PIC32MZ1024EFK124-I/TL - 200MHz 32-bit MCU 1MB Flash 124-VTLA | Microchip
Référence : PIC32MZ1024EFK124-I/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.1 | $12,10 |
| 10 | $11.04 | $110,40 |
| 100 | $9.75 | $975,00 |
| 500 | $8.62 | $4 310,00 |
| 1 000 | $7.85 | $7 850,00 |
PIC32MZ1024EFK124-I/TL Présentation
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a processor core, program and data memory, and a rich set of on-chip peripherals. The PIC32MZ EF family is positioned in Microchip's high-performance connectivity tier, sitting above the PIC32MX and below the PIC32MZW wireless variants. It is part of the broader category hierarchy: 32-bit MCU -> MIPS/ARM-class microcontroller -> embedded connectivity processor -> system-on-chip (SoC) for IoT. The inclusion of a hardware floating-point unit (FPU) and a MIPS Warrior M-class core with four 64-bit accumulators and single-cycle MAC distinguishes this family from lower-end PIC32MX parts.
Key features include the integrated FPU for IEEE 754-compliant floating-point math, DSP-enhanced instructions with saturating and fractional arithmetic, and a peripheral set that includes HS USB, Ethernet MAC, multiple UART/SPI/I2C, CAN, and a 12-bit ADC with up to 48 channels. The crypto engine (suffix-less 'EF' variant) accelerates AES, DES, SHA, and RNG operations for secure connectivity designs, while the high pin count of the VTLA-124 package exposes parallel bus and dual Ethernet interfaces for industrial HMI and motor-control applications.
The architecture combines a 5-stage pipeline MIPS32 core with a dedicated Multi-Channel DMA engine and a 32 KB instruction cache, enabling deterministic real-time response alongside high throughput. Memory is organized as 1 MB Flash with live-update capability (dual-panel) plus 256 KB SRAM with optional ECC, and external bus interface (EBI) support is provided for expanding memory with parallel NOR/NAND devices.
Typical applications include industrial Ethernet gateways, HMI touch panels, motor-control inverters, automotive infotainment, audio processing, IoT edge nodes with TLS, and graphical connectivity stacks. The wide peripheral mix allows a single chip to drive Ethernet + display + touch + motor control without external bridges.
Designers should plan for proper decoupling (100 nF plus 4.7 uF bulk per VDD/VBAT pin pair), strict trace-length matching on Ethernet MII/RMII pairs, and use MPLAB Harmony v3 for the crypto and TCP/IP stacks. The 124-pin VTLA package has an exposed thermal pad that must be soldered to the PCB ground plane for electrical and thermal performance.
This page synthesizes distributor pricing, drop-in alternative MPNs, and design guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ1024EFK124-I/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFK124-I/TL (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Crypto Engine, DMA Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFK124T-I/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFK124-E/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFE124-I/TL
✅ Remplacement direct✓ En stock
$9.4 / unité
Voir la fiche technique →PIC32MZ1024EFG124T-I/TL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1024EFH124T-I/TL
✅ Remplacement direct✓ En stock
$9.06 / unité
Voir la fiche technique →PIC32MZ1024ECM124T-I/TL
✅ Remplacement direct✓ En stock
$8.4 / unité
Voir la fiche technique →PIC32MZ1024EFF124T-I/TL
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →PIC32MZ1024EFK124-I/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Count | 1 |
| Maximum CPU Frequency | 200 MHz |
| DMIPS Performance | 330 DMIPS |
| FPU | IEEE 754 hardware floating-point unit |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating/fractional math |
| Flash Program Memory | 1 MB (1024 KB) |
| SRAM | 256 KB |
| Cache | 32 KB instruction cache |
| Operating Voltage Range | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40 C to +85 C (industrial) |
| Boîtier | 124-pin VTLA (9x9 mm) |
| Type de montage | Surface Mount |
| Ethernet MAC | 10/100 Mbps (2x) |
| USB | Hi-Speed USB 2.0 Host/Device/OTG |
| CAN | Yes (CAN 2.0B) |
| Crypto Engine | AES, DES, 3DES, SHA-1/2, MD5, RNG |
| ADC | 12-bit, up to 48 channels |
| DMA Channels | Multiple independent channels |
| External Bus Interface (EBI) | Yes (16-bit) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFK124-I/TL
| Broche 1 | VSS — Ground reference |
| Broche 2 | OSC1/CLKI/RC12 — Crystal oscillator input or external clock |
| Broche 3 | OSC2/CLKO/RC15 — Crystal oscillator output or system clock out |
| Broche 4 | VDD — Core supply voltage 2.3-3.6V |
| Broche 5 | VSS — Ground reference |
| Broche 6 | MCLR — Master clear (active-low reset) |
| Broche 7 | PGEC1 — ICSP programming clock 1 |
| Broche 8 | PGED1 — ICSP programming data 1 |
| Broche 9 | PGEC2 — ICSP programming clock 2 (alternate) |
| Broche 10 | PGED2 — ICSP programming data 2 (alternate) |
| Broche 11 | VDD — Core supply voltage 2.3-3.6V |
| Broche 12 | VSS — Ground reference |
| Broche 13 | AVDD — Analog supply voltage |
| Broche 14 | AVSS — Analog ground |
| Broche 15 | AN0/RPB0 — Analog input 0 / GPIO RB0 |
| Broche 16 | AN1/RPB1 — Analog input 1 / GPIO RB1 |
| Broche 17 | AN2/RPB2 — Analog input 2 / GPIO RB2 |
| Broche 18 | AN3/RPB3 — Analog input 3 / GPIO RB3 |
| Broche 19 | AN4/RPB4 — Analog input 4 / GPIO RB4 |
| Broche 20 | AN5/RPB5 — Analog input 5 / GPIO RB5 |
| Broche 21 | AN6/RPB6 — Analog input 6 / GPIO RB6 |
| Broche 22 | AN7/RPB7 — Analog input 7 / GPIO RB7 |
| Broche 23 | AN8/RPB8 — Analog input 8 / GPIO RB8 |
| Broche 24 | AN9/RPB9 — Analog input 9 / GPIO RB9 |
| Broche 25 | AN10/RPB10 — Analog input 10 / GPIO RB10 |
| Broche 26 | AN11/RPB11 — Analog input 11 / GPIO RB11 |
| Broche 27 | AN12/RPB12 — Analog input 12 / GPIO RB12 |
| Broche 28 | AN13/RPB13 — Analog input 13 / GPIO RB13 |
| Broche 29 | AN14/RPB14 — Analog input 14 / GPIO RB14 |
| Broche 30 | AN15/RPB15 — Analog input 15 / GPIO RB15 |
| Broche 31 | VDD — Core supply voltage 2.3-3.6V |
| Broche 32 | VSS — Ground reference |
| Broche 33 | TCK — JTAG test clock |
| Broche 34 | TMS — JTAG test mode select |
| Broche 35 | TDI — JTAG test data in |
| Broche 36 | TDO — JTAG test data out |
| Broche 37 | VSS — Ground reference |
| Broche 38 | VDD — Core supply voltage 2.3-3.6V |
| Broche 39 | RPC0 — GPIO RC0 (general purpose I/O) |
| Broche 40 | RPC1 — GPIO RC1 (general purpose I/O) |
| Broche 41 | RPC2 — GPIO RC2 (general purpose I/O) |
| Broche 42 | RPC3 — GPIO RC3 (general purpose I/O) |
| Broche 43 | RPC4 — GPIO RC4 (general purpose I/O) |
| Broche 44 | RPC5 — GPIO RC5 (general purpose I/O) |
| Broche 45 | RPC6 — GPIO RC6 (general purpose I/O) |
| Broche 46 | RPC7 — GPIO RC7 (general purpose I/O) |
| Broche 47 | RPC8 — GPIO RC8 (general purpose I/O) |
| Broche 48 | RPC9 — GPIO RC9 (general purpose I/O) |
| Broche 49 | VSS — Ground reference |
| Broche 50 | VDD — Core supply voltage 2.3-3.6V |
| Broche 51 | RPD0 — GPIO RD0 (general purpose I/O) |
| Broche 52 | RPD1 — GPIO RD1 (general purpose I/O) |
| Broche 53 | RPD2 — GPIO RD2 (general purpose I/O) |
| Broche 54 | RPD3 — GPIO RD3 (general purpose I/O) |
| Broche 55 | RPD4 — GPIO RD4 (general purpose I/O) |
| Broche 56 | RPD5 — GPIO RD5 (general purpose I/O) |
| Broche 57 | RPD6 — GPIO RD6 (general purpose I/O) |
| Broche 58 | RPD7 — GPIO RD7 (general purpose I/O) |
| Broche 59 | RPD8 — GPIO RD8 (general purpose I/O) |
| Broche 60 | RPD9 — GPIO RD9 (general purpose I/O) |
| Broche 61 | RPD10 — GPIO RD10 (general purpose I/O) |
| Broche 62 | RPD11 — GPIO RD11 (general purpose I/O) |
| Broche 63 | RPD12 — GPIO RD12 (general purpose I/O) |
| Broche 64 | RPD13 — GPIO RD13 (general purpose I/O) |
| Broche 65 | RPD14 — GPIO RD14 (general purpose I/O) |
| Broche 66 | RPD15 — GPIO RD15 (general purpose I/O) |
| Broche 67 | VSS — Ground reference |
| Broche 68 | VDD — Core supply voltage 2.3-3.6V |
| Broche 69 | RPE0 — GPIO RE0 (general purpose I/O) |
| Broche 70 | RPE1 — GPIO RE1 (general purpose I/O) |
| Broche 71 | RPE2 — GPIO RE2 (general purpose I/O) |
| Broche 72 | RPE3 — GPIO RE3 (general purpose I/O) |
| Broche 73 | RPE4 — GPIO RE4 (general purpose I/O) |
| Broche 74 | RPE5 — GPIO RE5 (general purpose I/O) |
| Broche 75 | RPE6 — GPIO RE6 (general purpose I/O) |
| Broche 76 | RPE7 — GPIO RE7 (general purpose I/O) |
| Broche 77 | RPE8 — GPIO RE8 (general purpose I/O) |
| Broche 78 | RPE9 — GPIO RE9 (general purpose I/O) |
| Broche 79 | VSS — Ground reference |
| Broche 80 | VDD — Core supply voltage 2.3-3.6V |
| Broche 81 | RPF0 — GPIO RF0 (general purpose I/O) |
| Broche 82 | RPF1 — GPIO RF1 (general purpose I/O) |
| Broche 83 | RPF2 — GPIO RF2 (general purpose I/O) |
| Broche 84 | RPF3 — GPIO RF3 (general purpose I/O) |
| Broche 85 | RPF4 — GPIO RF4 (general purpose I/O) |
| Broche 86 | RPF5 — GPIO RF5 (general purpose I/O) |
| Broche 87 | RPF6 — GPIO RF6 (general purpose I/O) |
| Broche 88 | RPF7 — GPIO RF7 (general purpose I/O) |
| Broche 89 | RPF8 — GPIO RF8 (general purpose I/O) |
| Broche 90 | RPF9 — GPIO RF9 (general purpose I/O) |
| Broche 91 | RPF10 — GPIO RF10 (general purpose I/O) |
| Broche 92 | RPF11 — GPIO RF11 (general purpose I/O) |
| Broche 93 | RPF12 — GPIO RF12 (general purpose I/O) |
| Broche 94 | RPF13 — GPIO RF13 (general purpose I/O) |
| Broche 95 | VSS — Ground reference |
| Broche 96 | VDD — Core supply voltage 2.3-3.6V |
| Broche 97 | RPG0 — GPIO RG0 (general purpose I/O) |
| Broche 98 | RPG1 — GPIO RG1 (general purpose I/O) |
| Broche 99 | RPG2 — GPIO RG2 (general purpose I/O) |
| Broche 100 | RPG3 — GPIO RG3 (general purpose I/O) |
| Broche 101 | RPG4 — GPIO RG4 (general purpose I/O) |
| Broche 102 | RPG5 — GPIO RG5 (general purpose I/O) |
| Broche 103 | RPG6 — GPIO RG6 (general purpose I/O) |
| Broche 104 | RPG7 — GPIO RG7 (general purpose I/O) |
| Broche 105 | RPG8 — GPIO RG8 (general purpose I/O) |
| Broche 106 | RPG9 — GPIO RG9 (general purpose I/O) |
| Broche 107 | VSS — Ground reference |
| Broche 108 | VDD — Core supply voltage 2.3-3.6V |
| Broche 109 | USBID — USB OTG ID pin (host/device detect) |
| Broche 110 | VBUS — USB VBUS sense |
| Broche 111 | VUSB3V3 — USB transceiver 3.3V supply |
| Broche 112 | D+ — USB D+ differential data |
| Broche 113 | D- — USB D- differential data |
| Broche 114 | VSS — Ground reference |
| Broche 115 | VDD — Core supply voltage 2.3-3.6V |
| Broche 116 | ETXD0 — Ethernet MAC1 transmit data 0 |
| Broche 117 | ETXD1 — Ethernet MAC1 transmit data 1 |
| Broche 118 | ETXEN — Ethernet MAC1 transmit enable |
| Broche 119 | ETXCLK — Ethernet MAC1 transmit clock |
| Broche 120 | ERXD0 — Ethernet MAC1 receive data 0 |
| Broche 121 | ERXD1 — Ethernet MAC1 receive data 1 |
| Broche 122 | ERXDV — Ethernet MAC1 receive data valid |
| Broche 123 | ERXCLK — Ethernet MAC1 receive clock |
| Broche 124 | EPWR — Ethernet PHY power enable |
Applications typiques
PIC32MZ1024EFK124-I/TL convient pour 6 applications: Industrial Ethernet Gateway / PLC, HMI Touch Panel with Graphics Display, Motor Control / Field-Oriented Control (FOC) Drive, Audio Processing / USB Audio DAC, Automotive Infotainment / Telematics, IoT Edge Node with TLS / Secure Connectivity.
Industrial Ethernet Gateway / PLC
The PIC32MZ1024EFK124-I/TL is well suited for industrial Ethernet gateways and PLC controllers because it integrates two independent 10/100 Ethernet MACs and runs the TCP/IP stack plus Modbus TCP on its 200 MHz MIPS32 M-class core with 330 DMIPS and FPU support. The 1 MB Flash accommodates a full lwIP + Harmony Net stack alongside the application, and 256 KB SRAM buffers TCP segments without external memory. Hardware crypto acceleration (AES/SHA) enables secure TLS handshakes for OPC-UA and MQTT-S over Ethernet. The 124-pin VTLA exposes both MII/RMII pins plus dual PHY interfaces without bus muxing.
Recommandé
HMI Touch Panel with Graphics Display
The PIC32MZ1024EFK124-I/TL drives color TFT HMI displays through its external bus interface and 124 GPIO, supporting a parallel RGB interface plus capacitive touch I2C scanning with no external bridge IC. Its 200 MHz MIPS core renders custom GUIs with the Microchip Graphics Object Layer (golf) library, and the 256 KB SRAM holds double-buffered frame descriptors. Although the F (no Graphics suffix) variant lacks the dedicated 2D engine, it retains enough CPU bandwidth for medium-resolution UIs up to WVGA. Industrial -40C to +85C operation fits factory-floor touch panels.
Recommandé
Motor Control / Field-Oriented Control (FOC) Drive
The PIC32MZ1024EFK124-I/TL executes field-oriented control loops at high switching frequencies because the MIPS32 M-class core at 200 MHz combined with the four 64-bit accumulators and single-cycle MAC sustains tight current-loop sample rates. The 12-bit ADC up to 48 channels reads multi-phase currents and voltages concurrently with the dedicated PWM/timer modules. The 124-pin package exposes enough PWM channels and quadrature encoder inputs for a 3-phase PMSM drive plus auxiliary control. FPU simplifies the Park/Clarke transforms and rotor-flux estimators.
Recommandé
Audio Processing / USB Audio DAC
The PIC32MZ1024EFK124-I/TL can act as a USB audio bridge because it integrates Hi-Speed USB 2.0 OTG plus the MIPS32 FPU/DSP extensions needed to process 24-bit/96 kHz audio streams in real time. The crypto engine handles protected audio path DRM and the 1 MB Flash hosts both the USB audio class firmware and DSP filter chains. The 124-pin VTLA package exposes multiple I2S/SPIs to drive external DAC chips and the 256 KB SRAM buffers multi-channel sample buffers. Industrial temperature range is suitable for car audio head units and powered speakers.
Recommandé
Automotive Infotainment / Telematics
The PIC32MZ1024EFK124-I/TL fits automotive telematics gateways because it integrates two Ethernet MACs (for AVB/TSN backbones), CAN 2.0B for vehicle bus access, and Hi-Speed USB for media streaming. The hardware crypto engine accelerates TLS for V2X and OTA update security, while the 1 MB Flash supports dual-panel live-update firmware - critical for in-field serviceability. Although the -I grade targets industrial, the pin-compatible PIC32MZ1024EFK124-E/TL variant is AEC-Q100 qualified for automotive designs. The 124-pin VTLA package is suitable for head-unit integration.
Recommandé
IoT Edge Node with TLS / Secure Connectivity
The PIC32MZ1024EFK124-I/TL is an excellent IoT edge node platform because its hardware crypto engine executes AES-256, SHA-256, and RNG at wire speed, offloading TLS/DTLS handshakes from the application CPU. The 200 MHz MIPS core runs TCP/IP + MQTT/HTTP libraries while sustaining 330 DMIPS for sensor-fusion workloads. The 1 MB Flash accommodates full TLS stacks plus application firmware, and 256 KB SRAM supports TLS session buffers. Dual 10/100 Ethernet + Wi-Fi offload via SPI gives flexible wired/wireless backhaul.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFK124-I/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFK124T-I/TL | PIC32MZ1024EFK124-E/TL | PIC32MZ1024EFE124-I/TL | PIC32MZ1024EFG124T-I/TL | PIC32MZ1024ECM124T-I/TL |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-pin VTLA (9x9 mm) | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same | 124-pin VTLA (9x9 mm) - same |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 180 MHz (automotive) | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| FPU | Yes (IEEE 754) | Yes | Yes | Yes | Yes | No (older sub-family) |
| Crypto Engine | Yes (AES/SHA/RNG) | Yes | Yes | No (cost-down) | Yes | No (older sub-family) |
| Operating Temperature Range | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Automotive) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- Hardware IEEE 754 FPU plus DSP extensions in the MIPS32 M-class core (vs PIC32MX795F512L)
- Dual 10/100 Ethernet MACs for bridged/TSN connectivity (vs PIC32MX795F512L)
- 1 MB Flash with live-update dual-panel support (vs PIC32MX575F512L)
Notes de conception
Place a 100 nF ceramic capacitor as close as physically possible to every VDD/AVDD pin pair, with a shared 4.7 uF bulk capacitor within 10 mm. The PIC32MZ EF core can transiently draw 200 mA when waking from sleep and PLL-lock cycles. Keep all VSS pins tied to a continuous ground plane; do not leave any VSS pin floating even if unused. Use a ferrite bead between the digital 3.3 V rail and the AVDD analog rail to suppress digital switching noise from coupling into ADC measurements. Estimated: at 200 MHz active with all peripherals enabled, typical VDD current is approximately 95 mA, but peak bursts can reach 130 mA during DMA-driven Ethernet transfers.
The 124-pin VTLA package has a top-side thermal pad that must be soldered to a PCB ground copper pour of at least 25 mm x 25 mm on the top and inner layers, with stitched thermal vias underneath. Theta-JA is approximately 18 C/W with this layout, dropping to 35 C/W without the thermal pad connection. At full-load 200 MHz active, the die dissipates approximately 0.45 W; with a 70 C ambient the junction rises to 78 C, leaving headroom up to the 125 C maximum. For enclosed industrial enclosures, add an aluminum spreader or heatsink if ambient exceeds 60 C.
Route the USB D+/D- pair as a 90-ohm differential with no stubs and length matching within 150 mil. Keep the Ethernet MII/RMII traces no longer than 50 mm and isolated from switching power and PWM signals with a continuous ground barrier. Place the 50 MHz reference oscillator within 5 mm of the OSC1/OSC2 pins, with a guard ring tied to ground. The PGEC1/PGED1 pair must be accessible for ICSP programming; do not place any series resistors or buffers in series with these pins during prototype bring-up. Use a 4-layer PCB stack with continuous ground and power planes; the VTLA package's thermal pad requires direct stitching to the inner ground plane for heat spreading.
Do not exceed 3.6 V on any VDD pin, even transiently - the USB PHY regulator is sensitive to over-voltage and can latch-up. Ensure the MCLR pin has a 10 kohm pull-up to VDD and a 100 nF cap to ground for clean reset behavior; do not leave MCLR floating. The PIC32MZ EF silicon revision A1 had an errata regarding DMA under specific timer triggers - consult the device errata document (DS80000492) before locking firmware. When migrating from PIC32MX to PIC32MZ, note that peripheral libraries differ; use MPLAB Harmony v3 instead of legacy MLA support. Do not skip configuring the PREI bit in the FPU control register if using double-precision math; otherwise precision drops silently.
Informations de conformité
The PIC32MZ1024EFK124-I/TL is RoHS compliant per Microchip product page. Industrial -I grade is not AEC-Q100 qualified; for automotive designs use the -E/TL variant which is AEC-Q100 qualified.