PIC32MZ1064DAG176T-I/2J - 200MHz 32-Bit MCU 1MB Flash | Microchip
Référence : PIC32MZ1064DAG176T-I/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.85 | $11,85 |
| 10 | $10.96 | $109,60 |
| 100 | $9.83 | $983,00 |
| 500 | $8.95 | $4 475,00 |
| 1 000 | $8.18 | $8 180,00 |
PIC32MZ1064DAG176T-I/2J Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on one die. Within the semiconductor taxonomy, an MCU belongs to integrated circuits -> microcontrollers -> 32-bit microcontrollers -> MIPS/ARM-based MCUs. The PIC32MZ DA family further elevates the MCU category by integrating an LCD graphics controller and a dedicated 2D graphics processor, blurring the line between traditional MCU and MPU-class designs.
Key features include 200 MHz core clock with hardware FPU/DSP, 640 KB SRAM, 2D graphics processing unit (GPU), integrated DDR2 DRAM controller supporting 32 MB or 128 MB external memory, Hi-Speed USB 2.0 OTG, dual CAN 2.0b controllers, 12-bit 18 MSPS ADC with 45 analog inputs, and up to 120 general-purpose I/O. The wide peripheral set reduces external chip count and BOM cost for HMI-centric designs.
Technically, the device uses a 5-stage pipeline MIPS32 microAptiv core with hardware multiply/divide and DSP extensions. A dedicated 2D graphics engine accelerates GUI rendering while leaving the CPU free for application logic. The DDR2 controller offloads high-bandwidth framebuffer access to external memory, enabling WVGA-resolution TFT panels at reasonable refresh rates.
Typical applications include industrial HMI panels, medical patient monitors, automotive infotainment clusters, point-of-sale terminals, smart-home control panels, and any GUI-rich embedded product requiring a 32-bit MCU with integrated graphics.
When designing with this MCU, plan power sequencing for the 2.0-3.6 V rail and provide adequate decoupling near the DDR2 interface. Use the integrated 2D GPU for layer compositing to offload the CPU. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC32MZ1064DAG176T-I/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1064DAG176T-I/2J (même facteur de forme et même empreinte) — différant par USB, Graphics Controller, CAN, Package, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1064DAL176T-I/2J
✅ Remplacement direct✓ En stock
$6.76 / unité
Voir la fiche technique →PIC32MZ1064DAB176-I/2J
✅ Remplacement direct✓ En stock
$4.45 / unité
Voir la fiche technique →PIC32MZ1064DAA176-I/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2064DAS176
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1064DAG176T-V/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ1064DAG176T-I/2J Valeurs maximales et caractéristiques électriques
| Core | MIPS32 microAptiv |
| Architecture | 32-bit RISC with FPU/DSP |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 640 KB |
| External Memory | DDR2 DRAM up to 128 MB addressable |
| Operating Voltage | 2.0 V to 3.6 V |
| Boîtier | 176-LQFP (20x20 mm) with exposed pad |
| Température de fonctionnement | -40C to +85C (industrial) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D GPU |
| USB | Hi-Speed USB 2.0 OTG |
| CAN | 2x CAN 2.0b |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du PIC32MZ1064DAG176T-I/2J 176-lqfp (20x20 mm) with exposed pad
Configuration des broches du PIC32MZ1064DAG176T-I/2J (boîtier 176-lqfp (20x20 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ1064DAG176T-I/2J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ1064DAG176T-I/2J convient pour 6 applications: Industrial HMI Panels, Medical Patient Monitors, Automotive Infotainment Clusters, Point-of-Sale Terminals, Smart-Home Control Panels, Industrial IoT Gateways.
Industrial HMI Panels
The PIC32MZ1064DAG176T-I/2J is ideal for industrial HMI panels because its integrated 2D graphics controller accelerates GUI rendering on TFT displays up to WVGA resolution. The 200 MHz MIPS32 microAptiv core runs application logic while the GPU handles layer compositing, alpha blending, and rectangle fills. The DDR2 interface allows framebuffer allocation in external memory, enabling full-screen double-buffering without consuming the 640 KB internal SRAM. The Hi-Speed USB 2.0 OTG and dual CAN 2.0b peripherals simplify connectivity to industrial PLCs and fieldbus networks. The 12-bit 18 MSPS ADC supports sensor inputs for local I/O.
Recommandé
Medical Patient Monitors
Medical patient monitors benefit from the PIC32MZ1064DAG176T-I/2J's 12-bit 18 MSPS ADC with 45 analog inputs, which digitizes multi-channel vital-sign waveforms in parallel. The 200 MHz core performs real-time signal processing for heart-rate, SpO2, and respiration algorithms while the GPU drives the waveform display. The 640 KB SRAM holds sample buffers and framebuffer for the LCD. The 2.0-3.6 V supply and -40C to +85C range suit battery-powered and clinical environments. Hi-Speed USB OTG supports wired data export to EMR systems.
Recommandé
Automotive Infotainment Clusters
The PIC32MZ1064DAG176T-I/2J powers automotive infotainment clusters by combining an integrated 2D graphics engine for instrument-cluster rendering, dual CAN 2.0b for chassis and body-network communication, and Hi-Speed USB for media connectivity. The DDR2 controller supports high-resolution cluster displays while the MIPS core manages real-time CAN stack and HMI logic. Designers should note the industrial -40C to +85C rating; for AEC-Q100 qualified parts, Microchip offers PIC32MK variants. The 1 MB Flash accommodates bootloader, CAN stack, and graphics libraries.
Recommandé
Point-of-Sale Terminals
POS terminals rely on the PIC32MZ1064DAG176T-I/2J's Hi-Speed USB 2.0 OTG for payment peripherals, the 2D graphics GPU for menu UI, and the 12-bit ADC for touch-screen and barcode-sensor input. The 200 MHz core runs encryption libraries for secure transactions, while the 1 MB Flash supports multiple payment-application stacks. The 176-LQFP package provides generous GPIO for keypad scanning, printer control, and Ethernet expansion. Operating from a regulated 3.3 V rail simplifies integration with common POS power architectures.
Recommandé
Smart-Home Control Panels
Smart-home control panels use the PIC32MZ1064DAG176T-I/2J to drive capacitive-touch TFT displays showing lighting, climate, and security controls. The integrated GPU handles smooth icon transitions and gestures; the MIPS core runs Wi-Fi/BLE host-stack glue code. Dual CAN connectivity supports HVAC bus integration, while Hi-Speed USB OTG allows firmware updates from a USB stick. The 640 KB SRAM enables local scene storage and protocol buffers, and the 12-bit ADC monitors panel temperature for backlight compensation.
Recommandé
Industrial IoT Gateways
Industrial IoT gateways leverage the PIC32MZ1064DAG176T-I/2J's dual CAN 2.0b, Hi-Speed USB, and Ethernet-ready peripherals to bridge fieldbus networks to cloud uplinks. The 200 MHz MIPS core processes protocol conversion (CANopen, Modbus) in real time, while the 1 MB Flash holds gateway firmware and TLS libraries. The wide 2.0-3.6 V supply tolerates industrial 24 V bus-derived rails after regulation. The 12-bit ADC with 45 inputs reads analog sensors for edge analytics, and the 640 KB SRAM buffers packets during network outages.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1064DAG176T-I/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1064DAL176T-I/2J | PIC32MZ1064DAB176-I/2J | PIC32MZ1064DAA176-I/2J | PIC32MZ2064DAS176 | PIC32MZ1064DAG176T-V/2J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 176-LQFP (20x20) | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same | 176-LQFP (20x20) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| DDR2 Controller | Yes | No | No | No | Yes | Yes |
| Graphics GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C |
Principaux différenciateurs
- Integrated 2D graphics GPU (vs PIC32MX795F512L-80I/PF)
- DDR2 memory controller (vs PIC32MZ1064DAL176T-I/2J)
- Higher core frequency and Flash density (vs PIC32MX775F256LT-80I/PF)
Notes de conception
The PIC32MZ1064DAG176T-I/2J operates from a 2.0-3.6 V supply rail; use a low-noise LDO (e.g., a 3.3 V LDO with 30 mA capacity) to power VDD, and a separate 1.8 V regulator (e.g., 500 mA buck) for the DDR2 interface. Decoupling: place 100 nF X7R capacitors on every VDD/VSS pair as close as possible to the pins, plus a 4.7 uF bulk capacitor within 5 mm of the exposed thermal pad (EP). The EP must be soldered to a continuous ground plane for thermal dissipation.
Route the DDR2 signals as matched-length pairs (within 50 mil of each other) on an inner layer with a continuous ground plane above and below. Keep trace impedance to 50 ohms and series-terminate clock signals at the source. Isolate the analog ADC inputs (AN0-AN44) from digital switching traces by at least 3 trace widths, and guard the analog ground island with a single bridge to the digital ground at the ADC ground pin. Reference Microchip AN2562 'DDR2 PCB Layout Guidelines' for the full routing checklist.
Do not exceed 200 MHz core clock or 3.6 V on any VDD pin. The DDR2 controller requires a 1.8 V VTT termination voltage; omitting VTT causes signal-integrity failures. Always configure the analog and digital grounds per the PIC32MZ DA hardware checklist (DS60006470), or you risk ADC offset errors. Programming: use any PGECx/PGEDx pair as a matched ICSP pair, never mix PGEC1 with PGED2.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; choose PIC32MK family for AEC-Q100 automotive applications.