 |
| Broche 44 | RF0 — Port F bit 0 |
| Broche 45 | RF1 — Port F bit 1 |
| Broche 46 | RF2 — Port F bit 2 |
| Broche 47 | RF3 — Port F bit 3 |
| Broche 48 | RF4 — Port F bit 4 |
| Broche 49 | RF5 — Port F bit 5 |
| Broche 50 | RF6 — Port F bit 6 |
| Broche 51 | RF7 — Port F bit 7 |
| Broche 52 | RF8 — Port F bit 8 |
| Broche 53 | RG0 — Port G bit 0 |
| Broche 54 | RG1 — Port G bit 1 |
| Broche 55 | RG2 — Port G bit 2 |
| Broche 56 | RG3 — Port G bit 3 |
| Broche 57 | RG6 — Port G bit 6 |
| Broche 58 | RG7 — Port G bit 7 |
| Broche 59 | RG8 — Port G bit 8 |
| Broche 60 | RG9 — Port G bit 9 |
| Broche 61 | MCLR — Master clear (reset) input |
| Broche 62 | AVSS — Analog ground |
| Broche 63 | AVDD — Analog supply voltage |
| Broche 64 | EP — Exposed thermal pad (must be soldered to ground) |
Applications typiques
PIC32MZ1024EFE064-I/MR convient pour 6 applications: Industrial HMI Touch Panels, IoT Edge Nodes with Ethernet/USB, Audio Processing Equipment, Motor Control FOC Drives, Industrial IoT Bridges and Gateways, Test and Measurement Instrumentation.
Industrial HMI Touch Panels
Drives color LCD touch panels in factory automation using the 200 MHz MIPS core with hardware FPU. The PIC32MZ1024EFE064-I/MR's 1MB Flash stores full graphics framebuffers and HMI application code, while the 256KB SRAM hosts RTOS, USB HID stacks and graphics primitives. The integrated 12-bit 5 Msps ADC handles backlight dimming, temperature compensation and analog touch-sensing channels, and the LCD-like parallel interface plus I2S audio interfaces connect to TFT controllers and codecs for combined HMI/audio appliances.
Recommandé
IoT Edge Nodes with Ethernet/USB
Acts as the host MCU in industrial IoT gateways combining 10/100 Ethernet MAC, Hi-Speed USB 2.0 OTG and a TCP/IP-capable 200 MHz core. The PIC32MZ1024EFE064-I/MR's dual-panel Flash supports secure live firmware updates, while the 53 GPIO and multiple UART/SPI/I2C interfaces attach sensors, modbus links, and wireless modules. The 256KB SRAM is sufficient for lightweight TLS, MQTT and concurrent Ethernet+USB stacks without external memory.
Recommandé
Audio Processing Equipment
Processes real-time audio DSP using the four 64-bit accumulators, single-cycle MAC and hardware FPU on the PIC32MZ1024EFE064-I/MR. The I2S audio interfaces connect to external codecs, while the 12-bit DACs generate analog monitor tones and the high-speed 12-bit ADC captures line-level inputs. 1MB Flash stores full audio effects/preset libraries, and the 200 MHz core sustains 48 kHz multi-channel processing under typical algorithmic loads.
Recommandé
Motor Control FOC Drives
Hosts field-oriented-control loops for BLDC and ACIM motor drives using the 200 MHz MIPS core and DSP extensions. The PIC32MZ1024EFE064-I/MR's high-speed 12-bit ADC samples multi-phase current feedback at the required PWM rate, while the 53 GPIO expose the PWM outputs to gate drivers. The hardware FPU accelerates Park/Clarke transforms in real time. Note: this 'EFE' variant lacks CAN-FD; select 'EFG' (PIC32MZ1024EFG064-I/MR) if the drive must report over CAN.
Recommandé
Industrial IoT Bridges and Gateways
Aggregates legacy serial and sensor buses (RS-485, RS-232, SPI, I2C) onto Ethernet or USB uplinks in industrial gateways. The PIC32MZ1024EFE064-I/MR's 1MB Flash stores a full TLS-capable TCP/IP stack plus application logic, while the Hi-Speed USB OTG enables local HMI dongles and the Ethernet MAC serves the fieldbus uplink. Multiple DMA channels move data without CPU intervention, allowing 200 MHz headroom for protocol parsing and security overhead.
Recommandé
Test and Measurement Instrumentation
Forms the control plane of bench-top instruments including oscilloscopes, data loggers and laboratory analyzers. The PIC32MZ1024EFE064-I/MR drives TFT displays, USB tethered PC interfaces and front-panel keypads simultaneously using its DMA-rich peripheral set. The 12-bit 5 Msps ADC serves measurement channels while spare ADC channels supervise rail voltages and internal temperatures. The 1MB Flash stores complex calibration tables and instrument personalities without external memory.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFE064-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFE064T-I/MR | PIC32MZ1024EFE064-E/MR | PIC32MZ1024EFG064-I/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Core Frequency | 200 MHz | 200 MHz | 180 MHz (-10%) | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB |
| CAN-FD | Not present | Not present | Not present | 2x CAN-FD |
| Crypto Engine | Not present | Not present | Not present | AES/SHA |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| Hi-Speed USB | Yes (device/host/OTG) | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | 10/100 |
Principaux différenciateurs
- 1 MB Flash / 256 KB SRAM with dual-panel live-update support (vs PIC32MX795F512L-80I/PT)
- Integrated Hi-Speed USB 2.0 OTG plus 10/100 Ethernet (vs PIC32MX575F512H-80I/PT)
- Cost-optimized 'EFE' variant without crypto or CAN (vs PIC32MZ1024EFG064-I/MR)
Notes de conception
The 64-QFN (MR) package dissipates power through the central exposed pad (pin 64). Solder this pad to a continuous ground plane with thermal vias (typical 4-9 vias, 0.3 mm drill, 0.5 mm pitch) to keep junction temperature in spec. Without adequate PCB copper and via stitching the device will overheat at 200 MHz full-load operation, especially at extended temperature grades.
Decouple every VDD/VSS pair with a 100 nF ceramic capacitor placed within 2 mm of the pin, and add a bulk 4.7 uF or 10 uF ceramic at the package supply entry. The PIC32MZ1024EFE064-I/MR has separate AVDD/AVSS rails; isolate analog ground from digital ground and join at a single point to avoid ADC noise coupling into the 5 Msps conversion channels.
Route USB D+/D- as a 90 ohm differential pair with continuous reference plane on layer 2, and keep total length under 50 mm to maintain Hi-Speed signal integrity. The 200 MHz MIPS core generates 25-50 MHz harmonics; use a 4-layer stackup with continuous ground beneath all clock and high-speed signal traces.
Do not confuse the 'EFE' (no crypto, no CAN) suffix with 'EFG' (with crypto and CAN-FD). According to Microchip part-number decoding, EBF-G contains both blocks while EFE contains neither; using an EFG where EFE was specified wastes cost, and using an EFE where EFG was specified loses CAN-FD and AES/SHA support on the same 64-QFN footprint.
Informations de conformité
RoHS compliant per Microchip product page; not AEC-Q100 qualified. Industrial -40 C to +85 C grade only on -I/ variant.