PIC32MZ1024EFE100-I/GJX - 200MHz 32-bit MCU 1MB Flash 100-TFBGA | Microchip
Référence : PIC32MZ1024EFE100-I/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.3 | $4,30 |
| 10 | $3.87 | $38,70 |
| 100 | $3.49 | $349,00 |
| 500 | $3.11 | $1 555,00 |
| 1 000 | $2.78 | $2 780,00 |
PIC32MZ1024EFE100-I/GJX Présentation
A 32-bit MCU is a microcontroller whose data path, registers, and arithmetic logic unit operate on 32 bits at a time, enabling higher code density, larger addressable memory, and richer data processing than 8/16-bit alternatives. The PIC32MZ EF family sits in the high-performance tier of Microchip's 32-bit portfolio, between the lower-cost PIC32MX and the higher-end PIC32MZ EC families. Built around the MIPS Warrior M-class architecture, it adds DSP extensions (four 64-bit accumulators, single-cycle MAC, saturating and fractional math) and a single-precision FPU, allowing sensor fusion, motor-control math, and graphics rendering to run on-chip without an external DSP.
Key features of the PIC32MZ1024EFE100 include high-speed connectivity peripherals (USB, Ethernet, CAN, multiple UART/SPI/I2C), a 12-bit ADC up to 2 Msps, dedicated motor-control PWM, and cryptographic accelerators on select derivatives. The F variant specifically excludes the Crypto module, making this 'EFE' SKU a no-crypto, no-CAN part per Mouser's listing, which simplifies BOM for designers who do not need those blocks. The Dual Panel Flash enables live firmware updates without halting the application, critical for industrial IoT and remote devices.
Typical applications include industrial IoT gateways, HMI panels and graphics, BLDC and PMSM motor drives, audio processing front-ends, and connected consumer devices. The wide operating temperature range and 1 MB code space support field-updatable, safety-conscious firmware. When designing with this part, ensure the PCB land pattern matches the 100-TFBGA 7x7 mm geometry, allocate decoupling per the family reference manual, and use MPLAB Harmony 3 for peripheral driver support.
Alternatives de remplacement direct pour PIC32MZ1024EFE100-I/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFE100-I/GJX (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, ADC, FPU, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFE100-E/GJX
✅ Remplacement direct✓ En stock
$5.38 / unité
Voir la fiche technique →PIC32MZ1024EFH100T-I/GJX
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ0512EFK100T-E/GJX
✅ Remplacement direct✓ En stock
$9.8 / unité
Voir la fiche technique →PIC32MZ0512EFE100-E/GJX
✅ Remplacement direct✓ En stock
$9.52 / unité
Voir la fiche technique →PIC32MZ0512EFF100T-I/PF
✅ Remplacement direct✓ En stock
$7.05 / unité
Voir la fiche technique →PIC32MX570F512LT-I/GJX
✅ Remplacement direct✓ En stock
$4.78 / unité
Voir la fiche technique →PIC32MZ1024EFE100-I/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class Warrior |
| Core Count | Single-Core |
| Largeur du bus de données | 32-bit |
| Fréquence d'horloge maximale | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754-compliant single-precision |
| DSP Extensions | 4 x 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Program Flash Memory | 1 MB (1M x 8) |
| Dual Panel Flash | Yes (live update support) |
| SRAM | 256 KB |
| Crypto Module | No (EFE variant) |
| CAN Module | No (EFE variant) |
| Tension d'alimentation | 3.3 V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 100-TFBGA (7x7 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1024EFE100-I/GJX 100-tfbga (7x7 mm)
Configuration des broches du PIC32MZ1024EFE100-I/GJX (boîtier 100-tfbga (7x7 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1024EFE100-I/GJX.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1024EFE100-I/GJX convient pour 6 applications: Industrial IoT Gateways, HMI Panels and Graphics Displays, BLDC and PMSM Motor Drives, Connected Consumer Devices, Audio Processing Front-Ends, Industrial Control and PLCs.
Industrial IoT Gateways
The PIC32MZ1024EFE100-I/GJX fits industrial IoT gateway designs because its 200 MHz MIPS M-class core, 1 MB Dual Panel Flash, and 256 KB SRAM can run a TCP/IP stack (lwIP or Harmony Net) while servicing sensor acquisition, local control, and MQTT/HTTP uplink simultaneously. The 100-TFBGA 7x7 mm footprint enables compact DIN-rail gateway enclosures. Unlike smaller PIC32MX parts, the EF SKU provides enough headroom for TLS handshakes via software crypto without starving the main application, and Dual Panel Flash supports OTA firmware updates that meet industrial uptime requirements.
Recommandé
HMI Panels and Graphics Displays
For HMI panels driving TFT LCDs up to WVGA, the PIC32MZ1024EFE100-I/GJX supplies sufficient CPU performance for graphics rendering using MPLAB Harmony's gfx library and the 2D graphics controller integrated in the EF family. The 330 DMIPS and FPU allow smooth menu transitions and touch-driven UI without an external graphics coprocessor. Compared with PIC32MX570, the EF core's higher clock and DSP extensions permit JPEG decoding and anti-aliased fonts on-chip. Designers typically pair this MCU with an SPI/parallel TFT and an external touch controller.
Recommandé
BLDC and PMSM Motor Drives
The PIC32MZ1024EFE100-I/GJX is well matched to sensorless or sensored BLDC/PMSM motor drives thanks to its dedicated motor-control PWM with complementary outputs, dead-band insertion, and ADC triggering; the FPU executes Park/Clarke transforms and PID loops within microseconds. The DSP extensions accelerate field-oriented control math, while 1 MB Flash accommodates vector-control libraries from Microchip ANs. The industrial -40C to +85C range supports most enclosed motor-drive environments; for harsher installations choose the E-suffix variant.
Recommandé
Connected Consumer Devices
In connected consumer devices (smart speakers, networked appliances, fitness hubs), the PIC32MZ1024EFE100-I/GJX delivers 200 MHz with hardware FPU to process audio and sensor data while running Wi-Fi/BLE stacks over UART/SPI links. The 1 MB Flash stores graphics, audio codecs, and connectivity firmware simultaneously, and 256 KB RAM supports audio buffering without external SDRAM. The 100-TFBGA package enables the thin enclosures consumers expect. Dual Panel Flash allows silent OTA updates that do not brick the device during firmware refresh.
Recommandé
Audio Processing Front-Ends
Audio processing front-ends benefit from the PIC32MZ1024EFE100-I/GJX's DSP extensions (single-cycle MAC, 64-bit accumulators) and FPU for real-time FFT, filtering, and beamforming. The 12-bit ADC up to 2 Msps captures wideband audio, while I2S interfaces connect to external codecs. Engineers use Harmony 3's audio framework to port codecs and DSP libraries onto this MCU. Compared with PIC32MX, the EF core's higher MIPS budget avoids audio dropouts under multi-channel load.
Recommandé
Industrial Control and PLCs
For compact PLCs and industrial controllers, the PIC32MZ1024EFE100-I/GJX offers enough GPIO and peripheral count (multiple UART, SPI, I2C, USB, Ethernet) to handle sensor aggregation and actuator control without a companion ASIC. The 1 MB Flash accommodates ladder-logic interpreters or IEC 61131-3 runtimes, while 256 KB SRAM supports comm stacks (Modbus TCP, EtherNet/IP). The industrial temperature range and 100-TFBGA package suit DIN-rail mountings. Dual Panel Flash permits safe firmware rollback during field updates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFE100-I/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFE100-E/GJX | PIC32MZ1024EFH100T-I/GJX | PIC32MZ0512EFK100T-E/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFF100T-I/PF | PIC32MX570F512LT-I/GJX |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) | 100-TQFP | 100-TFBGA |
| Core | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 M-Class 200 MHz | MIPS32 50 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 256 KB | 128 KB | 128 KB | 128 KB | 64 KB |
| FPU | Yes | Yes | Yes | Yes | Yes | Yes | No |
| Crypto Module | No | No | Yes | Yes (EFK) | No | No | No |
| CAN | No | No | Yes | Yes (EFK) | No | No | No |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) |
Principaux différenciateurs
- No Crypto, No CAN simplification for cost-sensitive connectivity (vs PIC32MZ1024EFH100T-I/GJX)
- Dual Panel Flash with 1 MB for live firmware update (vs PIC32MX570F512LT-I/GJX)
- 100-TFBGA 7x7 mm package for compact designs (vs PIC32MZ1024EFE100-I/PT (100-LQFP))
Notes de conception
Estimated: the 100-TFBGA 7x7 mm package uses 0.65 mm pitch balls and requires NSMD (non-solder-mask-defined) pads with microvia-in-pad construction for reliable assembly. Below-pad thermal vias (5-9 per BGA, 0.2 mm drill) tied to the inner ground plane reduce junction-to-board thermal resistance by 15-20%. Standard JEDEC MSL-3 preconditioning (30C/60% RH, 168 hours) is required before reflow to avoid popcorn failures during SMT.
Per the PIC32MZ EF family datasheet, decoupling requires 100 nF X7R ceramic capacitors on every VDD pin plus a single 4.7 uF bulk capacitor near the voltage regulator. The internal 1.2V core LDO requires its own 1 uF + 100 nF pair on the VDDCORE pin; omitting this causes erratic operation and reset loops. Active current at 200 MHz with all peripherals enabled is approximately 80 mA; use an LDO with at least 200 mA headroom to avoid dropout under transient loads.
Do not confuse the PIC32MZ EF family with the PIC32MX family - the EF parts use a different interrupt controller (PLIC vs legacy) and toolchain flags (-mprocessor=m14ke vs -mprocessor=m4k). Code written for PIC32MX will not link without retargeting. Also, the Dual Panel Flash feature requires explicit boot-switch configuration in the DEVCFG0 fuse; forgetting this disables live-update. The 'EFE' SKU omits Crypto and CAN - confirm peripheral availability before committing to firmware architecture.
Route the 50 MHz Ethernet MII/RMII traces as 50 ohm impedance-controlled pairs on the top layer over a continuous ground plane; keep length-matched within 2 mm. The USB D+/D- differential pair requires 90 ohm impedance and common-mode choke for FCC Class B compliance. Avoid routing high-speed signals under the BGA shadow - use inner layers only for short breakout segments, and place series termination resistors within 5 mm of the driver pin.
Informations de conformité
RoHS compliant per Microchip product page. The 'I' suffix is industrial grade (-40C to +85C) and is not AEC-Q100 qualified; automotive designs should evaluate the PIC32MZ EC family or add AEC-Q100-qualified external components.